• Facebook
  • Liendin
  • Gazouillement
  • Pinterest
  • Skype
  • Youtube

Contactez-nous maintenant-Email: sales@leadsintec.com

Leadsintec
  • MAISON
  • SERVICES
    • Service de fabrication d'électronique
    • Fabrication de contrats clé en main
    • Assemblage prototype
    • Solutions PCB ODM
    • Développement de projets électroniques
    • Alimentation des composants électroniques
    • Injection de plastique & moule
    • Assemblage de construction de boîtes
    • câble& harnais
    • 3D Impression
  • Assemblage PCB
    • assemblage PCB
    • Assemblage SMT
    • Ensemble PCB de haute qualité
    • Fabrication de PCB
    • PCB DFM
    • Solutions de test PCB
    • Conception de PCB
  • Fabrication de PCB
    • PCB en céramique
    • PCB multicouche
    • PCB flexible
    • PCB rigide
    • PCB Flex rigide
    • ROGERS PCB
    • PCB haute fréquence
    • Substrat IC
    • PCB en cuivre lourd
  • Marchés & Produits
    • Nouveaux produits
    • IoT
    • Nouvelle énergie
    • Automatisé
    • Électronique AI
    • Maison intelligente
    • Communication
    • Module de radar micro-ondes
    • Module de développement de PCB
    • Industriel
    • Agriculture
    • Médical
    • Sécurité
    • Température & Humidité
  • À PROPOS DE NOUS
    • Pourquoi nous choisir
    • Notre équipe
    • Notre équipement
    • Visite d'usine
    • FAQ
    • Notre certificat
  • Blog
    • Connaissances techniques PCB
    • Actualités de l'industrie
    • Nouvelles de l'entreprise
    • Connaissances des composants électroniques
  • CONTACT
  • Rechercher
  • Menu Menu

PCB rigide

Number of manufacturing layers: 1-48 couches

Number of SMT lines: 8 lignes d'accouplement SMT à grande vitesse

SMT daily production capacity: more than 50 million points

Inspection equipment: X-RAY tester, first piece tester, AOI automatic optical tester, ICT tester, BGA rework station

Mounting speed: CHIP component mounting speed (optimal conditions) 0.036S/chip

Minimum package: 0201, accuracy up to +0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be pasted, pin spacing up to +0.04mm

QUOTE NOW

Pourquoi choisir LST

Experienced Manufacturing

18 years of pcb manufacturing experience
Authoritative manufacturing team

Short delivery time

Adoption of advanced technology and manufacturing equipment
Perfect production system
Fast turnaround

Good quality control

Mature ISO9001/IATF16949 quality management system.
Perfect ERP and MaS order management system.

Affordable price

Professional cost control engineers
Cooperation with many raw material companies.

Professional engineering

Free DFM inspection of PCB files and BOMs.
PCB engineering evaluation and advice.

Wide range of services

Specialized in medical, automotive, consumer electronics, new energy pcb.
Serving global enterprises

The introduction and advantage of rigid PCB

What is rigid pcb

Rigid PCBs, are circuit boards made from rigid substrates. This type of circuit board has good mechanical strength, stable electrical properties, good heat and moisture resistance, and is widely used in various electronic products, such as computers, communication equipment, household appliances and so on. The substrate of rigid PCB is usually a rigid material such as FR-4.

What are the advantages of rigid pcb:

1. Good stability: rigid PCB is made of rigid substrate, has a high degree of rigidity and stability, not easy to bend or bend. This stability is conducive to ensuring the performance and life of electronic equipment.

2. High mechanical strength: Due to the use of rigid materials, rigid PCB has high mechanical strength and can withstand large mechanical stress. This makes it suitable for environments that need to withstand mechanical stress, such as automotive and aerospace.

3. Suitable for complex assembly: Rigid PCB is suitable for electronic devices that require a more complex assembly process and more components, providing stable mechanical support and the ability to fix electronic components.

4. Good thermal stability: Rigid PCB has better stability in high temperature environments and can withstand high temperature processes and high power applications.

5. Lower manufacturing costs: Compared to flexible PCBs, rigid PCBs usually have lower manufacturing costs and are suitable for high-volume production.


Application of Rigid PCB

Automotive

Aviation

Computer field

Appliance

Our Manufacturing Capabilities

Item Process Capability
Layer Counts 1-48L
Material FR-4, Kingboard, Nanya, Shengyi, Rogers, Isola, ITEQ, Ventec, Arlon
Maximum Size 600mm x 1500mm
Board Outline Tolerance ± 0.10mm
Board Thickness 0.2-8mm to 0.1mm-8mm
Thickness Tolerance(t≥0.8mm) ± 8%
Thickness Tolerance(t<0.8mm) ± 10%
Insulation Layer Thickness 0.075mm-5.00mm
Minimum Line 0.05mm
Minimum Space 0.05mm
Out Layer Copper Thickness 18um-350mm
Inner Layer Copper Thickness 17um-210mm
Drilling Hole(Mechanical) 0.15mm-6.35mm
Finish Hole(Mechanical) 0.10mm-6.30mm
Diameter Tolerance(Mechanical) 0.05mm
Registration(Mechanical) 0.075mm
Aspect Ratio 16:01
Solder Mask Type LPI
SMT Mini. Solder Mask Width 0.075mm
Mini. Solder Mask Clearance 0.05mm

Case Products

Charging pile PCBA

elevator power controller board

Elevator Power Controller Board

Audio Mixer Mainboard PCBA

Obtenez un devis gratuit,Veuillez me donner vos besoins

Coordonnées

adresser: 4/F,5/F,6/Parc de technologie f xingyuan, Route Gushu le matin, District de Xixiang Town Baoan, Shenzhen , Guangdong, Chine 518102
: Zone A3, Zone industrielle de la trêve de Phung Nenh(Parc industriel NAM Giang), Viet une ville, Bac Giang Province, Vietnam
: +86-15817390087
: +86-755-23108895
: +86-755-29129721
: Victor Zhang
:sales@leadsintec.com

Derniers produits

  • Banana PI BPI-M5 Pro Open Source Open Source Organe Computer PCB Module06/13/2025 - 03:04
  • BPI BPI:Bit Steam Education Development Board05/07/2025 - 06:16
  • Module de développement ESP32-H2-Devkitm-104/22/2025 - 03:35

Blog

  • Rockchip RK3588 Chip Application GuideGuide d'application de la puce Rockchip RK358808/13/2025 - 03:45
  • In-Depth Analysis of the ESP32-S3 ModuleAnalyse approfondie du module ESP32-S3: Performance, Sécurité, et écosystème08/11/2025 - 06:48
  • How to Choose the Right Ceramic PCB ManufacturerComment choisir le bon fabricant de PCB en céramique08/07/2025 - 06:30

SERVICES

·EMS
·Conception de PCB
·Approvisionnement
·Boîte de boîte
·Assemblage PCBA
·Fabrication de PCB
·Assemblage prototype
·Développement de projet
·Inspection de qualité
·Estampage métallique

SUIVEZ-NOUS

skype facebook
gazouillement liendin
pinterest pinterest

Traduction


Defini comme langue par défaut
Droit d'auteur Leadsin Technology Co.ltd | Tous droits réservés | Propulsé par la solution Nocti  |DataPrivacy|Sitemap
  • Facebook
  • Liendin
  • Gazouillement
  • Pinterest
  • Skype
  • Youtube
Faire défiler vers le haut
  • Contact us on WhatsApp
  • Send an email
  • leave a message