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Top 10 Methods for High-Quality PCB Assembly Testing

07/10/2025 dans /par

Behind every successful electronic product lies a high-quality Assemblage PCB. To ensure the functionality of a PCBA, testing is an essential and indispensable process.
PCBA testing refers to the inspection of electrically assembled PCBA boards to verify electrical connectivity and input-output functionality. In Conception de PCB, there are specific voltage and current relationships between various test points. Specialized testing equipment or manual multimeter methods are used to check these points and determine whether the assembled PCBA meets design requirements.

Testing is a critical step in ensuring product quality before delivery. According to the customer’s design—such as test points, test procedures, and software—a functional test fixture (FCT) is developed. The PCBA is then placed on the FCT jig for comprehensive testing. This article summarizes 10 key testing methods for high-quality PCB assembly.

Purpose of PCBA Testing

1. Verify Functionality

  • Ensure each electronic component (e.g., ICs, resistors, capacitors, inductors) functions properly.

  • Confirm that the circuit logic complies with design specifications.

  • Validate whether firmware or software operates as intended (e.g., MCU boots up properly after flashing).

2. Detect Manufacturing Defects

  • Identify soldering issues: cold solder joints, shorts, opens, bridging, solder balls, etc..

  • Detect misaligned, reversed, or missing components.

  • Spot inherent PCB defects, such as broken traces or misaligned holes.

3. Improve Yield and Reduce Rework Costs

  • Catch defects early to prevent faulty units from reaching customers.

  • Use test feedback to optimize production processes and increase the overall yield.

  • Minimize after-sales repairs, returns, and other hidden costs.

4. Ensure Reliability and Safety

  • Test the product’s performance under extreme conditions (e.g., thermal cycling, burn-in).

  • Comply with industry or customer-specific quality standards (e.g., IPC, ISO, Ul).

  • Prevent latent failures that could lead to safety issues or major losses.

5. Meet Customer or Certification Requirements

  • Certain industries—such as medical, automotive, and aerospace—require mandatory testing protocols.

  • Comprehensive test documentation is often necessary for third-party certifications like ISO 9001 or IATF 16949.

10 Essential PCBA Testing Methods for High-Quality Assembly

A high-quality PCB assembly is the backbone of every reliable electronic product. To ensure the PCBA performs as intended, testing plays a crucial role. Below are 10 widely used and effective PCBA testing methods that help detect manufacturing defects, verify functionality, and guarantee reliability.

1. AOI (Automated Optical Inspection): Key to SMT Process Quality

AOI uses high-resolution cameras to scan PCB images and compare them against a “golden sample” to identify issues such as component misalignment, missing parts, or poor solder joints. Modern AOI systems now include 3D capabilities, enabling analysis of solder paste height and volume. AOI is typically placed after solder paste printing and reflow to form an efficient closed-loop quality control process.

2. AXI (Automated X-ray Inspection): Revealing Hidden Solder Joints

AXI is indispensable for inspecting components like BGAs, where solder joints are not visible. X-ray imaging penetrates the board to detect voids, cold joints, or hidden defects. Advanced 3D AXI systems offer layer-by-layer analysis, clearly visualizing solder ball cross-sections and enabling detection of fine defects such as Head-in-Pillow (HiP). AXI is valuable both for inline testing and failure analysis.

3. FCT (Functional Circuit Testing): Verifying Real-World Performance

Functional testing simulates real-life operating conditions to ensure the PCBA functions as designed. It typically requires a custom test fixture and software to send commands and read responses. FCT verifies system-level performance and is often the final step before product shipment.

4. ICT (In-Circuit Testing): The Powerhouse for Mass Production

ICT uses a bed-of-nails fixture to access all test points simultaneously, enabling fast testing of shorts, opens, and component values. By applying guarding techniques, ICT isolates individual components for accurate measurement. While it doesn’t test dynamic behavior, it complements FCT to ensure complete coverage.

5. Flying Probe Test: Flexible Option for Prototypes and Low Volume

Flying probe testing requires no custom fixture and uses robotic probes to contact test points sequentially. It functions like an automated multimeter and is ideal for R&D, small batches, or designs without dedicated test pads. Probes can touch vias or solder pads directly, making it a versatile option.

Flying Probe Test

6. Burn-In Test: Filtering Early-Life Failures

Burn-in testing exposes boards to extreme conditions—such as 125°C or high voltage—for extended periods to eliminate early-life failures. It reveals hidden issues like microcracks or weak solder joints and is critical in industries requiring high reliability (automotive, medical, defense).

Burn-In Test

7. Cross-Section Analysis: The Ultimate Quality Investigation Tool

When facing deep or complex quality issues, micro-sectioning offers a clear internal view of the PCB. After sample extraction, embedding, and polishing, engineers can inspect copper thickness, layer alignment, via quality, and more under a microscope. It provides objective evidence for process evaluation and dispute resolution.

8. Solderability Testing: Preempting Soldering Issues

This test evaluates the wettability of component leads and PCB pads, usually during incoming inspection. Methods like dip-and-look or wetting balance testing assess how well solder adheres. It’s especially important for aged or unknown-sourced parts to prevent downstream soldering defects.

Solderability Testing

9. Ionic Contamination Testing: Preventing Electrochemical Failures

Residual flux, dust, or sweat can cause ionic contamination, leading to dendrite growth and short circuits. ROSE testing provides a quick assessment of overall ionic cleanliness, while ion chromatography (IC) identifies specific residues. These tests validate the effectiveness of cleaning processes and long-term reliability.

10. TDR (Time-Domain Reflectometry) Impedance Testing: Ensuring Signal Integrity

For high-speed signal boards, controlled impedance is critical. TDR works like a radar, sending fast pulses through traces and analyzing reflections to locate impedance discontinuities. It ensures that PCB fabrication meets signal integrity requirements, especially in telecom, server, and data center applications.

Conclusion

PCBA testing is essential for ensuring assembly quality and product reliability. Techniques such as AOI, AXI, ICT, FCT, and others help detect defects, verify performance, and eliminate latent failures. These tests ensure each board shipped meets design specifications and customer expectations, making PCBA testing a cornerstone of electronic quality assurance.

Detailed Process Description of Solder Mask Bridge in PCB

07/04/2025 dans /par

The surface of a PCB is coated with a layer of lacquer known as solder mask ink. This is one of the most common and essential types of ink used in Fabrication de PCB. While approximately 90% of solder mask is green, other colors such as red, blue, black, white, and yellow are also available.

