Entradas de]

Proceso de fabricación de PCB médicos.

04/17/2024 en /por

As technology rapidly advances, the medical industry’s demand for electronic products is also growing. Among the various electronic components, PCBs undoubtedly play an indispensable role in medical devices. Sin embargo, the requirements and standards for PCBs in the medical industry far exceed those in other sectors. Why is this so? This article will explore the high demands and standards of the medical industry for PCBs. En este artículo, we will discuss the manufacturing process of medical PCBs.

Importance of PCBAs in Medical Devices

  1. Precision: Medical devices require a high level of precision to ensure accurate diagnosis and effective treatment. Any defects or errors in the circuit board could lead to equipment failure or provide incorrect information, posing serious risks to patients’ health.
  2. Fiabilidad: Medical devices often need to operate in continuous working environments, placing high demands on the reliability of the circuit boards. Sudden equipment failures could result in surgery interruptions, data loss, or other medical accidents.
  3. Seguridad: Medical devices are directly related to patients’ lives and health, so the design and manufacturing of their circuit boards must comply with strict safety standards. This includes, but is not limited to, compatibilidad electromagnética, overheat protection, and fire prevention.
  4. Miniaturización: Con avances tecnológicos, many medical devices are pursuing smaller sizes and higher levels of integration. This requires circuit board designs to be more compact, with finer connections between components.

Material Selection and Performance

In the surface mounting process of medical device PCBA, the selection of PCB materials is crucial. Commonly used PCB materials include FR-4 (glass fiber reinforced epoxy resin), metal substrates (such as aluminum substrates), ceramic substrates, etcétera. Different materials have different performance characteristics, and it is necessary to choose the appropriate materials according to the operating environment and requirements of medical devices.

▶ Thermal Stability: Medical devices may operate in high-temperature environments, so the thermal stability of PCBs is crucial to avoid performance issues caused by thermal expansion and contraction in high-temperature environments.

▶ Mechanical Strength: PCBs need to have sufficient mechanical strength to prevent breakage during transportation, installation, or use, ensuring the stability and durability of medical devices.

Hierarchy Structure and Design Layout

Medical devices typically require high integration, so the hierarchy structure and design layout of PCBs are particularly important. A reasonable hierarchy structure and layout design can minimize signal interference, improve circuit stability, and reliability to the maximum extent.

▶ Layered Design: For complex medical devices, multi-layer PCBs can be used to distribute different functional modules on different layers, reducing signal interference and improving the circuit’s anti-interference ability.

▶ Reasonable Wiring: A reasonable wiring design can reduce signal transmission paths, decrease signal delay, increase signal transmission speed, and avoid interference caused by signal cross-talk.

Pad Design and Process Requirements

The design of pads on the PCB and the process requirements for surface mounting are closely related. Proper pad design and process can ensure a good connection between surface-mount components and the PCB, preventing soldering defects and cold joints.

▶ Pad Size and Spacing: Different sizes and types of surface-mount components require pads of appropriate size and spacing to ensure soldering stability and reliability.

▶ Pad Shape: Different shapes of pads are suitable for different types of soldering processes, such as Surface Mount Technology (Smt) and through-hole soldering technology. Choosing the appropriate pad shape can improve soldering efficiency and quality.

Fabricación de PCB médicos

Manufacturing Process of Medical PCBA

  1. Diseño de PCB: Engineers use professional software to design the circuit board according to the requirements and specifications of the device. Once the design is completed, el Fabricante de PCB produces the bare board based on the design.

  2. Adquisición de componentes: The procurement team purchases the required electronic components based on the Bill of Materials (Proseperar). These components may include resistors, condensadores, inductores, IM (circuitos integrados), etc..

  3. SMT Mounting: Electronic components are precisely mounted onto the PCB using a pick-and-place machine. This process is automated to ensure speed and accuracy.

  4. Soldadura: Components are soldered onto the PCB using reflow soldering or other soldering methods.

  5. Prueba e inspección: The completed PCBA undergoes quality inspection and functional testing using AOI (Inspección óptica automatizada) equipment and other testing tools to ensure it meets design requirements and quality standards.

  6. Assembly and Encapsulation: The tested and qualified PCBA is assembled with other components (such as displays, baterias, etc.) to form a complete medical device.

Challenges and Trends in Medical Device PCBA

  1. Technological Challenges: With the continuous advancement of medical technology, the requirements for circuit boards in devices are also increasing. Por ejemplo, many advanced imaging systems require processing large amounts of data, placing high demands on the transmission speed and processing capabilities of circuit boards.

  2. Regulatory Compliance: The medical device market is subject to strict regulatory oversight, and manufacturers must ensure that their products comply with various safety and performance standards. This requires PCBA manufacturers to have a high sense of responsibility and expertise.

  3. Gestión de la cadena de suministro: Due to the uncertainty of the global supply chain and issues of component shortages, medical device manufacturers need to pay more attention to supply chain management and optimization to ensure production stability and cost-effectiveness.

  4. Sustainable Development: With the increasing environmental awareness, manufacturers need to consider sustainability issues in the manufacturing process, such as using environmentally friendly materials and reducing waste generation.

Medical PCBA is closely related to patient health, so it is essential to maintain the accuracy and stability of the equipment. Por lo tanto, when choosing a medical PCB manufacturer, it is necessary to consider multiple factors. If you need medical PCBs, you can choose LST, con 16 years of experience in medical Fabricación de PCB and a professional team worthy of trust.

Guía de fabricación y aplicación de placas de desarrollo.

04/15/2024 en /por

Las placas de desarrollo son placas de circuitos que se utilizan para el desarrollo de sistemas integrados., que comprende una serie de componentes de hardware que incluyen unidades centrales de procesamiento, memoria, dispositivos de entrada, dispositivos de salida, rutas/buses de datos, e interfaces de recursos externos. Típicamente, Los desarrolladores de sistemas integrados personalizan las placas de desarrollo según sus necesidades de desarrollo., o los usuarios pueden diseñarlos por su cuenta. Las placas de desarrollo sirven como un medio para que los principiantes comprendan y aprendan tanto sobre el hardware como sobre el software de los sistemas.. Además, Algunas placas de desarrollo proporcionan entornos de desarrollo integrados básicos., código fuente del software, y esquemas de hardware. Los tipos comunes de placas de desarrollo incluyen 51, BRAZO, FPGA, y placas de desarrollo DSP.

El papel de las juntas de desarrollo:

Las placas de desarrollo sirven como plataformas integradas que facilitan el desarrollo de sistemas integrados y al mismo tiempo reducen las barreras y los riesgos asociados con él.. Desempeñan los siguientes roles:

  1. Prototipado y validación: Las placas de desarrollo permiten a los desarrolladores construir rápidamente prototipos de sistemas integrados y realizar depuraciones y pruebas conjuntas de software y hardware para validar la funcionalidad y el rendimiento del sistema.. También simulan entornos del mundo real., Reducir las incertidumbres y los riesgos durante el proceso de desarrollo..

  2. Desarrollo de aplicaciones: Las placas de desarrollo proporcionan diferentes plataformas de hardware y soporte de software para diversas necesidades de aplicaciones., haciendo que sea conveniente para los desarrolladores crear aplicaciones. Por lo general, ofrecen abundantes interfaces periféricas y bibliotecas de software., permitiendo una implementación rápida de varias funciones de la aplicación.

  3. Educación y formación: Las placas de desarrollo también se utilizan para educación y formación., Ayudar a estudiantes y principiantes a comprender los principios y métodos de desarrollo de los sistemas integrados.. Suelen tener costes bajos y son fáciles de usar., haciéndolos adecuados para el aprendizaje práctico y la experimentación..

  4. Mejorar la eficiencia del aprendizaje: En términos de aprendizaje, Las juntas de desarrollo pueden mejorar eficazmente la eficiencia del aprendizaje y acortar el proceso de desarrollo..

Ventajas de las placas de desarrollo.:

  1. creación rápida de prototipos: Las placas de desarrollo ayudan a los desarrolladores a diseñar prototipos rápidamente y a validar sus diseños de manera eficiente..
  2. Fácil portabilidad: Las placas de desarrollo son muy versátiles y se pueden migrar fácilmente a otras plataformas de hardware..
  3. Abundantes periféricos: Las placas de desarrollo suelen ofrecer una amplia gama de periféricos e interfaces., atendiendo a diversos escenarios de aplicación.
  4. Ahorro de costes: Comparado con el diseño y fabricación de prototipos de hardware desde cero., El uso de placas de desarrollo puede ahorrar en costos de desarrollo..
  5. Soporte de software y sistema predeterminado: Muchas placas de desarrollo vienen con soporte de software y sistema predeterminado, reduciendo la carga de trabajo para los desarrolladores.

