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Design and Manufacturing Guidelines for 6-Layer Printed Circuit Boards

The 6 -layer PCB (printed circuit board) is a printed circuit board with a multi -layer conductive layer. Its basic structures include the internal and external copper foil layers and the intermediate isolation layer. Among them, the first and 6th layers are the signal layer. Signal. This design allows more functions and higher performance in a limited space.

6-layer PCB application

The 6 -layer PCB (printed circuit board) plays a key role in modern electronic manufacturing, and its application is wide and diverse. The following are the main application areas of the 6 -layer circuit board:

1. In the field of communication equipment, the application of 6 layers of PCB is very common. For example, communication devices such as mobile phones and routers need to use this type of PCB. Due to the large amount of data processing of communication equipment and high requirements for circuit boards, the 6 -layer PCB can provide higher data transmission rate and lower signal interference, thereby ensuring the normal operation of the equipment.

2. In the field of industrial control equipment, the 6 -layer PCB also plays an important role. Industrial control equipment usually requires a large amount of data and complex control tasks, which have high requirements for the stability and reliability of the circuit board. The high stability and high reliability of the 6 -layer PCB can ensure the stable operation of the industrial control equipment, thereby improving production efficiency.

3. In the field of medical instruments, 6 -layer PCB is also widely used. For example, the ECG monitor and ultrasonic diagnostic instrument in medical equipment need to use this type of PCB. Because medical instruments have high requirements for data accuracy and stability, the 6 -layer PCB can provide high -precision signal transmission and stable working environment, thereby improving the work efficiency and diagnosis accuracy of medical equipment.

4.6 layers of PCB also have a wide range of application prospects in data centers and high -speed communication. Its high -density design can achieve smaller size and higher integration, saving space and cost for electronic products. At the same time, due to the characteristics of its high signal transmission rate and low signal loss, the 6 -layer PCB can meet the needs of high -speed communication and data centers.

Benefits of Using 6 Layer Printed Circuit Board

The six-layer printed circuit board incorporated within the multilayer board offers unmatched benefits. These exceptional advantages and specific characteristics of the six-layer printed circuit board are delineated in more detail hereinafter.

Firstly, a diminished size and surface area. The inclusion of additional layers provides ample room for diminishing the footprint of the printed circuit board. Consequently, one defining characteristic of the six-layer circuit board lies in its ability to minimize the overall area occupied by the end product while facilitating more intricate functionalities. This stands as one of the key motivators behind the utilization of six-layer printed circuit boards on an increasing scale currently. Reflecting the escalating demands for the portability of electronic gadgets, these attributes align flawlessly with prevailing market trends.

Secondly, superior electrical performance. With the escalating complexity of products, semiconductor DC, AC, rectification currents, diverse frequencies, and powers, encompassing high-grade ICs, elevated voltages, ADC conversion rates, precision, and so forth, the electrical performance benchmarks of components utilized for printed circuit boards invariably rise. This enhanced electrical reliability of six-layer printed circuit boards renders the interaction among components more reliable, offering a distinct edge over single- and double-layer printed circuit boards.

Thirdly, enhanced durability. Comparative to single-sided and double-layer printed circuit boards, six-layer printed circuit boards incorporate multiple insulation layers, thus enhancing PCB robustness for optimized prevention of PCB shorts, thereby prolonging PCB lifespan and product longevity.

Fourthly, superior connectivity, reduced weight. In contrast to conventional single-sided printed circuit boards and double-sided printed circuit boards, the elaborate circuitry of the six-layer printed circuit board simplifies component connections, thereby minimizing the usage of interconnection components and subsequently, reducing the total weight of the PCBA assembled product. As such, this represents a compact, yet lightweight solution ideal for portable electronics.

Lastly, the intricate stacking arrangement delivers a more robust structure and effectiveness. Design considerations related to stacking arrangements play a pivotal role in PCBs. Six-layer PCBs exhibit a more intricate stacking array compared to single-sided PCBs and double-layer PCBs. However, this increasingly complex configuration also enhances PCB application potential, ensuring quality and stability guarantees.

Which material does the 6 -layer PCB use?

The materials used in the 6 -layer PCB (printed circuit board) mainly include conductive materials, insulation materials and substrate materials. The following is a detailed introduction to the main materials used in 6 layers of PCB:

1. conductive material:
▶ Copper foil: The outer copper foil layer is a layer of metal foil on the surface of the PCB board. It will be processed into the required line pattern for connecting each component. The inner copper foil layer is located between the inner signal layer and is also used for the connection and transmission of the circuit.
▶ Gold plating, silver plating, etc.: Under certain specific needs, in order to improve the performance of electrical conductivity or prevent oxidation, metals such as gold -plated and silver plating may be used as conductive materials.

2. Insulation material:
▶ Prepreg: This is a thin piece of insulation material, which is used for adhesion materials and insulation materials for the inner conductive graphics of the multi -layer printing board. During the layer pressure, the semi -curing epoxy resin is squeezed away to form a reliable insulator.
▶ Polymidamine (PI), Polytesterafluoroethylene (PTFE), etc.: These high -performance insulation materials are also often used in 6 layers of PCB to improve insulation and high temperature resistance.

3. substrate material:
▶ FR-4: This is a glass fiber-covered copper plate with good insulation performance and mechanical strength. It is a substrate material commonly used in 6 layers of PCB. FR-4 contains flame retardants, so it is also called FR (flame retardant) layer.
▶ Other FR layer boards: In addition to the FR-4, there are FR-2 (paper-based phenolic resin layer plates), FR-6 (polyester resin glass fiber layer plate), etc. FR layer boards can also be used for 6-layer PCB manufacturing , But they may be different in certain performance or processing.

What Makes up a 6 Layer PCB Stackup?

A 6 layer PCB stackup comprises different layers. The ground plane, power plane, and signal layers make up a 6 layer PCB stackup. Each of these layers has its functions. However, it is important to understand how these layers play a significant role in the functionality of this stackup.

Ground plane
The ground plane functions as a return path for current from various components on the circuit. It is a layer of copper foil that connects to the ground point of the circuit. This separate layer is so large that it covers the whole board. The ground plane allows the PCB manufacturer to ground components easily.

Power plane
This is a plane of copper that connects to a power supply. The power plane provides a supply of voltage to the circuit board. This layer is often seen in multilayer stackups since these stackups use an even number of layers. A power plane reduces the operating temperature of a board as it can handle more current.

Signal layers
These layers include the bottom layer, top layer, and inner layer. All these layers have electrical connections.

▶Bottom signal layer: This layer is primarily for soldering and wiring. For a multilayer board, manufacturers can place components.
▶Top signal layer: It is also referred to as thecomponent layer. This layer is used to arrange copper or wires.
▶Inner signal layer: This layer is connected to power and ground planes. It has electrical connections and consists of an entire piece of the copper film. The inner signal layer can only be seen in multilayer boards.

6 -layer PCB stack design rules

The rules of the 6 -layer PCB stack design are mainly based on the performance requirements of the circuit board, signal integrity, the layout of the power supply and the formation, and the shielding effect. The following are some key stack design rules:

1. The tight coupling between the formation and the signal layer: the distance between the formation and the power layer should be as small as possible, and the thickness of the medium should be as small as possible to increase the capacitance between the power layer and the power efficiency.

2. Isolation between the signal layer: Try not to be adjacent directly between the two signal layers to prevent signal stringing and ensure that the performance of the circuit is stable.

3. Use the internal electrical layer to block: For the multi -layer circuit board, the signal layer should be adjacent to a internal electric layer (formation or power layer) as much as possible. The role of effectively avoids the skewers between the signal layer.

4. The layout of the high -speed signal layer: The high -speed signal layer should generally be between the two internal electrical layers. Small interference to other signal layers.

5. Symmetry of layered structure: During the design process, the symmetry of layering structure needs to be considered, which helps ensure the stability and reliability of the circuit board.

6. Use multiple ground electrical layers: This can effectively reduce ground impedance and improve the performance of the circuit board.

7. The use of even layers: It is generally recommended to use the even layer of PCB to avoid the odd number layer, because the strange number layer circuit board is easy to bend.

