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Que savez-vous du coût du PCB ?

02/27/2024/dans Nouvelles de l'entreprise/par Personnel administratif

Cartes de circuits imprimés (PCBS) are a vital component of electronic devices, and their cost significantly impacts the overall economics of a product. Understanding and mastering the cost structure of PCBs is crucial for companies to reduce costs and enhance market competitiveness. This article aims to delve into the cost composition of PCBs, explore the main influencing factors, and propose strategies for cost optimization.

PCB Cost Composition

1.Material Costs:This includes the expenses for substrates, feuille de cuivre, souder, masque de soudure, écran à soigneux, and other raw materials. The selection of the substrate material has the biggest impact on costs, as different materials, thicknesses, and sizes can significantly affect the final cost.

2.Manufacturing Costs:These cover the expenses related to processes such as lamination, forage, copper etching, placage, soudure, silkscreen printing, surface finishing, and PCB shaping. The complexity and precision requirements of these processes vary, leading to different costs.

3.Equipment Depreciation and Maintenance: Fabrication de PCB requires high-value equipment, and the depreciation and maintenance costs are a significant part of the overall PCB cost.

4.Labor Costs: The production of PCBs requires a significant amount of manpower, including operators, technicians, and quality inspectors. Their salaries and welfare benefits also contribute to the cost.

Factors Influencing PCB Cost

1.Complexité de conception:

Higher design complexity leads to increased material, fabrication, and labor costs. Strategies such as optimizing circuit design, simplifying wiring, and reducing component count can help reduce PCB costs.

2.Sélection des matériaux:

The choice of substrate material has a significant impact on PCB costs. Different materials have varying costs, and their performance, stabilité, and reliability also affect the overall PCB cost.

3.Processus de fabrication:

Selecting and optimizing manufacturing processes are crucial for cost reduction. Adopting advanced technologies, améliorer l'efficacité de la production, and reducing waste rates can help lower PCB costs.

4.Batch Size:

Batch size significantly affects PCB costs. Larger batches lead to lower unit costs. Companies should plan production batches based on market demand and production capacity.

5.Délai de mise en œuvre:

Lead time describes ordering and shipping times for your product. There is an inverse relationship between lead time and pricing, with extended lead times resulting in lower pricing.

6.Qualité:

Quality refers to how good your design is, C'est-à-dire, how well a design performs. Factors such as complexity, fiabilité, and yield determine the quality of your PCB. Complexity is often measured in terms of area for a given via count and has several components, including PCB tracks, soldering points, and so forth. To evaluate whether your Conception de PCB is complex or not, you will need to determine what the average number is in a specified product type and assembly method your company will use.

7.Functionality:

Some design errors are easy to spot, while others can be difficult to find. Donc, the more functionality tests you perform on your PCB design, the better quality control you will have. It will lead to higher tolerance levels and ultimately reduce rework and production delays. By improving efficiency in PCB manufacturing and assembly, the number of order cycles (designs built into the final product) will decrease significantly. This improves profitability for your company.

8.Quantité:

There is a fixed cost per square inch for each quantity order (except for bulk orders). Donc, the more units you order, the lower the cost per unit.

Once you know your costs, you can develop a budget for your project and determine how much profit margin you need to build into your Assemblage PCB quote. Once you do that, it will be easy to set your prices for each product produced by your company.

Strategies for PCB Cost Optimization

1.Optimisation de la conception:Simplifying circuit designs, reducing wiring complexity, and minimizing component count can help lower PCB costs. Optimizing component layout and wiring design can also improve PCB reliability and stability, reducing future maintenance and replacement costs.

2.Material Substitution:Where performance allows, cost-effective materials can be substituted for higher-cost options. Par exemple, using more cost-effective substrate materials and solders can help reduce material costs.

3.Process Improvement:Enhancing manufacturing processes, améliorer l'efficacité de la production, and reducing waste rates can help lower manufacturing costs. Automation, process parameter optimization, and precision improvement can be effective strategies.

4.Rationalizing Production Batches:Companies should plan production batches based on market demand and production capacity to minimize unit costs. Balancing production with sales to avoid inventory accumulation and capital waste is also crucial.

Why is PCB Assembly so Expensive?

PCB assembly is expensive because the basic materials themselves are expensive. This is not to say that no companies manufacture cheaper PCB assemblies; its purpose is to say that quality remains unaffected, regardless of its costs. It is not unheard of for companies to offer or exceed the price listed in the example above if they feel that you, as a valued customer, will be more willing to spend the extra money to receive better quality in your final product.

PCB Assembly Costs by Product Type

Manufacturers design, manufacture, and assemble PCBs to meet the needs of different industries. Donc, factors directly related to the industry, product type, and assembly option affect the cost of PCB assembly. The following list gives a rough estimate of where you can expect to find your typical cost for each product type.

Assembly Process Manufacturing Costs

●Stamp/Shrink +$1.00 per unit +/- 1%
●Solder +$1.00 per unit +/- 3%
●Spot +$0.05 per point +/- 2%
●SMT/LGA +$1.00 per unit +/- 1%

PCB Assembly Costs by Assembly Option

The Assembly process affects the cost of your PCB assembly in two ways:

●Materials themselves are more expensive
●Each assembly process requires a certain amount of retesting because of inconsistencies in the manufacturing process.

The following list shows each method used to assemble your PCB design and how much it costs you.

●Turnkey No Processing No Manufacturing No Assembling $0.52 per square inch +/- 2%
●General Process Assembling -$1.00 à -$1.20 per square inch
●Turnkey Processing +$0.72 per square inch +/- 1-2%
●General Process Manufacturing -$0.20 à -$0.52 per square inch
●Turnkey Manufacturing +$1.00 per square inch +/- 1-2%
●General Process Manufacturing -$0.20 à -$0.72 per square inch
●Turnkey Assembly +$1.00 per square inch

PCB costs play a pivotal role in determining the economic viability of electronic products. By understanding the cost composition and influencing factors of PCBs and implementing cost optimization strategies, companies can effectively reduce costs and enhance market competitiveness. As technology continues to advance and markets evolve, PCB cost optimization will remain a key area of focus and research.

Introduction à l'application de la carte de circuit imprimé

02/26/2024/dans Actualités de l'industrie/par Personnel administratif

Cartes de circuits imprimés (PCBS) are an integral part of the electronics industry, serving as the foundation for nearly all electronic devices. PCBs provide a platform for connecting and supporting electronic components, comme les résistances, condensateurs, inducteurs, diodes, transistors, et circuits intégrés. They enable these components to communicate and work together seamlessly, allowing for the creation of complex electronic systems.

The PCB’s design and manufacturing process involves several stages, including layout, routage, forage, gravure, and soldering. The layout stage involves planning the placement of components on the board, considering factors like signal integrity, power distribution, et gestion thermique. Routing involves creating the necessary connections between components using conductive traces. Drilling is the process of creating holes in the board for components with leads, while etching removes the unwanted copper from the board, leaving only the traces and pads. Enfin, soldering is used to attach the components to the PCB, completing the circuit.

PCBs are used in a wide range of applications, from simple consumer electronics like radios and televisions to complex industrial and military equipment. They are also crucial in the development of emerging technologies like wearable devices, L'Internet des objets (IoT), and renewable energy systems.

Applications for Printed Circuit Boards

Électronique grand public: Consumer electronics is the largest market for PCBs, with applications ranging from household appliances like refrigerators and washing machines to personal electronics like smartphones, comprimés, et ordinateurs portables. PCBs in these devices enable the smooth operation of various functions, comme le traitement des données, afficher, and connectivity.

Automotive Industry: The automotive industry is another major market for PCBs. They are used in various vehicle systems, including engine control, braking systems, infotainment, and advanced driver assistance systems (ADAS). PCBs in automobiles must meet strict safety and reliability standards, ensuring smooth and safe operation under various conditions.

Dispositifs médicaux: The medical industry relies heavily on PCBs for various medical devices, such as MRI machines, stimulateurs cardiaques, dialysis machines, and surgical robots. PCBs in these devices play a crucial role in ensuring accurate and reliable operation, often with strict regulations and certifications required.

Industrial and Military Applications: PCBs are also widely used in industrial and military applications, where they enable the operation of complex systems and equipment. These applications often require PCBs to operate under extreme conditions, such as high temperatures, humidité élevée, or radiation.

Communications and Networking: The communications and networking industry relies on PCBs for various equipment, including routers, commutateurs, serveurs, and mobile communication devices. PCBs in these devices enable the transmission and reception of data, ensuring smooth and secure communication.

Aéronautique et Défense:The aerospace and defense industries require PCBs that can withstand extreme environments and stringent safety requirements. These PCBs are used in aircraft, satellites, missiles, and other defense systems, enabling critical operations and ensuring national security.

LEDS：Light-emitting diodes, or LEDs, are an increasingly popular lighting technology used for residential and commercial lighting and across numerous industries including the automotive, medical and computer technology sectors. LEDs are favored for their energy efficiency, long life and compactness.

One role that PCBs play in LED applications is the transfer of heat away from the bulb. High temperatures decrease the average life of LEDs. Because of this, PCBs used for LEDs are typically made with aluminum, which can transfer heat better than other metals. This eliminates the need for an additional heat sink to a design and means it can be more compact.

You can find LED PCBs in:

Residential lighting: Éclairage LED, including smart bulbs, help homeowners light their property more efficiently.
Storefront lighting: Businesses can use LEDs for signage and to light their stores.
Présentoirs automobiles: Dashboard indicators, headlights, brake lights and more may use LED PCBs.
Computer displays: LED PCBs power many indicators and displays on laptop and desktop computers.
Medical lighting: LEDs provide bright light and give off little heat, making them ideal for medical applications, especially those related to surgery and emergency medicine.