Placa de desarrollo-4

Componentes de una placa de desarrollo

Una placa de desarrollo es un conjunto complejo de múltiples componentes electrónicos., cada uno de los cuales tiene un propósito específico. Los elementos principales se pueden dividir en varias categorías.:

Microcontrolador/Microprocesador
Este componente es el cerebro de la placa de desarrollo., ejecutar programas de software y controlar otros periféricos.

Memoria
Incluye tanto volátiles (RAM) y no volátil (Destello, Eeprom) Almacenamiento para almacenamiento y ejecución de código de programa..

Entrada/Salida (E/S) Interfaces
Estos hacen posible que la placa se comunique con otros dispositivos o partes.. Los ejemplos incluyen E/S digitales, entradas analógicas, e interfaces de comunicación como USB, Uart, y SPI.

Proceso de fabricación de placas de circuito de desarrollo.

  1. Determinar los requisitos y funcionalidades de la placa de desarrollo.: Antes de hacer una placa de desarrollo, Es fundamental aclarar sus requisitos y funcionalidades., incluyendo las interfaces necesarias, frecuencia operativa, tipo de procesador, etc.. Sólo con una comprensión clara de las funciones y requisitos de la placa se puede continuar con el diseño y la fabricación posteriores..

  2. Diseñar el esquema del circuito.: Una vez determinados los requisitos y funcionalidades de la placa de desarrollo., Es necesario diseñar el esquema del circuito.. Al diseñar el esquema., Las consideraciones deben incluir los métodos de conexión entre varios módulos de circuito., parámetros específicos de los módulos de circuito, etc.. Software de diseño de circuitos profesional como Altium Designer, protel, etc., Normalmente se utiliza para este proceso..

  3. Diseño de disposición de PCB: Después de completar el diseño esquemático del circuito., El diseño de la PCB es el siguiente. El diseño del diseño de PCB implica organizar componentes y trazas del esquema del circuito en la placa de circuito real.. Los factores a considerar durante el diseño del diseño incluyen las dimensiones del tablero., distancias entre componentes, enrutamiento de seguimiento, etc.. Profesional Diseño de PCB software como PADS, Diseñador avanzado, etc., se utiliza para este proceso.

  4. fabricación de placas PCB: Una vez que se completa el diseño de la PCB, la placa PCB diseñada debe fabricarse. La fabricación de placas PCB suele implicar técnicas como la fotolitografía., aguafuerte, etc., y el proceso debe realizarse en un entorno de laboratorio limpio. La placa PCB fabricada debe someterse a pruebas de calidad para garantizar que no haya problemas como fugas de cobre., cortocircuitos, etc..

  5. soldadura de componentes: Después de la fabricación de la placa PCB, Es necesario soldar varios componentes en la placa PCB.. Soldar requiere atención a factores como la temperatura., duración, etc., para garantizar la calidad de la soldadura. Después de soldar, Se realizan pruebas para garantizar una buena calidad de la unión..

  6. programación de software: Una vez que el hardware esté completo, se requiere programación de software. La programación de software generalmente implica el uso de lenguajes de programación como C., lenguaje ensamblador, etc., escribir programas que controlen varios módulos de la placa de desarrollo. Los programas escritos necesitan pruebas para garantizar la corrección y la estabilidad..

  7. Depuración y prueba: Después de la programación del software, Se llevan a cabo depuraciones y pruebas.. Este proceso implica el uso de instrumentos y herramientas de prueba profesionales como osciloscopios., analizadores lógicos, etc., para garantizar el funcionamiento normal de los módulos de la placa de desarrollo.

  8. Encapsulación y producción.: Después de completar la depuración y las pruebas, La placa de desarrollo se puede encapsular y poner en producción.. La encapsulación implica colocar la placa de desarrollo en una carcasa para protegerla de influencias ambientales externas.. La producción implica la fabricación en masa de la placa de desarrollo para satisfacer la demanda del mercado..

Resumen:

Las placas de circuitos de desarrollo desempeñan un papel crucial en el campo de la fabricación de productos electrónicos., ofreciendo excelentes soluciones a los desafíos del diseño electrónico. Si necesita placas de circuito de desarrollo, por favor contáctenos.

La aplicación y características técnicas de LTCC PCB.

04/11/2024 en /por

LTCC (Low Temperature Co-fired Ceramic) refers to a process where multiple layers of ceramic green sheets, printed with conductive metal patterns and interconnected vias, are stacked together after precise alignment and then co-fired at temperatures below 900°C to form a monolithic multilayer interconnect structure.

This technology allows for increased wiring density and shorter interconnect distances, as well as the independent design of circuits on each layer of the substrate, enabling the realization of circuits with three-dimensional structures.

Además, the surface of the multilayer ceramic substrate can be used to mount bare chips by cavity mounting or to install other circuit components by surface mounting, utilizing inter-layer vias and internal circuits for connectivity. This greatly enhances the assembly density of circuits, meeting the requirements of electronic devices for circuit miniaturization, high density, multifunctionality, alta confiabilidad, and high transmission rates.

Applications of LTCC PCB

LTCC PCBs are widely used in various applications that require high performance, fiabilidad, and operation in harsh environments. Some key application areas include:

  1. Aeroespacial y defensa: LTCC multilayer ceramics are used in aerospace electronic systems, radar systems, missile guidance systems, and other military applications that require high reliability, resistance to harsh environments, and high-frequency performance.

  2. Electrónica automotriz: The excellent thermal performance and reliability of LTCC PCBs make them suitable for automotive applications, such as engine control units, sensores, and Advanced Driver Assistance Systems (Adas).

  3. Telecommunications: LTCC technology is widely used in high-frequency applications in the telecommunications industry, such as RF front-end modules, power amplifiers, and antenna arrays for cellular base stations and satellite communications.

  4. Dispositivos médicos: The biocompatibility and hermetic sealing capability of LTCC PCBs make them suitable for implantable medical devices, such as pacemakers, cochlear implants, and neurostimulators.

  5. Industrial Sensors and Controls: LTCC multilayer ceramics are used in various industrial applications due to their ruggedness and tolerance to extreme temperatures, vibraciones, y quimicos. This includes pressure sensors, flow meters, and harsh environment monitoring systems.

Manufacturing Process of LTCC PCB

The production process of Low Temperature Co-fired Ceramic (LTCC) PCB typically involves the following steps:

  1. Film Removal: Remove the film layer on the surface of the glass fiber board, usually done using an alkaline solution.

  2. Perforación: Punch holes on the ceramic board according to the requirements of the circuit diagram.

  3. Organización: Mold solder pads and component positions on the ceramic board according to the requirements of the PCB.

  4. Coating: Apply coating on the surface of the shaped PCB to enhance its mechanical strength.

  5. Sintering: Subject the coated PCB to high-temperature sintering to achieve ceramicization and hardening of the PCB.

  6. Processing: Perform processes such as adhesive application and cleaning.

Material Selection for LTCC PCB

The materials used in the fabrication of LTCC PCBs include circuit layers, inner layer vias, hook holes, solder resist films, ceramic powders, silicon nitride, etc.. Entre ellos, ceramic powder is the primary raw material for making LTCC PCBs. The quality and performance of the selected ceramic powder determine the reliability and stability of the PCB. It is recommended to choose high-purity ceramic powder to ensure that the produced PCB has sufficient mechanical strength and durability.

Testing Specifications for LTCC PCB

The produced LTCC PCBs need to undergo relevant tests to ensure their quality and stability. The main testing specifications include:

  1. Solderability Test: Assessing the soldering quality of solder pads and wires on the PCB.

  2. Prueba de resistencia de aislamiento: Measuring whether the insulation resistance of the PCB meets specified requirements.

  3. Metal Adhesion Test: Evaluating the adhesion between the conductive layer on the PCB surface and the ceramic substrate.

  4. Thermal Shock Test: Assessing the stability and reliability of the PCB under rapid temperature changes.

  5. Low-Temperature Constant Stress Test: Evaluating the stability and reliability of the PCB under specified temperature and stress conditions.

LTCC pcb-2

Advantages of LTCC Integration Technology

Technological Advantages:

  1. Ceramic materials possess excellent high-frequency, transmisión de alta velocidad, and wide bandwidth characteristics. Depending on the composition, the dielectric constant of LTCC materials can vary within a wide range. When combined with high-conductivity metal materials as conductors, it helps improve the quality factor of the circuit system, increasing the flexibility of circuit design.

  2. LTCC can meet the requirements of high current and high temperature resistance, and it has better thermal conductivity than ordinary PCB circuit substrates. This greatly optimizes the thermal design of electronic devices, enhances reliability, and can be applied in harsh environments, extending their service life.

  3. It can produce circuit boards with a high number of layers, and multiple passive components can be embedded within them, eliminating the cost of packaging components. On high-layer three-dimensional circuit boards, integration of passive and active components facilitates increased circuit assembly density, further reducing volume and weight.

  4. It has good compatibility with other multilayer wiring technologies. Por ejemplo, combining LTCC with thin-film wiring technology can achieve hybrid multilayer substrates and hybrid multi-chip components with higher assembly density and better performance.