Factors To Consider In The Design Of 6-Layer PCB Stack-Up

Several factors need to be considered while designing the 6-layered PCB stack-up:

Signal Integrity Considerations
The electrical signal transmission through PCB is the result of signal integrity. Thus, trace lengths are planned carefully to prevent signal delays and distortions. On the other hand, impedance matching involves designing traces and terminations to match the characteristic impedance of the transmission lines, minimizing signal reflections. Additionally, minimizing crosstalk between adjacent traces is essential to avoid interference and ensure signal integrity. The design can maintain the desired signal quality and prevent data errors or signal degradation by addressing these factors.

Power and Ground Plane Design
A PCB’s overall performance depends heavily on the design of the power and ground planes. Several advantages to power and ground plane distribution can be realized. Noise reduction is one of the benefits. The planes serve as a shield, shielding the circuitry from outside noise. Another crucial element is stable power distribution, which guarantees that each component receives a steady supply of clean power. This helps prevent voltage swings and potential issues. Moreover, careful attention must be given to the placement and routing of power and ground traces to minimize the loop area, which reduces electromagnetic interference and improves signal integrity. These considerations collectively contribute to the efficient and reliable operation of the PCB.

Impedance Control and Routing Guidelines
Impedance control and routing guidelines are essential for maintaining consistent signal characteristics and preventing signal degradation. These guidelines dictate trace widths, spacing, and layer stack-up to achieve desired impedance values. Adhering to these guidelines helps minimize reflections and signal distortion.

EMI/EMC Considerations
EMI/EMC considerations are crucial for minimizing electromagnetic interference and ensuring compliance with electromagnetic compatibility standards. Shielding techniques, proper grounding, and strategic component placement are key to reducing EMI/EMC issues and ensuring the PCB functions reliably in its intended environment.

Materials
Standard substrate materials or aluminum cores are used to make single-layer PCBs. However, for the multilayer stack-ups, it should be clear that the aluminum core PCBs are not available. This is because multilayer aluminum PCBs are challenging to manufacture.

Thermal Management Techniques
Thermal management techniques are vital to prevent overheating and ensure the longevity and reliability of the PCB. This involves incorporating heat sinks, thermal vias, and proper component placement to dissipate heat efficiently. Thermal simulations and calculations can help identify potential hotspots and guide the selection of suitable cooling strategies.

6 Layer PCB Fabrication

Edit the schematic diagram
The 6 layer PCB can feature two layers of the ground plane in the circuit board. This means that the manufacturer can separate the digital and analog grounds. Involve the signal’s minimum return path in EMI. Ensure you check for any errors after creating the schematic diagram.

Create a new PCB file
After the manufacturer has created a new PCB file, the schematic netlist can be imported into that file. The manufacturer then sets the layer structure and adds layers. The next thing is to add the power and ground layers. During a 6 layer PCB fabrication, you must couple the main ground layer and the power layer. This should be at a distance of 5 ml.

Layout
Layout is very important in the fabrication of a 6 layer PCB stackup. The primary principle of layout is to ensure good partition. Moreso, the partition of digital and analog devices can help to minimize interference. Digital signals generate large interference and a strong anti-interference.

You need to check out the components layout with various operating voltages. Ensure that devices having large voltage differences are far apart. In principle, the best configuration type features 3 power layers and 3 signal layers. The ground plane is the second and fifth layers. The third and fourth layers are power and inner signal layers.

Ground plane production
In a 6 layer PCB fabrication, there are two layers of ground. They are DGND and AGND. The DGND is placed on the fourth layer while the AGND is placed on the second layer. The manufacturer uses wires to lead out the pins of the ground and top components. Then you use the via hole to connect the pins to the corresponding network. Ensure you use a few pads during the connection process. This is because the pads will increase interference.

Power plane production
You need to divide the power layer. This is because the 6 layer PCB will not feature one working voltage value. Follow these procedures for segmentation during a 6 layer PCB fabrication;

●Figure out a voltage network
●Change to the inner power layer    
●Draw a closed graph using a line
●Use wires to lead out the pins of the ground and top layer
●Create connection to the inner power layer via the pad
●Design the next power network.

Routing
Ensure the ground layer and power layer are made well. After this, route the signal lines. Routing during a 6 layer PCB fabrication requires serious attention. The manufacturer should ensure that the vital high-speed signal line goes to the inner signal layer. The signal can also move on its ground layer.

For instance, if analog signals are mostly on the top layer, the second layer should be set to AGND. Furthermore, you need to adjust the component layout appropriately to enhance wiring. The routing method for the inner signal layer is wire-pad –inner electric layer.

DRC Inspection
This is an important step for a 6 layer PCB fabrication. DRC simply means design rule check. After the manufacturer has drawn the board, the inspection must take place. Carrying out a DRC helps to enhance the fabrication yields of a 6 layer PCB.

What is the difference between breadboard and pcb board?

What is a breadboard?

Experimental PCB boards are mainly used in stages of circuit design, testing and functional verification to help engineers verify the correctness and reliability of circuit design during product development. They are usually bare boards, that is, the circuit board without components, so that engineers can add the required components to set up circuit construction and testing.

Breadboard has a wide range of applications in the fields of electronic engineering, communication, computer and other fields, and is an indispensable part of circuit design and product development. By using Breadboard, engineers can design and optimize the circuit more efficiently to improve the quality and performance of the product.

How does Breadboard work?

The circuit Breadboard, its working principle is mainly based on its unique structure and design. There are many jacks on the bread plate. These jacks are actually column connection sockets for fixing and connecting electronic components to form circuits.

Breadboard are usually divided into two independent parts. The first part is two rows of jacks separated by the red and blue lines on the left and right sides. The red is used to connect the positive pole of the power supply and blue is used for ground (GND). Each row of jacks are connected inside, so that users can connect the positive and negative poles of the power supply.

The second part is the middle jack area. These jacks are divided into left 5 and 5, and a total of 10 lines are identified as A, B, C, D, E, etc. The five jacks in each row are connected inside, which provides users with a convenient platform that can connect electronic components on it and connect to the power supply and grounding next to build the required circuit.

When setting a circuit on Breadboard, users can insert electronic components (such as resistance, capacitors, diode, integrated circuits, etc.) into the corresponding jump according to the needs of the circuit, and Connect with power and ground. In this way, a complete circuit can be formed to test, verify or demonstrate the functions and performance of the circuit.

When do I use Breadboard?

Breadboard is usually used in the following situations:

1. Circuit design and test: In the early stage of circuit design, engineers need to use Breadboard to build and test circuits. Through the actual construction of the circuit and observing its operating effect, engineers can verify the correctness and reliability of the circuit design, and timely discover and modify the problems in the design in time.

2. Functional verification and debugging: Breadboard is an important tool for verifying circuit functions. Engineers can build specific circuits on Breadboard to test specific functions or performance. In addition, Breadboard can also be used for debugging to help engineers position and solve the failure or problem in the circuit.

3. Learning and education: Breadboard plays an important role in professional teaching and learning in electronic engineering, communication, computer and other professional. Students can deepen their understanding of circuit principles, electronic components, and circuits by setting up and testing circuits on Breadboard to enhance their practical ability.

4. Prototype production and product development: During the product development stage, Breadboard can be used to make circuit prototypes. Engineers can quickly build and test the prototype of the circuit on Breadboard to verify whether their functions and performance meet the design requirements. This helps shorten the product development cycle and improves development efficiency.

5. Scientific research and experiments: In the field of scientific research, Breadboard is often used to build experimental circuits to study the performance, behavior, or characteristics of electronic components, circuits or systems.

The advantage of Breadboard

The advantages of breadboard:

▶You can rapidly change connections and test various plans in a development phase.

▶It’s easy and fast to assemble as there are no permanent solder connections.

▶You can also change various components such as the capacitor or resistor value.

▶You can add an ammeter anywhere with shifting wires (breaking into) any branch of your circuit. What’s more, the current measurement on PCBs require you to break tracks or add extra resistors in your design.

The difference between Breadboard and PCB

Difference 1: Breadboard can change components and PCB can’t because its connections are permanent.
The great difference between the breadboard and PCB is that the breadboard doesn’t have to be soldered because its components can be either changed or removed. Does this mean the breadboard is better than PCB in this regard? No way. You can’t say which is better because they meet different demands.

One point where the breadboard wins is that it has designed slots, which let you plug components that can be changed later. However, the PCB parts are surface-mounted and/or through-hole mounted on a circuit board, which is a permanent project.

