* Number of layers: Multicapa
* Insulation material: organic resin
* Insulation resin: epoxy resin
* Whether customized: can be customized
* Number of SMT lines: 7 high-speed SMT mating lines
* SMT daily production capacity: more than 50 million points
* Testing equipment: X-RAY tester, first piece tester, AOI automatic optical tester, ICT tester, BGA rework station
* Mounting speed: CHIP component mounting speed (optimal conditions) 0.036S/chip
* Minimum package: 0201, accuracy up to +0.04mm
* Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be pasted, pin spacing up to +0.04mm
* IC-type placement accuracy: the mounting of ultra-PCB boards, flexible PCB boards, gold fingers, etc.. has a high level, can be mounted/inserted/mixed TFT display driver boards, cell phone motherboards, battery protection circuits and other difficult products、

The main board of the MRI machine is manufactured using the crimping process, which is technically safer and more reliable. Crimping is a technique in which a tool or device is used to connect wires to terminals by compressing and displacing the metal within specified limits through compressive force. Benefits of this process include reliable connections, high productivity and the ability to accommodate automated production. Crimping is used in a wide range of electrical, médico, electronic and automotive applications.

Technical advantages of the crimping process

1.High reliability: crimp connector technology is reliable, even in high vibration and thermal cycling environments.

2.High repeatability: crimp connector technology ensures a perfect fit every time, the failure rate is 100 times lower than hand soldered components, the technology eliminates any risk of imperfect surface-to-surface bonding and improves the reliability of electronic components.

3.High flexibility: crimp connector technology for a variety of PCB thickness leaves room for one or both sides of the receiving PCB, and these components are also suitable for mass production.