  5. Discontinuous production processes facilitate quality inspection of each layer of wiring and interconnection holes before final product assembly. This helps improve the yield and quality of multilayer boards, shorten production cycles, and reduce costs.

  6. Energy saving, material saving, green, and environmental protection have become irresistible trends in the component industry, and LTCC meets this development demand. It minimizes environmental pollution caused by raw materials, waste, and production processes to the greatest extent.

Application Advantages:

  1. Easy to achieve more wiring layers, increasing assembly density.

  2. Convenient for embedding components internally, enhancing assembly density and achieving multifunctionality.

  3. Facilitates quality inspection of each layer of wiring and interconnection holes before substrate firing, which is beneficial for improving the yield and quality of multilayer boards, shortening production cycles, and reducing costs.

  4. Exhibits excellent high-frequency and high-speed transmission characteristics.

  5. Easy to form various structures of cavities, thus enabling the realization of high-performance multifunctional microwave MCMs (Multichip Modules).

  6. Possesses good compatibility with thin-film multilayer wiring technology. Combining the two can achieve hybrid multilayer substrates and hybrid multichip components (MCM-C/D) with higher assembly density and better performance.

  7. Easy to realize integration of multilayer wiring and packaging, further reducing volume and weight, and improving reliability.

Technical Features:

Utilizing LTCC for the fabrication of chip-type passive integrated devices and modules offers several advantages:

  1. Ceramic materials exhibit excellent high-frequency and high Q-factor characteristics.

  2. The use of high-conductivity metal materials as conductor materials helps improve the quality factor of the circuit system.

  3. It can adapt to high current and high-temperature requirements and possesses better thermal conductivity than ordinary PCB circuit boards.

  4. Passive components can be embedded into multilayer circuit boards, facilitating increased circuit assembly density.

  5. It has favorable temperature characteristics, such as a small coefficient of thermal expansion and a small temperature coefficient of dielectric constant, allowing for the production of extremely high-layer circuit boards and structures with line widths smaller than 50μm. Además, the discontinuous production process allows for inspections of the green substrate, thereby enhancing yield and reducing production costs.

The future development trends of LTCC technology, as an advanced passive component miniaturization technique, will focus on further enhancing integration, miniaturización, high-frequency capability, y confiabilidad. With the increasing demand for high-performance and high-reliability electronic products in fields such as electronics, comunicación, and automotive industries, LTCC technology is expected to play a crucial role in more application scenarios, driving sustained and stable market growth. Además, with technological advancements, the layer count of LTCC technology may further increase, enabling more efficient circuit designs and superior performance.

Inspection standard for PCBA processing

04/09/2024 en /por

Conjunto de placa de circuito impreso (PCBA) inspection is a crucial process in electronic device manufacturing. It involves examining the quality of PCBs and their components to ensure they meet necessary specifications and standards. PCBA inspection is a vital aspect of quality control as it helps prevent defects and failures in the final product. En este artículo, we will discuss in detail the inspection and acceptance criteria for PCBA boards.

PCBA Inspection Process

The PCBA inspection process typically involves a combination of automated and manual checks. The first step of the process is visual inspection, which includes examining the PCB for any physical defects such as cracks, scratches, or damage to solder mask layers. This is usually manually performed by trained inspectors using magnifying glasses or microscopes.

The next step is Automated Optical Inspection (AOI), which uses cameras and software to detect defects such as missing components, misaligned components, and soldering defects. AOI is a fast and accurate inspection method capable of detecting defects that may be difficult for humans to identify.

Following AOI, the circuit board may undergo X-ray inspection, which is used to detect defects in hidden areas such as solder joints beneath surface-mounted components. X-ray inspection is particularly useful for detecting defects like voids in solder joints, which may be challenging to detect using other methods.

PCBA Component Design and Inspection Specifications

Inspection Preparation: Inspectors must wear anti-static gloves and wristwatches and prepare tools such as calipers, electrical performance parameter instruments, etc..

  1. Technical Requirements

1.1 PCBA component boards must use materials with a flame retardancy rating of 94-V0 or above, with corresponding UL yellow cards.

1.2 The appearance of PCBA component boards should be free of rough burrs, poor cutting, and layer cracking.

1.3 The dimensions, apertures, and margins of PCBA component boards must comply with the engineering drawings’ requisitos, with a tolerance of ±0.1mm unless otherwise specified. The thickness of the boards should be 1.6±0.1mm unless otherwise specified.

1.4 PCBA components must print the production (diseño) fecha, UL symbol, certificate number, 94V-0 character, factory logo, and product model. If the PCBA component consists of multiple PCB boards, the rest of the PCB boards should also print the above content.

1.5 The printed symbols and font sizes should be clear and distinguishable.

1.6 If PCBA components use resistor-capacitor voltage reduction circuits, they must use half-wave rectification circuits to improve circuit safety and stability.

1.7 If PCBA components use switch-mode power supply circuits, the standby power consumption must be less than 0.5W.

1.8 European products using PCBA must have standby power consumption less than 1W. For the US version of PCBA, if customers have special requirements, standby power consumption should be executed according to technical requirements.

1.9 Except for power indicator lights using φ5 amber high-brightness scattering, the rest should use full green or full red φ3 high-brightness scattering.

1.10 PCBA components specify the live wire (ACL), neutral wire (ACN), relay common terminal wire (ACL1), high-grade or continuous wire (HI), and low-grade wire (LO).

1.11 The solder fuse and CBB capacitor (resistor-capacitor circuit) of PCBA components must be on the live wire (ACL).

1.12 ACL1 must be connected to the live wire, HI or LO must be connected to one end of the heating body each, and the common terminal of the heating body must be connected to the neutral wire.

1.13 The solder joints of PCBA components must not have virtual soldering, continuous soldering, or desoldering. The solder joints should be clean, uniform, and free of bubbles, pinholes, etc..

  1. Component Selection

2.1 PCBA component elements should be prioritized from reputable brand manufacturers, followed by manufacturers that meet international or industry standards; manufacturers with proprietary standards should not be used.

2.2 circuito integrado (CI) components should be industrial-grade ICs.

2.3 Connector plugs and terminals must have UL certification and provide certificates.

2.4 Resistor components should use metal film resistors with clear color bands, and manufacturers should meet industry standards.

2.5 Electrolytic capacitor components should use explosion-proof capacitors with a working temperature of -40 to 105°C, and manufacturers should meet industry standards.

2.6 Crystal oscillator components should use crystal elements; RC or chip-embedded options are not recommended. Manufacturers should meet international standards.

2.7 Diodes or transistors should be selected from reputable domestic brands that meet industry standards.

2.8 Tilt switches should use infrared photoelectric types and avoid mechanical types.

2.9 Specified component surfaces must be printed with clear and visible UL/VDE/CQC symbols, trademarks, parámetros, etc..

2.10 Relevant wires must have UL/VDE symbols, wire specifications, certification numbers, manufacturer names, etc., clearly visible.

  1. Prueba e inspección

3.1 PCBA components are mounted on the corresponding test fixtures, and voltage frequency parameters are adjusted accordingly.

3.2 Verify whether the self-check function of the PCBA components meets the requirements of the functional specifications. Check for abnormal sounds in relay outputs and uniform brightness in fully lit LEDs.

3.3 Verify whether the placement of the tilt device and the output function during tilting comply with the functional specifications.

3.4 Check whether the output function and fault indication of the PCBA components meet the functional specifications when the temperature probe is disconnected or shorted.

3.5 Verify whether the output of each button function of the PCBA components meets the requirements of the functional specifications.

3.6 Check whether the temperature indicated by the environmental temperature indication LED or digital display of the PCBA components complies with the functional specifications.

3.7 Verify whether the power status indication LED of the PCBA components meets the functional specifications.

3.8 Check whether the smart control operation mode of the PCBA components complies with the functional specifications.

3.9 Verify whether the continuous operation mode of the PCBA components complies with the functional specifications.

3.10 Check whether the standby power consumption of the PCBA components complies with the functional specifications.

3.11 Adjust the voltage to 80% of the rated voltage, and check for abnormal sounds in relay outputs and uniform brightness in LEDs.

3.12 Adjust the voltage to 1.24 times the rated voltage, and check for abnormal sounds in relay outputs and uniform brightness in LEDs.

PCBA General Appearance Inspection specification

  1. Solder Joint Contact Angle Defect: The wetting angle between the angle solder fillet and the terminal pad graphic endpoint exceeds 90°.

  2. Standing: One end of the component is raised or standing up from the solder pad.

  3. Short Circuit: The solder between two or more solder joints that should not be connected, or the solder of the solder joint is connected to adjacent wires.

  4. Open Solder: The component leads are not soldered to the PCB solder pads.

  5. False Solder: The component leads are seemingly connected to the PCB solder pads but are not actually connected.

  6. Cold Solder: The solder paste at the solder joint is not fully melted or does not form a metal alloy.

  7. Insufficient Solder (Insufficient Fill): The solder area or height of the component terminal and PAD does not meet the requirements.