Note
If you want to change the PCB’s component, you have to use soldering, but this can affect the board’s performance. So before you have your PCBs manufactured, remember to check your design carefully.
One point where the PCB wins is obvious. Try shaking the breadboard upside down. You will wish its connections were permanent.

Difference 2: breadboards are used in the development phase, and printed circuit boards are used for the end products.
Breadboards are used to test circuits because they are cheaper and you can change their components and test different scenarios. You can buy breadboards easily.

However, PCBs used for end products are customized. Before you have them manufactured, you need to generate Gerber files from schematics, and schematics come from your design. Once PCBs are designed, for a better effect, let a reliable one-stop PCB company manufacture and assemble them. When you get the PCB assemblies, you get end products.

Difference 3: PCBs have better carrying capacity than breadboards.
A printed circuit board has a significantly better current carrying capacity compared to a breadboard because its traces can be much wider for more current to run through. Breadboards provide the minimum current capacity to the circuits because the components are connected by wires. Besides, terminals can be added to your PCB to add external connections but can’t to breadboards.

Difference 4: PCBs are much more complex than breadboards.
Compared to PCBs, breadboards have a simple structure. The breadboard consists of distribution buses and groups of holes. A specific channel runs between the two rows, which creates an environment for the chip with pins you can place in there. You can place one or two power distribution buses on the side of the breadboard for grounding and running power.

Different PCBs have different structures, and even the simplest single-layer PCBs have a more complex structure than breadboards. The most basic PCB structure contains four layers – a PCB substrate, a copper layer, a solder mask, and silkscreen/legends. The connection is wireless because the copper traces are placed on the board.

What is blank PCB?

The courteous term for “blank PCB” is the PCB board that is devoid of electronic components, serving as a foundation for PCBA. Blank PCB is an electronic board composed of epoxy fiber, copper film or PCB ink. The simplicity of this board offers ample latitude for engineers and designers, allowing components to be added at will, thus possessing high degree of flexibility and apt for batch production.

What are the components of blank PCB?

The blank PCB (printing circuit board) is mainly composed of the following parts:

1. The substrate: Also known as the circuit board or PCB board, is the main part of the PCB. Generally consisting of insulating material, such as glass fiber enhanced epoxy resin (FR-4). It is the support and connection part of the circuit element on the PCB.

2. Conductive layer: composed of copper foil, covering one or sides of the substrate. The conductive layer is used to connect to electronic components and circuits.

3. pad: The pad is a metal area on the wire layer for welding connection with components. The pad is a metal part on PCB, which is used to connect electronic components and PCB.

4. Welle layer: a green paint film covered on PCB, which is used to protect circuits and pads to prevent short circuits and corrosion circuits.

5. Horcho: Including metal perforated and non -metallic pores, the metal pores are used to connect component pins between layers.

6. Installation holes: used for fixed circuit boards.

7. Wire: Electrical network copper film for connecting component pins.

8. Plug -in: The component of the connection between the circuit board.

9. Filling: Copper for the ground network network can effectively reduce impedance.

10. Electrical boundary: It is used to determine the size of the circuit board, and the components on the board cannot exceed the boundary.

Types of blank printed circuit boards

There are different types of blanks PCBs. In this section, we will look at the following types of blank PCBs:

AIN PCB and Alumina PCB
Both are distinct types of ceramic materials. They both have an impressive thermal conductivity. For IC use, AIN PCBs are the best to apply.

Both alumina and AIN PCBs are ideal for laser electronics, automotive sensors, and high-power LED applications, among many other functions.

High-frequency PCB
Otherwise known as a fast or RF microwave PCB, this is a blank PCB transmitting and receiving signals with top frequency. It is PTFE-based.

These types of blank PCBs have different applications, including their use in missiles, smartphones, global positioning systems, anti-collision mechanisms, antennas, and radars, among several other uses.

When choosing high frequency PCB manufacturers, it is important to look at the kind of technology that they use. This will determine whether or not they are able to reduce contraction and expansion of high-frequency PCBs. This contraction and expansion can take a toll on the performance of the blank printed circuit board. Therefore, thermal expansion needs to be as slight as it can be.

That is why vigilance is important when selecting a blank PCB dealer. You can always trust IBE’s technology in fabrication and assembly of PCBs.

Rigid-flex PCB and flexible PCB
From the name, you can already tell that these blank PCBs can bend. They are based on PET or PI. As for rigid-flex PCBs, their flex area has FR4 PCB layers laminated onto them.

For flexible PCBs, an ED or RA copper foil is applied. This is not the same with rigid-flex PCBs, as they only rely on RA copper.

Metal core PCB
Yet another blank PCB variant is the metal core PCB. They include both copper and aluminum PCBs. Due to their enhanced thermal conductivity, they are an ideal pick for power applications such as LED lighting.

For the insulation of the metallic core and the copper circuit layers, a dielectric is used. This dielectric determines the thermal conductivity.

FR4 PCB

By far the most popular blank PCB is the FR4 version. FR4 is an abbreviation that translates to flame retardant level 4. It has epoxy fiberglass and is quite simple to create. An FR4 quote is lower than most other PCBs. It is even cheaper than PCBs with the same complexity in circuitry.

Test method of blank PCB

The test of blank PCB is a key step to ensure the quality and performance of the circuit board. The following are several common blank PCB test methods:

     1. Ois visual inspection: Use a magnifying glass or calibrated microscope for visual inspection to determine whether the circuit board has defects, poor welding or other problems. This is the most traditional detection method, but its subjectivity and efficiency are low, which may not be applicable for complex PCB.

     2. Online test: identify manufacturing defects through electrical performance testing, and test simulation, digital and hybrid signal components to ensure that they meet the specifications. Common test methods include needle bed tester and flying needle tester. The advantage of this method is that the test cost is low and the test speed is fast, but special test fixtures and programming requires.

    3. Function test: In the middle stage of the production line and the end, the special testing equipment is used to comprehensively test the functional module of the circuit board. This method can confirm the quality of the circuit board, but the test cost is high, and special test equipment and personnel are required.

    4. Automatic X -ray check: Use different substances to absorb X -ray, and perspective needs to be detected to find defects. This method can detect problems such as poor welding and lack of components, but the electrical performance problem cannot be detected.

     5. Laser detection system: It is the latest development of PCB test technology, which has the characteristics of high precision, high speed and high reliability. It can scan the surface of the circuit board by laser to detect tiny defects and poor welding problems.

How a blank PCB is made?

In order to make a blank PCB, you’ll have to design and have PCB manufacturer fabricate the boards.
PCB designing typically follows the process of separating clock and analog signals. Also, the line angles need to be larger than 135 degrees. Lines have to be as short as they can be.

As you complete the PCB design, you’ll have to check on the following factors:

▶ Manufacturability
▶ Small electromagnetic interference
▶ Even impedance
▶ At IBE, we promise to deliver a perfect PCBA DFA and PCB DFM.

 

Conclude

If you are looking for PCB light board suppliers, you can contact us. We produce a variety of light board PCB. There are ceramics, rigidity, flexible, rigidity combination, heavy copper PCB and so on. We provide PCB services for customer service around the world. We also have EMS solutions, PCB manufacturing and assembly. Welcome to leave a message.

How to find the alternative of electronic components fast?

Electronic components are an important part of the printing circuit board. It can be said that electronic components determine the success or failure of an electronic project. When we choose electronic components, some may exceed your budget due to prices, inventory, delivery cycle and other issues. This is a challenge for all engineers. When facing these problems, you must know how to find the same efficiency electronic component, which plays a key role in completing the project.

The theme we are going to discuss today is “How to quickly find the alternative to electronic components?” I have sorted a score project guide for everyone, let’s take a look.

What is an alternative electronic component?

An alternative electronic component is one that works in an equivalent manner to the original component – offering the same level of performance and quality, while at the same time often either representing better value or being easier to source.

There are also a variety of instances in which you may need to identify an alternative or equivalent electronic component for your project:

The re-use of an old design
●A new design with a high-demand component
●A component that uses a material in shortage
●A component that has extended lead times
●A component that had a limited production run
●A component that is no longer in production
●A component or material that is banned in your country

Types of Alternative Electronic Components

Alternatives can conveniently fall into three groups: drop-in replacements, functional alternatives, and functional equivalent alternatives. The existence of custom parts as yet another viable option, albeit rare, must not be overlooked.