The primary function of solder mask ink is insulation. During the soldering process, it helps prevent short circuits caused by solder bridging and physical damage to conductive traces. It also protects against insulation degradation or corrosion caused by environmental factors such as dust and moisture.

A solder mask bridge refers to the section of solder mask between the solder pad openings of closely spaced component leads—typically ICs with fine-pitch pins. The role of the solder mask bridge is to prevent solder flow and bridging between pads during soldering. To ensure reliable solder joints and avoid shorts, it is essential to maintain solder mask bridges between adjacent pads wherever possible.

Types of Solder Mask Bridges

Each PCB layout and component density imposes specific requirements. PCB designers must choose the appropriate type of solder dam based on these needs. Different types of solder mask bridges offer various advantages, improving reliability and reducing the risk of solder bridging.

1. Open Solder Mask Bridge

An open solder mask bridge exposes designated areas of copper on the PCB. It provides controlled spacing between components to allow selective electrical connection. This technique prevents solder from migrating through the structure while still maintaining stable electrical conductivity. Open solder dams are especially suitable for high-frequency and RF (radio frequency) applications, where precise solder flow control is critical due to the performance sensitivity of the circuits.

2. Mesh (Grid) Solder Mask Bridge

The mesh solder mask bridge employs a grid-like structure in its design. This configuration helps to minimize thermal stress during soldering. The mesh layout enhances adhesion strength and prevents cracking of the solder mask material. Mesh-type solder dams are particularly effective for large copper areas. By incorporating these design improvements, the mechanical reliability and stability of the circuit board are significantly increased.

3.Circular Solder Mask Bridge

When using a circular solder mask bridge, a ring-shaped pattern is formed around the pad. This design helps prevent bridging between components in tightly packed areas of the circuit board. Due to its structural layout, circular solder mask bridges enable more precise and efficient soldering operations, while also minimizing the risk of short circuits.

Circular dams are particularly well-suited for fine-pitch and high-density PCBs, where maintaining solder joint integrity is crucial. With this design, solder joints are kept clean and uniform, contributing to consistent overall board quality.

Solder Mask Bridge in PCB

Design Rules and Standards for Solder Mask Bridge

1. Minimum Width Requirements

  • Standard Design:
    The typical minimum width of a solder mask bridge is ≥ 6 mil (0.152 mm), suitable for general consumer electronics and industrial control PCBs.

  • High-Density PCBs (e.g., HDI boards):
    The width can be reduced to 3.2 mil (0.08 mm) or even smaller, depending on the fabricator’s capabilities. Par exemple:

    • JLCPCB, using LDI (Laser Direct Imaging) technology, can achieve a minimum solder dam width of 2 mil (0.05 mm).

  • Ultra-High-Density Packaging (e.g., FC-BGA):
    A width range of 0.05–0.08 mm is used, suitable for high-end server boards and AI processors.

2. Pad Spacing Consideration

The solder mask bridge width should be calculated based on pad spacing. A typical empirical formula is:

Solder Mask Bridge Width = Pad Spacing − 2 × Pad Width − 2 × Fabrication Tolerance

Example:
If pad spacing = 0.5 mm, pad width = 0.25 mm, tolerance = 0.05 mm, then:

Solder mask bridge width ≥ 0.05 mm

3. Thickness Requirements

  • Standard Thickness:
    The solder mask layer is typically 8–15 μm thick.

    • If too thin: risks of soldering failure due to insufficient insulation.

    • If too thick: may negatively affect assembly precision.

  • Recommended Practice:
    Use multiple screen printing passes or spray coating to achieve a thickness ≥ 15 μm, especially for high-reliability applications.

Manufacturing Considerations for Solder Mask Bridges

The process capability of solder mask bridges is affected by ink color, copper thickness, and board layout:

  • Green solder mask ink offers better process control and can accommodate smaller solder dams compared to colored inks.

  • Thicker copper requires wider solder mask bridges, while thinner copper allows for narrower and more stable solder dams.

1. For Base Copper Thickness ≤ 1 oz:

  • Green & Matte Green: Solder mask bridge ≥ 4 mil

  • Other Colors: Solder mask bridge ≥ 5 mil

  • On large copper pour areas: Solder mask bridge ≥ 8 mil

2. For Base Copper Thickness 2–4 oz:

  • Glossy Black, Matte Black, White: Solder mask bridge ≥ 6 mil

  • On large copper pour areas: Solder mask bridge ≥ 8 mil

3. Solder Mask Bridges Between Large Copper Areas (HASL Surfaces):

  • To prevent solder bridging between large copper zones (especially with HASL finish), solder dam width must be ≥ 8 mil.

Solder Mask Bridge in PCB-1

Main Application Scenarios of Solder Mask Bridge

1. Fine-Pitch Packages

For ICs with fine-pitch packaging such as QFP (Quad Flat Package), LGA (Land Grid Array), and BGA (Ball Grid Array), the pad spacing is typically less than 0.5 mm.
Solder mask bridges are essential to prevent solder bridging between adjacent pads, which could otherwise lead to short circuits.
This is especially critical in automated soldering processes, where solder paste tends to spread under heat; without solder mask bridges, solder bridging becomes more likely.

2. High-Density Routing Areas

In HDI (High-Density Interconnect) PCBs, where routing is dense, solder can easily flow between adjacent pads if solder mask bridges are not implemented.
Solder dams act as physical barriers, enhancing electrical insulation and ensuring the reliability and safety of the circuit.

3. Prevention of Solder Ball Spatter

Solder mask bridges help seal gaps between pads, reducing the likelihood of solder balls splashing into unintended areas during reflow soldering.
This significantly improves soldering quality and reduces potential post-soldering defects.

4. Multilayer Boards or Bottom-Side Soldering

In double-sided PCB assemblies, when components are soldered on the bottom layer, solder mask bridges can be applied between pads on the top layer to prevent flux or solder contamination of areas that should not be soldered.
This is particularly useful in soudure d'onde or selective soldering applications.

Conclusion

Solder mask bridges are a critical structure in ensuring the reliability of PCB soldering. Their design must take into account pad spacing, manufacturing capability, and soldering process.
By selecting appropriate solder dam widths, optimizing solder mask material properties, and closely collaborating with PCB manufacturers, one can significantly improve PCB yield and long-term reliability.

As electronic products continue to evolve toward higher density and finer pitch designs, solder mask technologies will continue to advance to meet the growing demands of miniaturization and performance.

