Compared with the conventional PCB board, the IC packaging substrate has a wide width and smaller line spacing, and the size of the board is smaller, which can meet the harsh requirements of mainstream chips.
Nombre de couches de fabrication: 1-48 couches
Nombre de lignes SMT: 8 lignes d'accouplement SMT à grande vitesse
Capacité de production quotidienne SMT: plus que 50 millions de points
Matériel de contrôle: Testeur de rayons X, testeur de première pièce, Testeur optique automatique AOI, Testeur TIC, Station de reprise BGA
Vitesse de montage: Vitesse de montage des composants CHIP (conditions optimales) 0.036S/puce
Forfait minimum: 0201, précision jusqu'à +0,04 mm
Précision minimale de l'appareil: Plcc, Mf, BGA, CSP et autres appareils peuvent être collés, espacement des broches jusqu'à +0,04 mm
18 années de fabrication de circuits imprimés expérience
Équipe de fabrication faisant autorité
Adoption de technologies de pointe et d’équipements de fabrication
Système de production parfait
Délai d'exécution rapide
Système de gestion de la qualité ISO9001/IATF16949 mature.
Système de gestion des commandes ERP et MaS parfait.
Ingénieurs professionnels en contrôle des coûts
Coopération avec de nombreuses entreprises de matières premières.
Inspection DFM gratuite des fichiers PCB et des nomenclatures.
Évaluation et conseils techniques en matière de PCB.
Spécialisé en médecine, automobile, électronique grand public, nouvelle carte électronique d'énergie.
Au service des entreprises mondiales
IC Substrate PCB is the packaging substrate. The development of the HDI board is a technological innovation that adapts to the rapid development of electronic packaging technology. It has excellent characteristics such as high density, high precision, high performance, miniaturization, and lightness. The complete chip is combined by a nude chip (wafer) and the packaging body (packaging substrate and firing material, plomb, etc.).
As the core material of chip packaging, the packaging substrate can protect, fix, and support the chip on the one hand, enhance the heat and heat dissipation performance of the chip, and ensure that the chip is not physical damage. D'autre part , To realize the functions of electrical and physical connection, power distribution, signal allocation, and communication chip internal and external circuits.
Integrated circuit IC substrates have a variety of attributes and characteristics. Some of them include:
Light weight: IC substrates are generally light. This is mainly because the materials they use are relatively thin.
Extremely reliable: These substrates form a protective layer around the integrated circuit. Donc, they must consist of solid materials.
There are fewer wiring and soldering points: IC substrates are usually smaller than typical PCB substrates. Donc, they need less wiring and welding joints.
Compact: IC substrates adopt a miniaturized design. Donc, they need less materials to pack.
Durable: Although some IC substrates are large in size, they are very strong.
Mobile Terminal Equipment
Satellite communications equipment
Storage equipment
Medical equipment
Different materials, technologie, and crafts have different load attributes, and the scope of application is different. The mainstream classification method of the packaging substrate is classified by packaging process, substrate material and application field.
(1) The most widely used packaging process is the lead and inverted of the lead and inverted.
The lead key is combined with fine metal wires, and the use of heat, pressure, and ultrasonic energy to make the metal lead with the chip pad and the substrate pads tightly welded to realize the communication between the electrical interconnection between the chip and the substrate. RF module, storage chip, microcomputer system device packaging;
The inverted packaging is different from the lead key. It uses a welding ball to connect the chip and substrate, c'est, forming a welding ball on the pad of the chip, and then flip the chip to the corresponding substrate, and use the heating and melting welding ball to achieve the chip and the substrate plate and the substrate. Combining pads, the packaging process has been widely used in products such as CPU, GPU and Chipset.
(2) From the perspective of the substrate material, the IC carrier can be divided into ceramic substrates, plastic substrates and metal substrates.
Most of the world’s integrated circuit packaging is encapsulated by resin. Parmi eux, BT resin and ABF resin are most widely used.
BT resin is used to produce BT loads. Because BT resin has a variety of excellent characteristics such as heat resistance, hygrotic resistance, low -agent electric constant, low disappearance factors, etc., it is often used for stable size and prevents heat expansion and improves the benefits of equipment.
(3) From the perspective of the final application, according to the different types of IC finished products, the packaging substrate (Substrat IC) can be divided into storage chip packaging substrates, micro -electromechanical system packaging substrates, radio frequency module packaging substrates, processor chip packaging substrates, and high -speed communication packaging packaging packaging packaging The substrate, etc.. The storage chip packaging substrate is mainly used for the storage module and solid -state drive of smartphones and tablets;
Micro -electrical system packaging substrates are mainly used for sensors for smartphones, comprimés, and wearable electronic products; radio frequency module packaging substrates are mainly used for radio frequency modules for mobile communication products such as smartphones; processor chip packaging substrates are mainly used for smartphones and tablets. The baseband and application processor of the computer.
(4) Combining the packaging process with the packaging technology, and the packaging substrate can be divided into different types. Different packaging processes are used in the field of packaging substrates produced by packaging technology.
HDI Feature
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IC Substrate technical specification
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Layer count
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2 à 10
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Technology highlights
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IC Substrate is PCB support for 1 Chip solder by Wire Bonding Process or Flip Chip Process
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Matériels
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BT (Bismaleimide Triazine)
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Base Copper Thickness
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0-12um depending upon substrate structure method
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Minimum track & espacement
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30/30µm (Advanced 20/20µm)
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Surface finishes available
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Accepter & ENEPIG
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Minimum laser drill
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50µm
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Minimum mechanical drill
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100µm
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PCB thickness
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2L min. 130µm, 4L min. 210µm, 6L min. 300µm
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4 layer LGA substrate
6-layer BGA substrate
Storage card substrate
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: Victor Zhang
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