Impacto mecánico del diseño de las dimensiones de la almohadilla de PCB en el Tombstoning durante las soluciones de optimización y soldadura por reflujo SMT
desecho (Manhattan Effect) is one of the most common failure issues in SMT reflow soldering of miniature surface-mount components such as 0201 y 0402 paquetes. The core cause is the imbalance of solder joint forces at both ends of the component. This article starts from the principles of mechanics and provides an in-depth analysis of […]