What is the manufacturing process of ceramic pcb?

07/02/2025 dans /par

With the continuous advancement of electronic technology, the market demand for circuit boards with greater robustness, higher reliability, and enhanced performance is on the rise—driving the widespread adoption of ceramic PCB manufacturing technology.
Compared with traditional PCBs that use fiberglass or plastic substrates—which perform adequately in standard applications—these conventional materials often fall short in harsh or high-performance environments. Ceramic PCBs, by contrast, have emerged as the ideal solution for industries with stringent system stability requirements, thanks to their superior thermal conductivity, outstanding structural strength, and exceptional environmental adaptability.

The production of ceramic PCBs involves a series of precise and specialized processes aimed at transforming high-performance ceramic materials into highly reliable electronic substrates. These PCBs are widely used in aerospace, automotive electronics, medical instruments, and telecommunications equipment, playing a vital role in ensuring the durability and overall performance of electronic components.
This article will provide a systematic overview of the ceramic PCB manufacturing process, the key material compositions, and a detailed comparison of their advantages over traditional PCB solutions.

What is a Ceramic PCB?

A ceramic PCB (Ceramic Printed Circuit Board) is a high-performance circuit board that uses ceramic materials as its substrate. It is fabricated by directly bonding copper foil to ceramic bases such as aluminum oxide (Al₂O₃) or aluminum nitride (AlN), offering excellent thermal conductivity, high-frequency electrical performance, and mechanical strength. As a result, ceramic PCBs are widely employed in high-power, high-frequency, and extreme-environment electronic devices.

As a next-generation high-performance electronic carrier, ceramic PCBs excel in thermal conductivity, electrical insulation, high-temperature resistance, and dimensional stability. These properties make them indispensable in demanding fields such as aérospatial, military equipment, new energy vehicles, lasers, high-power modules, RF communications, and medical electronics—all of which require exceptional reliability and performance. Compared to traditional FR4 organic materials, ceramic PCBs offer significant advantages in terms of heat dissipation, frequency response, dielectric loss, and mechanical strength.

Types of Ceramic Printed Circuit Boards

Ceramic Fabrication de PCB processes allow for the production of several types of ceramic PCBs, each tailored to specific applications. These include:

High-Temperature Co-Fired Ceramic (HTCC)

HTCC ceramic printed circuit boards are produced by integrating conductive layers with ceramic substrates through a high-temperature co-firing process that operates at temperatures above 1600°C. The resulting products offer enhanced integration, mechanical stability, and compatibility with high temperatures and environmental stress. HTCC dielectric substrates are commonly used in aerospace, military, and high-power applications where optimal performance stability under extreme conditions is essential.

Low-Temperature Co-Fired Ceramic (LTCC)

LTCC PCBs are manufactured using a similar co-firing technique but at a lower temperature, typically around 850°C. These boards are ideal for high-frequency signals, such as those used in RF modules and telecommunications equipment. LTCC PCBs meet high electrical standards and are the preferred choice for compact, miniaturized, and high-frequency circuits.

Multilayer Ceramic Printed Circuit Boards

Multilayer ceramic PCBs involve the use of multiple layers of ceramic materials, each containing uniquely printed circuits. These layers are stacked and fused together during the ceramic PCB manufacturing process, resulting in a compact and highly dense final product. Multilayer ceramic PCBs are widely used in microelectronics, dispositifs médicaux, and satellite communication systems, where both size and performance are critical.

PCB en céramique

Ceramic PCB Manufacturing Process

Ceramic printed circuit boards are high-performance electronic components characterized by high temperature resistance, high frequency, high voltage, and high reliability. They are widely used in aerospace, military, telecommunications, and other fields. The following outlines the typical manufacturing process of ceramic PCBs.

1. Raw Material Preparation

The performance of ceramic PCBs heavily depends on the purity, particle size distribution, and chemical stability of the ceramic powder substrate. Therefore, the first step is the careful selection and treatment of base materials.

Raw Materials Composition:

  • Ceramic powders: such as aluminum oxide (Al₂O₃), aluminum nitride (AlN), zirconium oxide (ZrO₂), magnesium oxide (MgO), with purity exceeding 99%;

  • Organic binders: such as PVA (polyvinyl alcohol), polyethylene glycol, used for temporary binding;

  • Solvents and additives: used to adjust flowability and film formation, including ethanol, acetone, butanone, dispersants, etc..

Process Flow:
Ceramic raw material selection → ball milling and mixing → vacuum de-airing → drying and granulation → storage for use

Control Focus:

  • Particle size controlled between 0.5 to 3 μm;

  • Uniform distribution to prevent sintering defects like porosity or cracking;

  • Strict control of moisture and impurities to avoid gas bubbles during sintering.

2. Ceramic Slurry Printing or Lamination Molding

The mixed ceramic powder, organic binder, and solvent slurry is printed onto ceramic substrates to form the required circuit patterns and component mounting locations. The forming method varies with different ceramic PCB types:

  • A. Thick Film/Thin Film Printing (for single-layer ceramic boards):
    Ceramic or conductor slurry is printed on the substrate via screen printing or inkjet printing;
    Functional patterns like circuits, pads, capacitive layers, and inductive patterns are formed.

  • B. Green Tape Lamination (for LTCC/HTCC):
    Ceramic powders are mixed into “green tapes” and laminated via hot pressing to form multilayer structures;
    Conductive circuits are printed on each layer, with vias created to establish electrical connections.

Core Equipment:

  • Automatic screen printers

  • Precision laminating alignment machines

  • Vacuum presses / isostatic presses (the latter for complex shapes)

3. Drying and Pre-curing

Printed or laminated substrates are placed in a temperature-controlled oven for low-temperature drying at 80~120°C for 1-2 hours.
This step evaporates solvents in the slurry, enhancing initial pattern stability and preventing defects such as bubbles or delamination during subsequent sintering.

Key Points:

  • Uniform drying with controlled temperature rise to avoid internal stress buildup;

  • Conducted in cleanroom or controlled environment to prevent dust contamination.

4. High-Temperature Sintering (Densification)

This is the critical step for ceramic PCB formation.

Sintering Process:

  • Dried ceramic boards are placed in a high-temperature furnace following a programmed sintering curve;

  • Temperatures typically range from 1300 to 1650°C;

  • Sintering duration is 2-4 hours (including heating, soaking, and cooling phases);

  • Furnace atmosphere can be air, nitrogen, hydrogen, or vacuum depending on ceramic type and metallization method.

