Arriba 8 PCB manufacturing and assembly factory in European 2023 años

Europe has always been an important territory in the PCB marker. It has a huge customer group and has always been a head consumer group in the high -end PCB field. There are also many Fabricantes de PCB in Europe. This article will introduce the well -known PCB manufacturers in Europe. If you are looking for a Fabricante de PCB, you will be helpful to you after reading the article.

1、Leadsintec PCB Factory
This is a PCB manufacturer from China,Cubras de fábrica Área de 8000 metros cuadrados, debido a 10 líneas de producción, de los cuales hay 5 línea de producción SMD de máquina Juki de alta velocidad, 2 a través del agujero y 3 línea de montaje.

Totally there are about 380 Empleados en nuestra fábrica. Entre ellos, 18 engineers who have rich experience in PCB and PCBA industria, 32QA que inspeccionará cada proceso de producción estrictamente, 5 PMC para garantizar la cantidad correcta y la calidad de los materiales entrantes, así como ese tiempo de producción, se mantiene en un nivel óptimo, 6 El comprador para comprar y hacer un seguimiento de las órdenes de compra para garantizar que el proveedor cumpla el acuerdo de compra sobre la entrega.

Guía Fabricación de PCB Capability

Procesamiento de superficie	Sangrar / Oro / oro de inmersión / Revestimiento de dedo dorado /OSP / Flujo
Capas	1~ 32 capas
Espesor de cobre	O.5oz ~ 5oz
Espesor de la tabla	0.2mm ~ 6.0 mm
Tamaño de agujero mínimo	0.2mm
Ancho de línea mínimo	0.1mm
Min Line Spacing	0.1mm
Tamaño máximo de tablero	508mm*609 mm
Tipo de máscara de soldadura	Verde / Negro / Rojo / Amarillo / Blanco / Azul
Color silscreen	Blanco/ amarillo/ negro
Formato de archivo de datos	Archivo Gerber y el archivo de perforación correspondiente, Serie de protel, Lista de BOM
Material base	FR4, Cem3, Ptfe, A base de aluminio, Alto tg fr4, Tablero de alta frecuencia, Rogers

2、AT&S
AT&S is one of the leading PCB manufacturers in Europe, producing high-end prototypes in various fields such as medicine, aviation, and measurement technology. As global Sustrato de IC manufacturers for PCBs in Europe, AT&S produces semiconductor substrates for cameras, phones, computers, and portable music players. AT&S has more than 35 years of experience in the industry and is a trusted supplier for many leading companies.