Safety and Security Equipment：Many aspects of security systems, whether for homes, businesses or government buildings, rely on PCBs. They play a role in our safety and security more often than many people realize.

Some safety and security devices that use PCBs include:

Security cameras: Security cameras, whether used indoors or outdoors, rely on PCBs, as does equipment used to monitor security footage.
Smoke detectors: Smoke detectors as well as other similar devices, such as carbon monoxide detectors, need reliable PCBs to function.
Electronic door locks: Modern electronic door locks also incorporate PCBs.
Motion sensors and burglar alarms: Security sensors that detect motion rely on PCBs as well.

The above is the classification of printing circuit boards. Bien sûr, this is only part of them. PCB is also widely used in other industries. If your business needs Fabrication de PCB et assemblage, Veuillez nous contacter, we can provide you with one -stop PCB business services.

Les caractéristiques et l'introduction de l'application de PCB violet

02/22/2024/dans Actualités de l'industrie/par Personnel administratif

La couleur de la carte de circuit imprimé est déterminée par la couleur de la couche de soudage du groupe. Nos planches de PCB communes sont noires, bleu, vert, et violet. Ce que nous voulons discuter aujourd'hui, ce sont les informations détaillées sur la carte de circuit imprimé violet. Le contenu spécifique est le suivant:

Qu'est-ce que le PCB violet?

PCB violet, une carte de circuit imprimé avec une couche soudée violette, est déterminé par la couche de soudage du circuit. La couche soudé violette fournit non seulement la couleur de la carte de circuit imprimé, mais peut également améliorer les performances de la carte de circuit imprimé. Cependant, Parce que le violet n'est pas une couleur standard, Il peut avoir besoin de passer des commandes au fabricant de la carte de circuit imprimé pour fournir, ce qui peut augmenter le coût de fabrication.

Matériau PCB violet

Les matériaux du circuit imprimé violet comprennent principalement les éléments suivants:

1.Carte FR4: Il s'agit d'un matériau couramment utilisé qui rend le circuit imprimé solide et étanche., et offre une bonne isolation, améliorant ainsi l'intégrité du signal. La plaque FR4 est un matériau composé de résine époxy et de tissu en fibre de verre. Il présente les caractéristiques de résistance mécanique moyenne, bonnes performances diélectriques, résistance à la chaleur, humidité, et corrosion chimique.

2.CEM-1 et CEM-2: Ces cartes composites sont également des matériaux de circuits imprimés couramment utilisés., qui ont de bonnes performances électriques et de traitement.

3. Planches spéciales: tels que des panneaux en céramique et des plaques métalliques, ces matériaux ont des performances et une utilisation particulières, qui peut répondre à certains besoins d'applications spéciales.

En outre, selon le procédé de fabrication et l'utilisation du circuit imprimé, d'autres types de matériaux peuvent être utilisés, comme le carton (comme FR-1, Fr-2, FR-3), Cartes HDI, etc..

Il convient de noter que la couleur de la carte de circuit imprimé violet est déterminée par la couche de soudage du circuit, non déterminé par le matériau lui-même. Donc, Peu importe le matériau utilisé, Tant que la couche de soudage est utilisée pour utiliser de l'encre violette, Une carte de circuit imprimé peut être fabriquée.

Avantages et limites du PCB violet

Les avantages des PCB violets

Appel visuel et marque
Dans un marché où la différenciation peut être un facteur clé du succès, La couleur unique d'une carte de circuit imprimé violet peut avoir un impact significatif. Cela est particulièrement vrai pour l'électronique grand public, où la conception interne d'un appareil, y compris sa carte de circuit imprimé, peut être un point de distinction esthétique.

Inspectibilité améliorée
Le contraste entre le masque de soudure violette vibrante et l'éclat métallique des traces d'argent peut faciliter les ingénieurs et les techniciens de repérer les problèmes ou les défauts pendant le processus de fabrication ou les contrôles de contrôle de la qualité.

Avantages matériels
L'utilisation de polyimide ou d'autres matériaux spécialisés pour atteindre la couleur violette peut également offrir des avantages fonctionnels. Ces matériaux présentent souvent une résistance et une flexibilité supérieures à la chaleur par rapport aux matériaux standard utilisés dans les PCB vert.

Les limites des PCB violets

Disponibilité et délais de direction
Les matériaux et les colorants spécialisés requis pour les masques à soudure violet ne sont pas aussi couramment utilisés que ceux des PCB vert, conduisant à des problèmes potentiels avec l'approvisionnement et les délais plus longs. For projects on a tight schedule or for manufacturers accustomed to rapid production cycles, this can pose a logistical challenge.

Higher Costs
The lower demand for purple solder masks, combined with the specialized processes required to produce them, often results in higher prices compared to standard green PCBs. For large-scale projects or for companies with strict budget constraints, the additional cost of purple circuit boards might be a prohibitive factor.

Purple PCB Applications

Purple PCBs have found a place in a wide range of applications, y compris:

Electronics and Gadgets
Many innovative companies and startups are choosing purple PCBs to give their products a unique and captivating appearance. The vibrant color helps create an emotional connection with customers, making their devices more memorable and enticing.

Projets de bricolage et makerspaces
Dans le domaine des amateurs de bricolage et des espaces de création, Les PCB violets sont devenus un symbole de créativité et d'expression de soi. L'allure émotionnelle de la couleur inspire les amateurs de replice les limites de leurs projets, alimenter leur passion pour l'électronique.

Technologie portable
Avec la montée en puissance de la technologie portable, Les PCB violets sont de plus en plus utilisés dans des appareils comme les montres intelligentes, trackers de fitness, et les casques VR. La couleur distinctive ajoute une touche de flair et de style personnel, Faire en sorte que la technologie se sente comme une extension de la personnalité du porteur.

Les caractéristiques du PCB violet

Les caractéristiques du PCB violet incluent principalement les aspects suivants:

1. Reconnaissance: L'apparition du violet rend la carte de circuit imprimé plus visible parmi de nombreux appareils électroniques, ce qui aide à améliorer la reconnaissance et l'image de marque du produit.

2. Type mince: La quantité de cuivre utilisée dans les circuits imprimés conventionnels pour les PCB violets est petit, ce qui rend la taille de la carte de circuit imprimé et aide à atteindre le léger et la portabilité de l'équipement.

3. Isolement de circuit: En ajoutant la boîte violette, Différents modules fonctionnels de la carte de circuit imprimé peuvent être séparés pour réduire les interférences du signal et améliorer la fiabilité et la stabilité de la carte de circuit imprimé.

4. Traitement du signal: La boîte violette peut également être utilisée pour définir la limite du circuit de traitement du signal pour assurer la précision et la précision de la transmission du signal. En même temps, Il aide également les conseils et la transmission de la gestion des signaux sur les cartes de circuits imprimées multi-couches.

5. Distribution de puissance: En ajoutant des boîtes violettes à la disposition PCB, La zone du réseau de distribution d'énergie peut être déterminée pour améliorer la traçabilité du cordon d'alimentation et aider à résoudre le problème des lignes de saut de puissance.

FAQ sur les PCB violets:

Pourquoi les PCB vert sont-ils plus courants que les PCB violets?
Les PCB verts sont la norme de l'industrie depuis des décennies en raison de leurs coûts de production inférieurs et de leur facilité de matériaux d'approvisionnement. Cependant, Comme la technologie a progressé, Les PCB colorés comme Purple sont devenus plus accessibles et abordables.

Les PCB violets peuvent-ils être utilisés dans des applications à haute fréquence?
Oui, Les PCB violets peuvent être utilisés dans des applications à haute fréquence, comme tout autre PCB. La couleur du masque de soudure n'a pas d'impact sur les performances ou les fonctionnalités du PCB.

Les PCB violets sont-ils adaptés à tous les types de projets électroniques?

Absolument! Les PCB violets peuvent être utilisés dans un large éventail d'applications, de l'électronique grand public aux projets de bricolage et à la technologie portable.

Les PCB violets ont-ils des inconvénients par rapport aux autres couleurs?
Le principal inconvénient des PCB violets est leur rareté relative par rapport aux couleurs plus courantes comme le vert. Cela peut rendre l'approvisionnement en PCB violets un peu plus difficile. Cependant, Leur apparence unique et l'impact émotionnel qu'ils créent peut l'emporter sur cette inconvénient mineur pour de nombreux amateurs d'électronique.

Comment puis-je assurer la qualité de mon PCB violet?
Pour assurer la qualité de votre PCB violet, Travaillez avec un fabricant réputé comme MorePCB qui a fait ses preuves de production de PCB de haute qualité. Assurez-vous de suivre leurs directives de conception et de bien prendre soin de votre PCB pour maintenir ses performances et son apparence.

Processus de fabrication du substrat PCB en céramique multicouche: Technologie HTCC et LTCC

01/23/2024/dans Connaissances techniques PCB/par Personnel administratif

Multicouche substrat en céramique est également connu sous le nom de coque en céramique, coque de tube en céramique. À l'heure actuelle, la plupart des substrats céramiques multicouches sont fabriqués à l'aide de la technologie céramique cocuite – technologie céramique cocuite à haute température (HTCC), technologie céramique cocuite à basse température (LTCC) pour généraliser la fabrication à grande échelle de substrats céramiques multicouches.

Dans cet article, nous nous concentrerons sur l'analyse des avantages et des applications des deux processus HTCC et LTCC, pour faciliter la sélection de procédés de fabrication ayant une direction plus claire. Les détails sont les suivants:

Qu'est-ce que le HTCC?