Sintering Outcomes:

  • Ceramic powder grains reorganize, forming a continuous, dense polycrystalline structure;

  • Final boards achieve target mechanical strength, dimensional stability, thermal conductivity, and electrical insulation.

5. Surface Metallization (Conductive Circuit Formation)

After sintering, ceramic substrates are insulating and require metallization to deposit conductive layers forming the circuit patterns.

Common Metallization Techniques:

Process Name Principle & Features Typical Applications
DPC (Direct Plated Copper) Sputtering TiW/Cu seed layer + copper electroplating; high precision (down to 50 μm) High-frequency, high-density packaging
DBC (Direct Bonded Copper) Copper foil bonded to ceramic via high-temperature eutectic reaction; copper thickness up to 800 μm High-current modules, power devices
Electroless Ni/Cu/Au Plating Surface activation followed by chemical deposition of multilayer Ni/Cu/Au Chip carriers, solder pins
Screen-Printed Conductive Paste Sintered silver paste, gold paste, suitable for high-frequency and thick-film circuits Microwave, radar applications

6. Soldering and Component Mounting

Following metallization and patterning, electronic components are soldered onto the circuits.

Common Techniques:

  • Soudeur de reflux (SMD assembly)

  • Laser welding, ultrasonic welding (for leads or power pins)

  • Silver paste sintering (especially suitable for IGBT chip mounting)

Process Features:

  • Ceramic PCBs withstand high temperatures (>800°C), compatible with various high-temperature soldering methods;

  • Strong copper-ceramic bonding endows excellent thermal shock resistance and high current capacity.

7. Testing

Completed PCBs undergo rigorous inspections, y compris:

  • Electrical Testing: Verify correct circuit connections, no shorts or open circuits, ensuring reliable operation with connected devices.

  • Thermal Testing: Assess heat conduction and convection performance, crucial for PCBs exposed to high temperatures.

  • Mechanical Testing: Apply bending, vibration, or other stresses to test mechanical resilience.

Whether used in satellites, electric vehicles, or medical devices, each test is critical to ensure reliable operation of ceramic PCBs in their intended applications.

8. Shaping, Cutting, and Packaging

  • Shaping:
    Mechanical drilling is unsuitable for ceramics; laser processing (UV, CO₂) is employed for drilling, V-cuts, grooves, and vias with precision control.

  • Cleaning and Packaging:
    Ultrasonic cleaning with deionized water;
    Drying followed by vacuum sealing;
    For sensitive products, desiccants and anti-static bags are added.

Conclusion

The manufacturing of ceramic PCBs is a highly complex and precise technological process, capable of producing circuit boards that combine exceptional thermal conductivity, mechanical strength, and electrical performance. From the selection of raw materials to the formation of circuit patterns and final testing, every step is meticulously controlled to ensure outstanding performance and reliability of the finished product.

In fields with stringent demands for durability, heat dissipation efficiency, and electrical stability, ceramic PCBs have become an indispensable solution. From aerospace to medical instruments, from automotive electronics to telecommunications, ceramic-based circuit boards provide a solid foundation for the next generation of high-tech applications. As the demand for high-performance electronic systems continues to rise, ceramic PCBs will play an increasingly critical role in enhancing device reliability and operational efficiency.

What is the difference between ceramic PCB and FR4?

06/26/2025 dans /par

In the current PCB industry, both ceramic PCB substrates and FR4 PCB substrates are commonly used.FR4 substrates are widely applied due to their low cost, while ceramic PCB substrates are more high-end with relatively higher costs. Many customers are still unfamiliar with ceramic PCBs, so in this article, we will compare ceramic PCBs and FR4 PCBs from several aspects including materials, performance, manufacturing processes, and applications.

What is a Ceramic PCB?

A ceramic PCB (Printed Circuit Board) is a type of circuit board manufactured using ceramic materials as the base. Unlike conventional substrates made from glass fiber-reinforced epoxy (FR4), ceramic PCBs offer superior thermal stability, mechanical strength, dielectric properties, and longer service life.
They are primarily used in high-temperature, high-frequency, and high-power applications—such as LED lighting, power amplifiers, semiconductor lasers, RF transceivers, sensors, and microwave devices.

What is an FR4 PCB?

FR4 is a composite material made primarily of woven fiberglass cloth and epoxy resin, compressed into multiple layers. It is one of the most widely used substrate materials for printed circuit boards (PCBs).
FR4 is favored for its excellent insulation, mechanical strength, low cost, and ease of processing. Its key properties include a low dielectric constant, high temperature resistance, good flame retardancy, strong mechanical performance, and outstanding chemical stability. These characteristics make FR4 the most commonly used PCB base material in a wide range of electronic products.

What Is the Difference Between Ceramic PCB and FR4?

1. Different Base Materials Lead to Different Properties

Ceramic PCBs use ceramic substrates such as alumina (Al₂O₃), aluminum nitride (AlN), or silicon nitride (Si₃N₄), which offer excellent thermal conductivity and insulation. In contrast, FR4 boards are made of fiberglass-reinforced epoxy laminate, which has relatively poor thermal conductivity and lacks inherent insulation performance.

2. Significant Differences in Thermal Conductivity and Insulation

Ceramic PCBs feature thermal conductivity ranging from 25 W/m·K to 230 W/m·K, depending on the material:

  • Alumina: 25–30 W/m·K

  • Aluminum nitride: 170 W/m·K or higher

  • Silicon nitride: 80–95 W/m·K

By contrast, FR4 PCBs typically offer thermal conductivity of only a few W/m·K. Moreover, FR4 boards require an additional insulation layer to help dissipate heat, whereas ceramic PCBs are inherently excellent insulators, with insulation resistance reaching ≥10¹⁴ Ω·cm.

3. Differences in Cost and Production Lead Time

Ceramic PCBs are significantly more expensive and have longer lead times compared to FR4 boards. While an FR4 prototype may cost only a few hundred RMB and be completed within 24 hours, a ceramic PCB prototype could cost several thousand RMB and typically takes 10–15 days for production.

ceramic PCB

ceramic PCB

4. Differences in Performance Advantages

Advantages of Ceramic PCBs:

  • High-Frequency, High-Speed Performance:
    Very low dielectric constant (<10) and dielectric loss (<0.001), ensuring fast signal transmission and low latency—ideal for 5G communications and radar systems.