1. Drop-In Replacements
Our product range includes various components allotted for each specified part number. Each component functions seamlessly as an alternate to its counterpart, being utilized interchangeably during production cycles. These are pre-screened and assurance-backed individuals, serving our goals of preserving a robust and adaptable supply chain.

2. Functional Alternatives
Functional alternatives fill the same role as an authorized component, however, they are uncontrolled substitutes. Prior to validating a functional alternative’s usage, our diligent design engineers assess the component. Resultantly, it might be incorporated as a substitute for the initial component, necessitating a design adjustment occasionally.

3. Functional Equivalent Alternatives
When functional alternatives match or outperform the original component performance-wise, it often transforms into an either/or choice. Upon our engineering team deeming the alternative fitting, a design revision could become necessary. Any ensuing design alterations might render the original component incompatible with the product’s specifications.

4. Custom Alternatives
The creation of custom alternatives is undoubtedly costly. Hence, most electronics manufacturers reshape their procurement patterns to accommodate a singular channels of supply. Indiscriminate use of multiple producers for these bespoke components nearly doubles the expenses associated with component research and development.

Why do I need an alternative to electronic components?

1. Supply chain problem: Due to various reasons (such as bankruptcy, geopolitical tension, natural disasters, etc.), some electronic components may be interrupted by the supply chain. In this case, finding an alternative can ensure the continuity of the production line and avoid stagnation of production.

2. Consider: With market fluctuations, the price of some electronic components may rise sharply. In order to reduce costs, the company may find alternatives with similar properties but low prices.

3. Technology upgrade: With the development of technology, the performance of new electronic components may be higher, low power consumption or small amount. The use of these new components as alternative materials can enhance the competitiveness of the product.

4. Environmental friendship: Today, with the understanding of environmental protection, the company may be more inclined to choose environmental materials as alternative materials to reduce the negative impact on the environment.

5. Intellectual property protection: In some cases, in order to avoid infringing intellectual property rights, enterprises may need to find alternative materials that do not infringe patents.

6. Customer demand: Customers’ specific needs may need to use specific types of electronic components. In some cases, in order to meet these needs, the company may need to find alternative materials to meet customer needs.

In short, looking for an alternative to electronic components can ensure the stability of the production line, reduce costs, improve product performance, protect the environment, avoid intellectual property disputes, and meet customer needs. Therefore, finding appropriate alternative materials in the purchase and supply chain management of electronic components is an important task

How do I find alternative of electronic components?

Please find below several prevalent indicators indicating potential electronic component counterfeits when conducting inspections:

Familiarize yourself with component specifications
Prior to initiating a quest for viable substitutes, deep knowledge of the specifications pertaining to the component requiring replacement is vital. This encompasses variables such as voltage ratings, current ratings, packaging type, and pin configurations. Mastery of these specifics will significantly aid in locating suitable replacements while refining your search.

Utilize parametric searches
Electronic component distributor websites typically provide parametric search tools facilitating filtering of components based on precise criteria. This utility becomes invaluable during the pursuit of alternatives possessing comparable specs. By selecting variabilities including voltage range, package type, etc., your search results can be significantly refined.

Seek guidance from manufacturer’s resources
Practically, component manufacturers often offer substitution lists for their products directly on their websites. These resources proving especially beneficial in locating replacements for outdated components.

Appraise functional equivalents
Although crucial to align component specifications, consider also potential functional equivalents. These components might feature slightly distinct specifications yet fulfill the necessary function within your circuit. Be certain to evaluate how any discrepancies impact your overall design.

Engage suppliers in collaboration
Feel free to proactively solicit advice and engage in dialogue with suppliers who may impart beneficial insights and suggestions – we stand ready to assist with advice regarding alternative electronic component sourcing should you reach out to our team.

LST has a very professional team to provide you with electronic component solutions. Our members are familiar with various types of electronic components and their functions, and maintain a cooperative relationship with many electronic component suppliers. We can help customers find the most suitable electronic component instead in the shortest time.

Introduction to 0603 SMD: You should know

What is 0603 SMD?

0603 SMD refers to a patch resistance with a length of 0.6mm and a width of 0.3mm. Among them, 0603’s “06” represents 0.6mm, and “03” represents 0.3mm. This specification of patch resistance is usually used in small circuit boards or in circuits that require high -density assembly. Its size is small and can be used in the case of limited space, so it is widely used in electronic products such as mobile devices, laptops, and smartphones.

The power of the patch resistance 0603 is usually between 1/16 watts and 1/10 watts. Because its size is small and the heat dissipation area is small, the power is low. However, its accuracy is relatively high and can reach 1%or higher. In addition, 0603 also has some special types, such as the stable patch resistance of the temperature coefficient (TCR), high -frequency patch resistance, etc.

0603 SMD Applications

0603 SMD is mainly applied to the following aspects:

1. Electronic equipment: 0603 SMD resistance packaging and 0603 ceramic patch capacitors are widely used in various circuit boards and electronic devices, such as mobile phones, laptops, tablet computers, car electronics, etc.

2. Communication equipment: 0603 SMD resistance packaging and 0603 ceramic SMD capacitors can be used for high -frequency communication devices such as mobile phones, routers, base stations, and providing stable resistance matching and signal transmission.

3. Industrial control: In the field of industrial automation and control, the 0603 SMD resistance seal is used in various sensors, PLC, servo controllers and other devices.

4. Lighting equipment: 0603 SMD LED blue light is widely used in wireless chargers, charging treasures, routers, small appliances (such as: sweeper, vacuum cleaner, etc.), smart home, circuit board, vehicle instrumentation, Bluetooth headset audio and other fields Essence The blue glowing color can increase the sense of technology of electronic products and make intelligent products more distinctive.

0603 SMD Electrical Ratings

0603 SMD packages have no standard set of electrical ratings. Capacitors, resistors, and inductors feature different specifications. Therefore, these values rely on the materials for building the component. Generally, 0603 inductors’ inductance value will be lower than that of larger packages. The same thing goes for capacitors.

However, these setbacks are due to the fact that these values rely on the package size. 0603 SMD capacitors usually feature low voltage ratings since the electric field between the capacitor’s ends will be extremely high when the package becomes small. The current/power ratings for inductors and resistors are low since these ratings cause heat in the package. Also, a small package needs less heat to heat up.

It is crucial to utilize larger components when designing a high current/ high voltage. There are special 0603 RF inductors and capacitors for high-frequency RF systems. The parasitic values of the capacitors and inductors are weak in the package. Therefore, their impedance will be very reliable. Once you decide on the type of components needed, use an E-parts finder to quickly locate 0603 package footprints.

Also, you can locate the components needed when looking for 3D models and 0603 package footprints. Furthermore, you can locate the components needed by using the parts search features. You will be able to access CAD models from manufacturers. You can import these CAD models into ECAD applications. Also, you access sourcing information from distributors across the world.

How to solder 0603 smd ?

The steps of 0603 SMD welding are as follows:

1. Put the welded torch on the pointed welding head. After heating to 320 degrees and 330 degrees, use a welding gun to dip a little tin. Note that tin does not need to be too much, because compared with direct -inserted components, welding of patch components does not require too much tin.

2. Gently click on one of the two pads, let the tin spread evenly on it, and slightly bulge a little. Note that tin must not be too much, and it cannot directly become a small mountain or a drum bag like a straight plug -in resistor, which will affect the later work.

3. Holding the welded carbide in the right hand to ensure that the tin on the pad is still melting. The left hand is pinched with a patch resistance with a tweeter, and the pad from one side of the tin from the side of the tin is pushed to the side of the tin. Put it on the pad and dip it in tin.

4. Take away the tin to cool down. At this time, the patch resistance is fixed on the pad.

5. Use the pad to dip some tin, gently point the other on the other two pads, and let the tin and the other end of the patch resistance be passed together. After the tin is cooled, the entire patch resistance will be fastened on the pad with tin.

Common 0603 patch resistance brand

 

American brand: Vishay, KOA Speer, YAGEO, Panasonic, Bourns, etc.

Taiwan brands: Chilisin, FENGHUA, Superworld, YAGEO, WALSIN Technology, etc.

What do you know about the pcb cost ?