HTCC (Céramique cocuite haute température), en utilisant des matériaux tels que le tungstène, molybdène, molybdène, manganèse et autre pâte de résistance chauffante métallique à point de fusion élevé conformément aux exigences de la conception du circuit de chauffage imprimée sur 92 ~ 96% de la billette de céramique coulée en alumine, 4 ~ 8% additifs de frittage, puis multicouche empilé, à une température élevée de 1,500 ~ 1,600 ℃ co-tiré en un seul. Le produit est co-cuit à une température inférieure à 1 500 ～ 1 600 ℃.

Donc, il présente les avantages de la résistance à la corrosion, résistance aux hautes températures, longue durée de vie, haute efficacité et économie d'énergie, température uniforme, bonne conductivité thermique, compensation thermique rapide, etc.. De plus, il ne contient pas de plomb, cadmium, mercure, chrome hexavalent, biphényles polybromés (PBB), éthers diphényliques polybromés (PBDE), et autres substances dangereuses, et il est conforme aux exigences de protection de l'environnement de l'Union européenne, comme RoHS.

En raison de la température de cuisson élevée, HTCC ne peut pas utiliser de matériaux métalliques à bas point de fusion tels que l'or., argent, cuivre, etc.. Matériaux métalliques réfractaires tels que le tungstène, molybdène, manganèse, etc.. doit être utilisé, et la faible conductivité électrique de ces matériaux provoquera des défauts tels que des signaux retardés, et donc ils ne sont pas adaptés à la réalisation du substrat de circuits de microassemblages à grande vitesse ou haute fréquence. Cependant, Les substrats HTCC ont une large gamme d'applications dans les circuits de micro-assemblages haute puissance en raison de leurs avantages de haute résistance structurelle, conductivité thermique élevée, bonne stabilité chimique et densité de câblage élevée.

Qu'est-ce que le LTCC?

Technologie céramique cocuite basse température LTCC (Céramique cocuite à basse température) est une poudre céramique frittée à basse température composée d'un ruban céramique brut d'une épaisseur et d'une densité précises, dans le ruban céramique brut par perforation laser, injection de boue de microvia, impression de pâte conductrice de précision et autres processus pour réaliser les graphiques de circuit requis, et un certain nombre de composants passifs (Par exemple, condensateurs à faible tolérance, résistances, filtres.), convertisseurs d'impédance, coupleurs, etc.. enterré dans un substrat céramique multicouche, puis empilés ensemble, Convertisseur d'impédance, coupleur, etc.) enterré dans un substrat céramique multicouche, puis empilés ensemble, les électrodes intérieures et extérieures peuvent être utilisées respectivement en argent, cuivre, or et autres métaux, fritté à 900 ℃, constitué d'un espace tridimensionnel n'interfère pas avec les circuits haute densité des uns et des autres, mais également constitué de composants passifs intégrés du substrat de circuit tridimensionnel, dont la surface peut être montée sur le circuit intégré et les dispositifs actifs, composé de modules fonctionnels intégrés passifs/actifs, peut être un circuit supplémentaire. Cela permet de miniaturiser davantage les circuits et d'augmenter la densité., et est particulièrement adapté aux composants de communication haute fréquence.

Les composants intégrés LTCC comprennent une variété de substrats portant ou intégrés dans une variété de composants actifs ou passifs du produit, le programme de produits de composants intégrés comprend des composants, substrats et modules.

Technologie HTCC vs technologie LTCC

Technologie céramique cocuite à haute température

▶Matériaux isolants: alumine, nitrure d'aluminium, placage d'oxyde, etc..
▶Matériau conducteur: tungstène, platine, platine-manganèse, etc..
▶Température de co-cuisson: supérieur à 1400 ℃
▶Avantages: haute résistance mécanique, conductivité thermique élevée, faible coût du matériel, chimiquement stable.
▶Inconvénients: haute résistance à l'état passant, coût de fabrication élevé

Technologie céramique cocuite à basse température

▶Matériaux isolants: verre microcristallin, céramique + système composite de verre, verre amorphe, etc..
▶Matériaux conducteurs: or, argent, cuivre, avantage – argent, etc..
▶Température de co-cuisson: en dessous de 900°C
▶Avantages: faible résistance à l'état passant, faible coût de fabrication, faible coefficient de dilatation thermique, faible constante diélectrique et facile à régler, peut être enterré des appareils passifs, les caractéristiques haute fréquence sont excellentes, et peut être produit avec une largeur de ligne aussi faible que 50 euh de beaux circuits.
▶Inconvénients: faible résistance mécanique, faible conductivité thermique, coût matériel élevé.

Avantages technologiques

Avantages de la technologie HTCC

HTCC en raison de l'utilisation du tungstène, platine, et autres métaux à point de fusion élevé, ces métaux augmentent considérablement la perte RF du composant. Les avantages sont une résistance structurelle élevée, bonne stabilité chimique et densité de câblage élevée, et sa conductivité thermique atteint 20 W/mK, ce qui est bien supérieur à l'efficacité thermique du substrat LTCC. En revanche, la conductivité thermique du substrat LTCC n'est que de 3 W/mK, ce qui rend difficile la dissipation de la chaleur dans la structure des cartes haute densité et endommage facilement la puce.

Avantages de la technologie LTCC

(1) possède de bonnes propriétés électriques et mécaniques, telles que les caractéristiques haute fréquence, bonne stabilité en température de la fréquence de résonance, la constante diélectrique couvre une large plage, le coefficient de dilatation thermique est proche du silicium.

(2) Possède une stabilité et une fiabilité élevées du système.

(3)Peut produire des microstructures 3D comprenant des cavités et des canaux.

(4)Possède un haut niveau de caractéristiques d'intégration (capteurs, conducteurs, contrôle microfluidique, systèmes électroniques et optoélectroniques pour LTCC, etc.) ;et

(5) Très bonnes caractéristiques à haute tension.

(6) Caractéristiques haute tension et vide poussé. En outre, L’industrie manufacturière LTCC est simple, rapide et pas cher, avec un faible investissement en capital, temps de cycle court et rentabilité élevée.

Application de la technologie HTCC

Les produits céramiques cocuits à haute température comprennent principalement des substrats multicouches en céramique, coques d'emballage en céramique, Supports UVLED, Supports VCSEL, différents types de coussins chauffants, ponts thermiques, etc., qui sont principalement utilisés dans l'emballage des appareils à micro-ondes, emballage de circuits intégrés à grande échelle, emballage de circuit intégré hybride, emballage de dispositifs optoélectroniques, Emballage CMS, Emballage de puce LED, emballage de semi-conducteurs et autres domaines d'emballage. Le substrat en céramique HTCC peut être fritté avec des matériaux métalliques tels qu'un alliage de déforestation pour fabriquer la coque du boîtier HTCC., ce qui économise considérablement l'espace de câblage.

Application de la technologie LTCC

Les produits LTCC ont une large gamme d'applications, comme divers types de téléphones portables, Modules Bluetooth, GPS, PDA, caméras numériques, Wi-Fi, électronique automobile, lecteurs optiques et ainsi de suite. Parmi eux, l'utilisation des téléphones portables occupe l'essentiel, à propos 80% au-dessus de; suivi du module Bluetooth et du WLAN. en raison de la grande fiabilité des produits LTCC, l'application dans l'électronique automobile est également en augmentation. Les produits LTCC utilisés dans les téléphones portables incluent des filtres LC, recto verso, modules de fonction, modules de fonction de commutation d'émetteur-récepteur, convertisseurs symétriques-asymétriques, coupleurs, diviseurs de puissance, selfs de mode commun et ainsi de suite.

Que savez-vous de la classification des modules Bluetooth

01/17/2024/dans Actualités de l'industrie/par Personnel administratif

Bluetooth module, is a kind of PCBA board with integrated Bluetooth function, used for short distance wireless communication. According to the function, it is divided into Bluetooth data module and Bluetooth voice module. Bluetooth module refers to the integrated bluetooth function of the chip basic circuit collection, used for wireless network communication, can be roughly divided into three types: data transmission module, bluetooth audio module, bluetooth audio+ data two-in-one module and so on. The general module has the property of semi-finished product, which is processed on the basis of the chip to make the subsequent application more simple.

This article is from the different classification of Bluetooth modules to sort out the type of Bluetooth module, as far as possible from the classification point of view to understand the Bluetooth module has some features and functions.

1.Categorized by protocol type

(1) Classic Bluetooth module

Classic Bluetooth module (BT) refers to Bluetooth protocol support 4.0 or less modules can be subdivided into: traditional Bluetooth module and high-speed Bluetooth module.

Traditional bluetooth module: bluetooth was born at the beginning, the use of BR basic rate technology, the bluetooth theoretical transmission rate, can only reach 721.2Kbps, launched in 2004 to support the bluetooth 2.0 protocol module, the outbreak of the smartphone era, the new EDR bluetooth enhancement rate (Enhanced Data Rate) technologie, by improving the multitasking and a variety of bluetooth By improving multitasking and the ability of multiple Bluetooth devices to operate simultaneously, it enables Bluetooth devices to transmit at rates up to 3Mbps, which is three times the transmission rate of Bluetooth 1.2 technologie. Par conséquent, in addition to more stable audio streaming and lower power consumption, you can take full advantage of bandwidth to connect multiple Bluetooth devices at the same time.

High-speed Bluetooth module: High-speed Bluetooth module was launched in 2009, the main representative is to support the Bluetooth 3.0 protocol module, the new High Speed technology, you can make Bluetooth call 802.11 WiFi used to achieve high-speed data transmission, the transmission rate of up to 24Mbps, is the traditional Bluetooth module of 8 fois.

Classic Bluetooth module is generally used for continuous streaming of audio and data volume is relatively large transmission, such as voice, music, wireless headphones, file transfer between devices, imprimantes, wireless speakers and so on.