  • Superior Heat Dissipation:
    High thermal conductivity helps quickly dissipate heat, reducing thermal stress on power devices and extending lifespan—for example, in LED lighting and automotive ECUs.

  • Environmental Resilience:
    Operates reliably under harsh conditions: wide temperature range (-55°C to 850°C), radiation resistance, and vibration resistance—suitable for aérospatial and military applications.

  • High Integration Capability:
    Compatible with LTCC/HTCC technologies for 3D integration, reducing size in semiconductor modules and intelligent power components.

Advantages of FR4 PCBs:

  • Cost-Effective:
    Material costs are about one-third that of ceramic PCBs, making them ideal for mass production.

  • Mature Manufacturing Processes:
    Well-established SMT support and short turnaround times—double-sided boards can be produced in just a few days.

  • Stable Electrical Performance:
    Dielectric constant of 4.0–4.7 and dielectric loss of 0.01–0.03, suitable for low- to mid-frequency applications such as consumer electronics and telecom devices.

5. Different Manufacturing Processes

Ceramic PCB manufacturing involves several complex processes such as DPC, DBC, thin-film, thick-film, HTCC, and LTCC technologies—each with unique requirements. In contrast, FR4 PCB production is simpler and more standardized. For multilayer ceramic PCBs, the process becomes even more complex and technically demanding compared to multilayer FR4 boards, resulting in higher cost and difficulty.

6. Different Market Applications

Thanks to their high thermal conductivity, excellent insulation, high-frequency capability, and resistance to extreme conditions, ceramic PCBs are widely used in:

  • High-power applications

  • High-current circuits

  • High-frequency systems

  • Environments requiring high thermal stability and insulation

On the other hand, FR4 PCBs are more broadly adopted across various industries due to their lower cost, shorter production cycle, and high demand—making them the go-to choice for consumer electronics, telecommunications, and general-purpose electronics.

Ceramic PCB vs FR4 PCB

Feature PCB en céramique FR4 PCB
Material Ceramic (AlN, Al₂O₃, BeO) Fiberglass + epoxy (FR4)
Thermal Conductivity High Low
Heat Resistance Very High Moderate
Mechanical Strength Brittle Tough/Flexible
Cost High Low
Applications High-power, high-temp General electronics

Comparison and Selection Guide for Ceramic PCBs and FR4 PCBs

Selection Criteria Ceramic PCBs FR4 PCBs
Performance Priorities High-frequency and high-speed performance, thermal management, high-temperature resistance, radiation hardness Cost-effectiveness, manufacturing maturity, electrical stability for mid/low-frequency applications
Cost Sensitivity High (material and processing costs exceed FR4 by 3x or more) Low (ideal for mass production)
Typical Application Scenarios Aerospace, 5G communications, automotive electronics (high-power modules) Consumer electronics, communication devices, industrial controls
Reliability Requirements High (requires CTE-matched designs) Moderate (conventional UL94 V-0 flame-retardant standards)

Future Trends and Decision-Making Guidance

Technological Evolution

  • Ceramic PCBs: With the growing maturity of LTCC/HTCC processes, ceramic PCBs are expected to see wider adoption in 5G base stations, electric vehicle battery management systems (BMS), and other high-performance applications.

  • FR4 PCBs: By incorporating high-frequency materials (e.g., PTFE composites) and eco-friendly technologies (e.g., lead-free processes), FR4 PCBs continue evolving to meet new market demands.

Selection Decision Tree

  • High-frequency, high-speed requirements →
    Choose ceramic PCB or high-frequency FR4 materials (e.g., Rogers RO4003).

  • High-power thermal management needs →
    Choose ceramic PCB or aluminum-based PCB.

  • Cost-sensitive projects →
    Choose FR4, ideally with 96% alumina hybrid designs for better thermal performance at lower cost.

  • Extreme environments (high temperature/radiation) →
    Choose ceramic PCB, particularly aluminum nitride (AlN) substrates.

Conclusion

The core difference between PCB ceramic substrate and FR4 substrate lies in material properties and application direction. Ceramic substrate is based on ceramic materials such as alumina and aluminum nitride, with high thermal conductivity, excellent electrical insulation and outstanding high temperature resistance, suitable for power electronics, LED lighting, radio frequency communication and other fields with extremely high requirements for heat dissipation and stability; while FR4 substrate is composed of glass fiber cloth and epoxy resin, with good mechanical strength and processability, low cost, and is the first choice for most common electronic products such as consumer electronics, computers and industrial control.

Classification of Surface Mount Technologies for Ceramic PCB

06/11/2025 dans /par

Ceramic circuit boards are a new class of materials known for their high-temperature stability, excellent insulation properties, low thermal expansion coefficient, and superior processability. These characteristics make them widely used in high-temperature and high-frequency circuits, power electronics, and electromagnetic compatibility applications.

As electronic technologies continue to advance, the use of ceramic PCBs is becoming increasingly prevalent. Among their key technological aspects, surface mount technology (Smt) plays a crucial role. This article explores the classification of SMT techniques for ceramic PCBs and analyzes their prospects in the electronics industry.

Classification of Surface Mount Technologies for Ceramic PCBs

1. Thin Film Method (DPC – Direct Plated Copper)

Process: A metal seed layer is deposited on the ceramic surface using magnetron sputtering or vacuum evaporation, followed by electroplating to thicken the copper layer. Photolithography and etching are then used for circuit patterning.
Technical Features:

  • High Precision: Line width/spacing can reach 20μm, suitable for high-frequency, high-density circuits.

  • Material Compatibility: Supports substrates such as alumina (Al₂O₃) and aluminum nitride (AlN), offering excellent surface flatness.
    Typical Applications:

  • LED Lighting: High thermal conductivity (AlN substrate up to 230 W/m·K) ensures efficient heat dissipation.

  • Microwave & RF Devices: Low dielectric loss (ε_r ≈ 9) meets 5G/6G communication requirements.

2. Thick Film Method (TFC – Thick Film Ceramic)

Process: Conductive paste containing metal and glass powders is screen-printed onto a ceramic substrate and then sintered at high temperatures to form circuits.
Technical Features:

  • Cost-Effective: Simple process with low equipment costs, though line width precision is limited (≥0.1 mm).

  • Material Constraints: Conductive layer thickness is typically 10–20μm, suitable for low- to medium-power applications.
    Typical Applications:

  • Automotive Electronics: Used in ECUs and control modules requiring resistance to high temperatures (>150°C) and mechanical vibration.

