Guía completa para el codiseño de PCB en 2026

With the trend of electronic devices evolving toward miniaturización, rendimiento alto, y alta confiabilidad, heterogeneous integration solutions that integrate multiple functional chips (Chiplets) onto a single Sustrato de PCB are gradually replacing traditional monolithic chip designs.

This integration model splits complex SoCs into independent functional modules and optimizes cost and yield by using different process nodes. As the core interconnection carrier, el degree of collaboration between Diseño de PCB and IC chips directly determines the upper limit of system performance.

Unlike traditional design approaches, modern PCB co-design emphasizes the synchronous planning of PCBs and ICs. From the early stage of a project, barriers among electronics, mecánica, fabricación, and supply chain domains are eliminated. Through deep coordination in layer optimization, via layout, and signal path planning, three major benefits can be achieved:

• 40% improvement in design efficiency

• 30% reduction in rework rate

• 18% optimización de costos

1.1 Core Value Upgrade of Co-design: From “Parallel Work” to “Deep Integration”

Heterogeneous integration adaptation
Through early collaboration between PCB and IC design, key issues such as multi-chip pin mapping, adaptación de impedancia, y distribución de energía can be solved to ensure seamless integration of chips fabricated with different process nodes.

Full-link risk mitigation in advance
Potential issues in Integridad de la señal (Y), Integridad del poder (PI), and thermal stress conflicts can be identified early, especially for high-speed interfaces such as PCIe and SerDes, addressing problems like reflection and jitter.

Lifecycle collaboration
Realizing closed-loop coordination among diseño, simulación, fabricación, and supply chain, ensuring that the solution is designable, manufacturable, procurable, y confiable.

1.2 Four Typical Application Scenarios of Co-design

Heterogeneous integrated systems
Por ejemplo, AI servers and high-end processors using Chiplet + PCB integration architectures.

High-speed and high-frequency equipment
Products such as 5G base stations and optical modules that require strict control of signal loss.

Precision electronic devices
Applications such as wearables and implantable medical devices that require extremely strict size and reliability constraints.

Large and complex projects
Defense and aerospace projects involving cross-regional R&D teams and multiple suppliers.

Five Core Strategies of PCB Co-design

2.1 Cross-domain Collaboration: Synchronous Planning Mechanism for PCB and IC

The core of heterogeneous integration lies in the tight matching between PCB and IC, requiring a collaborative workflow of “early alignment – data sharing – dynamic optimization.”

Pin-mapping collaboration
At the early stage of a project, synchronize IC pin definitions with PCB routing requirements to ensure that I/O directions and high-speed interface locations match the PCB stack-up plan, avoiding later pin redefinition.

Data synchronization tools
Use dedicated collaboration platforms such as Cadence Allegro Co-Design y Mentor xpedition to enable real-time exchange of data such as package drawings, power connections, and thermal pads, supporting bidirectional updates.

Stack-up and chip architecture adaptation
Design the Estructura de apilamiento de PCB based on IC power network and ground layer requirements, optimizing power return path inductance. Technologies such as via-in-pad microvias and stacked microvias can be used to achieve compact interconnections.

Practical case
A 32-channel 5G RF module adopted a Chiplet integration solution. Through early collaboration between PCB and IC design, the pin mapping of memory chips (advanced process nodes) y analog chips (mature process nodes) was locked in advance.

The PCB stack-up was designed as a 12-layer HDI structure, using stacked microvia technology to achieve low-inductance power distribution within a 1.2 mm de espesor del tablero, reducing signal insertion loss by 15%.

2.2 Cross-tool Collaboration: Seamless Integration of ECAD / MCAD / EDA

Breaking tool barriers is key to improving collaboration efficiency. Tool collaboration schemes for heterogeneous integration scenarios are as follows:

2.3 Colaboración en equipo: Modular Management and Version Control

Task decomposition strategy
Divide tasks according to the full workflow:
IC interface definition → PCB stack-up design → high-speed routing → simulation verification → manufacturing adaptation, clearly defining responsibilities of IC teams, PCB teams, and simulation teams.

Version control system
Adopt Vault + PLM systems to centrally archive pin definition files, stack-up schemes, routing data, and simulation reports, supporting change tracking (P.EJ., REV_A04) and conflict detection.

Closed-loop communication mechanism
Establish a process of change request → cross-team review → execution → verification, triggering notifications through collaboration platforms to avoid information deviations caused by verbal communication.

2.4 Simulation-Driven Collaboration: Comprehensive Performance Assurance

Heterogeneous integration systems require more stringent simulation collaboration covering señal, fuerza, térmico, and manufacturing dimensions.

Signal integrity simulation
Based on IC driver characteristics and impedance models, simular reflection and crosstalk in high-speed transmission lines, optimize differential pair length matching and via geometry, and eliminate signal stubs.

Power integrity simulation
Model the Power Distribution Network (PDN), optimizar decoupling capacitor placement and copper thickness, control voltage drop and current ripple, and reduce simultaneous switching noise.

Thermal simulation collaboration
Based on chip power maps, simulate PCB temperature distribution. Improve heat dissipation through vias termicas, disipadores de calor, and material selection (such as low-loss dielectric materials) while matching the chip’s thermal expansion coefficient.

DFM simulation verification
Synchronize manufacturing process rules in advance (como HDI lamination and microvia depth control) to ensure layout compatibility with mass production processes and maintain yield.

2.5 Colaboración en la cadena de suministro: From Component Selection to Manufacturing

Shared component library construction
Integrate 3modelos D, parámetros eléctricos, and supply chain information (inventario, lead time, alternative components) for chips, conectores, and substrates to enable synchronized access by IC and PCB teams.

BOM collaborative management
Synchronize BOM data in real time during the design process and coordinate with procurement departments to avoid chip shortages and confirm compatibility of alternative components in advance.

Manufacturing-side collaboration
Confirm materiales de sustrato (such as HDI substrates and advanced dielectric materials), stack-up processes, and drilling accuracy with PCB manufacturers early to ensure that the design meets mass-production requirements.