  8. Excessive Solder (Excessive Fill): The solder area or height of the component terminal and PAD exceeds the requirements.

  9. Solder Joint Blackening: The solder joint is blackened and lacks luster.

  10. Oxidation: Chemical reaction has occurred on the surface of components, circuits, PADs, or solder joints, resulting in colored oxides.

  11. Displacement: The component deviates from the predetermined position in the plane of the solder pad horizontally, vertically, or rotationally (based on the centerline of the component and the centerline of the solder pad).

  12. Polarity Reversal: The orientation or polarity of components with polarity does not match the requirements of documents (Proseperar, ECN, component position diagram, etc.).

  13. Float Height: There is a gap or difference in height between the component and the PCB.

  14. Wrong Part: The specifications, models, parámetros, and forms of the components do not match the requirements of documents (Proseperar, samples, customer data, etc.).

  15. Solder Tip: The component solder joint is not smooth and has a pulled tip condition.

  16. Multiple Parts: The positions of parts that should not be mounted according to the BOM, ECN, or samples, or there are surplus parts on the PCB.

  17. Missing Parts: The positions on the PCB where parts should be mounted according to the BOM and ECN or samples, but no parts are present.

  18. Misalignment: The position of the component or component pin has shifted to other PADs or pin positions.

  19. Open Circuit: PCB circuit is disconnected.

  20. Side Mounting: Sheet-like components with differences in width and height are mounted sideways.

  21. Reverse Side (Upside Down): Two symmetrical faces of components with differences are swapped (P.EJ., faces with silk screen markings are inverted vertically), common in chip resistors.

  22. Solder Ball: Small solder points between component pins or outside PADs.

  23. Bubbles: There are bubbles inside solder joints, componentes, or PCBs.

  24. Soldadura (Solder Climb): The solder height of the component solder joint exceeds the required height.

  25. Solder Cracking: The solder joint has a cracked condition.

  26. Hole Plugging: PCB plug-in holes or vias are blocked by solder or other substances.

  27. Damage: Componentes, board bottom, board surface, lámina de cobre, circuits, vías, etc., have cracks, cuts, or damage.

  28. Unclear Silk Screen: The text or silk screen on the component or PCB is blurry or has broken lines, making it unrecognizable or unclear.

  29. Dirt: The board surface is unclean, with foreign objects or stains, etc..

  30. Scratches: Scratches or exposed copper foil on the PCB or buttons, etc..

  31. Deformation: The component or PCB body or corners are not on the same plane or are bent.

  32. Bubbling (Delamination): PCB or components delaminate from the copper plating and have gaps.

  33. Glue Overflow (Excess Glue): Excessive amount of red glue (or overflow) exceeds the required range.

  34. Insufficient Glue: The amount of red glue is insufficient or does not meet the required range.

  35. Pinhole (Concavity): There are pinholes or concavities on PCBs, PADs, solder joints, etc..

  36. Burr (Peak): The edge or burr of the PCB board exceeds the required range or length.

  37. Gold Finger Impurities: There are dots, tin spots, or solder resist oil abnormalities on the surface of the gold finger plating.

  38. Gold Finger Scratches: There are scratch marks or exposed copper on the surface of the gold finger plating.

How to help box build assembly manufacturers assemble products

04/07/2024 en /por

Montaje de compilación de caja is an essential production method for electronic products. Manufacturers meticulously assemble various electronic components, módulos, and parts according to specific designs and process requirements, precisely fitting them inside a casing to create a complete and fully functional electronic enclosure structure. During the assembly process, customers must provide certain assistance to the manufacturer to ensure the swift completion of the box assembly. En este artículo, we will discuss the assistance that customers should provide. Here are the details:

What is box build assembly?

Box build assembly refers to the process of fitting electronic components, including printed circuit boards (PCBS) and cables, into a fully enclosed chassis or housing. Precision and stability are crucial in electronic box assembly. Assembly personnel must strictly adhere to process requirements to ensure that each component is correctly and accurately installed in its designated position, and that all connections are securely reliable.

Benefits of Box Build Assembly

Some key benefits of utilizing box build assembly services:

▶Faster time-to-market – Using an experienced contract manufacturer speeds up product development and launch.
▶Focus on core competencies – Brands can focus on design and innovation while the EMS provider handles manufacturing.
▶Cost savings – Specialized manufacturers enjoy economies of scale in procurement and production.
▶Quality and reliability – Established EMS providers have robust quality control and testing capabilities.
▶Flexibility and scalability – Production volumes can be rapidly scaled up or down.
▶One-stop-shop – The EMS provider handles sourcing, asamblea, pruebas, logística, repairs, etc..

Industries Using Box Build Manufacturing

Some common industries that rely on box build assembly services:

▶Consumer electronics – Game consoles, home theaters, smart speakers
▶Industrial equipment – Power supplies, motor drives, automation controls, test instruments.
▶Telecom/networking – Routers, interruptores, servidores, estaciones base.
▶Medical devices – Imaging systems, analyzers, monitors.
▶Automotive – Navigation systems, EV charging stations, auto infotainment.
▶Kiosks and vending – Self-checkout, ticketing kiosks, vending machines.
▶Defense and aerospace – Ruggedized electronics, avionics boxes.

How to help box build manufacturers

In the process of box assembly for electronic products, manufacturers and customers need to collaborate closely to produce high-quality products. En esta sección, we will discuss the assistance that customers can provide to manufacturers.

  1. Demand Feedback and Market Insights:
  • Customers can provide specific requirements for box assembly products, helping manufacturers better understand market trends and customer needs.
  • Sharing usage experiences, improvement suggestions, and potential market opportunities regarding box assembly products can assist manufacturers in adjusting product designs and marketing strategies.
  1. Technical Support and R&D Collaboration:
  • If customers have expertise in relevant fields, they can offer technical support to help manufacturers solve technical challenges or optimize product designs.
  • In terms of new product development, customers can act as partners, jointly investing resources in research and development to achieve technological innovation and product upgrades.
  1. Providing Schematic Diagrams and Layouts of the Enclosure Structure:
  • Providing schematic diagrams and layouts aims to give manufacturers a clear understanding of the appearance inside the cabinet, enabling them to engage in the work more efficiently.
  1. Providing Quality Control and Inspection Standards:
  • Customers can provide stringent quality control requirements and inspection standards to help manufacturers improve product quality and reliability.
  • By participating in the product testing phase, customers can promptly identify potential issues and provide improvement suggestions, ensuring that the product meets market and customer expectations.
  1. Supply Chain Optimization and Raw Material Recommendations:
  • Customers can share their supply chain management experience to help manufacturers optimize processes such as raw material procurement, inventory management, and logistics.
  • Recommending reliable raw material suppliers or providing information on alternative materials can help manufacturers reduce costs and improve production efficiency.

LST（leadsin technology）participated in ITES Shenzhen Industrial Exhibition

03/29/2024 en /por

The 25th ITES Shenzhen Industrial Exhibition was launched on March 28 at the Baoan International Convention and Exhibition Center. This exhibition focuses on two cores: high -end equipment industry cluster and advanced manufacturing technology industry cluster. The exhibition content of manufacturing creates a professional display and efficient exchange platform, bringing the latest technological achievements throughout the precision manufacturing industry chain to the audience.

As a part of the 2200+ exhibitors, Lingxin Tech also sent a super lineup. The project team and the sales team went together to make a detailed introduction to the customers who came to visit.

Shenzhen Lingxin Special Technology is a service provider with one -stop electronic product solutions for enterprises. We focus on the hardware design, desarrollo de software, Fabricación de PCB asamblea, Prueba de PCB, finished product assembly and other businesses. La compañía fue fundada en 2011 con 23 million registered funds; industrial factories with more than 8,000 square meters of facilities, 7 fully automatic SMT production lines, 3 DIP back -end production lines; 2 assembly and testing production lines, más que 250 in -service staff; posts post; posts; The actual Nissan capacity of the film is 50 millones de puntos, and the plug -in is 2 million pieces; it can be installed with QFN and Embalaje BGA chips with components above 0201 or foot spacing of 0.3mm.

ITES

Four major industries focusing on the future development direction of the PCB industry

1. Automobile field

The development of the new energy vehicle industry will bring new growth points to the PCB industry. According to data released by the China Automobile Industry Association: En 2023, my country’s new energy vehicle production and sales were 9.587 million and 9.495 millón, respectively, an increase of 35.8%and 37.9%year -on -year. It is expected that the production and sales of new energy vehicles in 2024 will reach about 11.5 million vehicles. Growth is about 20%. With the deepening of the degree of electronics of automobiles, and the continuous progress of the advanced driving assistance system (Adas), autonomous driving technology and networking of the car, the demand for car PCB will increase rapidly, bringing a new round of growth momentum to the PCB industry.