3. Co-fired Method (HTCC / LTCC)

High-Temperature Co-fired Ceramic (HTCC):

  • Process: Sintered at 1650–1850°C, involving multilayer ceramic green tapes printed with circuits and laminated.

  • Advantages: High mechanical strength (flexural strength >400 MPa), ideal for aerospace applications.

Low-Temperature Co-fired Ceramic (LTCC):

  • Process: Sintered at 800–950°C; allows integration of passive components like resistors and capacitors.

  • Advantages: Excellent high-frequency performance (Q factor >500), suitable for 5G filters.

4. Direct Copper Bonding Method (DBC / AMB)

Direct Bonded Copper (DBC):

  • Process: A Cu/O eutectic liquid phase is formed at 1065–1083°C, bonding copper foil directly to the ceramic substrate.

  • Advantages: High thermal conductivity (Al₂O₃ substrate up to 25 W/m·K), widely used in IGBT modules.

Active Metal Brazing (AMB):

  • Process: Utilizes active solders (containing Ti, Ag) to enhance bonding strength and reliability.

  • Advantages: Excellent thermal cycling performance (survives 1000 cycles from –55°C to 200°C without failure).

ceramic PCB

Advantages of Surface Mount Technology (Smt) for Ceramic PCBs

  1. High Thermal Conductivity:
    Surface mount technology enhances the thermal performance of ceramic PCBs, improving the overall reliability and efficiency of electronic devices.

  2. Superior Wear Resistance:
    SMT improves the wear resistance of ceramic substrates, thereby extending the operational life of the equipment.

  3. High Mechanical Strength:
    SMT increases the mechanical robustness of ceramic PCBs, ensuring enhanced safety and durability of electronic systems.

  4. Environmental Friendliness:
    Ceramic PCBs with advanced SMT can reduce electromagnetic emissions, contributing to better environmental compliance and reduced interference.

  5. Design Flexibility:
    SMT enables more flexible design configurations, allowing ceramic PCBs to meet the varying demands of different electronic applications.

SMT Process Flow for Ceramic PCBs

The SMT process for ceramic PCBs is similar to that for traditional organic substrates, but must be optimized to accommodate the unique properties of ceramic materials:

  1. Substrate Preparation and Surface Treatment

    • Cleaning and Polishing: Remove surface contaminants to ensure flatness (surface roughness Ra < 0.1 μm).

    • Surface Treatment: Use Electroless Nickel Immersion Gold (ENIG) or Electroless Nickel Palladium Immersion Gold (ENEPIG) for enhanced solderability. ENEPIG includes a palladium layer to reduce “black pad” defects, making it ideal for fine-pitch components such as BGAs.

  2. Solder Paste Printing

    • Paste Selection: Choose high-viscosity lead-free solder paste (e.g., SnAgCu alloys) to prevent slump.

    • Printing Parameters: Precisely control squeegee pressure and speed to ensure consistent solder paste thickness (typically 25–75 μm).

  3. Component Placement and Reflow Soldering

    • High-Speed Placement Machines: Must be adapted for the rigidity of ceramic substrates to minimize mechanical stress.

    • Reflow Profile: Use a stepped temperature ramp to mitigate stress from mismatched thermal expansion between ceramic and components. Peak temperature should be maintained between 240–260°C. Nitrogen atmosphere is preferred to reduce oxidation.

  4. Inspection and Rework

    • AOI (Automated Optical Inspection): Used to check solder paste quality and component alignment.

    • Inspection des rayons X: Essential for bottom-terminated components like BGAs, to detect voids in solder joints.

    • Rework Process: Utilize localized heating platforms with ±2°C accuracy to prevent damage to adjacent components.

Conclusion

The classification of surface mount technologies for ceramic PCBs must consider a combination of process capability, material properties, and end-use application. Current trends are moving toward ultra-fine precision (line widths <10 μm), high-frequency performance (5G+), and eco-friendly practices (lead-free and recyclable). Innovations such as 3D Impression and laser activation are emerging as key enablers. Material choices must balance performance with cost efficiency.

With the rapid rise of industries such as new energy vehicles and 5G communications, demand for ceramic PCBs is expected to grow steadily. Future technological advancements will focus on cross-disciplinary integration and intelligent manufacturing.

Analysis of Ceramic PCB Packaging Technology

06/09/2025 dans /par

Ceramic packaging is a method of enclosing electronic components within a ceramic substrate. This type of packaging offers superior heat resistance, moisture resistance, corrosion resistance, and immunity to electromagnetic interference. It also helps reduce electrical and thermal noise within the package, making it ideal for high-performance electronic devices such as high-frequency power amplifiers, high-speed data transceivers, and low-noise amplifiers.

Advantages of Ceramic Packaging:

  • High Heat Resistance: Ceramic materials typically have high melting points and can withstand elevated temperatures. This allows ceramic packaging to operate reliably in high-temperature environments without performance degradation.

  • Excellent Moisture Resistance: With strong waterproof and moisture-proof characteristics, ceramic materials are well-suited for use in humid conditions. Their performance remains stable despite fluctuations in humidity.

  • Outstanding Corrosion Resistance: Ceramic materials are highly resistant to most chemicals, including acids, bases, salts, and organic solvents. This makes them suitable for use in harsh chemical environments without risk of corrosion-induced failure.

  • Superior Electromagnetic Interference (EMI) Shielding: Ceramics offer excellent EMI shielding properties, minimizing the impact of external electromagnetic interference. This enables stable operation in high-frequency applications without performance loss due to EMI.

Ceramic PCB Packaging Process Overview

1. Chip Preparation Stage

  • Wafer Dicing:
    Utilizing precision laser cutting technology, the wafer is segmented into individual dies with micron-level accuracy, ensuring precise chip dimensions to meet the assembly requirements of ceramic substrates.

  • Chip Cleaning:
    Multi-step chemical cleaning, including degreasing with organic solvents and rinsing with deionized water, removes cutting residues to prevent poor soldering or electrical failure.

2. Ceramic Substrate Fabrication

  • Substrate Forming:

    • Tape Casting: Ceramic slurry (e.g., alumina, aluminum nitride) is blade-cast into thin sheets, with thickness tolerance controlled within ±5μm, suitable for high-volume production.

    • Dry Pressing: Combined with isostatic pressing, this method allows fabrication of complex-shaped substrates with improved density uniformity.