(2) Bluetooth Low Power Module

LowPower Module (Bordel) means a module that supports the 2010 launch of Bluetooth Protocol 4.0 ou supérieur . The biggest feature is the reduction in cost and power consumption . Bluetooth low-power technology uses variable connection time intervals. The interval can be set according to the specific application for a few milliseconds to a few seconds ranging from BLE technology using a very fast connection, so it can be in the “non-connection” state (energy saving), when the connection between the two ends of the link is only necessary to open the link, and then close the link in the shortest possible time. Then the link is closed in the shortest possible time.

Low-power Bluetooth is used in real time. Requirements are relatively high, but low speed, low power consumption of the scene, such as mouse and keyboard, heart rate detectors and thermometers and other sensor devices, maison intelligente, smart wear such as the need for large amounts of data interaction in scenarios, is very suitable for Internet of Things applications.

Pour résumer, classic Bluetooth is not an outdated version of BLE. Classic Bluetooth and low-power Bluetooth coexist and are used in different applications, which completely depend on the different needs of each person.

2.Categorized by support for protocols

According to the number of Bluetooth protocol stack support can be divided into single-mode module and dual-mode module. The concept of single mode and dual mode is only available after the emergence of BLE Bluetooth. We should choose the required module according to cost, application and function.

(1) Single mode module

Single mode module is the module that supports a certain Bluetooth protocol, only the classic Bluetooth (BT) protocol or Bluetooth Low Power (Bordel) protocol.

(2) Dual mode module

Dual-mode modules are modules that support both the classic Bluetooth (BT) protocol and the low-power Bluetooth (Bordel) protocol, and can run two sets of protocol stacks. There are two types of dual-mode modules: Classic Bluetooth (data only)+ BLE and Classic Bluetooth (data+ audio)+ Bordel. Dual-mode modules have good flexibility and compatibility.

Bluetooth dual mode is undoubtedly the mainstream of the future. Classic Bluetooth power consumption, 4.0 after Bluetooth BLE, power consumption is small, but does not support the audio protocol and due to data transmission speed limitations, Bluetooth dual mode is a combination of the advantages and disadvantages of the two, can support both audio transmission, can also support data transmission, faible consommation d'énergie, and compatibility is the sum of the two.

3.Categorized by function

Standing in the Bluetooth module to transmit the size of of the functional point of view content, can be divided into the following categories.

(1) Data module

The general use of more data modules, i.e. Bluetooth low power, also known as Bluetooth transmission module. Because the amount of data is not large, the transmission of proximity, operation and standby power consumption has strict requirements for the device is a good choice. Due to the advantages of power consumption, Bluetooth 4.0 module has now occupied most of the share of mobile data transmission, and the size and share is expected to continue to grow.

(2) Audio Module

The audio module requires a very large bit of streaming data, so it is more suitable for the classic Bluetooth module.

(3) Composite data and audio modules

It can transmit voice, audio and data at the same time. Under the trend of mobile Internet, data+ audio application, the dual mode module with data and audio composite is a good choice.2\According to the protocol support points

4. According to the chip design classification

This is differentiated according to the type of storage used by the Bluetooth chip in the module.

(1) ROM version

En général, the chip manufacturer’s ROM version of the chip, characterised by the chip manufacturer, will be the standard application PROFILES cured in the chip. Usually a fixed function, the user can not modify the program in the chip. Can be connected to an external EEPROM, storage space is small, can be used to store Bluetooth address, device name, PIN code , etc..

Use the ROM version of the chip to do less differentiation of the product, but the development is simple. For some conventional products, they do not need deep customization of the product. The choice of ROM version of the chip can be developed to speed up the development progress, speed up the time to market. Suitable for large-scale mass production, the price is very low, more commonly used for dongles, Bluetooth headset modules, cell phone modules, mouse and keyboard modules, etc., can modify the configuration parameters, but the basic function is fixed. Large-scale civilian products generally use the ROM version of the module, such as USB Bluetooth adapters on the market, because most of the protocol will run inside the PC. The chip processing power requirements are very low, so the chip manufacturer will launch very low-priced products.

(2) FLASH version

Chips are generally built-in FLASH, storage space is large. If you want to do some customer-defined products, such as the need to add some sensors, communication with external MCU, increase Bluetooth protocol or service, you need to use the FLASH version of the chip in the FLASH version of the existing project to add their own engineering code, develop their own firmware, to make a differentiated product. Relatively speaking , it is more flexible.

FLASH version of the chip price is high, but the user can be carried out according to their own application needs, due to the chip built-in FLASH storage, the performance of its performance, while built-in audio codec circuitry, suitable for a variety of voice gateway and other applications. Industrial Bluetooth applications should generally use the FLASH version of the chip produced by the module, fast running, with high integration, haute fiabilité, high performance indicators and other characteristics.

(3) EXT version

EXT module chip without FLASH memory, the need to expand the memory device, the user can carry out application development, characterized by moderate prices, shortcomings are stability, power consumption and other performance differences, while most EXT chip does not have audio decoding circuits, such as the need to realizeio transmission needs to be connected to an external codec device.

5. Classification according to power

In terms of power, there is a difference between low-power Bluetooth and classic Bluetooth.

Low power Bluetooth has no power level, the transmission distance can be more than 100m, 5.0 protocol distance even up to 300m, the specific distance depends on the product design power. The modulation of Bluetooth Low Power technology is slightly different from traditional Bluetooth technology. This different modulation uses a 10mwdb wireless chipset (Low Power Bluetooth’s maximum power) to achieve a connection range of up to 300m, which means that the entire range of homes and buildings can be covered, achieving a more robust and reliable connection.

Classic Bluetooth has three levels of power, expressed in Class. According to the Bluetooth specification, Class is not used to specify distance, but to indicate transmit power. Bluetooth module transmit power parameters are determined, the actual transmit efficiency and RF circuit, antenna efficiency related to the Bluetooth module communication distance and transmit power, reception sensitivity and application environment is closely related to Bluetooth work in the 2.4G band, penetration capacity is poor, in the case of blocking, should be in the actual field to test the communication effect. The purpose of power control is to control the radiation within the limits without interfering with the normal operation of neighboring Bluetooth devices, using the link management protocol to realize the power control algorithm between master and slave devices.

(1) Classe 1

Classe 1 output power of 1mW (0dbm) to 100mW (20dbm), support for 100m transmission distance, in order to achieve the maximum range, power control is mandatory. Classe 1 is used in high-power, long-distance Bluetooth products, but because of the high cost and high power consumption, it is not suitable for cooperation with personal communication products (téléphones portables, Bluetooth headsets, Bluetooth Dongle, etc.), so it is mostly used in long-distance transmission.

En général, few people will use long-distance transmission, but if you want to transmit audio over a long distance, connect audio over a long distance, and more commonly in some large-scale venues, stages, and industrial scenarios, using a Bluetooth adapter that supports Class 1 is the best solution.

(2) Classe 2

Classe 2 output power of 0.25mW (-6dbm) to 2.5mW (4dbm), power control is optional, under normal circumstances 1mW (0dbm) supports 10m transmission distance, as long as the transmitter power can exceed 0dBm is part of the scope of Class 2, but if more than 4dBm, then it is Class 1.

Most of the common Bluetooth devices on the market today are power consumption Class 2, mostly used in cell phones, Bluetooth headsets, Bluetooth Dongle personal communication products, power consumption and smaller size, while easy to carry.

(3) Classe 3

Classe 3 output power ≤ 1mW (0dbm), support 1m transmission distance. With the lowest output power, Classe 3 devices are not common due to their very limited range of coverage.

6. Classification according to the support temperature

(1) Commercial grade

The temperature range is about 0℃~70℃. Generally used in ordinary consumer products, more common in life and lower prices are cheaper. Suitable for environmental conditions (comme la température, EMC and mechanical stress) at a mild to moderate level in consumer product applications. Such as a variety of consumer electronics, smart home appliances, entertainment devices, mobile computing, cameras, moniteurs, routers and test equipment.

(2) Industrial Grade

The temperature range is about -40°C to 85°C. Generally used in industrial environments, but also able to operate outdoors where the environment is not so good or where there is interference. Compared to commercial grade products, industrial grade products can withstand more extreme environments, and are suitable, expected, or required to be used in types or qualities for industrial use, such as transportation, factory automation, and high shock and vibration environments.

(3) Automotive grade

The temperature range is approximately -40℃ to 125℃. Generally used in automobiles or harsh environments, due to the high heat generated during the start-up process of automobiles, it will be a bit higher in terms of high temperature and more expensive than industrial grade, which may be subject to high levels of EMI, collision, shock and vibration, and extreme temperatures. This type of product is therefore designed for automotive, transportation and other mission-critical applications and meets industry-standard automotive specifications.

(4) Military Grade

The temperature range is approximately -55℃ to 150℃. Generally used in military equipment, so the requirements are also the most stringent, mainly used in missiles, aircraft, tanks, aircraft carriers and other military fields. Grade is the most advanced, high precision, advanced technology and at the same time expensive, military grade is generally several years ahead of industrial grade time.

Classification and application of pcb gold fingers

01/15/2024/dans Connaissances techniques PCB/par Personnel administratif

In modern high -tech equipment, many devices need to be connected to each other, which requires signal transmission. How to connect the two devices, the golden finger is an important hub in it. The golden finger is a connection contact between the motherboard and the graphics card or sound card.

The technology used to transmit these signals and commands is a huge leap for early electronic technology. Early electronic technology is usually composed of independent modules, which is difficult to communicate with each other. With the golden finger, the process of a circuit board was immediately read by the main processing board.

WHAT ARE GOLD FINGERS?

