Multi-layer pcb assembly
Get the highest quality Multilayer PCB with our extensive manufacturing capabilities and facility.
Get the highest quality Multilayer PCB with our extensive manufacturing capabilities and facility.
Number of manufacturing layers: 1-48 camadas
Número de linhas SMT: 8 high-speed SMT mating lines
Capacidade de produção diária SMT: mais do que 50 milhões de pontos
Inspection equipment: Testador de RAIO X, testador de primeira peça, Testador óptico automático AOI, Testador de TIC, Estação de retrabalho BGA
Velocidade de montagem: Velocidade de montagem do componente CHIP (condições ideais) 0.036S/chip
Pacote mínimo: 0201, precisão de até +0,04 mm
Precisão mínima do dispositivo: PLCC, Mf, BGA, CSP e outros dispositivos podem ser colados, espaçamento entre pinos de até +0,04 mm
18 years of pcb manufacturing experiência
Authoritative manufacturing team
Adoption of advanced technology and manufacturing equipment
Perfect production system
Fast turnaround
Mature ISO9001/IATF16949 quality management system.
Perfect ERP and MaS order management system.
Professional cost control engineers
Cooperation with many raw material companies.
Free DFM inspection of PCB files and BOMs.
PCB engineering evaluation and advice.
Specialized in medical, Automotivo, eletrônica de consumo, new energy pcb.
Serving global enterprises
Multi -layer PCB generally refers to a circuit board above 3 camadas. It has a multi -layer conductive material and insulating layer sandwiched together to form a complex circuit design.
As the leading PCB manufacturer in China, LST Technology has rich experience and professional knowledge in multi -layer PCB manufacturing. We can make up to 48 -layer circuit boards, and we provide EMS solutions for different customers.
1. Increased signal transmission speed and data processing capability. Multilayer circuit boards can realize high-speed serial communication and high-frequency digital signal processing by increasing the number of line layers.
2. Improve the system’s anti-interference ability and power stability. Multilayer circuit boards can use more ground and power supply layers, but also by adding shielding layers to reduce electromagnetic interference.
3. High flexibility. Multi-layer circuit boards can be layered according to different functional requirements to achieve a high degree of modularity and reusability, which helps to reduce design costs and shorten the development cycle.
4. Reduced power consumption and improved thermal performance. Multi-layer circuit boards can reduce power consumption by optimizing signal paths and reducing unnecessary connections, while metal-core heat dissipation layers can also be set up on multi-layer circuit boards to meet the requirements of shielding, heat dissipation and other special functions.
5. High assembly density and high size requirements. As electronic products become smaller and smaller, the electrical performance of the PCB also puts forward higher requirements, the demand for multilayer circuit boards is also growing. Ao mesmo tempo, the choice of multi-layer PCB circuit board laying line convenient, laying line length greatly shortened, electronic components between each other to reduce the laying line, but also to enhance the rate of data signal transmission.
6. High-frequency circuit performance. For high-frequency circuits, into the grounding layer, the signal line to the ground to produce a stable low characteristic impedance, the power circuit characteristic impedance is greatly reduced, the interception effect is obvious.
New energy equipment
Satellite communications equipment
Equipamento médico
Industrial equipment
| Número de camadas | 1-48 camadas |
| Materiais | FR4, TG = 135150170180210, CEM-3, CEM-1, substrato de alumínio, Ptfe, Rogers, ONCO |
| Espessura de cobre | 1/2Oz, 1Oz, 2Oz, 3Oz, 4Oz, 5Oz |
| Espessura da placa | 8-236mil (0.2-6.0mm) |
| Largura/espaçamento mínimo da linha | 3/3 milhão (75/75um) |
| Tamanho da perfuração minuto | 8 milhão (0.2 mm) |
| Tamanho da broca de laser de HDI min | 3 milhão (0.067 mm) |
| Tolerância à abertura | 2 milhão (0.05 mm) |
| Espessura do cobre PTH | 1 milhão (25 microns) |
| Cor de soldagem de resistência | Verde, Azul, Amarelo, Branco, Preto, Vermelho |
| Camada de máscara de solda ripileira | sim |
| tratamento de superfície | Sangrar (Rohs), Ening, Osp, naufrágio de prata, lata afundando, ouro brilhante, dedos dourados |
| Espessura do ouro | 2-30você “(0.05-0.76um) |
| Buraco cego/buraco enterrado | sim |
| Corte em forma de V. | sim |
Solar controller motherboard
Placa de substituição do painel de controle do sistema de alarme de incêndio