PCBA Testing Method | Guía

Leadsintec has an extensive array of testing equipment and systems for assembled printed circuit board (PCBA junta). These include Automatic Optical Inspection (AOI), X-Ray Examination (BGA’s), Pruebas funcionales, In-Circuit Testing (TIC) and Framescan. Each of these test methods serves different functions.

Pruebas de AOI provides a scan of components for proper placement.

X-Ray Examination insures that BGA’s are installed and soldered correctly and will detect any shorts or poor solder joints.

Pruebas funcionales provides a partial or 100% test of the finished product. Typically these functional testers are provided by our Customers or designed and manufactured by us with their cooperation.

TIC is an electrical probe test on populated PCB’s, checking for shorts, abertura, resistencia, capacidad, and other basic parameters to demonstrate correct assembly.

Framescan is a vector-less test technique used to detect open pins on component packages and connectors. Text fixtures, si es necesario, for any of the testing systems are typically built on-site.