PCB Manufacturing Capabilities

	Standard Capability	Advanced Capability
Minimum Layer Count	1	1
Maximum Layer Count	16	30
Trace/Space	0.006″	0.002″
Finished Hole Size	0.010″	0.004″
Surface Finishes	Sangrar, Aceptar, Hard Gold, Soft Gold (see all below)	ENEPIG, OSP, EPIG (see all below)
Materiales	FR-4, High Temp FR-4, Isola, Rogers	PTFE/Duroid, Poliimida, Doblar
Controlled Impedance	+/- 10%	+/- 5%
Annular Ring	0.006″	0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper	1.5 oz to 2 onz	1 oz to 5 onz
Inner Layers Finished Copper	0.5 oz to 2 onz	0.3 oz to 4 onz
Soldermask Colors	Verde, Negro, Azul, Rojo, Blanco, Clear, Costumbre	Amarillo, Costumbre
Silkscreen Colors	Verde, Negro, Azul, Rojo, Blanco, Clear, Costumbre	Amarillo, Costumbre
Filled Vias	Non-Conductive Fill	Non-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter	0.010″	0.004″
Smallest Laser Drill Diameter	N/A	0.003″
Blind Vias	No	Yes
Buried Vias	No	Yes
Aspect Ratio	10:01	15:01
Plated Hole to Copper	0.008″	0.005″
Clearance – Copper to Edge of Board	Outer Layer – 0.010″	Outer Layer – 0.005″
	Inner Layer – 0.015″	Inner Layer – 0.005″
Minimum Panel Size	9″ x 12″	8″ x 8″
Maximum Panel Size	18″ x 24″	24″ x 36″
Plated Slots	Routed	Routed or Nibbled
Non-Plated Slots	Routed	Routed or Nibbled
Plating in Holes	0.0008″	0.0015″
Web (or Mask Width)	0.006″	0.003″
Soldermask Swell	0.003″	0.001″
Silkscreen Width	0.003″	0.003″
Inspection & Testing Criteria
IPC Class 2	Yes	Yes
IPC Class 3	No	Yes
Netlist Generation and Netlist Compare	Yes	Yes
Trace / Space
Outer Layers (finished copper)	1 onz. Cu – Min .005″ Trace/Space	1 onz. Cu – Min .002″ Trace/Space
2 onz. Cu – Min .008″ Trace/Space	2 onz. Cu – Min .006″ Trace/Space
3 onz. Cu – Min .012″ Trace/Space	3 onz. Cu – Min .008″ Trace/Space
4 onz. Cu – Min .014″ Trace/Space	4 onz. Cu – Min .012″ Trace/Space
Inner Layers
0.3 oz Cu – Min .002″ Trace/Space	0.5 oz Cu – Min .003″ Trace/Space
0.5 oz Cu – Min .005″ Trace/Space	1 onz. Cu – Min .005″ Trace/Space
1 onz. Cu – Min .006″ Trace/Space	2 onz. Cu – Min .008″ Trace/Space
2 onz. Cu – Min .012″ Trace/Space	3 onz. Cu – Min .0012″ Trace/Space
Perforación
Min drilled diameter, final board thickness 0.031″ or less	0.008″	0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″	0.010″	0.006″
Min drilled diameter, final board thickness between 0.062″ and 0.093″	0.012″	0.010″
Min drilled diameter, final board thickness between 0.093″ and 0.125″	0.015″	0.012″
Min laser diameter, dielectric thickness less than or equal to 0.004″	N/A	0.003″
Min laser diameter, dielectric thickness between 0.004″ and 0.005″	N/A	0.004″
Min laser diameter, dielectric thickness between 0.005″ and 0.007″	N/A	0.005″
Controlled depth blind vias	No	Yes, max 0.75:1 aspect ratio
Pre-drilled core blind vias	No	Yes
Sub-lamination blind vias	No	Yes
Build-up technology	No	Up to 4-N-4, Any layer
Buried vias	No	Yes
Filled vias	Non-Conductive fill	Non-Conductive or Conductive fill
Nibbling	No	Yes
Largest hole	0.247″ plated, 0.250″ non-plated	No maximum
Slots	Plated or non-plated, routed	Plated or non-plated, routed or nibbled
Plating in holes	0.0008″	0.0015″
Plated hole to copper	0.008″	0.005″
Surface Finish
Hot Air Solder Level (HASL – Lead)	Yes	Yes
Hot Air Solder Level (HASL – Lead-Free)	Yes	Yes
Electroless Nickel Immersion Gold (Aceptar)	Yes	Yes
Immersion Silver	Yes	Yes
Hard Gold Fingers with ENIG	Yes	Yes
Hard Gold Fingers with HASL	Yes	Yes
Electrolytic Soft Gold	Yes	Yes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)	No	Yes
Organic Surface Protectant (OSP)	Yes	Yes
Bare Copper	Yes	Yes
Electroless Palladium Immersion Gold (EPIG)	No	Yes
Tin Nickel	No	Yes
White Tin	Yes	Yes
Carbon Ink	No	Yes
Soldermask
Colors	Verde, Negro, Azul, Rojo, Blanco, Clear, Costumbre	Amarillo, Costumbre
Finish/Texture	Semi-gloss, Matte	Semi-gloss, Matte
Tented Vias	Yes	Yes
Soldermask Plugged Vias	Yes	Yes
Soldermask Thickness over Copper	5 micron to 25 micron	5 micron to 25 micron
Soldermask Web	5 mil	3 mil
Soldermask Gap to Pad	4 mil	2 mil
Copper Ring Under Mask-Defined Pad	3 mil	1 mil
Peelable Soldermask	No	Yes
LPI Soldermask	Yes	Yes
Dry Film Soldermask	No	Yes
Silkscreen
Colors	Verde, Negro, Azul, Rojo, Blanco, Clear, Costumbre	Amarillo, Costumbre
Minimum Legend Width	3 mil	3 mil
Space between Silkscreen and Pad	5 mil	4 mil
Controlled Impedance
Capas	0-10 Capas	0-30 Capas
Impedance Tolerance	Single-ended +/- 10%	Single-ended +/- 5%
Impedance Tolerance	Differential Pairs +/- 10%	Differential Pairs +/- 5%
Impedance Tolerance	Coplanar Waveguide +/- 10%	Coplanar Waveguide +/- 5%
TDR Testing	Yes, Included	Yes, Included
Espesor de la tabla
1-Layer or 2-Layer	Min .015″ | Max .200″	Min .008″ | Max .250″
4-Layer	Min .020″ | Max .200″	Min .015″ | Max .250″
6-Layer	Min .031″ | Max .200″	Min .025″ | Max .250″
8-Layer	Min .047″ | Max .200″	Min .031″ | Max .250″
10-Layer	Min .062″ | Max .200″	Min .040″ | Max .250″
12-Layer	Min .062″ | Max .200″	Min .047″ | Max .250″
14-Layer	Min .062″ | Max .200″	Min .054″ | Max .250″
16-Layer	Min .062″ | Max .200″	Min .062″ | Max .250″
CNC / Routing / Score / Mechanical Rules
Router Bit Size	0.078″	Min 0.021″, Max. 0.078″
Spacing for Tab Rout Array	0.100″
Standard V- Score Angle	30°	20°, 30°, 45°, 60°
V-Score Depth	One third of board thickness (min 0.010″)
Jump Score	No	Yes, overshoot up to 0.35″
Scoring Direction	Vertical and Horizontal	Routed Scoring
Bevel Angle	20, 30, 45, o 60 Degree Gold Finger Bevel	Milling/Offset or Recessed Beveling
Countersinks	60, 82, 90, 100 Degree Countersink **	60, 82, 90, 100 Degree Countersink **
Counterbores	Yes	Yes
Edge Castellations	No	Castellated Edges Min .040″
Plated Edges	No	Yes
Cross Section	Level 1	Level 1, Level 2, Level 3

