Our company specializes in the R&D, prototypage, production en petits et moyens lots, and large-scale manufacturing of high-layer PCBs ranging from 16 à 36 couches. We focus on standardized production of 24-layer PCBs and have overcome six major industry challenges: multi-layer lamination misalignment, registration deviation, via copper cracking, dielectric inconsistency, impedance deviation, and board warpage.
The 24-layer PCB is a high-density interconnect (HDI) multilayer circuit board featuring high routing density, performances électriques stables, strong EMI shielding, high integration capability, and strong computational load support. It is widely used as a core substrate in high-end industrial equipment, server computing systems, medical imaging devices, rail transit control systems, 5G communication base stations, et aérospatiale & électronique automobile.
Unlike conventional low- and mid-layer PCBs, 24-layer PCBs undergo more than four sequential lamination cycles, blind and buried via alignment processes, inner-layer flow control design, and differential impedance management. They are designed to meet the requirements of miniaturization, haute intégration, and high-frequency/high-speed circuit applications. We support customization with standard FR-4, high-TG materials, Rogers high-frequency laminates, and halogen-free substrates, ensuring long-term reliability under harsh industrial conditions.
24-Layer PCB Standard Process Parameters
| Paramètre |
Industry Standard Process |
Our High-Precision Process |
| Matériel |
Standard FR-4 TG130 |
High-TG 170/180, Rogers, Shengyi/Nanya military-grade laminates, matériaux sans halogène |
| Finished Board Thickness |
2.4 ± 0.2 MM |
2.2–3.0 mm adjustable, tolerance ±0.08 mm |
| Minimum Trace/Space |
0.12 MM / 0.12 MM |
0.075 MM / 0.075 mm high-precision routing |
| Via Technology |
Mechanical through-hole vias |
Mechanical vias + 1st/2nd order blind & vias enterrés, laser microvias |
| Lamination Accuracy |
Registration error ≤ 75 µm |
Multi-layer registration error ≤ 35 µm, preventing layer misalignment short circuits |
| Tolérance d'impédance |
±10% |
High-speed differential impedance control within ±5% |
| Finition de surface |
Saigner, boîte à immersion |
Accepter, Enépique, argent par immersion, OSP, anti-oxidation, thick gold plating |
| Fiabilité |
Standard reflow soldering |
No delamination or blistering, 260°C thermal resistance test, UL/RoHS compliant |