Gold fingers are the gold-plated columns that you see along the connecting edges of printed circuit boards (PCBS). The purpose of gold fingers is to connect a secondary PCB to the motherboard of a computer. PCB gold fingers are also used in various other devices that communicate via digital signals, such as consumer smartphones and smartwatches. Gold is used for the connecting points along a PCB because of the alloy’s superior conductivity.

There are two types of gold applicable to the PCB gold finger plating process:

➤Electroless Nickel Immersion Gold (Accepter): This gold is more cost-effective and easier to solder than electroplated gold, but its soft, thin (typically 2-5u” composition renders ENIG unsuitable for the abrasive effects of circuit board insertion and removal.

➤Electroplated Hard gold: This gold is solid (hard) and thick (typically 30u”), thus more ideal for the abrasive effects of constant PCB usage.

Gold fingers make it possible for different circuit boards to communicate with one another. From the power source to the device or equipment, signals must pass between several contacts for a given command to be enacted.

Once you press a command, the signal will pass between one or more circuit boards before it is read. Par exemple, if you press a remote command on a mobile device, the signal will be sent from the PCB-enabled device in your hand to the near or distant machine, which in turn receives the signal with its own circuit board.

Golden finger classification

En général, the main role of gold finger is connection, so it must have good conductive performance, wear resistance, antioxidant performance, and corrosion resistance. According to its performance characteristics, the gold finger is divided into the following:

① Conventional gold finger: Qiping’s finger is characterized by the edge of the PCB board. The position is neatly arranged and the same length. The width of the pads is rectangular and widely used. It is often found in the type of network card and graphics card.

② long -term gold finger: c'est, unsatisfactory gold fingers, characterized by rectangular pads with difficulty in the length of the PCB board, often found in memory, U disk, card reader, etc..

③ Segment gold fingers: In the new gold finger, unlike long and short gold fingers, segmented gold fingers are rectangular pads located at different lengths of the board, but the front end is broken.

What is the PCB gold finger plating process?

Here is a list of the process for hard gold plating to PCB gold fingers:

1) Covered with blue glue

In addition to the PCB gold finger pads that require hard gold plating, the rest of the PCB surface is covered with blue glue. And we make the conductive position and the direction of the board is consistent.

2) Remove the oxide layer on the copper surface of PCB pads

We use sulfuric acid to wash off the oxide layer on the surface of the PCB pads and then clean the copper surface with water. We then grind to further clean the PCB pad surface. Suivant, we use water and deionized water to clean the copper surface.

3) Electroplating nickel on the copper surface of PCB pads

We energize the cleaned gold finger pad surface to electroplate a nickel layer. Suivant, we use water and deionized water to clean the nickel plated pad surface.

4) Electroplating gold on nickel-plated PCB pads

We electrically plate a layer of gold on the surface of the nickel-plated PCB pads. We recover the remaining gold. Then we clean the gold finger surface with water and then deionized water.

5) Remove the blue glue

Now the hard gold plating of the PCB gold fingers is completed. We then remove the blue glue and continue with the PCB fabrication to the soldermask printing step.

How to use PCB Golden Finger

1. Edge Connectors
When an auxiliary PCB is connected to the main board, it does so through one of several female slots, such as PCI, ISA or AGP slots.
Through these slots, the gold fingers conduct signals between the peripherals or internal cards and the computer itself.

Edge connector sockets are surrounded by a plastic box that opens on one side and has pins at one or both ends of the longer edge. Typiquement, connectors contain tabs or notches for polarity to ensure that the correct type of device is inserted into the connector. The width of the socket is chosen based on the thickness of the connection plate. On the other side of the socket is usually an insulated piercing connector that connects to the ribbon cable. The motherboard or daughter card can also be connected to the other side.

2. Special adapters
Gold fingers Many performance enhancements can be added to a personal computer. By plugging vertically into the motherboard’s auxiliary PCB, the computer can provide enhanced graphics and high-fidelity sound. Because these cards are rarely connected and reconnected individually, the gold fingers are usually more durable than the cards themselves.

3. External Connections
Peripheral devices that have been added to the computer station are connected to the motherboard via PCB gold fingers. Devices such as speakers, subwoofers, scanners, imprimantes, and monitors are plugged into specific slots on the back of the computer tower. In turn, these slots connect to the PCB that is attached to the motherboard.

Design Rules of PCB Gold Fingers

●Keep plated through holes away from the fingers by at least 1mm. Plated through holes require copper plating around the hole on all layers. This copper can flow onto the gold fingers during plating and cause contamination or plating thickness issues. Maintaining a 1mm keepout prevents this.

●Maintain spacing between the fingers and any solder mask or silkscreen printing. This prevents material from overflowing onto the fingers during application which can interfere with insertion.

●Orient the fingers on the side of the board opposite from the component center. This aids in insertion and alignment as it clears components on the bottom side.

●Do not place any SMD parts, plated through holes, or solder pads within 1mm of the fingers. This prevents interference with the interfacing connector.

●Remove all inner layer copper beneath the fingers, typically 3mm beyond the edge of the finger width. This prevents inner layer copper from being exposed during PCB beveling/chamfering which looks bad aesthetically.

●Limit the maximum finger length to around 40mm. Longer fingers are prone to damage during handling and insertion.

●Avoid soldermask or silkscreen printing in areas immediately adjacent to the fingers where material can overflow causing buildup issues.

●Design continuous openings in the solder mask around the fingers. This prevents the need for score lines or steel mesh.

PCB gold fingers play an important role in electronic products. They not only connect circuit boards and other electronic components, but also transmit signals and currents.The production process of PCB Gold Finger includes plating and anti-corrosion treatment to increase its electrical conductivity and corrosion resistance.PCB Gold Finger is widely used in cell phones, computers and automobiles. Through a deeper understanding of PCB gold fingers, we can better understand the principles of connection and transmission in electronic products.

Processus et avantages de traitement de surface des PCB OSP

01/11/2024/dans Actualités de l'industrie/par Personnel administratif

OSP (Conservateurs organiques soudables) est un procédé de traitement de surface sans plomb, qui est principalement utilisé pour les circuits imprimés emballés en surface SMT. Par rapport au HASL traditionnel (Nivellement de soudure à air chaud) processus, le procédé OSP ne nécessite pas de traitement de fusion à haute température, ce qui peut réduire le risque de corrosion des métaux, la pollution de l'environnement et composant électronique dommage, il est donc largement utilisé dans l'industrie de la fabrication électronique.

Principe OSP

Le principe de base du processus OSP est de recouvrir une couche de substances organiques sur la surface du PCB pour former une couche protectrice afin d'empêcher l'oxydation et la corrosion de la surface du cuivre.. Cette couche protectrice est généralement mélangée à des produits chimiques tels que des acides organiques et de l'azote.. Les principaux produits chimiques comprennent:

1. Acide organique: comme l'acide acétique, acide propionique, etc., principalement utilisé pour réguler les valeurs de pH et améliorer les réactions chimiques.

2. Composés nitrurés: comme l'acide nitrique, nitrite, etc., qui sont principalement utilisés pour augmenter l’adhérence et la durabilité de la couche protectrice.

3. Autres additifs: comme les tensioactifs, antioxydants, etc., pour augmenter la stabilité et la durabilité de l'agent de revêtement.

Étape du processus OSP

1. Pré-traitement: Traitement chimique sur la surface du PCB, éliminer les oxydes et les polluants, pour que la surface soit propre et lisse, ce qui est pratique pour un revêtement et une réponse ultérieurs.

2. Revêtement: Appliquer une couche d'agent de revêtement OSP sur la surface du PCB, et former une couche protectrice par séchage et autres processus.

3. impôt sur le revenu de: Mettez le PCB dans un four durci, je l'ai chauffé à une certaine température, de sorte que l'agent de revêtement OSP se solidifie pour former un film protecteur.

4. Détection: Le PCB solidifié est détecté, y compris le test d'indicateurs tels que l'adhérence, épaisseur, et planéité.

5. Pâte SMT: Placez le composant électronique sur la surface du traitement PCB après le traitement OSP.

Le procédé OSP présente les avantages de la protection de l'environnement, sans plomb, et adapté à la fabrication de produits microélectroniques. Cependant, son processus de traitement est plus compliqué et nécessite un contrôle strict de la composition et de la qualité des agents de revêtement pour garantir la qualité et la stabilité des PCB. Lors de l'utilisation du processus OSP, vous devez faire attention aux problèmes suivants:

1. La composition et la qualité de l'agent de revêtement OSP ont un impact important sur la qualité et la stabilité des PCB. Il doit être sélectionné en fonction des produits chimiques et des fournisseurs appropriés afin d'éviter d'utiliser des agents de revêtement de qualité inférieure..

2. L'épaisseur du revêtement de l'agent de revêtement OSP a également un impact important sur la qualité et la stabilité des PCB.. Il doit être sélectionné avec une épaisseur différente en fonction des différentes exigences en matière de PCB. En général, l'épaisseur de l'agent de revêtement OSP doit être contrôlée entre 0,2 et 0,5 um. entre.

3. Le temps de durcissement et la température de l'agent de revêtement OSP sont également très importants pour la qualité et la stabilité du PCB.. Vous devez choisir les conditions de durcissement appropriées en fonction des différents agents de revêtement et des exigences en matière de PCB.

4. L'adhérence et la durabilité de l'agent de revêtement OSP sont également des indicateurs clés de la qualité des PCB.. Il doit être assuré par des tests de qualité et des tests stricts pour garantir sa qualité et sa stabilité..

