High frequency PCB assembly
With precision craftsmanship for superior high-frequency circuit boards, LST Technology can be trusted.
With precision craftsmanship for superior high-frequency circuit boards, LST Technology can be trusted.
Número de capas de fabricación: 1-48 capas
Número de líneas SMT: 8 líneas de apareamiento SMT de alta velocidad
Capacidad de producción diaria SMT: más que 50 millones de puntos
Equipo de inspección: Probador de rayos X, Probador de primera pieza, Probador óptico automático AOI, Probador de TIC, Estación de retrabajo de BGA
Velocidad de montaje: Velocidad de montaje del componente de chip (condiciones óptimas) 0.036S/chip
Paquete mínimo: 0201, precisión de hasta +0.04 mm
Precisión mínima del dispositivo: PLCC, Mf, BGA, Se pueden pegar CSP y otros dispositivos, Espacio de alfiler hasta +0.04 mm
18 años de fabricación de PCB experiencia
Equipo de fabricación autorizado
Adopción de tecnología avanzada y equipos de fabricación
Sistema de producción perfecto
Cambio rápido
Sistema maduro de ISO9001/IATF16949 Sistema de gestión de calidad.
Sistema perfecto de gestión de pedidos ERP y MAS.
Ingenieros de control de costos profesionales
Cooperación con muchas compañías de materias primas.
Inspección DFM gratuita de archivos PCB y BOMS.
Evaluación y asesoramiento de la ingeniería de PCB.
Especializado en médico, automotor, Electrónica de consumo, PCB de nueva energía.
Sirviendo a las empresas globales
High-frequency PCB board refers to a printed circuit board above 1GHz. This definition may be different in the industry. Its physical performance, accuracy, and technical parameters are very high. They are often used in the fields of communication systems, car ADAS systems, satellite communication systems, and radio systems.
High-frequency PCB is a circuit board for high -frequency signal transmission. It has the following characteristics:
1. Low loss: High-frequency PCB uses better materials and special process design, which can reduce the loss of signals during transmission and maintain lower signal attenuation.
2. Low noise: Special design and shielding technology adopted by high-frequency PCB can reduce the generation and dissemination of noise, and provide clean signal output.
3. Good impedance matching: High -frequency PCB can achieve effective impedance matching with other high-frequency devices through accurate design and debugging to improve the efficiency of signal transmission.
4. Strong anti-interference ability: High-frequency PCB has good anti-interference ability, can work normally in a complex electromagnetic environment, and reduce the impact of external interference on signals.
5. The dielectric constant is small and stable: En general, the smaller the dielectric constant, the better because the square root of the signal transmission rate is the opposite of the square root of the material of the material. Al mismo tiempo, the medium consumption requirements are small because this will mainly affect the quality of signal transmission.
6. Thermal expansion coefficient is consistent with copper foil: If the thermal expansion coefficient is not synchronized, it will cause copper foil to be separated during hot and cold.
7. Excellent heat resistance, chemical resistance, impact strength and separation strength: These characteristics ensure the stability and reliability of high-frequency PCB in harsh environments.
Satellite communications
Wearable device
Medical diagnostic equipment
Equipo industrial
We manufacture high-frequency PCBs with frequency typically in the range from 500MHz to 2GHz.
Característica | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 2 – 42capas |
Order Quantity | 1pc – 10000+pcs |
Build Time | 2días – 5weeks |
Material | RO4003C, RO4350B, Ro3003, Ro3010, RT5880 |
PP | Rogers 4450F, Domestic-(25FR), Domestic-(RF-27), Domestic-(6700) |
Board Size | Min 6mm x 6mm | Max 457mm x 610mm |
Espesor de la tabla | 0.4mm – 5.0mm |
Copper Weight(Finished) | 0.5onz – 2.onz |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Verde, Blanco, Azul, Negro, Rojo, Amarillo |
Silkscreen Sides | As per the file |
Color silscreen | Blanco, Negro, Amarillo |
Surface Finish | Electroless nickel/immersion gold (ENIG) – RoHS |
Immersion silver – RoHS | |
Immersion tin – RoHS | |
Organic solderability preservatives – RoHS | |
Min Annular Ring | 4mil |
Min Drilling Hole Diameter | 6mil |
Impedance tolerance | ±10% |
Other Techniques | Peelable solder mask |
Gold fingers | |
Carbon oil | |
Countersink holes |
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