2. intelligent medical care

Intelligent medical care refers to the use of new technologies such as artificial intelligence, Internet de las cosas, and cloud computing to realize the intelligent, digital, and networked medical model of medical services. It has the advantages of efficient, convenient and personalized. It is the development direction of the future medical industry. Essence The realization of intelligent medical care requires a large number of intelligent medical equipment, intelligent medical platforms, and smart medical terminals. These devices and terminals require high -precision, highly reliable, and integrated circuit boards to support. It is estimated that the market size of smart medical circuit board will reach US $ 10 billion. The demand for intelligent medical care will grow rapidly, and the design and manufacturing of the circuit board also put forward higher challenges.

3. 5G communication

The commercialization of 5G technology has promoted the miniaturization and integration of communication equipment, and puts forward higher requirements for the miniaturization and high density of PCB. PCB has a wide range of application prospects in the fields of 5G base stations, mobile phones, Dispositivos IoT.

4.new energy module

The new energy field represented by the photovoltaic industry is also the focus of the future development of the PCB industry. With the increasing attention of renewable energy around the world, the solar panel industry is undergoing unprecedented rapid development. The prospects of the solar panel industry look very bright, and it will continue to become an important role in the field of clean energy in the next decades.

As a leading company in the circuit board industry, LST has been committed to providing customers with high -quality circuit board products and technical solutions. In this exhibition, we brought a variety of representative PCBAs. Smart charging modules in the automotive field, nuclear magnetic resonance systems in the medical field, smart home appliance modules in the smart home field, and photovoltaic inverters, energy storage systems, intelligent alarms in the security field, etcétera.

We follow the direction of the industry, grasp the context of the industry, and continue to carry out technological innovation to bring new vitality to the entire industry. We will also continue to forge innovation toughness and continuously transport the technological achievements to Innovate and develop, empower thousands of industries to «new», and take effect with «quality».

¿Qué es el código HS de PCB?

03/26/2024 en /por

«Código HS» se basa en el número de código establecido por la Convención Internacional sobre la «Sistema de coordinación de nombres y códigos de productos básicos» (Convenio SA), que se utiliza para clasificar diversas importaciones y exportaciones en el comercio internacional. A cada carga se le asigna un número de clasificación único para que el tipo de carga pueda identificarse claramente.. La codificación HS es fundamental para el comercio internacional, y está estrechamente relacionado con la determinación de aranceles. Con la implementación de acuerdos de libre comercio como TPP y EPA, la demanda de la «certificado de origen» esta aumentando, y la formulación del lugar de origen original depende de la codificación HS. Por lo tanto, La comprensión y el uso precisos de la codificación HS son particularmente importantes en el comercio internacional..

La codificación HS es un número de código, que otorga el número de categoría única a diversos bienes que importan y exportan, para que puedas entender cómo se ven los productos en el mundo. Es un código HS porque es un número de código definido por el Convenio HS.. La Convención HS es una convención internacional sobre el nombre del producto y el sistema de coordinación de codificación..

El Tratado SA mencionado anteriormente es gestionado por la Organización Mundial de Aduanas. (OMA), y 158 Países como China y la Unión Europea son miembros del Tratado HS.. Algunos países/regiones utilizan codificación HS, entonces más que 200 Los países/regiones utilizan la codificación HS..

¿Qué es el código HS de PCB??

Las placas de circuitos de impresión son un producto muy frecuente en el mundo actual.. Comprender el código SA de PCB es particularmente importante para el comercio relacionado.. El código aduanero de la placa de circuito de impresión es 8534,0000. 8534 es el número de clase de codificación del producto, y 0000 representa el número de subcategoría bajo el producto. En la declaración de aduana real, se requiere el número de subclasificación correspondiente de acuerdo con los estándares de clasificación específicos de la placa de circuito de impresión.

Desglose del código HS de PCB

El código HS específico para PCB es 8534.00.00. Este código consta de seis dígitos., Cada dígito tiene un propósito específico en la clasificación de productos.. Analicemos el Código HS de PCB para comprender su significado:

85: Los dos primeros dígitos, 85, representan la categoría más amplia de maquinaria y equipos eléctricos. Esta categoría incluye una amplia gama de productos eléctricos y electrónicos., por lo que es esencial reducir aún más la clasificación.

34: Los siguientes dos dígitos, 34, especificar la subcategoría de placas de circuito impreso. Esta subcategoría es más específica y dirige a los funcionarios de aduanas al ámbito de los PCB dentro de la categoría más amplia de maquinaria y equipos eléctricos..

00: Los dos últimos dígitos, 00, proporcionar detalles adicionales y diferenciación dentro de la subcategoría. Si bien estos dígitos pueden parecer genéricos, Ayudan a las autoridades aduaneras a identificar el tipo específico de PCB que se importa o exporta., permitiendo procedimientos aduaneros y determinación de aranceles precisos.

Conjunto de placa de circuito impreso, a menudo referido como PCBA, son la columna vertebral de los dispositivos electrónicos modernos. Sirven como base para conectar y soportar varios componentes electrónicos como microchips., condensadores, y resistencias. Los PCB vienen en varias formas, tamaños, y configuraciones, por lo que es esencial tener un código HS específico para ellos.

El Código HS para PCB, 8534.00.00, simplifica el proceso de despacho de aduanas al enviar o recibir estos componentes electrónicos cruciales a través de fronteras internacionales. Las autoridades aduaneras pueden identificar y clasificar rápidamente los PCB, garantizar que se apliquen los derechos y aranceles de importación adecuados.

¿Qué hace el código HS de PCB??

El código HS de PCB juega un papel muy importante en el comercio internacional. Específicamente, El papel del código HS de PCB se refleja principalmente en los siguientes aspectos.:

1. Clasificación y categorización de productos básicos.: El código HS es un sistema estandarizado para la clasificación de productos básicos del comercio internacional., que permite a las aduanas clasificar y categorizar con precisión los productos básicos. Para PCB, su código HS puede ayudar a la aduana a identificar y clasificar este producto electrónico en particular.

2. Cobro de aranceles aduaneros: El código HS es una base importante para que las aduanas cobren aranceles. Según el código HS de PCB, La aduana puede determinar el tipo arancelario correspondiente., para realizar el cobro de tarifas.

3. Estadísticas comerciales: El código HS también se utiliza en las estadísticas del comercio internacional.. Aduanas de todos los países según el código HS de estadísticas de productos de importación y exportación, que ayuda a reflejar las condiciones comerciales nacionales de importación y exportación., para que el gobierno formule una política comercial que proporcione soporte de datos.

4. Control comercial: El código SA ayuda a implementar medidas de control comercial, como cuotas, licencias, prohibiciones y restricciones. A través de códigos HS, se puede determinar si los PCB están sujetos a medidas de control comercial, garantizando así el cumplimiento comercial.

5. Transporte y Logística: Durante el transporte y logística de mercancías., Los códigos HS pueden ayudar a las empresas de transporte y logística a identificar mercancías con precisión y mejorar la eficiencia del transporte y la logística.. Para productos electrónicos como PCB, el código HS correcto ayuda a garantizar su seguridad y eficiencia durante el transporte.

Requisitos de declaración de PCB

Cuando la declaración de la placa de circuito de impresión., debe prestar atención a los siguientes requisitos:

1. Codifique con precisión. Seleccione el número de subclasificación correspondiente a la placa de circuito de impresión de acuerdo con la situación real para evitar sanciones o retención causadas por errores de codificación incorrectos..

2. Proporcionar un proceso de producción completo.. En el formulario de declaración, Se requiere el proceso de producción de placas de circuito impreso., incluyendo la adquisición, producción, tratamiento, y prueba de materiales para facilitar la aduana de la aduana para verificar la placa de circuito de impresión.

3. Solicite materiales y parámetros técnicos precisos.. En el formulario de declaración, el material del sustrato, espesor de la lámina de cobre, espesor de la placa, diámetro del diamante, ancho de línea, distancia de línea, y la distancia de la línea de la placa de circuito de impresión son necesarias para declarar con precisión.

4. Es necesario reorganizar la sustitución del proceso productivo líder.. Si reemplaza el proceso de producción líder., debe presentarse en la aduana y volver a presentar el formulario de declaración de aduanas.

5. Cumplir con los estándares de calidad nacionales relevantes.. Las placas de circuitos de impresión deben cumplir con los estándares de calidad nacionales, como ISO, Ul, etc..

Resumir

El código HS de PCB desempeña un papel vital en el comercio internacional. No es sólo la clave para la identificación y clasificación aduanera de productos de importación y exportación., Pero también es importante que la aduana determine el tipo arancelario., imponer aranceles de importación, medidas comerciales regulatorias, y la implementación de políticas proteccionistas regionales. de acuerdo con. Por lo tanto, al realizar actividades comerciales de importación y exportación de PCB, Los códigos HS pertinentes deben declararse correctamente para garantizar el buen progreso del comercio y el cumplimiento..