5.Le processus OSP est un processus de traitement de surface sans plomb vert et respectueux de l'environnement.. Il utilise des polymères organiques comme agents de revêtement pour former un film protecteur sur la surface du PCB afin de protéger la surface du PCB sans oxydation ni corrosion.. Par rapport au procédé Hasl traditionnel, l'avantage du procédé OSP est que l'agent de revêtement est respectueux de l'environnement, revêtement uniforme, boule non soudée, et facile à souder. Donc, dans la fabrication électronique moderne, le processus OSP est largement utilisé.

Avantage OSP

Les avantages de l’OSP peuvent être résumés comme suit ::

• Processus simple et utilisation réutilisable: Le circuit imprimé avec OSP peut facilement être refait par les fabricants de PCB. De cette façon, une fois que le personnel de préparation des PCB constate que le revêtement est endommagé, le nouveau revêtement peut être utilisé.

• Bonne mouillabilité: Lorsque les soudures rencontrent des trous et des plots, Les circuits imprimés à revêtement OSP fonctionnent mieux en cas de mouillage soudé.

• Respectueux de l'environnement: Parce que des composés à base d'eau sont appliqués dans la génération d'OSP, cela ne nuira pas à l'environnement, et cela ne fera que répondre aux attentes des gens à l’égard du monde vert. Donc, OSP est le meilleur choix pour les produits électroniques qui répondent aux réglementations vertes telles que ROHS Essence

• Coût des PCB avantages: Comme des composés simples et des processus de fabrication simples sont appliqués pendant le processus de fabrication des OSP, le coût de l'OSP dans tous les types de traitement de surface est très important. Son coût est inférieur, ce qui entraîne une réduction du coût du circuit imprimé final.

• Soudure de retour adaptée à l'assemblage CMS double face: Avec le développement et les progrès continus d'OSP, il a été accepté par l'assemblage SMT simple face et l'assemblage SMT double face, ce qui a considérablement élargi son champ d'application.

• Faibles besoins en encre de soudage: Les exigences de stockage des PCB OSP pour les exigences de longue durée de stockage En raison des conservateurs très fins produits par la technologie OSP, c'est facile à couper, il faut donc être très prudent pendant le transport et le transport. L'OSP est exposé à des températures et à une humidité élevées pendant une longue période en tant que PCB traité en surface., qui peut se produire à la surface du PCB, ce qui entraîne souvent une faible soudabilité.

Comment l'OSP est fabriqué

1.La première étape est le nettoyage, qui élimine les contaminants organiques tels que l'huile et les films d'oxydation de la feuille de cuivre, la composante principale de l'OSP. Un nettoyage insuffisant peut entraîner une épaisseur inégale du conservateur créé. Pour obtenir des films OSP de haute qualité, la concentration du liquide de nettoyage doit se situer dans une certaine plage selon les normes du laboratoire. Le processus de nettoyage doit être régulièrement surveillé pour garantir que la norme requise est respectée.. Si les résultats souhaités ne sont pas obtenus, le liquide de nettoyage doit être changé.

2.Le deuxième bloc est l'amélioration de la topographie, où la micro-gravure est utilisée pour éliminer l'oxydation produite sur la feuille de cuivre qui provoque une forte liaison entre la feuille de cuivre et la solution de préservation de soudabilité organique. Le taux de formation du film dépend de la vitesse de micro-gravure. Pour obtenir une épaisseur de film lisse, la vitesse de micro-gravure doit être stable. La plage de vitesse de micro-gravure est d'environ 1.0 à 1.5 micromètres par minute.

3.La meilleure option est d'utiliser un rinçage avant de créer le conservateur, car la solution OSP peut être polluée par les ions, ce qui peut provoquer un ternissement après la fin du processus de brasage par refusion. En plus de ça, Le rinçage DI doit être utilisé après la création du conservateur avec un pH de 4 à 7. Si ces paramètres ne sont pas respectés, le conservateur peut être détruit à cause de la pollution.

4.Le revêtement OSP PCB est ensuite appliqué sur la surface de cuivre nettoyée via un processus d'adsorption.. La solution OSP contient des composés organiques tels que les benzimidazoles, imidazolés, et les benzotriazoles qui forment une fine couche à la surface du cuivre. L'épaisseur du revêtement peut être contrôlée en ajustant la concentration et le temps d'immersion de la solution.

5.Une fois le revêtement appliqué, le PCB est séché et durci dans un environnement contrôlé pour éliminer toute humidité restante et garantir une bonne adhérence de la couche OSP.

6.Une fois le revêtement appliqué, le PCB est inspecté pour déceler tout défaut ou irrégularité. Les circuits imprimés à revêtement OSP sont ensuite soumis à divers tests PCB pour garantir leur qualité., fiabilité, et les performances.

Application des PCB multicouches dans la fabrication électronique

01/05/2024/dans Actualités de l'industrie/par Personnel administratif

Les équipements électroniques sont visibles partout dans nos vies, et certains produits électroniques sont devenus nos fournitures indispensables. Nous dépendons d'eux, tandis que l'équipement électronique dépend du circuit imprimé. Le PCB est désormais le composant principal de la plupart des produits, et les fonctions de base sont déterminées par la combinaison de composants et de mécanismes de câblage.

Le PCB est divisé selon le niveau, qui peut être divisé en: circuit imprimé monocouche, circuit imprimé double couche, et circuit imprimé multicouche. Ce dont nous voulons discuter aujourd'hui, c'est du circuit imprimé multicouche.. Le circuit imprimé simple et fonctionnel utilise principalement un PCB monocouche, mais des produits électroniques plus compliqués, comme la carte mère de l'ordinateur, se composent de plusieurs couches. Avec la complexité croissante des produits électroniques modernes, ces PCB multicouches sont plus populaires que jamais, et la technologie de fabrication a considérablement réduit leur taille.

Qu'est-ce qu'un PCB multicouche

Le PCB multicouche est une carte de circuit imprimé composée d'une couche conductrice multicouche et d'une couche isolante. Ce circuit imprimé est principalement utilisé dans les produits électroniques haut de gamme, comme la communication sans fil, ordinateur, automatisation industrielle, équipement médical et autres domaines.

Le PCB multicouche est composé de plusieurs couches conductrices, qui sont séparés les uns des autres par la couche isolante. Sur chaque couche conductrice, il y a une fine couche de feuille de cuivre, qui forme des graphiques de circuits par gravure chimique ou perçage mécanique. Les couches conductrices adjacentes sont connectées à travers le trou.

Par rapport aux panneaux simples ou doubles, le PCB multicouche a une densité de circuit plus élevée, meilleure compatibilité électromagnétique, bruit de circuit réduit et meilleures performances de dissipation thermique. Son processus de production est relativement compliqué, et plusieurs étapes telles que la couverture d'une feuille de cuivre, gravure chimique, forage, impression, un placage de cuivre et d'autres étapes sont nécessaires. Ces étapes nécessitent un niveau technique élevé et un contrôle strict du processus pour garantir la qualité et la stabilité du produit final..

La conception et la fabrication de PCB multicouches nécessitent de nombreux facteurs, comme l'apparence, taille, nombre de couches, comment placer les composants, comment disposer les fils, forage, coussinets, etc.. La clé est d'optimiser le câblage interne pour améliorer les performances et la fiabilité du circuit.

Avantages des PCB multicouches

D'un point de vue technique, PCB multicouches présentent plusieurs avantages en matière de conception. Ces avantages que présentent les PCB multicouches incluent:

• Petite taille: L'un des avantages les plus importants et les plus appréciés de l'utilisation de PCB multicouches réside dans leur taille.. En raison de leur conception en couches, les PCB multicouches sont intrinsèquement plus petits que les autres PCB ayant des fonctionnalités similaires. Cela présente un avantage majeur pour l’électronique moderne, car la tendance actuelle est à la réduction, des gadgets plus compacts mais plus puissants comme les smartphones, ordinateurs portables, tablettes et appareils portables.

• Construction légère: Des PCB plus petits entraînent moins de poids, especially as the multiple connectors required to interlink separate single and double-layered PCBs are eliminated in favor of a multilayered design. This, encore, is beneficial for modern electronics, which are geared more toward mobility.

• High-Quality: Due to the amount of work and planning that must go into the creation of multilayer PCBs, these types of PCBs tend to be better in quality than single and double-layer PCBs. They also tend to be more reliable as a result.

• Increased Durability: Multilayer PCBs tend to be durable by their nature. Not only do these multilayer PCBs have to withstand their own weight, but they must also be able to handle the heat and pressure used to bind them together. On top of these factors, multilayer PCBs use multiple layers of insulation between circuit layers, binding it all together with prepreg bonding agent and protective materials.

• Enhanced Flexibility: Though this does not apply to all PCB multicouche assemblies, some do use flexible construction techniques, resulting in a flexible multilayer PCB. This can be a highly desirable trait for applications where mild bending and flexing may occur on a semi-regular basis. Encore, this does not apply to all multilayer PCBs, and the more layers incorporated into a carte PCB flexible, the less flexible the PCB becomes.

• More Powerful: Multilayer PCBs are extremely high-density assemblies, incorporating multiple layers into a single PCB. These close-quarters enable boards to be more connective, and their innate electrical properties allow them to achieve greater capacity and speed despite their smaller size.

• Single Connection Point: Multilayer PCBs are designed to work as a singular unit, rather than in tandem with other PCB components. Par conséquent, they have a single connection point, rather than the multiple connection points required to use multiple single layer PCBs. This proves to be a benefit in electronic product design as well since they only need to include a single connection point in the final product. This is particularly beneficial for small electronics and gadgets designed to minimize size and weight.

These benefits make multilayer PCBs highly useful in a variety of applications, particularly mobile devices and high-functioning electronics. In turn, with so many industries turning to mobile solutions, multilayer PCBs are finding a place in an increasing number of industry-specific applications.