Printed Circuit Boards (PCBs) are a vital component of electronic devices, and their cost significantly impacts the overall economics of a product. Understanding and mastering the cost structure of PCBs is crucial for companies to reduce costs and enhance market competitiveness. This article aims to delve into the cost composition of PCBs, explore the main influencing factors, and propose strategies for cost optimization.

PCB Cost Composition

1.Material Costs:This includes the expenses for substrates, copper foil, solder, solder mask, silkscreen, and other raw materials. The selection of the substrate material has the biggest impact on costs, as different materials, thicknesses, and sizes can significantly affect the final cost.

2.Manufacturing Costs:These cover the expenses related to processes such as lamination, drilling, copper etching, plating, soldering, silkscreen printing, surface finishing, and PCB shaping. The complexity and precision requirements of these processes vary, leading to different costs.

3.Equipment Depreciation and Maintenance: PCB manufacturing requires high-value equipment, and the depreciation and maintenance costs are a significant part of the overall PCB cost.

4.Labor Costs: The production of PCBs requires a significant amount of manpower, including operators, technicians, and quality inspectors. Their salaries and welfare benefits also contribute to the cost.

Factors Influencing PCB Cost

1.Design Complexity:

Higher design complexity leads to increased material, manufacturing, and labor costs. Strategies such as optimizing circuit design, simplifying wiring, and reducing component count can help reduce PCB costs.

2.Material Selection:

The choice of substrate material has a significant impact on PCB costs. Different materials have varying costs, and their performance, stability, and reliability also affect the overall PCB cost.

3.Manufacturing Processes:

Selecting and optimizing manufacturing processes are crucial for cost reduction. Adopting advanced technologies, improving production efficiency, and reducing waste rates can help lower PCB costs.

4.Batch Size:

Batch size significantly affects PCB costs. Larger batches lead to lower unit costs. Companies should plan production batches based on market demand and production capacity.

5.Lead time:

Lead time describes ordering and shipping times for your product. There is an inverse relationship between lead time and pricing, with extended lead times resulting in lower pricing.

6.Quality:

Quality refers to how good your design is, i.e., how well a design performs. Factors such as complexity, reliability, and yield determine the quality of your PCB. Complexity is often measured in terms of area for a given via count and has several components, including PCB tracks, soldering points, and so forth. To evaluate whether your PCB design is complex or not, you will need to determine what the average number is in a specified product type and assembly method your company will use.

7.Functionality:

Some design errors are easy to spot, while others can be difficult to find. Therefore, the more functionality tests you perform on your PCB design, the better quality control you will have. It will lead to higher tolerance levels and ultimately reduce rework and production delays. By improving efficiency in PCB manufacturing and assembly, the number of order cycles (designs built into the final product) will decrease significantly. This improves profitability for your company.

8.Quantity:

There is a fixed cost per square inch for each quantity order (except for bulk orders). Therefore, the more units you order, the lower the cost per unit.

Once you know your costs, you can develop a budget for your project and determine how much profit margin you need to build into your PCB assembly quote. Once you do that, it will be easy to set your prices for each product produced by your company.

Strategies for PCB Cost Optimization

1.Design Optimization:Simplifying circuit designs, reducing wiring complexity, and minimizing component count can help lower PCB costs. Optimizing component layout and wiring design can also improve PCB reliability and stability, reducing future maintenance and replacement costs.

2.Material Substitution:Where performance allows, cost-effective materials can be substituted for higher-cost options. For example, using more cost-effective substrate materials and solders can help reduce material costs.

3.Process Improvement:Enhancing manufacturing processes, improving production efficiency, and reducing waste rates can help lower manufacturing costs. Automation, process parameter optimization, and precision improvement can be effective strategies.

4.Rationalizing Production Batches:Companies should plan production batches based on market demand and production capacity to minimize unit costs. Balancing production with sales to avoid inventory accumulation and capital waste is also crucial.

Why is PCB Assembly so Expensive?

PCB assembly is expensive because the basic materials themselves are expensive. This is not to say that no companies manufacture cheaper PCB assemblies; its purpose is to say that quality remains unaffected, regardless of its costs. It is not unheard of for companies to offer or exceed the price listed in the example above if they feel that you, as a valued customer, will be more willing to spend the extra money to receive better quality in your final product.

PCB Assembly Costs by Product Type

Manufacturers design, manufacture, and assemble PCBs to meet the needs of different industries. Therefore, factors directly related to the industry, product type, and assembly option affect the cost of PCB assembly. The following list gives a rough estimate of where you can expect to find your typical cost for each product type.

Assembly Process Manufacturing Costs

    ●Stamp/Shrink +$1.00 per unit +/- 1%
    ●Solder +$1.00 per unit +/- 3%
    ●Spot +$0.05 per point +/- 2%
    ●SMT/LGA +$1.00 per unit +/- 1%

PCB Assembly Costs by Assembly Option

The Assembly process affects the cost of your PCB assembly in two ways:

    ●Materials themselves are more expensive
    ●Each assembly process requires a certain amount of retesting because of inconsistencies in the manufacturing process.

The following list shows each method used to assemble your PCB design and how much it costs you.

    ●Turnkey No Processing No Manufacturing No Assembling $0.52 per square inch +/- 2%
    ●General Process Assembling -$1.00 to -$1.20 per square inch
    ●Turnkey Processing +$0.72 per square inch +/- 1-2%
    ●General Process Manufacturing -$0.20 to -$0.52 per square inch
    ●Turnkey Manufacturing +$1.00 per square inch +/- 1-2%
    ●General Process Manufacturing -$0.20 to -$0.72 per square inch
    ●Turnkey Assembly +$1.00 per square inch

PCB costs play a pivotal role in determining the economic viability of electronic products. By understanding the cost composition and influencing factors of PCBs and implementing cost optimization strategies, companies can effectively reduce costs and enhance market competitiveness. As technology continues to advance and markets evolve, PCB cost optimization will remain a key area of focus and research.

Introduction to the application of printing circuit board

Printed Circuit Boards (PCBs) are an integral part of the electronics industry, serving as the foundation for nearly all electronic devices. PCBs provide a platform for connecting and supporting electronic components, such as resistors, capacitors, inductors, diodes, transistors, and integrated circuits. They enable these components to communicate and work together seamlessly, allowing for the creation of complex electronic systems.

The PCB’s design and manufacturing process involves several stages, including layout, routing, drilling, etching, and soldering. The layout stage involves planning the placement of components on the board, considering factors like signal integrity, power distribution, and thermal management. Routing involves creating the necessary connections between components using conductive traces. Drilling is the process of creating holes in the board for components with leads, while etching removes the unwanted copper from the board, leaving only the traces and pads. Finally, soldering is used to attach the components to the PCB, completing the circuit.

PCBs are used in a wide range of applications, from simple consumer electronics like radios and televisions to complex industrial and military equipment. They are also crucial in the development of emerging technologies like wearable devices, the Internet of Things (IoT), and renewable energy systems.

Applications for Printed Circuit Boards

Consumer Electronics: Consumer electronics is the largest market for PCBs, with applications ranging from household appliances like refrigerators and washing machines to personal electronics like smartphones, tablets, and laptops. PCBs in these devices enable the smooth operation of various functions, such as data processing, display, and connectivity.

 

Automotive Industry:  The automotive industry is another major market for PCBs. They are used in various vehicle systems, including engine control, braking systems, infotainment, and advanced driver assistance systems (ADAS). PCBs in automobiles must meet strict safety and reliability standards, ensuring smooth and safe operation under various conditions.

 

Medical Devices:  The medical industry relies heavily on PCBs for various medical devices, such as MRI machines, pacemakers, dialysis machines, and surgical robots. PCBs in these devices play a crucial role in ensuring accurate and reliable operation, often with strict regulations and certifications required.

 

Industrial and Military Applications: PCBs are also widely used in industrial and military applications, where they enable the operation of complex systems and equipment. These applications often require PCBs to operate under extreme conditions, such as high temperatures, high humidity, or radiation.

 

Communications and Networking: The communications and networking industry relies on PCBs for various equipment, including routers, switches, servers, and mobile communication devices. PCBs in these devices enable the transmission and reception of data, ensuring smooth and secure communication.

 

Aerospace and Defense:The aerospace and defense industries require PCBs that can withstand extreme environments and stringent safety requirements. These PCBs are used in aircraft, satellites, missiles, and other defense systems, enabling critical operations and ensuring national security.