Diseño y fabricación de PCB militares.

03/22/2024 en /por

Military PCB is a printed circuit board for military products. Because of its high requirements in terms of environment, stability and reliability, its design is relatively complicated and the design requirements are more stricter. How to ensure the quality of military PCB is a very critical issue. En este artículo, we will introduce the processes and requirements of military Fabricación de PCB in detail.

The importance of military circuit board

Military circuit board is part of the core component of military electronic equipment. It is responsible for connecting and supporting various electronic components to realize the function of the circuit. In many military applications, such as communication, navegación, control, detection, etc., they need to rely on military circuit boards to ensure the stability of the equipment’s normal operation and signal transmission. Without a stable and reliable circuit board, these equipment will not be able to work effectively, which will affect the performance and security of the entire military system.

Military circuit boards have high reliability and durability. In military applications, equipment often needs to face harsh working environment, como la alta temperatura, temperatura baja, alta humedad, strong vibration, etc.. Military circuit boards are specially designed and manufactured, and can operate stably under these extreme conditions to ensure that the equipment can work for a long time and fail to fail. This is essential for ensuring the smooth completion of military tasks.

Military PCB design requirements

Components Selection:

Select high-quality printed circuit board materials that are best suited for military and defense applications. Use materials that meet the required standards for thermal management, resistencia química, and PCB mechanical strength.

Abiding by Standards:

Military, aeroespacial, and law enforcement systems often hold specific standards and certifications that must be adhered to. Por ejemplo, mention the standards and certifications of MIL-PFR-31032 (PCB HDI) and IPC-A-610 (acceptability of electronics assembled). Check and make sure that the Proceso de fabricación de PCB is according to these standards.

Durability and Functionality:

Military systems and their environment can be rigorous, facing extreme temperatures, increased humidity, y vibración. PCB must be designed very efficiently to adhere the required condition to ensure better functionality.

Confidentiality and Security Factor:

Military and security defense applications usually hold sensitive and confidential information. Entonces, the security and keeping secret the design and manufacturing process of military PCB is very crucial to preventing unauthorized and unknown individuals from obtaining it.

PCB Traceability, Testing and Evaluation:

Design a strong traceability system for all materials to be used in military PCB manufacturing and assembly. It is essential to identify any malfunctions, errors, or defects throughout the military application lifecycle.

Apply a thorough testing and evaluation process to in the design and manufacturing of all components from beginning to the final military application.

Testing methods include visual testing, X-ray inspections, automated optical inspections (AOI), etc.. which can help identify any malfunctions and defects produced in the early military PCB manufacturing process. Regarding the microscope magnification requirements for military PCB board inspection, it is generally required to use a microscope of more than 40 times for inspection.

The implementation of all these design and manufacturing considerations for military PCB is very important, as the military and law enforcement sectors need strict obedience to standards and regulations. Which enhances the required specifications for PCB manufacturing, such as working precision, functionality, and security throughout the Ensamblaje de PCB y proceso de fabricación. Extreme

Gestión térmica:

Military PCBs are subjected to extreme temperature conditions, so this factor should be critically considered in designing military systems and applications.

Interferencia electromagnética(EMI):

Military and defense sector environments often consist of electrical noise, which can interrupt sensitive electronics applications. Military PCBs should be properly shielded and designed to avoid any EMI issues.

PCB Corrosion:

Moisture exposure of PCB and severe chemicals can affect a printed circuit board with corrosion. Por eso, military printed circuit boards must be covered with specialized components to resist and avoid corrosion.

Military PCB material

For military PCB, the reliability and stability of the material are very important. In extreme environments, under bad conditions such as high temperature, temperatura baja, y humedad, PCB needs to maintain good performance and working status. The commonly used materials are as follows:

1.FR-4

FR-4 is a glass fiber widely used in PCB to enhance epoxy resin materials, which has high mechanical strength and excellent insulation performance. It is widely used in the field of military industry, mainly because of its high stability and relatively low price, and is suitable for most military equipment.

2.Ptfe

PTFE has excellent high temperature resistance and chemical stability. PTFE’s applications in military PCB are widely used, especially in some areas that have strict requirements on high -frequency performance, such as radar, communication and other systems, PTFE’s PCB can provide better signal transmission performance.

3. Metal substrate

The metal substrate has good heat dissipation performance and mechanical strength, which can effectively reduce the working temperature of electronic components and improve the reliability and stability of the system. In some military equipment with high heat dissipation, metal substrates are often adopted.

The characteristics of military PCB

Military PCB has the following characteristics:
1. Alta fiabilidad
In military applications, reliability is crucial. Military PCB must be able to ensure stability in extreme environments to ensure the smooth completion of military tasks. The high reliability of the military PCB is mainly manifested in the control of the thickness of the copper of the hole wall or avoiding welding repairs or cutting circuit supplementation to ensure the performance and safety of the circuit board.

2. High -intensity
The high strength of military PCB refers to its ability to withstand high -intensity use environments, including high temperature, temperatura baja, high radiation, vibración, etc., while ensuring the stability and reliability of the circuit. This high -intensity is determined by military PCB materials and structural design to ensure that it can work normally in harsh environments and meet the special needs of military applications.

3. high heat dissipation properties
The military PCB’s high heat dissipation properties refer to their good thermal conductivity and heat dissipation capabilities, which can quickly pass and distribute the heat generated during the work of the circuit to ensure the stability and reliability of the circuit. This high heat dissipation is determined by the military PCB materials and structural design to meet the needs of military applications under high load and long -term work.

4.high confidentiality
The high confidentiality of military PCB refers to its good electromagnetic shielding and information security performance, which can prevent electromagnetic leakage and information leakage, to ensure the confidentiality and security of military equipment. This high secret is determined by military PCB materials and structural design to meet the special needs of military applications in information security.

5. high durability
The high durability of military PCB refers to its good mechanical strength and stability, and can work for a long time in harsh environments to ensure the reliability and service life of military equipment. This high durability is determined by military PCB materials and structural design to meet the special needs of military applications in a complex and changeable environment.

The testing standards for military-grade boards

There are different electrical test requirements as per MIL-PRF-55110 and MIL-PRF-31032 standards.

Electrical test requirements as per MIL-PRF-31032 standard
➤Continuity should be less than 10 Ω.
➤Isolation should be more than 2 mΩ and can be managed up to more than 10 mΩ for stringent requirements.
➤Voltage should be at least 40 volts unless otherwise specified.

Subject to all group A testing per C=0 sampling plan:
The following tests should be performed on a monthly basis on thermally stressed cross-section of every panel in X and Y direction.

➤Solderability
➤Ionic contamination
➤Dimensional & hole sizes
➤Plating adhesion test
➤Solder mask adhesion testing
➤Legend adhesion
➤Surface finish thickness – XRF
➤Bow and twist
➤Electrical testing (continuity and isolation)
➤Copper tensile and elongation should be tested monthly

Electrical test requirements as per MIL-PRF-55110 standard

➤Continuity should be less than 10Ω.
➤Isolation should be more than 10mΩ, including metal core jobs.
➤Voltage should be at least 40 volts unless otherwise specified.

Subject to all group A testing per C=0 sampling plan: The following tests should be performed on a monthly basis on thermally stressed cross-section of every panel in X and Y direction.

➤Solderability
➤Ionic contamination
➤Dimensional & hole sizes
➤Plating adhesion test
➤Solder mask adhesion testing
➤Legend adhesion
➤Surface finish thickness – XRF
➤Bow and twist
➤Electrical testing (continuity and isolation)
➤Copper tensile and elongation

Military PCB application

Military PCB (printing circuit board) is widely used in the military field, and its high reliability, stability and excellent performance make it an indispensable core component in military electronic equipment. The following are the main application areas of military PCB:

1. Missile system: Military PCB plays a key role in the guidance, control and communication systems of missiles to ensure that the missile can perform the task accurately and stably.

2. Aircraft and spacecraft: In the aerospace system, communication system, and navigation systems of aircraft and spacecraft, military PCB is responsible for connecting and supporting various electronic components to ensure the safe and stable flight of aircraft and spacecraft.

3. Chariot and ships: Military PCB plays an important role in the control system, communication system and weapon system of chariots and ships to improve combat effectiveness and survivability.

4. Radar and electronic warfare systems: radar and electronic warfare systems are key technologies in the military field. Military PCB undertakes tasks such as signal transmission, data processing and communication connection to ensure the stable operation of the system and efficient operations.

Application of 1.2K Ohm resistor

03/20/2024 en /por

1.2K resistor is a very common resistor. It is widely used and is an important part of the precision circuit. It can do surprising things. If you want to know more about the resistor, please authenticate this article.

What is a 1.2K Resistor?