Advantages of Multilayer PCBs over Single Layer Alternatives

When compared to single layer alternatives, the advantages of multilayer PCBs become even more pronounced. Some of the key improvements multilayer PCBs offer include the following:

• Higher Assembly Density: While single layer PCBs’ density is limited by their surface area, multilayer PCBs multiply their density through layering. This increased density allows greater functionality, improving capacity and speed despite the smaller PCB size.

• Smaller Size: Dans l'ensemble, multilayer PCBs are smaller in size than single layer PCBs. While single layer PCBs must increase the surface area of the circuit by increasing size, multilayer PCBs increase surface area through the addition of layers, decreasing overall size. This allows for higher-capacity multilayer PCBs to be used in smaller devices, while high-capacity single layer PCBs must be installed into larger products.

• Lighter Weight: The integration of components in a multilayer PCB means less of a need for connectors and other components, resulting in a lightweight solution for complex electrical applications. Multilayer PCBs can accomplish the same amount of work as multiple single-layer PCBs, but does so at a smaller size and with fewer connecting components, reducing weight. This is an essential consideration for smaller electronics where weight is a concern.

• Enhanced Design Functionality: Dans l'ensemble, multilayer PCBs are capable of being more than the average single layer PCB. With more incorporation of controlled impedance features, greater EMI shielding and overall improved design quality, multilayer PCBs can accomplish more despite their smaller size and lesser weight.

Application du PCB multicouche

Multi-layer PCB is widely used in various high-end electronic products, including but not limited to the following fields:

1. Matériel de communication: Multi-layer PCB plays a key role in communication devices such as mobile phones, routeurs, communication par satellite, etc., and realizes high-speed data transmission, signal processing and power management functions.

2. Computer hardware: Multi-layer PCB is widely used in hardware such as computer motherboards, cartes graphiques, and memory strips. It provides high -density and high reliability circuit wiring to ensure the stable operation of the computer system.

3. Automatisation industrielle: Multi-layer PCB is widely used in industrial automation equipment, such as programmable controllers, capteurs, motors controllers, etc.. Its high reliability and durability meet the needs of industrial automation equipment.

4. Matériel médical: Multi-layer PCB is also widely used in medical equipment, such as monitor, ECG, ultrasound equipment, etc., its miniaturization, high density and reliability provide strong support for the performance of medical equipment.

5. Aérospatial: The application of multi-layer PCB in the field of aerospace is very important because this field requires high reliability and durability electronic equipment. The characteristics of high-density wiring, electromagnetic compatibility and heat dissipation performance of multi -layer PCB meet the needs of the aerospace field.

6. Car Electronics: Multi-layer PCB is also widely used in automotive electronics, such as engine control modules, airbag control modules, etc.. Its high reliability and durability can ensure stable operation in the harsh working environment of the car.

Get a Manufacturer For Your Multilayer PCB

Lst is a PCB personnalisé SORUTIONS Provider, Serving Companies the World in PCB ManuFacturing and Assembly Services. We Help Companies Sourcing To Testing, ALL The Who Remaining Compliant with IPC Class 3, Rohs and ISO9001: 2008 Normes.

We can design a variety of complex multi -layer circuit boards for you. We have an experienced production technology team to track the processing of multi -layer circuit boards throughout the process. Any of your needs, LST can be met.

15 common PCB faults and solutions

01/03/2024/dans Actualités de l'industrie/par Personnel administratif

Regardless of whether it is an engineer or a Fabricant de PCB, it is impossible to avoid PCB failures. The emergence of these faults may lead to delayed product intersection and affected the reputation of the manufacturer, increasing time and money costs.
Today is mainly about the PCB fault mode and the PCB failure solution. Here we mainly list the following 15 PCB fault modes, let’s analyze this.

1. PCB crack or bend

Reason: Due to high mechanical or physical stress, printing circuit board components (PCBA) may be ruptured or bent. Par exemple, if the rigid PCBA is placed under repeated vibration or thermal shock, it may fail. En outre, if your curved strength exceeds its ability, even flexible PCBA will break.

PCB crack

Prevention method: Before using PCB during the assembly process, bake PCB and store it in a cabinet with humidity control to remove any water in the naked PCB to avoid impact caused by the later stages of assembly.

2. The assembled PCB components have obvious polarity

Reason: When designing the PCB layout, if the component on the printed circuit board component is not obvious, it may lead to the problem of polar counter -connection. Par exemple, if the battery pole is reversed, the battery and electrical components may be damaged. Printing circuit board components may also fail, and electric shocks may occur.

PCB components have obvious polarity

Prevention method: You can use diode or Schottky diode to reduce the effects of reverse polarity. If you connect the diode with the battery, the circuit will be turned off in the opposite situation, it will prevent any major damage to the printed circuit board component.

3. PCB solder joint break

Reason: The difference between the thermal coefficient and composant électronique of the PCB may cause the solder joints to break. If the printed circuit board components are placed in a repeated high or low temperature environment, a failure may occur. Another reason may be manual welding, which makes welded more vulnerable to thermal stress.

PCB solder joint break

Prevention method: It would be much better if you use a special automatic machine to welded electronic components. Before sending the PCB to the assembly process, make sure you have visited inspection.

4. PCB corrosion

Reason: Since there may be some residues during the Assemblage PCB, there may be some residues, so the printed circuit board component may be corroded. The welding agent is essential to ensure the safe connection of electrical components. Cependant, once contact, it will also cause their corrosion.

Prevention method: Welds are composed of organic acids, such as citric acid or adenic acid. PCB assemblers should ensure that any extra welded agents are eliminated from the PCB surface. This will not help the solder to destroy the metal contact. If the PCB assembler uses a refund welding machine, you should remember to rinse any excess welding agent.

5. Burning or burning electronic components (court-circuit)

Reason: During the PCB assembly, short circuit may damage PCB and electronic components. This may be short circuit due to the unexplained welding bridge, humid or accidental events (such as high -current peaks). Short -circuit will cause sudden and sudden damage to components, and may also cause damage to fire and electrical equipment.

Prevention method: Check the short -circuit situation of the PCB surface. For the inner layer, electrical testing is most suitable for the assembly of printing circuit boards. The test mainly checks whether there is short -circuit or opening. En outre, you can compare the obtained readings with the readings obtained from the probe test.
En outre, when designing the PCB layout, PCB assembly personnel must accurately align each layer. De cette façon, they will be able to work together and avoid any short circuits. You can also reduce the thickness of the PCB template to reduce the deposits of welded paste.

6. Copper weight is not suitable

Reason: For the good current in the printing circuit board component, the weight of the correct copper foil is necessary. If the copper weight is too thin or too thick, it will cause your print circuit board component to fail, which is mainly because the size determination and the width selection of the wiring width when designing the PCB layout.

Prevention method: PCB assemblers must follow the copper weight specifications required by PCB engineers. Copper cannot be too thick because it increases costs and cannot be too thin, because they may cause PCB to heat up.

7, component position movement

Reason: In PCB assembly, pick up and place or place components of the circuit board in other automatic machines. If the component is shifted or moved due to the welded weld during welding, the PCB may be faulty. It is mainly because reliable solder joints will not be formed and may cause the road.

Prevention method: PCB assemblers should follow the standard humidity and temperature requirements. They may use more accurate pickup and placing machines to accurately place components. En outre, if you still use more corrosive welding agents, it will improve the weldability of parts, which can keep the electronic components in the original position.

8. The warranty period of electronic components expires

Reason: If any single component in the printed circuit board component fails, it may cause the entire PCB component to collapse, and parts may fail due to reverse selection. If these components are not limited, they will be helpful. En outre, if you choose a low -quality component, it will reduce the service life of the parts, and it may not even be before the warranty period expires.

Prevention method: You should carefully select the component or ask your PCB factory to do so. The parts should not be damaged or the quality should be low (electronic component preparation). En outre, you can directly add components to prepare damage.

9. PCB hot pressure or wet pressure

Reason: Different materials have different expansion rates. Donc, when a constant a thermal stress is applied, it will damage the solder joint and damage the component. If the wrong copper weight or electroplating problem is used, the stress of thermal factors will increase. Even in the process of manufacturing, the temperature of the assembly PCB room will affect its performance.

Prevention method: PCB assembly personnel must conduct a careful circuit board inspection, prepare, and then clean the necessary cleaning. Pencil rubber rubbing can eliminate any slight corrosion or rust. You can identify the sub -light copper pad through their dark brown. Welds are not sticky to the surface of rust, and must be applied after cleaning, and excess is removed with the welding core.

10. Problems of PCB welding process

Welded welds are very important for the work of electronic circuits, so pay more attention. The most common problems related to soldering are the conditioning conditions for welded pollution and bad processing. The welding agent is a chemical cleaner used before and during the circuit board. Some welded residues will absorb the possible conductive moisture, which will cause short circuit. If the welding process is not set and controlled correctly, the connector can be opened and pollution.

11. PCB uses physical problems of materials

The materials used in PCB often encounters problems that cause the circuit board to fail. In the manufacturing stage, if a layer of PCB is not aligned, it will cause short -circuit, opening and cross -signal lines. If the material has a psychological defect such as breaks, empty holes, and layered, the performance of PCB will be seriously affected. If the material used is not pure, it will also fail.

12. Chemical fluid leaks in electronic components in PCB

The existence of any chemical liquid leaked in the component will severely damage the PCB and cause failure. Most chemicals are removed during the manufacturing process. Cependant, trace elements may be left. Inside the packaging of the component, leaks may occur, which will cause semiconductors or packaging rapidly. This chemical leak will eventually lead to short -circuit or corrosion.