3、Elvia PCB
Elvia PCB Group (Tableros de circuito impreso) whose headquarters are located in Coutances (Normandy, France) is one of the European leaders in the Aerospace, Defence and Railway sectors. The group has five production facilities, each with a specific area of expertise and market position. It has a turnover of close to 50 million euros and 430 empleados.

Elvia ’s PCB Manufacturing Capabilities

Technical index				Mass Batch	Small batch	Sample
Material base	FR4		Normal Tg	Shengyi S1141, KB6160,Huazhen H140（not suitable for lead free process ）
			Middle Tg	For HDI, multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662；
			High Tg	For thick copper、high layer：SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752；
	Halogen Free			Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg: SY S1165
	High CTI			CTI≥600 SY S1600、Huazheng H1600HF、H1600A；
	High Frequency			Rogers、 Arlón、Taconic、SY SCGA-500、S7136; HuazhengH5000
	High Speed			SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380
	Flex Material		Base	Glue-free：Dupont AK XingyangW-type, Panosonic RF-775；
			Coverlay	SY SF305C、Xingyang Q-type
	Special PP			No flow PP： VT-447LF，Taiguang 370BL Arlon 49N
				Ceramic filled adhesive sheet: Rogers4450F
				PTFE adhesive sheet： Arlon6700、Taconic FR-27/FR-28
				Double-sided coatingPI： xingyang N-1010TF-mb
	Metal Base			Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase
	Special			High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250）
				High thermal conductivity material：92Ml
				Pure ceramic material：alumina ceramic、Aluminum nitride ceramics
				BT material： Taiwan Nanya NGP-200WT
Capas	FR4			24	36	64
	Rigid&Flex /（Flex）			16（12）	20（12）	24（16）
	High Frequency Mixed Lamination			12	18	24
	100% Ptfe			4	12	18
	HDI			2 pasos	3 pasos	4 pasos
Delivery Size		Max(mm)		460*560	460*560	550*900
(mm)		Min(mm)		20*20	10*10	5*10
Width / Gap	Inner（mil）			0.5OZ base copper： 3/3 1.0OZ base copper： 4/4 2.0OZ base copper： 5/6
				3.0OZ base copper： 7/9 4.0OZ base copper： 8/12 5.0OZ base copper： 10/15
				6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28
	Outer（mil）			1/3OZ base copper： 3/3 0.5OZ base copper： 4/4 1.0OZ base copper： 5/5
				2.0OZ base copper： 6/8 3.0OZ base copper： 7/10 4.0OZ base copper： 8/13
				5.0OZ base copper： 10/16 6.0OZ base copper： 12/18 10 OZ base copper： 18/24
				12 OZ base copper： 20/28 15 OZ base copper： 24/32
Line Width Tolerance	＞5.0 mil			±20%	±20%	±1.0mil
	≤5.0 mil			±1.0mil	±1.0mil	±1.0mil
Espesor de cobre	Inner layer（OZ）			4	6	12
	Out layer（OZ）			4	6	15
Board thickness（mm）				0.5-5.0	0.4-6.5	0.4-11.5
Final Board Thickness	＞1.0 mm			±10%	±8%	±8%
	≤1.0 mm			±0.1mm	±0.1mm	±0.1mm
Board thickness/drill bit				10:01	12:01	13:01
Contour	Bevel edge			20～60 degree；±5degree
Bow and twist				≤0.75%	≤0.75%	≤0.5%