 

LEDs:Light-emitting diodes, or LEDs, are an increasingly popular lighting technology used for residential and commercial lighting and across numerous industries including the automotive, medical and computer technology sectors. LEDs are favored for their energy efficiency, long life and compactness.

One role that PCBs play in LED applications is the transfer of heat away from the bulb. High temperatures decrease the average life of LEDs. Because of this, PCBs used for LEDs are typically made with aluminum, which can transfer heat better than other metals. This eliminates the need for an additional heat sink to a design and means it can be more compact.

You can find LED PCBs in:

Residential lighting: LED lighting, including smart bulbs, help homeowners light their property more efficiently.
Storefront lighting: Businesses can use LEDs for signage and to light their stores.
Automotive displays: Dashboard indicators, headlights, brake lights and more may use LED PCBs.
Computer displays: LED PCBs power many indicators and displays on laptop and desktop computers.
Medical lighting: LEDs provide bright light and give off little heat, making them ideal for medical applications, especially those related to surgery and emergency medicine.

 

Safety and Security Equipment:Many aspects of security systems, whether for homes, businesses or government buildings, rely on PCBs. They play a role in our safety and security more often than many people realize.

Some safety and security devices that use PCBs include:

Security cameras: Security cameras, whether used indoors or outdoors, rely on PCBs, as does equipment used to monitor security footage.
Smoke detectors: Smoke detectors as well as other similar devices, such as carbon monoxide detectors, need reliable PCBs to function.
Electronic door locks: Modern electronic door locks also incorporate PCBs.
Motion sensors and burglar alarms: Security sensors that detect motion rely on PCBs as well.

 

The above is the classification of printing circuit boards. Of course, this is only part of them. PCB is also widely used in other industries. If your business needs PCB manufacturing and assembly, please contact us, we can provide you with one -stop PCB business services.

The characteristics and application introduction of purple PCB

The color of the printing circuit board is determined by the color of the group welding layer. Our common PCB boards are black, blue, green, and purple. What we want to discuss today is the detailed information about the purple circuit board. The specific content is as follows:

What is purple PCB?

Purple PCB, a circuit board with a purple welded layer, is determined by the welding layer of the circuit. Purple welded layer not only provides the color of the circuit board, but also may improve the performance of the circuit board. However, because purple is not a standard color, it may need to place orders to the circuit board manufacturer alone to provide, which may increase the manufacturing cost.

Purple PCB material

The materials of the purple circuit board mainly include the following:

1.FR4 board: This is a commonly used material that makes the circuit board strong and waterproof, and provides good insulation, thereby improving signal integrity. FR4 plate is a material made of epoxy resin and glass fiber cloth. It has the characteristics of medium mechanical strength, good dielectric performance, heat resistance, moisture, and chemical corrosion.

2.CEM-1 and CEM-2: These composite boards are also commonly used circuit board materials, which have good electrical and processing performance.

3. Special boards: such as ceramic boards and metal plates, these materials have special performance and use, which can meet certain special application needs.

In addition, according to the manufacturing process and use of the circuit board, other types of materials may be used, such as cardboard (such as FR-1, FR-2, FR-3), HDI boards, etc.

It should be noted that the color of the purple circuit board is determined by the welding layer of the circuit, not determined by the material itself. Therefore, no matter which material is used, as long as the welding layer is used to use purple ink, a purple circuit board can be made.

Benefits and Limitations of Purple PCB

 

The Benefits of Purple PCBs

Visual Appeal and Branding
In a market where differentiation can be a key factor in success, the unique color of a purple circuit board can make a significant impact. This is particularly true for consumer electronics, where the internal design of a device, including its circuit board, can be a point of aesthetic distinction.

Enhanced Inspectability
The contrast between the vibrant purple solder mask and the metallic sheen of the silver traces can make it easier for engineers and technicians to spot issues or defects during the manufacturing process or in quality control checks.

Material Advantages
The use of polyimide or other specialized materials for achieving the purple color can also offer functional benefits. These materials often exhibit superior heat resistance and flexibility compared to the standard materials used in green PCBs.

The Limitations of Purple PCBs

Availability and Lead Times
The specialized materials and dyes required for purple solder masks are not as commonly used as those for green PCBs, leading to potential issues with sourcing and longer lead times. For projects on a tight schedule or for manufacturers accustomed to rapid production cycles, this can pose a logistical challenge.

Higher Costs
The lower demand for purple solder masks, combined with the specialized processes required to produce them, often results in higher prices compared to standard green PCBs. For large-scale projects or for companies with strict budget constraints, the additional cost of purple circuit boards might be a prohibitive factor.

Purple PCB Applications

Purple PCBs have found a place in a wide range of applications, including:

Electronics and Gadgets
Many innovative companies and startups are choosing purple PCBs to give their products a unique and captivating appearance. The vibrant color helps create an emotional connection with customers, making their devices more memorable and enticing.

DIY Projects and Makerspaces
In the realm of DIY enthusiasts and makerspaces, purple PCBs have become a symbol of creativity and self-expression. The color’s emotional allure inspires hobbyists to push the boundaries of their projects, fueling their passion for electronics.

Wearable Technology
With the rise of wearable technology, purple PCBs are increasingly being used in devices like smartwatches, fitness trackers, and VR headsets. The distinctive color adds a touch of flair and personal style, making the technology feel like an extension of the wearer’s personality.

The characteristics of purple PCB

The characteristics of purple PCB mainly include the following aspects:

1. Recognition: The appearance of purple makes the circuit board more conspicuous among many electronic devices, which helps improve the recognition and brand image of the product.

2. Thin -type: The amount of copper used in conventional purple PCB circuit boards is small, which makes the size of the circuit board very thin and helps to achieve lightweight and portability of the equipment.

3. Circuit isolation: By adding the purple box, different functional modules of the circuit board can be separated to reduce signal interference and improve the reliability and stability of the circuit board.

4. Signal processing: The purple box can also be used to define the boundary of the signal processing circuit to ensure the accuracy and accuracy of the signal transmission. At the same time, it also helps the guidance and transmission of managing signals on multi -layer circuit boards.

5. Power distribution: By adding purple boxes to the PCB layout, the area of the power distribution network can be determined to improve the traceability of the power cord and help solve the problem of power jump lines.

FAQs About Purple PCBs:

Why are green PCBs more common than purple PCBs?
Green PCBs have been the industry standard for decades due to their lower production costs and ease of sourcing materials. However, as technology has advanced, colored PCBs like purple have become more accessible and affordable.

Can purple PCBs be used in high-frequency applications?
Yes, purple PCBs can be used in high-frequency applications, just like any other PCB. The color of the solder mask does not impact the PCB’s performance or functionality.

Are purple PCBs suitable for all types of electronic projects?

Absolutely! Purple PCBs can be used in a wide range of applications, from consumer electronics to DIY projects and wearable technology.

Do purple PCBs have any disadvantages compared to other colors?
The primary disadvantage of purple PCBs is their relative rarity compared to more common colors like green. This may make sourcing purple PCBs slightly more challenging. However, their unique appearance and the emotional impact they create can outweigh this minor inconvenience for many electronics enthusiasts.

How can I ensure the quality of my purple PCB?
To ensure the quality of your purple PCB, work with a reputable manufacturer like MorePCB that has a proven track record of producing high-quality PCBs. Make sure to follow their design guidelines and properly care for your PCB to maintain its performance and appearance.

Multilayer ceramic pcb substrate manufacturing process: HTCC and LTCC technology

Multilayer ceramic substrate is also known as ceramic shell, ceramic tube shell. At present, most of the multilayer ceramic substrates are manufactured using co-fired ceramic technology – high-temperature co-fired ceramic technology (HTCC), low-temperature co-fired ceramic technology (LTCC) to achieve the mainstream of large-scale manufacturing of multilayer ceramic substrates.

In this article, we will focus on analyzing the advantages and applications of HTCC and LTCC two processes, to facilitate the selection of manufacturing processes that have a clearer direction. Details are as follows:

What is HTCC?

HTCC (High Temperature co-fired Ceramic), using materials such as tungsten, molybdenum, molybdenum, manganese and other high melting point metal heating resistor paste in accordance with the requirements of the heating circuit design printed on 92 ~ 96% of the alumina cast ceramic billet, 4 ~ 8% sintering additives, and then multi-layer stacked, at a high temperature of 1,500 ~ 1,600 ℃ co-fired into one. The product is co-fired under 1500~1600℃.