13. PCB component design failed

One of the most common reasons for PCB failures is incorrect components due to insufficient PCB space, power failure or overheating. Space is crucial, especially when the circuit board becomes more complicated and needs to meet harsh requirements. Here are only some examples of errors in the design and manufacturing stage. Don’t forget, you can avoid many such problems by following the correct Conception de PCB rules.
Welding problem
Chemical (fluid) fuite
Component barrier damage
Wrong component placement
Burning component

14, inferior electronic components

It is not so easy to find an electronic component that conforms to the circuit design. Whether it is to ensure packaging or management components, it is very important to find high -quality electronic components when considering PCB assembly and manufacturing.
The tightly placed wiring and channels, poor welding of cold welds, poor connection between circuit boards, insufficient circuit board thickness, and use of counterfeit elements are just some problems that may face.

15. PCB placement environment

PCB is exposed to heat, dust and humidity, accidental impact (falling and falling), and power supply/waves, which may be the cause of circuit board failure. Cependant, the most destructive reason for the premature failure of the circuit board is the electrostatic discharge (ESD) in the assembly stage. Electricity discharge (ESD) is a sudden current flow caused by short circuit or dielectric breakdown between the two electric objects. Static accumulation may be caused by friction charging or electrostatic sensing.

The specifications and requirements of PCB Silkscreen designed.

12/28/2023/dans Actualités de l'industrie/par Personnel administratif

PCB Silkscreen design mainly refers to the design of the silk layer printing on the carte de circuit imprimé (PCB). The silk layer is a special layer on the PCB, which is used to print various texts, symbols and graphics, such as circuit points, composants, circuit symbols, etc.. This information is mainly used for various components and functional areas on the identification, identification and management of PCB.

In the PCB Silkscreen design, many factors need to be considered, such as space restrictions, information importance and readability. Due to the limited PCB surface space, designers need to decide which information is the most critical and prefer to display this information in the silk print layer. Par exemple, component reference signs, polar marks, pins 1 labeling, component boundary, company logo, manufacturing trademark, warning symbols, component numbers, version numbers, and date code are all common silk print content.

Design PCB Silkscreen usually uses EDA (electronic design automation) logiciel. Designers can identify and assemble all the necessary marks, symbols and texts required for components on PCB, and then export the format that can be used by manufacturers. Modern PCB Silkscreen design usually uses a digital inkjet printer to print the screen printing image to the surface of the PCB, while the initial screen printing technology uses the screen printing method.

Importance of PCB Silkscreen

In order to lay the right background on a silkscreen PCB role, it is important that we recall the uses of a printed circuit board (PCB). PCB offers mechanical support and helps in connecting electronic components. PCBs have signal traces, conductive pathways, or copper sheet-etched traces that are laminated to a substrate (non-conductive).

The conductive tracks and components of the PCB are seen throughout the board without the right identification. This is why it is necessary for end-users and manufacturers to exist. This helps them to identify components such as:

▶Manufacturer identifiers
▶Testing points
▶Warning signs like high voltage
▶Processing types
▶Version numbers like V2, V3, etc..
▶Component orientation and numbers
▶Company logos i.e. manufacturer name

The importance and roles of silkscreen PCB include:

▶Identifying circuit points such as part interconnect, testing points, etc.. quickly
▶Useful in troubleshooting circuits in case you get a defective component or a contrasting outcome
▶It helps you quickly identify components whenever you are designing or replacing evaluation requirements.
▶It serves as a form of safety by showing some warning signs, such as grounding, high voltage, etc..
▶Silkscreen PCB also helps manufacturers dung marketing and branding purposes. Cependant, it prevents illegal duplication or forgery of circuit designs.

Silkscreen PCB is also great for evaluating products, such as rating verifications. Note that the information of your silkscreen depends on the size of your board. If your silkscreen board is a small one, make sure you take the important information seriously.

Silk print design requirements

The ratio of the word height to the word width of the silk print character is generally required ≥6: 1. There are three common font samples: where the board density is relatively large, the character of 4/25mil is commonly used (Non. 1); when the conventional density is recommended, it is recommended to 5/recommended 5/ 30mil characters (Non. 2); when the board is relatively loose, it is recommended to 6/45mil characters (Non. 3); usually the thickness of the surface of the surface of the surface also has corresponding requirements for the width of the silk print: When the thickness of the base is 1oz, the 5/30mil character is preferred; when the base copies are 2oz, the 6/45mil character is preferred.

PCB Silkscreen requirements

1. Placement position: En général, the wire printing of resistors, condensateurs, pipes and other devices should not be used in four directions when placing. This will cause debugging, entretien, and welding.

2. Try not to hit the silk print as much as possible.

3. Do not press on the high -speed signal line (tel que, clock line, etc.): For high -speed signal lines on the top or bottom layer, because this type of signal line can be regarded as a microstrip line.

4. The reading direction of the silk print should be consistent with the reading direction of the silk printing and the use direction of the chip. It is mainly because the probability of welding is reduced when welding.

5. The pins are clearly marked on the silk print.

6. Special packaging Silk Printing: For special packaging such as BGA and QFN, the size of the silk print must be exactly the same as the size of the chip.

7. Silk printing of the installation hole: The screws are added near the installation hole, and the total length and screws are marked for easy installation.

8. The two meaning of silk printing: the most commonly used RS232, many people will mark RX and TX, but there are RX and TX on the PC side. When do you use cross lines and when do you use it? Misty is unclear.

PCB Silkscreen design precautions

1. The width of the wire printing line on the board is ≥4mil, and the width of the component wire printing line is 0.

2. Silk printing and pad distance: Do not cover the welding point on the board, such as patch device pads, plug -in holes, silk printing as insulating material, once pads are put on , Mark point, etc.; usually require a 6mil spacing.

3. Sitries between silk prints: It is acceptable to keep 6mil. There is a coincidence between the silk seal. Once the coincidence is overwhelmed, it needs to be adjusted.

4. Silk printing direction: Silk print string arrangement should follow: the principles of string from left to right or from bottom to top when facing the right look.

5. The device bit number is placed: the device bit number should correspond to the device one by one, and cannot be reversed and transforms the order; when the density density is relatively high, you can use the method of drawing or symbolic labeling to place the bit number on the board other other boards. There is space.

6. The polar identity of the component and the “1” foot logo should be placed correctly and clearly.

7. When the labeling or symbol labeling, the added silk prints and characters added should be placed on the silk layer of Board Geometry.

The added board name number silk print is also placed on the silk seal layer of Board Geometry.

8. The device bit number cannot be placed in the device or outside the board.

9. When the density of the board is relatively high, when there is no space for placing the bit number, you can discuss with the customer not to sign, but you need to install pictures to facilitate the installation and inspection of the guidance device.

10. When the customer is required to write copper characters on the bottom layer, the line bronze line width: HOZ base bronze: character width above 8mil, height of 45mil or more; 1oz base bronze: more than 10mil in the character; above 50mil. En même temps, you need to do a good job of welding windows, so that the copper characters produced on the board are relatively bright.

Three Main Process Methods Of Silk Screen Printing.

The following are the most common PCB silk screen technology processes and processes on PCB:

▶Manual Silk Screen PCB: This process can be used when the line width is greater than 7mm and the registration tolerance is 5mm. For this method, you will need pcb silkscreen minimum text size and trace template made of nylon. The oil is printed onto the plate through the stencil. Next step,make the PCB board baked in a curing oven and let it to besolidification.

▶Liquid Photo Imaging (IPV): This procedure supplied greater correctness and legibility than manual screen printing. Using this method when the trace width is greater than 4 mil. Liquid photo imaging is very similar to the process of applying solder mask. Dans ce cas, a liquid photoimageable epoxy was applied to the laminate and then exposed to UV light. Après cela, the PCB board is developed and cured.

▶Direct Legend Printing (DLP): This is the most correct way to add PCB silk screen, but it is very high-priced. In such pcb silkscreen process, using an inkjet projector with acrylic pcb silkscreen ink, which have relevance to the original print circuit board from the CAD data. The pcb silkscreen acrylic inks is solid with UV light during printing. It should be noted that acrylic inks will not cure on boards with a silver finish.

Understand PCB Screen Printing Cost.

Due to the fixed cost characteristics, the cost of PCB screen printing is placed in the first place of non recurring tools in the Conception de PCB processus. PCB screen printing process accounts for about 15% of the total cost from Fabrication de PCB coût.

1.The minimum text size design of PCB screen printing refers to the change of character width, height, PCB screen printing thickness, spacing and character position. Art fees are usually not charged separately.

2.The cost of PCB screen printing ink depends on the screen printing method used. Acrylic ink is used for the DLP method of legend printing, while other methods use epoxy ink.

3.The cost of PCB screen printing ink decided by specific features, such as curing procedure, adhésion,substrate compatibility, and immunity to acid / alkali treatment.

4.PCB screen printing color is also a decisive cost factor. The cost of white ink silkscreen is lower than that of other color inks. By optimizing the cost of PCB screen printing through the selection of PCB screen printing materials, the total cost of PCB can be reduced by about 5%.

5.The screen printing method that used also has an effect on the total cost. The cost of LPI for liquid photo imaging and DLP for direct legend printing is higher than that of manual screen printing because of the high capital cost of setup.

6.Another important factor to consider in the cost calculation of screen printing is whether you want to print legends on both sides or just on one side. In the case of both parties, the cost will rise.

Conclusion

The process of PCB silkscreen is delicate. This is because the quality of the printed circuit board can be affected. Another aspect you must consider closely is the cost aspect during the design. En outre, having a good understanding about the whole process of screen printing as well as the benefits and pitfalls of each of the printing methods ensures that it becomes easy to decide if you should do a DIY PCB silkscreen or consult the services of any professional manufacturer.

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