 

4、NCAB Group

NCAB Group is one of the fastest growing PCB producers, whose focus has from the start, been on customer & market presence. The timeline traces our journey from PCB trader to Integrated PCB Producer.

NCAB Group ’s PCB Manufacturing Capabilities

No.	Item	Capacidades de fabricación
1	Material	FR-4 (Fiberglass)
2	Número de capas	1 Layer, 2 Capas, 4 Capas, 6 Layer, 8 Capas,
		10 Capas
3	TG Grade	TG130~140, TG150~160, TG170~180
4	Max PCB Size	1 capa & 2 capas: 1200*300mm or 600*500mm
		Multi-layers: 600*500mm
5	Min PCB Size	5mm*5mm
6	Board Size Tolerance(Outline)	±0.2mm(CNC routing)
		±0.5mm(V-scoring)
7	Surface Finish	HASL with lead, HASL lead free, Immersion gold(Aceptar), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None
8	Espesor de la tabla	1 Layer/2 Layers: 0.2~2.4mm
		4 Capas: 0.4~2.4mm
		6 Capas: 0.8~2.4mm
		8 Capas: 1.0~2.4mm
		10 Capas: 1.2~2.4mm
		Note: Customized PCB thickness and Layer stackup are acceptable.
9	Board Thickness Tolerance	Thickness≥1.0mm: ±10%
		Thickness<1.0mm: ±0.1mm
		Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
10	Outer Layer Copper Thickness	1oz/2oz/3oz
		(35μm/70μm/105μm)
		Note:
		2onz
		PCB thickness≥1.2mm,
		Via size≥0.25mm,
		Min Track/Spacing≥0.15mm
		3onz
		PCB thickness≥2.0mm,
		Via size≥0.3mm,
		Min Track/Spacing≥0.2mm
11	Inner Layer Copper Thickness	1oz/1.5oz
		(35μm/50μm)
12	Outer layer Min track/spacing	≥3mil
13	Inner layer Min track/spacing	≥4mil
14	Annual ring size	≥0.13mm
15	Grid Line track/spacing	≥0.2mm
16	Coil board Line track/spacing	≥0.2mm
17	BGA pad size	≥0.2mm
18	BGA Distance	≥0.12mm
19	Board Outlines	Track to Outline: ≥0.3mm
		Trace to V-cut line: ≥0.4mm
20	Finished Hole Size Tolerance	±0.08mm
21	Finished Hole Diameter(CNC)	0.2mm~6.3mm
		1. PCB Thickness=2.0mm, Min
		hole size is 0.3mm
		2. PCB Thickness=2.4mm, Min
		hole size is 0.4mm
		3. Copper Thickness=2OZ, Min
		hole size is 0.25mm
		4. Copper Thickness=3OZ, Min
		hole size is 0.3mm
22	TH Via Distance	Equipotential: 0.15mm
		Isoelectric: 0.25mm
23	Plated Slot Size	≥0.5mm
		Note:
		L:W=2.5: 1 (Should be 2.5:1 o
		higher. If it is less than this, the holes may be misaligned.) If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. También, it is okay to draw the oblong hole in Profile Layer instead of Drilling Layer.
24	Castellated Holes	≥0.6mm
25	Non-Plated Holes	≥0.8mm
26	NPTH to Copper Line	≥0.2mm
27	Soldermask	Verde, Rojo, Amarillo, Blanco, Negro, Azul, Purple, Matte Green,Matte Black,None
28	Soldermask Thickness	20~30um
29	Soldermask Bridge	Verde: ≥0.1mm
		Others: ≥0.15mm
30	Soldermask to soldering pad distance	≥0.05mm
31	Silkscreen	Blanco, Negro, Amarillo, None
32	Minimum Character Width(Legend)	≥0.15mm
		Note: Characters of less than 0.15mm wide will be too narrow to be identifiable.
33	Minimum Character Height (Legend)	≥0.75mm
		Note: Characters of less than 0.8mm high will be too small to be recognizable.
34	Character Width to Height Ratio (Legend)	1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio)
35	Silkscreen to Soldermask Distance	≥0.1mm
36	V-cut Line	≥75mm
		Note:
		PCB thickness≥0.6mm
		Details refer to right side
		picture
37	V-cut Line Distance	≥3.5mm
38	Distance betwen Board to Board	≥0.8mm
39	Stamp-hole Width	≥2.0mm
		Note: PCB size and thickness are subject to review by PCBGOGO.