  • Metallization:

    • Direct Bonded Copper (DBC): At high temperatures, active brazing creates a strong bond between the ceramic and copper layers, achieving copper thicknesses exceeding 300μm.

    • Direct Plated Copper (DPC): Copper is electroplated after photolithographic patterning, enabling multilayer routing and via filling, with line width/spacing down to 10μm.

  • Laser Drilling:
    Advanced laser technology forms microvias (diameter <0.06mm) with smooth via walls (roughness <0.3μm), enabling high-density interconnects.

3. Chip-to-Substrate Integration

  • Die Attachment:
    High thermal conductivity adhesives such as silver paste are dispensed with precision equipment to mount chips on designated areas of the substrate. Low shrinkage after curing minimizes thermal stress.

  • Soudure:
    For high-power devices, reflow soldering or ultrasonic welding is employed to form metallurgical bonds, ensuring both electrical conductivity and mechanical stability.

4. Wire Bonding and Packaging

  • Bonding Techniques:

    • Gold/Copper Wire Bonding: Thermal compression or ultrasonic energy is used to connect bonding wires between chip pads and substrate. Bonds must endure thermal cycling and mechanical vibration.

    • Flip-Chip Bonding (FC): The chip is flipped and directly interconnected with the substrate, eliminating bond wires and minimizing parasitic effects — ideal for high-frequency applications.

  • Encapsulation:

    • Hermetic Sealing: Parallel seam welding or glass frit sealing (e.g., PbO-B₂O₃-ZnO systems) is conducted at ~450°C, achieving leak rates below 1×10⁻⁸ Pa·m³/s.

    • Plastic Molding: For non-hermetic applications, epoxy resin or silicone encapsulation is used to enhance environmental durability.

5. Post-Processing and Testing

  • Electrical Testing:
    Signal integrity, impedance matching, and high-frequency performance (10–20 GHz transmission) are verified using tools such as network analyzers and oscilloscopes.

  • Reliability Testing:

    • Thermal Cycling: Simulates temperature swings from -65°C to +250°C to evaluate substrate-chip bonding reliability.

    • Mechanical Shock Testing: Assesses vibration resistance to ensure operational stability in aerospace and other demanding environments.

ceramic PCB packaging

Key Process Technologies in Ceramic PCB Packaging

1. Precision Laser Processing
Laser drilling and cutting technologies achieve micron-level precision, enabling high-density routing (line width/spacing down to 10 μm) and 3D interconnection (interlayer via diameter as small as 50 μm).

2. Metallization and Circuit Patterning
DBC and DPC processes, combined with photolithography, create high-resolution circuit patterns. Aluminum nitride substrates offer thermal conductivity of 180–230 W/m·K and a thermal expansion coefficient (CTE ≈ 4.5 ppm/°C), closely matching silicon chips.

3. Multilayer Co-Firing Technology

  • LTCC (Low-Temperature Co-Fired Ceramic):
    Fired at ~850°C, integrates multiple ceramic layers and metal traces, allowing embedded passive components. Ideal for 5G millimeter-wave antennas.

  • HTCC (High-Temperature Co-Fired Ceramic):
    Fired at ~1600°C, offers high mechanical strength (≥400 MPa in three-point bending) for aerospace power modules.

Applications of Ceramic PCB Packaging

Automotive Electronics

  • Engine Control Units, Safety Systems (ABS, ESP):
    Designed to withstand high temperature, humidity, and vibration.

  • Battery Management Systems:
    Ceramic substrates optimize current conduction and heat dissipation, enhancing safety in electric vehicles.

Telecommunications

  • 5G Base Station Antennas and RF Modules:
    Low dielectric loss ensures signal integrity.

  • Satellite Communication Devices:
    Excellent radiation resistance adapts to the harsh space environment.

Aerospace and Defense

  • Missile Guidance Systems, Radar Transceiver Modules:
    Aluminum nitride substrates endure extreme temperatures and mechanical shock.

  • Military Electronics:
    Corrosion resistance ensures reliable operation in battlefield conditions.

LED and High-Power Electronics

  • High-Power LED Lighting:
    Enhanced thermal conductivity improves light efficiency by over 30% and prolongs lifespan.

  • Semiconductor Coolers and Electronic Heaters:
    High current capacity supports sustained high-power operation.

Semiconductor Power Modules

  • IGBTs and MOSFET Substrates:
    Silicon nitride (Si₃N₄) substrates with ultra-high flexural strength (>800 MPa) are well-suited for high-voltage applications.

Conclusion

In summary, ceramic PCB packaging has become a vital technology for high-end electronic applications due to its excellent thermal performance, electrical insulation, and resistance to high temperatures and corrosion. As industries like 5G communications, power electronics, and electric vehicles continue to evolve, the demand for ceramic packaging is expected to grow rapidly. It will play an increasingly important role in enhancing device performance and overall system reliability.

Medical equipment pcb assembly

06/05/2025 dans /par

In this era of rapid development of science and technology, medical equipment is increasingly important for the protection of human health. The PCBA (Printed Circuit Board Assembly) inside the device, as its core component, the quality of its processing and assembly has a direct impact on the performance and stability of the device. Therefore, as a purchasing staff of electronic equipment manufacturers, in-depth understanding of the various aspects of medical PCBA processing and assembly is particularly critical. Next, we will go into this field together, detailed analysis of medical PCBA processing and assembly process of several core links.

Five core advantages of medical electronics PCB assembly

1. Functional core platform
As the “central nerve” of medical electronics, PCB is responsible for signal acquisition, processing and transmission.
Typical applications include:

Complex signal processing in high-end medical imaging equipment (e.g. CT, MRI).

High-speed data processing in vital signs monitoring systems such as electrocardiogram (ECG) and electroencephalogram (EEG).

Electronic control units for sophisticated therapeutic equipment such as ventilators and defibrillators

2. Technology Driver for Miniaturization
Reduces the size of medical electronic devices by up to 20% while improving functional integration through High Density Interconnect (HDI) technology.
Key Application Example:

Non-invasive blood glucose meters Integrated multi-layer flexible circuit boards (up to 10 couches)

Compact probe driver circuits for portable ultrasound systems

Ultra-thin, biocompatible PCB structures for implantable devices.

3. Core Carrier of Intelligent Healthcare
Supports multi-sensor system integration and edge intelligent computing, and is a key component in the upgrade of intelligent healthcare.
Typical smart scenarios:

Intelligent infusion management system, combining temperature, flow rate and pressure sensing.