Therefore, it has the advantages of corrosion resistance, high temperature resistance, long service life, high efficiency and energy saving, uniform temperature, good thermal conductivity, fast thermal compensation, etc. Moreover, it does not contain lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs), and other hazardous substances, and it complies with the environmental protection requirements of the European Union, such as RoHS.

Due to the high firing temperature, HTCC cannot use low melting point metal materials such as gold, silver, copper, etc. Refractory metal materials such as tungsten, molybdenum, manganese, etc. must be used, and the low electrical conductivity of these materials will cause defects such as delayed signals, and therefore they are not suitable for making the substrate of high-speed or high-frequency microassembly circuits. However, HTCC substrates have a wide range of applications in high-power microassembly circuits due to their advantages of high structural strength, high thermal conductivity, good chemical stability and high wiring density.

What is LTCC?

Low Temperature Co-fired Ceramic technology LTCC (Low Temperature Co-fired Ceramic) is a low-temperature sintered ceramic powder made of raw ceramic tape with precise thickness and density, in the raw ceramic tape using laser perforation, microvia slurry injection, precision conductor paste printing and other processes to make the required circuit graphics, and a number of passive components (e.g., low-tolerance capacitors, resistors, filters.), impedance converters, couplers, etc. buried in a multilayer ceramic substrate, and then stacked together, Impedance converter, coupler, etc.) buried in a multilayer ceramic substrate, and then stacked together, the inner and outer electrodes can be used respectively silver, copper, gold and other metals, sintered at 900 ℃, made of three-dimensional space does not interfere with each other’s high-density circuits, but also made of built-in passive components of the three-dimensional circuit substrate, the surface of which can be mounted on the IC and active devices, made of passive/active integrated functional modules, can be further circuit This makes it possible to further miniaturize circuits and increase density, and is particularly suitable for high-frequency communication components.

LTCC integrated components include a variety of substrates carrying or embedded in a variety of active or passive components of the product, integrated components product program includes components, substrates and modules.

HTCC technology vs LTCC technology

 

High temperature co-fired ceramic technology

▶Insulating materials: alumina, aluminum nitride, oxide plating, etc.
▶Conductor material: tungsten, platinum, platinum-manganese, etc.
▶Co-firing temperature: higher than 1400℃
▶Advantages: high mechanical strength, high thermal conductivity, low material cost, chemically stable.
▶Disadvantages: high on-resistance, high manufacturing cost

Low temperature co-fired ceramic technology

▶Insulating materials: microcrystalline glass, ceramic + glass composite system, amorphous glass, etc.
▶Conductor materials: gold, silver, copper, vantage – silver, etc.
▶Co-firing temperature: below 900°C
▶Advantages: low on-resistance, low manufacturing cost, low coefficient of thermal expansion, low dielectric constant and easy to adjust, can be buried passive devices, high-frequency characteristics are excellent, and can be produced with a line width of as low as 50 um of fine circuits.
▶Disadvantages: low mechanical strength, low thermal conductivity, high material cost.

Technology Benefits

Advantages of HTCC technology

HTCC because of the use of tungsten, platinum, and other high melting point metals, these metals greatly increase the RF loss of the component. The advantages are high structural strength, good chemical stability and high wiring density, and its thermal conductivity is as high as 20W/mK, which is far greater than the thermal efficiency of LTCC substrate. In contrast, the thermal conductivity of LTCC substrate is only 3W/mK, which makes it difficult to dissipate heat in the structure of high-density boards and easily makes the chip damaged.

Advantages of LTCC technology

(1) has good electrical and mechanical properties, such as high frequency characteristics, good temperature stability of the resonant frequency, the dielectric constant covers a wide range, the coefficient of thermal expansion is close to silicon.

(2) Has high system stability and reliability.

(3)Can produce 3D microstructures including cavities and channels.

(4)Possesses high level of integration characteristics (sensors, drivers, microfluidic control, electronic and optoelectronic systems for LTCC, etc.) ;and

(5) Very good characteristics at high voltage.

(6) High voltage characteristics and high vacuum. In addition, LTCC manufacturing industry is simple, fast and inexpensive, with low capital investment, short cycle time and high profitability.

Application of HTCC technology

High-temperature co-fired ceramic products mainly include ceramic multilayer substrates, ceramic packaging shells, UVLED brackets, VCSEL brackets, various types of heating pads, thermal bridges, etc., which are mainly used in microwave device packaging, large-scale integrated circuit packaging, hybrid integrated circuit packaging, optoelectronic device packaging, SMD packaging, LED chip packaging, semiconductor packaging and other packaging fields. HTCC ceramic substrate can be sintered with metal materials such as deforestation alloy to make HTCC package shell, which greatly saves the wiring space.

Application of LTCC technology

LTCC products have a wide range of applications, such as various types of cell phones, Bluetooth modules, GPS, PDA, digital cameras, WLAN, automotive electronics, optical drives and so on. Among them, the use of cell phones occupies the main part, about 80% above; followed by Bluetooth module and WLAN. due to the high reliability of LTCC products, the application in automotive electronics is also rising. LTCC products used in cell phones include LC filters, duplexers, function modules, transceiver switching function modules, balanced-unbalanced converters, couplers, power dividers, common mode chokes and so on.

What do you know about the classification of Bluetooth modules

Bluetooth module, is a kind of PCBA board with integrated Bluetooth function, used for short distance wireless communication. According to the function, it is divided into Bluetooth data module and Bluetooth voice module. Bluetooth module refers to the integrated bluetooth function of the chip basic circuit collection, used for wireless network communication, can be roughly divided into three types: data transmission module, bluetooth audio module, bluetooth audio+ data two-in-one module and so on. The general module has the property of semi-finished product, which is processed on the basis of the chip to make the subsequent application more simple.

This article is from the different classification of Bluetooth modules to sort out the type of Bluetooth module, as far as possible from the classification point of view to understand the Bluetooth module has some features and functions.

1.Categorized by protocol type

(1) Classic Bluetooth module

Classic Bluetooth module (BT) refers to Bluetooth protocol support 4.0 or less modules can be subdivided into: traditional Bluetooth module and high-speed Bluetooth module.

Traditional bluetooth module: bluetooth was born at the beginning, the use of BR basic rate technology, the bluetooth theoretical transmission rate, can only reach 721.2Kbps, launched in 2004 to support the bluetooth 2.0 protocol module, the outbreak of the smartphone era, the new EDR bluetooth enhancement rate (Enhanced Data Rate) technology, by improving the multitasking and a variety of bluetooth By improving multitasking and the ability of multiple Bluetooth devices to operate simultaneously, it enables Bluetooth devices to transmit at rates up to 3Mbps, which is three times the transmission rate of Bluetooth 1.2 technology. As a result, in addition to more stable audio streaming and lower power consumption, you can take full advantage of bandwidth to connect multiple Bluetooth devices at the same time.

High-speed Bluetooth module: High-speed Bluetooth module was launched in 2009, the main representative is to support the Bluetooth 3.0 protocol module, the new High Speed technology, you can make Bluetooth call 802.11 WiFi used to achieve high-speed data transmission, the transmission rate of up to 24Mbps, is the traditional Bluetooth module of 8 times.

Classic Bluetooth module is generally used for continuous streaming of audio and data volume is relatively large transmission, such as voice, music, wireless headphones, file transfer between devices, printers, wireless speakers and so on.

 

(2) Bluetooth Low Power Module

LowPower Module (BLE) means a module that supports the 2010 launch of Bluetooth Protocol 4.0 or higher . The biggest feature is the reduction in cost and power consumption . Bluetooth low-power technology uses variable connection time intervals. The interval can be set according to the specific application for a few milliseconds to a few seconds ranging from BLE technology using a very fast connection, so it can be in the “non-connection” state (energy saving), when the connection between the two ends of the link is only necessary to open the link, and then close the link in the shortest possible time. Then the link is closed in the shortest possible time.

Low-power Bluetooth is used in real time. Requirements are relatively high, but low speed, low power consumption of the scene, such as mouse and keyboard, heart rate detectors and thermometers and other sensor devices, smart home, smart wear such as the need for large amounts of data interaction in scenarios, is very suitable for Internet of Things applications.