 

5、KSG PCB
KSG GmbH is one of the Printed Circuit Board market leaders in Europe with a strong focus on technology and innovation. The company has two plants, one located in Gornsdorf, Germany and another in Austria. All products are manufactured exclusively within Europe to ensure the highest quality for their international customer base. At KSG, forward-looking technologies are developed from samples to large-scale production . They strive to continually be at the forefront RF solutions as well as high-current and thermal management issues that may arise.

KSG PCB ’s PCB Manufacturing Capabilities

ITEM	TECHNICAL PARAMETER
LAYERS	1-60
Max.Board Size	680mm×1000mm
Espesor de la tabla	0.25-6.0mm 10mil-152.4mil
Min. Line Width	0.075mm 3mil
Min Space	0.075mm 3mil
Min Hole Size（Mechanical）	0.2mm 8mil
Min Hole Size （Laser）	0.10mm 4mil
PTH Wall Thickness	＞0.025mm 1mil
PTH Hole Dia Tolerance	±0.076mm 3mil
Non PTH Hole Dia Tolerance	±0.05mm 2mil
Hole Position Deviation	±0.05mm 2mil
Outline Tolerance	±0.13mm 3mil
V-cut	30°/45°/60°
Impedance Control	+/- 7%
Fire Resistance	94V0
Max copper weight(inner)	6 onz
Peel-off Strength	1.4N/mm
Soldermask Abrasion	>7H
Solderability Test	260℃20 second
Flammability	94V0
E-test Voltage	50-300v
Bow/Twist	≤0.75%

6、JLCPCB Factory
Fundado en 2006, JLCPCB has been at the forefront of the PCB industry. With over 15-year continuous innovation and improvement based on customers’ need, we have been growing fast, and becoming a leading global PCB manufacturer, who provides the rapid production of high-reliability and cost-effective PCBs and creates the best customer experience in the industry.

JLCPCB ’s PCB Manufacturing Capabilities

Features	Capability	Notes
Layer count	1,2,4,6 capas	The number of copper layers in the board.
Controlled Impedance	4/6 capa, default layer stack-up	Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator
Material	FR-4	FR-4 Standard Tg 130-140/ Tg 155
Dielectric constant	4.5(double-side PCB)	7628 structure 4.6
		2313 structure 4.05
		2116 structure 4.25
Max. Dimensión	400x500mm	The maximum dimension JLCPCB can accept
Dimension Tolerance	±0.2mm	±0.2mm for CNC routing, and ±0.4mm for V-scoring
Espesor de la tabla	0.4/0.6/0.8/1.0/1.2/1.6/2.0mm	The thickness of finished board.
Thickness Tolerance	± 10%	p.ej. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
( Thickness≥1.0mm)
Thickness Tolerance	± 0.1mm	p.ej. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
( Thickness<1.0mm)
Finished Outer Layer Copper	1 oz/2 oz (35um/75um)	Finished copper weight of outer layer is 1oz or 2oz.
Finished Inner Layer Copper	0.5 onz (17uno)	Finished copper weight of inner layer is 0.5oz only.

7、PCBWay Factory

With more than a decade in the field of Prototipo de PCB and fabrication, we are committed to meeting the needs of our customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requests. As one of the most experienced PCB manufacturers in China, Can provide customers with various types of PCB manufacturing services.