Remote diagnosis and treatment equipment, realizing dual-mode connection between 5G and Wi-Fi.

AI-assisted diagnostic equipment embedded with edge computing chips to improve analysis efficiency.

4. Highly Reliable Technology Guarantee
fully complies with international medical electronics standards to ensure safe and stable product operation.
Certification and testing include:

IPC-A-610 Level 3 assembly standard

ISO 10993 biocompatibility certification

Continuous aging test up to 96 hours or more
Critical process control:

Medical grade lead-free soldering technology

Conformal coating treatment for moisture, mold and salt spray resistance

Comprehensive AOI automatic optical inspection + flying probe electrical test

5. Innovation and R&D Accelerator
Rapid prototyping capability to significantly shorten the product development cycle.
Features include:

From design drawings to physical prototypes in as little as 2 weeks

Supports process validation for over 10 specialty functional materials
Emerging Application Scenarios:

Flexible and extensible circuits for wearable health devices.

High-speed, high-precision control boards for surgical robots

Small implantable circuit systems for neuromodulators

Medical PCB

Precision planning in pcb design stage

1. Functional positioning and structural layout optimization
Medical devices pose a higher challenge to the precision of PCBA design due to their complex functions. Design engineers need to rationally configure the size ratio, layer structure and device layout of the PCB board according to the core functions of the device. During the design process, the electrical characteristics, heat dissipation efficiency, electromagnetic compatibility (EMC) and manufacturing process suitability must be considered simultaneously. With the help of professional EDA software, we ensure that the production process is optimized while the performance meets the standard.

2. Material Selection and Quality Assurance
The overall performance of PCBAs is highly dependent on the reliability of the materials used. The substrates, components and soldering materials commonly used in medical PCBs must meet the standards of medical grade and have the characteristics of high temperature resistance, corrosion resistance and non-toxicity. In the material preparation stage, all key materials should be comprehensive quality inspection, strict control to ensure that it meets the requirements of the medical industry for safety and stability.

High-precision execution of PCB manufacturing

1. Fine control of process flow
PCB, as the structural foundation of PCBA, has a manufacturing process that covers several key processes, such as board cutting, inner layer treatment, copper plating, drilling, exposure, developing, etching, etc.. To ensure circuit accuracy and inter-layer connection, all key materials should be fully inspected to ensure that they meet the safety and stability requirements of the medical industry. In order to ensure line accuracy and inter-layer connection reliability, we need to rely on advanced manufacturing equipment and standardized process management. At this stage, any small process deviation may cause defects in the subsequent SMT mounting or soldering process, affecting the electrical performance of the entire board.

2. Strict control of the manufacturing environment
High-quality Fabrication de PCB is inseparable from a clean, well-protected electrostatic production environment. Dust particles or electrostatic discharge can lead to board performance degradation or even failure. Therefore, the need to carry out key processes in a clean room, and set up electrostatic protection measures to protect the stability and consistency of the PCB from the source.

Medical pcb smt assembly

1 SMT precision and speed
In the processing of medical PCBA boards, SMT placement plays a crucial role. High-precision mounter can realize the precise installation of components, and its error can even be controlled within 01mm, thus ensuring the accuracy of the component position, and significantly improve the production efficiency. En outre, the high-speed operation of the mounter also fully reflects the modern electronics manufacturing industry on the pursuit of efficient production.

2 Solder paste selection and printing quality

Solder paste as a key material for fixing components, its selection has a direct impact on product quality. According to the characteristics of different models and sizes of components, the need to choose the appropriate type of solder paste. At the same time, in the solder paste printing process, we must ensure that the solder paste can be uniformly and accurately printed to the PCB pads, laying a solid foundation for the subsequent welding process.

3 reflow soldering and temperature control

Reflow soldering is the core process of SMT chip processing. By precisely controlling the temperature profile of the exhaust gas furnace, you can ensure that the solder paste can fully melt and form a solid connection. The proper temperature profile is not only related to the quality of soldering, but also can effectively reduce the generation of soldering defects and defective products.

4 AOI Inspection and Quality Control

AOI (Automatic Optical Inspection) technology is widely used to detect the quality of welding. It visually inspects the completed soldered PCB boards through optical inspection means, and is able to detect and report soldering defects or errors in a timely manner, thus providing strong support for ensuring the high quality and reliability of medical PCBA boards.

Complementary aspects of DIP insert processing

For those components that cannot be mounted by SMT technology, such as large connectors, electrolytic capacitors, etc., they need to be processed by DIP (Dual Inline Package) plug-in processing. This step usually includes insertion, soudure d'onde and manual refill soldering. Although DIP insert processing is relatively less used in modern electronics manufacturing, it still occupies a place in the processing of medical PCBA boards. Ensuring the accuracy of the insertion and the reliability of the soldering is crucial to improving the overall product quality.

Functional Verification and System Debugging

After the PCBA has been processed and assembled, it enters the stage of functional verification and debugging. The core task of this link is to confirm that the circuit board functions run normally, and all components meet the design expectations. Through this process, we can effectively troubleshoot potential faults and improve the stability and safety of the whole machine.

1. Functional and aging double test
After completing the soldering process, the PCBA needs to be subjected to a series of system tests, including ICT (in-circuit test), FCT (Functional Completion Test) and aging operation test. These tests help to identify potential device anomalies, circuit short circuits or software defects, and are a key part of ensuring product reliability.

2. Debugging Process and Firmware Burning
According to the specific application requirements, the PCBA will be finely tuned to ensure that each module operates in concert. The debugging stage will check the performance of the chip, interface, power module and other key parts one by one. En outre, through the program burning tool, the software code will be implanted into the microcontroller or embedded chip, so that the equipment has the ability of independent control and logic judgment.

Finished product processing and packaging process

1. Board Cleaning and Protective Coating
In order to enhance the adaptability of PCBAs in changing environments, finished products need to be thoroughly cleaned after processing to remove residual flux, dust and impurities. Subsequently, the three protective coatings are applied to form a protective film against moisture, corrosion and pollution to enhance the durability of the circuit board in practical applications.

2. Finished product packaging and shipping security
After the final quality inspection to confirm that there is no error, PCBA products will enter the packaging process. The packaging process is strictly enforced anti-vibration, anti-static and sealing standards to ensure that the transportation process is not damaged. Before packaging, we also carry out appearance verification, function retesting and safety audit to ensure the integrity and consistency of the products at the time of shipment.