1.2k ohm resistor refers to the resistance value of a resistor 1.2k ohm. The resistance is the physical quantity that indicates the size of the conductor to the current hindering the current, and its unit is Om (ω). In the circuit, the resistance can limit the size of the current, separate pressure or diversion. It can also be used as a matching between circuit components to ensure the correct transmission of signals or energy.

1.2k ohm resistor is a resistor with a specific resistance value. It can be a fixed resistor, variable resistor, or special type of resistor (such as thermal resistance, optical resistance, etc.), depending on application requirements. In the circuit, it can limit the current, adjust the voltage, or implement other specific functions according to the design requirements of the circuit.

When selecting a 1.2k ohm resistor, in addition to the resistance itself, it is necessary to consider parameters such as power capacity, exactitud, and temperature coefficient. The power capacity determines the maximum power that the resistor can bear safely, while the accuracy affects the accuracy of the resistance value, while the temperature coefficient describes the condition where the resistance value changes with temperature.

What Is The Color Code Of The 1.2K Resistor?

A 1.2K resistor has a color code of brown, red, red, and gold. Here’s how to interpret the color code:

The first band is brown, which represents the number 1. The second band is red, which represents the number 2. The third band is also red, which means there is an additional zero that needs to be added to the number. So the actual value of the resistor is 12 with one zero added, que es 1.2 in scientific notation.

The fourth band is gold, which represents the tolerance of the resistor. Por lo tanto, a 1.2K resistor with a tolerance of +/- 5 percent would have the color code of brown, red, red, and gold.

1.2k ohm resistor application

1.1.2K Ohm’s resistance value is applied in multiple fields, depending on the design and needs of the circuit or system. The following are some possible application scenarios:

2. Electronic circuit: In the electronic circuit, the resistance is used to limit the matching of current, Voltaje, diversion or as a match between circuit components. 1.2K Ohm resistor can be used for these purposes according to the needs of the circuit.

3. Sensor: some types of sensors (such as photoresistid resistance, thermistor, etc.) may have 1.2k ohm’s resistor value or its nearby resistance range. These sensors can detect environmental parameters (such as light intensity, temperatura, etc.) and convert them to resistance changes, and then convert them into measuring signals through circuits.

4. Measurement and calibration: In electrical measurement, accurate resistance is used to calibrate the measurement equipment or as a reference resistance. 1.2K Ohm’s resistors may be used in such applications, especially in calibration and measurement tasks that require medium resistance range.

5. Safety and protection: In certain circuits, the resistance is used to limit the current to protect the circuit component from the damage to the large current. 1.2K Ohm’s resistor may be used for such purposes, especially in circuits that require medium current restrictions.

6. Communication and signal processing: In the communication system and signal processing circuit, the resistance is used to match the radio impedance, attenuation signals, or perform other signal processing tasks. 1.2K Ohm’s resistors may play a role in these applications.

7. Power and battery management: In the power supply and battery management system, the resistance is used in the functions of current sampling, overcurrent protection or battery power detection. 1.2K Ohm resistor may be used for these purposes to achieve precise management of power or battery.

1.2K resistor

The role of 1.2k ohm resistor in the switch circuit

● Flow limit effect: When there is an inductance or capacitance in the circuit, they will generate an inductance or capacitor response when switching, thereby generating instantaneous changes in voltage and current. These instantaneous changes may cause damage to the components and switch tubes in the circuit. En este caso, el 1.2 ohm resistor can be used as a restricted resistance to limit the instantaneous changes of the current, thereby protecting the components and switch tubes in the circuit.

● Stabilization: When the load changes in the circuit, it may cause the voltage change. The change in this voltage may cause other components in the circuit to be affected. En este caso, 1.2 Ohm resistor can be used as a voltage resistance, which is to reduce the output voltage of the stable circuit by generating a constant voltage.

● Current detection function: 1.2 Ohm resistor can also be used as current detection resistance. By detecting the voltage drop at both ends of the resistance, the current in the circuit can be calculated.

Precautions for using 1.2k ohm resistor

●Make sure the power rating of the 1.2K resistor is sufficient for the circuit. Exceeding the power rating can cause the resistor to overheat and possibly fail.

●Verify the resistor’s tolerance: Resistors have a tolerance, which specifies how close the actual resistance value can be to the nominal resistance value. Make sure the resistor’s tolerance is acceptable for your circuit’s requirements.

●Make sure the resistor is installed in the correct orientation. Otherwise, you may encounter unexpected results.

●Make sure the resistor is not exposed to any high temperatures, humedad, or other environmental conditions.
Frequently Asked Questi

Resumir

1.2K Ohm resistor is one of the indispensable basic elements in the electronic circuit. Its accurate resistance and extensive application make it play an important role in various circuit design. In practical applications, the appropriate resistance types and parameters should be selected according to the specific circuit design requirements and performance requirements.

Design and Manufacturing Guidelines for 6-Layer Printed Circuit Boards

03/13/2024 en /por

El 6 -layer PCB (placa de circuito impreso) is a printed circuit board with a multi -layer conductive layer. Its basic structures include the internal and external copper foil layers and the intermediate isolation layer. Entre ellos, the first and 6th layers are the signal layer. Signal. This design allows more functions and higher performance in a limited space.

6-layer PCB application

El 6 -layer PCB (placa de circuito impreso) plays a key role in modern electronic manufacturing, and its application is wide and diverse. The following are the main application areas of the 6 -layer circuit board:

1. In the field of communication equipment, the application of 6 layers of PCB is very common. Por ejemplo, communication devices such as mobile phones and routers need to use this type of PCB. Due to the large amount of data processing of communication equipment and high requirements for circuit boards, el 6 -layer PCB can provide higher data transmission rate and lower signal interference, thereby ensuring the normal operation of the equipment.

2. In the field of industrial control equipment, el 6 -layer PCB also plays an important role. Industrial control equipment usually requires a large amount of data and complex control tasks, which have high requirements for the stability and reliability of the circuit board. The high stability and high reliability of the 6 -layer PCB can ensure the stable operation of the industrial control equipment, thereby improving production efficiency.

3. In the field of medical instruments, 6 -layer PCB is also widely used. Por ejemplo, the ECG monitor and ultrasonic diagnostic instrument in medical equipment need to use this type of PCB. Because medical instruments have high requirements for data accuracy and stability, el 6 -layer PCB can provide high -precision signal transmission and stable working environment, thereby improving the work efficiency and diagnosis accuracy of medical equipment.

4.6 layers of PCB also have a wide range of application prospects in data centers and high -speed communication. Its high -density design can achieve smaller size and higher integration, saving space and cost for electronic products. Al mismo tiempo, due to the characteristics of its high signal transmission rate and low signal loss, el 6 -layer PCB can meet the needs of high -speed communication and data centers.

Benefits of Using 6 Layer Printed Circuit Board

The six-layer printed circuit board incorporated within the multilayer board offers unmatched benefits. These exceptional advantages and specific characteristics of the six-layer printed circuit board are delineated in more detail hereinafter.

Firstly, a diminished size and surface area. The inclusion of additional layers provides ample room for diminishing the footprint of the printed circuit board. Consequently, one defining characteristic of the six-layer circuit board lies in its ability to minimize the overall area occupied by the end product while facilitating more intricate functionalities. This stands as one of the key motivators behind the utilization of six-layer printed circuit boards on an increasing scale currently. Reflecting the escalating demands for the portability of electronic gadgets, these attributes align flawlessly with prevailing market trends.

En segundo lugar, superior electrical performance. With the escalating complexity of products, semiconductor DC, C.A., rectification currents, diverse frequencies, and powers, encompassing high-grade ICs, elevated voltages, ADC conversion rates, precisión, and so forth, the electrical performance benchmarks of components utilized for printed circuit boards invariably rise. This enhanced electrical reliability of six-layer printed circuit boards renders the interaction among components more reliable, offering a distinct edge over single- and double-layer printed circuit boards.

Thirdly, enhanced durability. Comparative to single-sided and double-layer printed circuit boards, six-layer printed circuit boards incorporate multiple insulation layers, thus enhancing PCB robustness for optimized prevention of PCB shorts, thereby prolonging PCB lifespan and product longevity.

Fourthly, superior connectivity, reduced weight. In contrast to conventional single-sided printed circuit boards and double-sided printed circuit boards, the elaborate circuitry of the six-layer printed circuit board simplifies component connections, thereby minimizing the usage of interconnection components and subsequently, reducing the total weight of the PCBA assembled product. As such, this represents a compact, yet lightweight solution ideal for portable electronics.

Lastly, the intricate stacking arrangement delivers a more robust structure and effectiveness. Design considerations related to stacking arrangements play a pivotal role in PCBs. Six-layer PCBs exhibit a more intricate stacking array compared to single-sided PCBs and double-layer PCBs. Sin embargo, this increasingly complex configuration also enhances PCB application potential, ensuring quality and stability guarantees.

Which material does the 6 -layer PCB use?

