Multi-layer pcb assembly
Get the highest quality Multilayer PCB with our extensive manufacturing capabilities and facility.
Get the highest quality Multilayer PCB with our extensive manufacturing capabilities and facility.
Nombre de couches de fabrication: 1-48 couches
Nombre de lignes SMT: 8 lignes d'accouplement SMT à grande vitesse
Capacité de production quotidienne SMT: plus que 50 millions de points
Matériel de contrôle: Testeur de rayons X, testeur de première pièce, Testeur optique automatique AOI, Testeur TIC, Station de reprise BGA
Vitesse de montage: Vitesse de montage des composants CHIP (conditions optimales) 0.036S/puce
Forfait minimum: 0201, précision jusqu'à +0,04 mm
Précision minimale de l'appareil: Plcc, Mf, BGA, CSP et autres appareils peuvent être collés, espacement des broches jusqu'à +0,04 mm
18 années de fabrication de circuits imprimés expérience
Équipe de fabrication faisant autorité
Adoption de technologies de pointe et d’équipements de fabrication
Système de production parfait
Délai d'exécution rapide
Système de gestion de la qualité ISO9001/IATF16949 mature.
Système de gestion des commandes ERP et MaS parfait.
Ingénieurs professionnels en contrôle des coûts
Coopération avec de nombreuses entreprises de matières premières.
Inspection DFM gratuite des fichiers PCB et des nomenclatures.
Évaluation et conseils techniques en matière de PCB.
Spécialisé en médecine, automobile, électronique grand public, nouvelle carte électronique d'énergie.
Au service des entreprises mondiales
Multi -layer PCB generally refers to a circuit board above 3 couches. It has a multi -layer conductive material and insulating layer sandwiched together to form a complex circuit design.
As the leading PCB manufacturer in China, LST Technology has rich experience and professional knowledge in multi -layer PCB manufacturing. We can make up to 48 -layer circuit boards, and we provide EMS solutions for different customers.
1. Increased signal transmission speed and data processing capability. Multilayer circuit boards can realize high-speed serial communication and high-frequency digital signal processing by increasing the number of line layers.
2. Improve the system’s anti-interference ability and power stability. Multilayer circuit boards can use more ground and power supply layers, but also by adding shielding layers to reduce electromagnetic interference.
3. High flexibility. Multi-layer circuit boards can be layered according to different functional requirements to achieve a high degree of modularity and reusability, which helps to reduce design costs and shorten the development cycle.
4. Reduced power consumption and improved thermal performance. Multi-layer circuit boards can reduce power consumption by optimizing signal paths and reducing unnecessary connections, while metal-core heat dissipation layers can also be set up on multi-layer circuit boards to meet the requirements of shielding, heat dissipation and other special functions.
5. High assembly density and high size requirements. As electronic products become smaller and smaller, the electrical performance of the PCB also puts forward higher requirements, the demand for multilayer circuit boards is also growing. En même temps, the choice of multi-layer PCB circuit board laying line convenient, laying line length greatly shortened, electronic components between each other to reduce the laying line, but also to enhance the rate of data signal transmission.
6. High-frequency circuit performance. For high-frequency circuits, into the grounding layer, the signal line to the ground to produce a stable low characteristic impedance, the power circuit characteristic impedance is greatly reduced, the interception effect is obvious.
New energy equipment
Satellite communications equipment
Medical equipment
Équipement industriel
Nombre de couches | 1-48 couches |
Matériels | FR4, Tg=135150170180210, cem-3, cem-1, substrat en aluminium, Ptfe, Rogers, Nelco |
Copper thickness | 1/2oz, 1oz, 2oz, 3oz, 4oz, 5oz |
Épaisseur de planche | 8-236mil (0.2-6.0MM) |
Minimum line width/spacing | 3/3 million (75/75um) |
Minute drilling size | 8 million (0.2 MM) |
Min HDI laser drill size | 3 million (0.067 MM) |
Aperture tolerance | 2 million (0.05 MM) |
PTH copper thickness | 1 million (25 microns) |
Resistance welding color | Vert, Bleu, Jaune, Blanc, Noir, Rouge |
Strippable solder mask layer | yes |
surface treatment | Saigner (ROHS), ENING, OSP, sinking silver, sinking tin, shining gold, golden fingers |
Gold thickness | 2-30u “(0.05-0.76um) |
Blind hole/buried hole | yes |
V-shaped cutting | yes |
Contrôleur solaire Carte mère
Carte de remplacement du panneau de commande du système d'alarme incendie