PCBWay ’s PCB Manufacturing Capabilities

Items		Spec.
Número de capas	General PCB board	2-40
	Buried IC	Sí
	HDI（buried and blind vias)	HDI(5+N+5)
		staggered and stacked vias
Materiales	FR4(shengyi)	Sí
	High Tg	Tg-220
	EHalongen Free	Sí
	High Frequency	Sí
Maximum board size		20*35inch(508*889mm)
Espesor de la tabla		0.21-6.0mm
Minimum track line		2mil-inner 2mil-outer
Minimum Spacing line		2mil-inner 2mil-outer
Outer layer copper thickness		7onz
Inner layer copper thickness		7onz
Min. finished hole size(Mechanical)	0.15mm	Sí
Min. finished hole size(laser hole)	0.076mm	Sí
Aspect ratio		12:01
Solder Mask Types and brand	NAYA(LP_4G)	Sí
	Tamura(TT19G)	Sí
	TAIYO(PSR2200)	Sí
Solder Mask Color	green;blue;red;white;black	Sí
Impedance Control Tolerance	±10%,50Ω and below:±5Ω	Sí
Plug via hole	Min.size can be plugged:	0.1mm
	Max.size can be plugged:	0.7mm
Min. annular ring can be kept		3mil
Min. distance between the IC pads		8mil
can keep SM bridge
Min. SM bridge for green soldermask		3mil
Min. SM bridge for black soldermask		4mil
Tratamiento superficial	Sangrar	Sí
	Aceptar	Sí
	OSP	Sí
	LEAD FREE HASL	Sí
	GOLD PLATING	Sí
	IMMERSION Ag	Sí
	IMMERSION Sn	Sí
V-Cut	CNC V-cut, degree	20304560
	V-cut by hand, degree	20304560
Outline Profile		CNC
Chamfer	The angle typeof the chamfer:	203045
	Min. distance of jumping chamfer:	5mm
Tolerance of the dimension size		±0.1mm
Tolerance of the board thickness	0.21-1.0	±0.1
	1.0-2.5	±7%
	2.5-6.3	±6%
Tolerance of the finished hole size	0-0.3mm	±0.08mm
	0.31-0.8mm	±0.08mm
	0.81-1.60mm	±0.05mm
	1.61-2.49mm	±0.75mm
	2.5-6.0mm	+0.15/-1mm
	>6.0mm	+0.3/-1mm
Certificates(copies are needed)	Ul	Sí
	ISO9001	Sí
	ISO14000	Sí
	ROHS	Sí
	TS16949	Sí

 

 

8、ICAPE Group
Since 1999, ICAPE Group has had longtime experience in the production and manufacturing of Printed Circuit Boards and Customized Technical Parts. 3000 clientes en más de 70 countries trust the quality and service offered by the Group and remain recurring clients even now.

ICAPE Group ’s PCB Manufacturing Capabilities

Ensamblaje de PCB Capabilities
Tiempo de entrega	2 – 5 Days, 1 – 2 Weeks and Scheduled Deliveries
Parts Procurement	Full Turnkey, Partial Turnkey and Kitted/Consigned
Assembly Types	Surface Mount (Smt), A través, Mixed Technology (SMT/Thru-hole), Single and Double Sided SMT/PTH, Large Parts on Both Sides, BGA on Both Sides
Board Type	Rigid Boards, Flex Boards and Rigid-Flex Boards
Stencils	Laser Cut Stainless Steel and Nano-coating
Components	Passive Components Smallest Size 01005, Fine Pitch Components Smallest Size 8 Mils Pitch, Leadless Chip Carriers/BGA, VFBGA, FPGA & DFN, Connectors and Terminals
Largest PCB Size	18» incógnita 20»
Smallest PCB Size	1.2» wide
Largest QFP Size	75 mm x 75 mm
BGA Pitch Range	De 0.20 mm to 3 mm
Smallest QFP Pitch Range	De 0.20 mm to 3 mm
Component packaging	Reels, Cut tape, Tube and Loose Parts
Inspection	X-ray Analysis, AOI and Microscope to 20X
Solder Type	Leaded and Lead-free/RoHS Compliant
Assembly surface mount connectors	Yes
Wave Soldering	Yes
PCB Finish	SMOBC/HASL, Electrolytic Gold, Electroless Gold, Electroless Silver, Immersion Gold, Immersion Tin and OSP
Panelized PCB	Tab Routed, Breakaway Tabs, V-Scored and Routed + V-scored
Design File Format	Gerber RS-274X, Eagle and AutoCAD’s DXF, DWG BOM (Bill of Materials) and Pick and Place file (XYRS)