Guía de aplicación de chips Rockchip RK3576

The RK3576 is a high-performance SoC chip carefully developed by Rockchip. It adopts advanced manufacturing processes and achieves an excellent balance between performance and power consumption. Since its launch, the chip has attracted widespread market attention due to its rich features and strong processing power, and has been widely used in AIoT, artificial intelligence, control industrial, and many other fields.

RK3576 Parameters in Detail

1. CPU Performance
RK3576 adopts a big.LITTLE architecture of quad-core Cortex-A72 + quad-core Cortex-A53, and is equipped with an ARM Cortex-M0 coprocessor. The Cortex-A72 cores have strong processing capabilities, with a maximum frequency of 2.3GHz, capable of efficiently handling complex computing tasks; while the Cortex-A53 cores perform excellently in power control, with a maximum frequency of 2.2GHz, reducing energy consumption when executing lightweight tasks. This big.LITTLE architecture design allows the chip to flexibly allocate resources according to different workloads, ensuring performance while effectively reducing overall power consumption.

2. GPU Performance
Its GPU adopts ARM Mali-G52 MC3, with a computing power of 145G FLOPS, supporting OpenGL ES 1.1, 2.0, y 3.2 as well as Vulkan 1.2 graphics standards. This enables the RK3576 to smoothly handle graphics-intensive applications such as 3D gaming and high-definition video playback. For OpenCL, it supports up to version 2.1, providing strong support for heterogeneous computing to meet application scenarios requiring parallel computing.

3. NPU Performance
The RK3576 is equipped with an NPU with 6 TOPS computing power, supporting multiple data formats including int4/int8/int16/FP16/BF16/TF32, adaptable to diverse AI application scenarios. Whether for image recognition, speech recognition, or behavior analysis in smart security, the chip can rely on its powerful NPU computing power to achieve efficient AI inference, endowing products with intelligent core capabilities.

4. Multimedia Processing Capability

• Video Encoding: Supports up to 4K@60fps H.264/H.265 encoding, meeting the needs of high-definition video recording and transmission, enabling high-quality video output in applications such as video surveillance and video conferencing.

• Video Decoding: Supports video decoding up to 8K@30fps, allowing smooth playback of ultra-high-definition videos, bringing users an ultimate visual experience, suitable for smart TVs, HD players, y otros productos.

• ISP (Procesador de señal de imagen): Supports up to 16M Pixel ISP, con HDR (Rango dinámico alto) y 3dnr (3D Digital Noise Reduction) functions, capable of optimizing camera-captured images to improve image quality, playing an important role in smart cameras, security monitoring, and other devices.

5. Expansion Interfaces

• Storage Interfaces: Supports 32-bit LPDDR4/LPDDR4X/LPDDR5 memory, and also supports eMMC5.1, SDIO3.0, SFC, and UFS v2.0. The rich storage interface types allow developers to flexibly choose storage solutions according to product needs, meeting requirements for storage capacity and read/write speed in different application scenarios.

• Interfaces de alta velocidad: Equipped with USB 3.0 interface, with data transfer rates up to 5Gbps, enabling fast transmission of large amounts of data, facilitating connections to external storage devices, high-speed communication modules, etc.. Además, it supports PCIe interface, which can be used to expand high-speed devices such as NVMe SSDs, further improving data read/write speed and meeting the needs of applications requiring high-speed data processing.

• Display Interfaces: Supports multi-screen display, with up to 3 independent displays, supporting 4K@120Hz ultra-clear display and super-resolution functions. It features multiple display interfaces including HDMI/eDP, MIPI DSI, Parallel, EBC, and DP, meeting the connection requirements of different display devices, widely used in smart display terminals, multi-screen interactive devices, y más.

• Other Interfaces: Also equipped with 10/100/1000M Ethernet controllers x2, UART x12, I2C x9, CAN FD x2, and other interfaces, enabling easy communication with various peripherals to meet the multi-interface needs of industrial control, IoT devices, y más.

6. Power Consumption and Heat Dissipation
In terms of power consumption, the RK3576 benefits from advanced manufacturing processes and an optimized power management system, keeping overall power consumption at a reasonable level. Sin embargo, during high-load operations, such as performing complex AI computations or long-term video encoding/decoding, it still generates a certain amount of heat. Por lo tanto, in product design, it is necessary to reasonably design cooling solutions according to actual application scenarios, such as using heatsinks, admiradores, etc., to ensure that the chip operates within a stable temperature range, ensuring system reliability and stability.

RK3576 Power Consumption Test Results:

• Power-on startup with no load: 1.46W

• UPC 100% utilization + memory 10% utilization: 3.44W

• UPC 100% utilization + memory 20% utilization: 4.63W

• UPC 100% utilization + memory 50% utilization: 5.80W