The materials used in the 6 -layer PCB (placa de circuito impreso) mainly include conductive materials, insulation materials and substrate materials. The following is a detailed introduction to the main materials used in 6 layers of PCB:

1. conductive material:
▶ Copper foil: The outer copper foil layer is a layer of metal foil on the surface of the PCB board. It will be processed into the required line pattern for connecting each component. The inner copper foil layer is located between the inner signal layer and is also used for the connection and transmission of the circuit.
▶ Gold plating, silver plating, etc.: Under certain specific needs, in order to improve the performance of electrical conductivity or prevent oxidation, metals such as gold -plated and silver plating may be used as conductive materials.

2. Insulation material:
▶ Prepreg: This is a thin piece of insulation material, which is used for adhesion materials and insulation materials for the inner conductive graphics of the multi -layer printing board. During the layer pressure, the semi -curing epoxy resin is squeezed away to form a reliable insulator.
▶ Polymidamine (PI), Polytesterafluoroethylene (Ptfe), etc.: These high -performance insulation materials are also often used in 6 layers of PCB to improve insulation and high temperature resistance.

3. substrate material:
▶ FR-4: This is a glass fiber-covered copper plate with good insulation performance and mechanical strength. It is a substrate material commonly used in 6 layers of PCB. FR-4 contains flame retardants, so it is also called FR (retardante de la llama) capa.
▶ Other FR layer boards: In addition to the FR-4, there are FR-2 (paper-based phenolic resin layer plates), FR-6 (polyester resin glass fiber layer plate), etc.. FR layer boards can also be used for 6-layer Fabricación de PCB , But they may be different in certain performance or processing.

What Makes up a 6 Layer PCB Stackup?

A 6 layer PCB stackup comprises different layers. The ground plane, power plane, and signal layers make up a 6 layer PCB stackup. Each of these layers has its functions. Sin embargo, it is important to understand how these layers play a significant role in the functionality of this stackup.

Ground plane
The ground plane functions as a return path for current from various components on the circuit. It is a layer of copper foil that connects to the ground point of the circuit. This separate layer is so large that it covers the whole board. The ground plane allows the Fabricante de PCB to ground components easily.

Power plane
This is a plane of copper that connects to a power supply. The power plane provides a supply of voltage to the circuit board. This layer is often seen in multilayer stackups since these stackups use an even number of layers. A power plane reduces the operating temperature of a board as it can handle more current.

Signal layers
These layers include the bottom layer, top layer, and inner layer. All these layers have electrical connections.

▶Bottom signal layer: This layer is primarily for soldering and wiring. For a multilayer board, manufacturers can place components.
▶Top signal layer: It is also referred to as thecomponent layer. This layer is used to arrange copper or wires.
▶Inner signal layer: This layer is connected to power and ground planes. It has electrical connections and consists of an entire piece of the copper film. The inner signal layer can only be seen in multilayer boards.

6 -layer PCB stack design rules

The rules of the 6 -layer PCB stack design are mainly based on the performance requirements of the circuit board, signal integrity, the layout of the power supply and the formation, and the shielding effect. The following are some key stack design rules:

1. The tight coupling between the formation and the signal layer: the distance between the formation and the power layer should be as small as possible, and the thickness of the medium should be as small as possible to increase the capacitance between the power layer and the power efficiency.

2. Isolation between the signal layer: Try not to be adjacent directly between the two signal layers to prevent signal stringing and ensure that the performance of the circuit is stable.

3. Use the internal electrical layer to block: For the multi -layer circuit board, the signal layer should be adjacent to a internal electric layer (formation or power layer) as much as possible. The role of effectively avoids the skewers between the signal layer.

4. The layout of the high -speed signal layer: The high -speed signal layer should generally be between the two internal electrical layers. Small interference to other signal layers.

5. Symmetry of layered structure: Durante el proceso de diseño, the symmetry of layering structure needs to be considered, which helps ensure the stability and reliability of the circuit board.

6. Use multiple ground electrical layers: This can effectively reduce ground impedance and improve the performance of the circuit board.

7. The use of even layers: It is generally recommended to use the even layer of PCB to avoid the odd number layer, because the strange number layer circuit board is easy to bend.

Factors To Consider In The Design Of 6-Layer PCB Stack-Up

Several factors need to be considered while designing the 6-layered PCB stack-up:

Signal Integrity Considerations
The electrical signal transmission through PCB is the result of signal integrity. De este modo, trace lengths are planned carefully to prevent signal delays and distortions. Por otro lado, impedance matching involves designing traces and terminations to match the characteristic impedance of the transmission lines, minimizing signal reflections. Además, minimizing crosstalk between adjacent traces is essential to avoid interference and ensure signal integrity. The design can maintain the desired signal quality and prevent data errors or signal degradation by addressing these factors.

Power and Ground Plane Design
A PCB’s overall performance depends heavily on the design of the power and ground planes. Several advantages to power and ground plane distribution can be realized. Noise reduction is one of the benefits. The planes serve as a shield, shielding the circuitry from outside noise. Another crucial element is stable power distribution, which guarantees that each component receives a steady supply of clean power. This helps prevent voltage swings and potential issues. Además, careful attention must be given to the placement and routing of power and ground traces to minimize the loop area, which reduces electromagnetic interference and improves signal integrity. These considerations collectively contribute to the efficient and reliable operation of the PCB.

Impedance Control and Routing Guidelines
Impedance control and routing guidelines are essential for maintaining consistent signal characteristics and preventing signal degradation. These guidelines dictate trace widths, espaciado, and layer stack-up to achieve desired impedance values. Adhering to these guidelines helps minimize reflections and signal distortion.

EMI/EMC Considerations
EMI/EMC considerations are crucial for minimizing electromagnetic interference and ensuring compliance with electromagnetic compatibility standards. Shielding techniques, proper grounding, and strategic component placement are key to reducing EMI/EMC issues and ensuring the PCB functions reliably in its intended environment.

Materiales
Standard substrate materials or aluminum cores are used to make single-layer PCBs. Sin embargo, for the multilayer stack-ups, it should be clear that the aluminum core PCBs are not available. This is because multilayer aluminum PCBs are challenging to manufacture.

Thermal Management Techniques
Thermal management techniques are vital to prevent overheating and ensure the longevity and reliability of the PCB. This involves incorporating heat sinks, thermal vias, and proper component placement to dissipate heat efficiently. Thermal simulations and calculations can help identify potential hotspots and guide the selection of suitable cooling strategies.

6 Layer PCB Fabrication

Edit the schematic diagram
El 6 layer PCB can feature two layers of the ground plane in the circuit board. This means that the manufacturer can separate the digital and analog grounds. Involve the signal’s minimum return path in EMI. Ensure you check for any errors after creating the schematic diagram.

Create a new PCB file
After the manufacturer has created a new PCB file, the schematic netlist can be imported into that file. The manufacturer then sets the layer structure and adds layers. The next thing is to add the power and ground layers. During a 6 layer PCB fabrication, you must couple the main ground layer and the power layer. This should be at a distance of 5 ml.

Disposición
Layout is very important in the fabrication of a 6 layer PCB stackup. The primary principle of layout is to ensure good partition. Moreso, the partition of digital and analog devices can help to minimize interference. Digital signals generate large interference and a strong anti-interference.

You need to check out the components layout with various operating voltages. Ensure that devices having large voltage differences are far apart. En principio, the best configuration type features 3 power layers and 3 signal layers. The ground plane is the second and fifth layers. The third and fourth layers are power and inner signal layers.

Ground plane production
In a 6 layer PCB fabrication, there are two layers of ground. They are DGND and AGND. The DGND is placed on the fourth layer while the AGND is placed on the second layer. The manufacturer uses wires to lead out the pins of the ground and top components. Then you use the via hole to connect the pins to the corresponding network. Ensure you use a few pads during the connection process. This is because the pads will increase interference.

Power plane production
You need to divide the power layer. This is because the 6 layer PCB will not feature one working voltage value. Follow these procedures for segmentation during a 6 layer PCB fabrication;

●Figure out a voltage network
●Change to the inner power layer
●Draw a closed graph using a line
●Use wires to lead out the pins of the ground and top layer
●Create connection to the inner power layer via the pad
●Design the next power network.

Enrutamiento
Ensure the ground layer and power layer are made well. After this, route the signal lines. Routing during a 6 layer PCB fabrication requires serious attention. The manufacturer should ensure that the vital high-speed signal line goes to the inner signal layer. The signal can also move on its ground layer.

Por ejemplo, if analog signals are mostly on the top layer, the second layer should be set to AGND. Además, you need to adjust the component layout appropriately to enhance wiring. The routing method for the inner signal layer is wire-pad –inner electric layer.

DRC Inspection
This is an important step for a 6 layer PCB fabrication. DRC simply means design rule check. After the manufacturer has drawn the board, the inspection must take place. Carrying out a DRC helps to enhance the fabrication yields of a 6 layer PCB.