To sum up, classic Bluetooth is not an outdated version of BLE. Classic Bluetooth and low-power Bluetooth coexist and are used in different applications, which completely depend on the different needs of each person.

2.Categorized by support for protocols

According to the number of Bluetooth protocol stack support can be divided into single-mode module and dual-mode module. The concept of single mode and dual mode is only available after the emergence of BLE Bluetooth. We should choose the required module according to cost, application and function.

 

(1) Single mode module

Single mode module is the module that supports a certain Bluetooth protocol, only the classic Bluetooth (BT) protocol or Bluetooth Low Power (BLE) protocol.

 

(2) Dual mode module

Dual-mode modules are modules that support both the classic Bluetooth (BT) protocol and the low-power Bluetooth (BLE) protocol, and can run two sets of protocol stacks. There are two types of dual-mode modules: Classic Bluetooth (data only)+ BLE and Classic Bluetooth (data+ audio)+ BLE. Dual-mode modules have good flexibility and compatibility.

Bluetooth dual mode is undoubtedly the mainstream of the future. Classic Bluetooth power consumption, 4.0 after Bluetooth BLE, power consumption is small, but does not support the audio protocol and due to data transmission speed limitations, Bluetooth dual mode is a combination of the advantages and disadvantages of the two, can support both audio transmission, can also support data transmission, low power consumption, and compatibility is the sum of the two.

3.Categorized by function

Standing in the Bluetooth module to transmit the size of of the functional point of view content, can be divided into the following categories.

(1) Data module

The general use of more data modules, i.e. Bluetooth low power, also known as Bluetooth transmission module. Because the amount of data is not large, the transmission of proximity, operation and standby power consumption has strict requirements for the device is a good choice. Due to the advantages of power consumption, Bluetooth 4.0 module has now occupied most of the share of mobile data transmission, and the size and share is expected to continue to grow.

(2) Audio Module

The audio module requires a very large bit of streaming data, so it is more suitable for the classic Bluetooth module.

(3) Composite data and audio modules

It can transmit voice, audio and data at the same time. Under the trend of mobile Internet, data+ audio application, the dual mode module with data and audio composite is a good choice.2\According to the protocol support points

4. According to the chip design classification

This is differentiated according to the type of storage used by the Bluetooth chip in the module.

(1) ROM version

In general, the chip manufacturer’s ROM version of the chip, characterised by the chip manufacturer, will be the standard application PROFILES cured in the chip. Usually a fixed function, the user can not modify the program in the chip. Can be connected to an external EEPROM, storage space is small, can be used to store Bluetooth address, device name, PIN code , etc.

Use the ROM version of the chip to do less differentiation of the product, but the development is simple. For some conventional products, they do not need deep customization of the product. The choice of ROM version of the chip can be developed to speed up the development progress, speed up the time to market. Suitable for large-scale mass production, the price is very low, more commonly used for dongles, Bluetooth headset modules, cell phone modules, mouse and keyboard modules, etc., can modify the configuration parameters, but the basic function is fixed. Large-scale civilian products generally use the ROM version of the module, such as USB Bluetooth adapters on the market, because most of the protocol will run inside the PC. The chip processing power requirements are very low, so the chip manufacturer will launch very low-priced products.

(2) FLASH version

Chips are generally built-in FLASH, storage space is large. If you want to do some customer-defined products, such as the need to add some sensors, communication with external MCU, increase Bluetooth protocol or service, you need to use the FLASH version of the chip in the FLASH version of the existing project to add their own engineering code, develop their own firmware, to make a differentiated product. Relatively speaking , it is more flexible.

FLASH version of the chip price is high, but the user can be carried out according to their own application needs, due to the chip built-in FLASH storage, the performance of its performance, while built-in audio codec circuitry, suitable for a variety of voice gateway and other applications. Industrial Bluetooth applications should generally use the FLASH version of the chip produced by the module, fast running, with high integration, high reliability, high performance indicators and other characteristics.

(3) EXT version

EXT module chip without FLASH memory, the need to expand the memory device, the user can carry out application development, characterized by moderate prices, shortcomings are stability, power consumption and other performance differences, while most EXT chip does not have audio decoding circuits, such as the need to realizeio transmission needs to be connected to an external codec device.

5. Classification according to power

In terms of power, there is a difference between low-power Bluetooth and classic Bluetooth.

Low power Bluetooth has no power level, the transmission distance can be more than 100m, 5.0 protocol distance even up to 300m, the specific distance depends on the product design power. The modulation of Bluetooth Low Power technology is slightly different from traditional Bluetooth technology. This different modulation uses a 10mwdb wireless chipset (Low Power Bluetooth’s maximum power) to achieve a connection range of up to 300m, which means that the entire range of homes and buildings can be covered, achieving a more robust and reliable connection.

Classic Bluetooth has three levels of power, expressed in Class. According to the Bluetooth specification, Class is not used to specify distance, but to indicate transmit power. Bluetooth module transmit power parameters are determined, the actual transmit efficiency and RF circuit, antenna efficiency related to the Bluetooth module communication distance and transmit power, reception sensitivity and application environment is closely related to Bluetooth work in the 2.4G band, penetration capacity is poor, in the case of blocking, should be in the actual field to test the communication effect. The purpose of power control is to control the radiation within the limits without interfering with the normal operation of neighboring Bluetooth devices, using the link management protocol to realize the power control algorithm between master and slave devices.

(1) Class 1

Class 1 output power of 1mW (0dBm) to 100mW (20dBm), support for 100m transmission distance, in order to achieve the maximum range, power control is mandatory. Class 1 is used in high-power, long-distance Bluetooth products, but because of the high cost and high power consumption, it is not suitable for cooperation with personal communication products (cell phones, Bluetooth headsets, Bluetooth Dongle, etc.), so it is mostly used in long-distance transmission.

Generally, few people will use long-distance transmission, but if you want to transmit audio over a long distance, connect audio over a long distance, and more commonly in some large-scale venues, stages, and industrial scenarios, using a Bluetooth adapter that supports Class 1 is the best solution.

(2) Class 2

Class 2 output power of 0.25mW (-6dBm) to 2.5mW (4dBm), power control is optional, under normal circumstances 1mW (0dBm) supports 10m transmission distance, as long as the transmitter power can exceed 0dBm is part of the scope of Class 2, but if more than 4dBm, then it is Class 1.

Most of the common Bluetooth devices on the market today are power consumption Class 2, mostly used in cell phones, Bluetooth headsets, Bluetooth Dongle personal communication products, power consumption and smaller size, while easy to carry.

(3) Class 3

Class 3 output power ≤ 1mW (0dBm), support 1m transmission distance. With the lowest output power, Class 3 devices are not common due to their very limited range of coverage.

6. Classification according to the support temperature

(1) Commercial grade

The temperature range is about 0℃~70℃. Generally used in ordinary consumer products, more common in life and lower prices are cheaper. Suitable for environmental conditions (such as temperature, EMC and mechanical stress) at a mild to moderate level in consumer product applications. Such as a variety of consumer electronics, smart home appliances, entertainment devices, mobile computing, cameras, monitors, routers and test equipment.

(2) Industrial Grade

The temperature range is about -40°C to 85°C. Generally used in industrial environments, but also able to operate outdoors where the environment is not so good or where there is interference. Compared to commercial grade products, industrial grade products can withstand more extreme environments, and are suitable, expected, or required to be used in types or qualities for industrial use, such as transportation, factory automation, and high shock and vibration environments.

(3) Automotive grade

The temperature range is approximately -40℃ to 125℃. Generally used in automobiles or harsh environments, due to the high heat generated during the start-up process of automobiles, it will be a bit higher in terms of high temperature and more expensive than industrial grade, which may be subject to high levels of EMI, collision, shock and vibration, and extreme temperatures. This type of product is therefore designed for automotive, transportation and other mission-critical applications and meets industry-standard automotive specifications.

(4) Military Grade

The temperature range is approximately -55℃ to 150℃. Generally used in military equipment, so the requirements are also the most stringent, mainly used in missiles, aircraft, tanks, aircraft carriers and other military fields. Grade is the most advanced, high precision, advanced technology and at the same time expensive, military grade is generally several years ahead of industrial grade time.