Analyse complète du matériau PCB FR4: Propriétés, Notes (TG130/TG150/TG170) et applications expliquées
In PCB (Circuit Circuit Bancar) design and manufacturing, FR4 is undoubtedly the most common and widely used substrate. Whether you are a hardware engineer, PCB procurement specialist, or electronics enthusiast, gaining an in-depth understanding of FR4 material properties and grade classification is an important prerequisite for ensuring product reliability and optimizing cost. This article provides a comprehensive interpretation of this “universal” PCB material from three dimensions: FR4 fundamental properties, Tg value classification, and typical application scenarios.
1. What Is FR4 PCB Substrate?
FR4 stands for Flame Retardant Grade 4, a glass fiber epoxy copper-clad laminate. It accounts for more than 75% of global PCB substrate usage and follows the IPC-4101 international laminate specification.
Three-layer core structure
- Reinforcement substrate: E-grade electronic glass fiber fabric, providing mechanical rigidity and bending resistance
- Bonding resin: Brominated flame-retardant epoxy resin, achieving UL94 V-0 self-extinguishing fire resistance and insulation
- Couche conductrice: Electrolytic copper foil (0.5oz~4oz), laminated on both sides of the board to form conductive circuit pathways
Meaning breakdown of the name
- FR = Flame Retardant: Self-extinguishing within 10 seconds under flame, no dripping ignition risk
- 4 = Flame retardant grade standard: Different from paper-based FR1/FR2 and cotton-paper FR3 low-end laminates, suitable for industrial long-term use
2. Core Comprehensive Properties of FR4 PCB (Électrique / Thermique / Mécanique / Chimique)
2.1. Propriétés électriques (core of circuit stability)
- Dielectric constant Dk: 4.2~4.7 (à 1 GHz), stable signal propagation delay, suitable for IoT modules such as Wi-Fi, LoRaWAN, Bluetooth (ESP32 main control boards commonly use this substrate)
- Dielectric loss Df: ≤0.02, low loss for low-to-mid frequency signals, sufficient for consumer and industrial control applications
- Volume resistivity: >10¹³ Ω·cm, dielectric breakdown strength 20~50 kV/mm, ensuring reliable insulation safety under high and low voltage
- Contrôle d'impédance: Supports precise differential impedance design, suitable for high-speed digital boards and RF sensor PCBs
2.2. Thermal properties (Tg, CTE, Td — three key parameters)
- Tg glass transition temperature: The core classification parameter. It is the critical temperature at which resin transitions from a rigid glass state to a rubber-like elastic state. Beyond Tg, the board expands, softens, strength drops sharply, and failures such as delamination, via fracture, and layer separation may occur
- CTE (coefficient de dilatation thermique): Includes XY-plane and Z-axis expansion. Z-axis expansion directly affects via and microvia reliability. Higher Tg results in lower Z-axis CTE and better dimensional stability at high temperature
- Td thermal decomposition temperature: FR4 typically 300–350°C, meeting lead-free reflow peak temperature (260° C) exigences
- Conductivité thermique: 0.3~0.4 W/m·K, relatively poor heat dissipation capability. High-power boards require thermal vias, cuivre épais, or aluminum substrates for assistance
2.3. Mechanical and processing properties
- Flexural strength: 400~600 MPa, resistant to deformation and vibration, suitable for automotive and outdoor industrial equipment
- Water absorption: only 0.1%~0.2%, minimal degradation of insulation in humid environments
- Strong processing compatibility: supports drilling, laser microvias, laminage, gravure, Accepter, HASL and full manufacturing processes; 2~30 layer multilayer boards can be produced
2.4. Chemical and safety properties
- UL94V-0 ignifuge
- Resistant to weak acids, weak alkalis, and flux corrosion
- Conventional brominated FR4 has lower cost; halogen-free FR4 is used for new energy and medical environmental compliance requirements
3. FR4 Three Tg Grades: TG130 / TG150 / TG170 Full Comparison
Industry standard classification: Standard Tg (TG130), Mid Tg (TG150), Tg élevée (TG170). The core differences lie in thermal resistance, dilatation thermique, multilayer capability, et coûter.
Tableau
| Paramètre | FR4 TG130 (Standard Tg) | FR4 TG150 (Mid Tg) | FR4 TG170 (Tg élevée) |
|---|---|---|---|
| Actual Tg range | 125~135°C | 145~160°C | ≥170°C (170~180°C) |
| CTE sur l'axe Z (above Tg) | 60~80 ppm/°C | 40~50 ppm/°C | <30~40 ppm/°C |
| Reflow cycles | 1~2 (leaded soldering) | 2~3 (basic lead-free) | ≥4 (multiple rework, lamination cycles) |
| Suitable PCB layers | 2~8 layers simple boards | 4~12 layers general multilayer | 8~30 layers high-layer / HDI microvia boards |
| High temperature deformation risk | Haut, prone to warping | Moyen | Très faible |
| Cost premium | Référence (lowest) | +10%~15% | +18%~25% |
| Main drawback | Fails in lead-free process | Insufficient long-term 120°C+ stability | Higher material and process cost |
Detailed grade breakdown
1. FR4 TG130 Standard FR4
The most basic general-purpose substrate, with the largest market share, fastest lead time, and highest cost performance.
- Thermal limitation: above 130°C resin softens rapidly, high Z-axis expansion
- Only suitable for traditional leaded soldering (peak 230°C)
- Not suitable for multiple rework, high-layer boards, or long-term high-temperature operation
- Lead-free reflow easily causes via cracking and delamination
2. FR4 TG150 Mid Tg balanced substrate
Currently the mainstream choice for consumer electronics and IoT devices, balancing cost and thermal reliability.
- Performance improvement: Tg increased by ~20°C, significantly reduced Z-axis expansion
- Stable for lead-free reflow (255~260°C peak)
- Suitable for limited rework and 4~10 layer multilayer boards
- Ideal for ESP32, LoRa modules, Wi-Fi routers, smart home PCBs
- Limitation: long-term operation above 125°C still risks aging and delamination
3. FR4 TG170 High Tg high reliability substrate
Industrial-grade high-temperature laminate defined by IPC. High cross-link density resin provides excellent thermal stability, widely used in new energy and automotive electronics.
- Core advantage: maintains rigidity below 170°C, excellente stabilité dimensionnelle
- Low Z-axis expansion, supports multiple reflow cycles and thermal shock resistance
- T288 delamination time >15 min
- Reliable for HDI microvias and fine-pitch BGA soldering without warpage
- Suitable for high-layer boards, thick copper power boards, and harsh thermal environments
- Meets IATF16949 automotive and military-grade reliability requirements
4. FR4 vs Other Common PCB Materials (Key Selection Reference)
In actual Conception de PCB, FR4 is not the only option. Différents scénarios d'application (haute fréquence, dissipation de chaleur, flexibilité, haute fiabilité) require different substrates.
4.1. FR4 vs Rogers high-frequency materials (RO4003 / RO4350)
| Article | FR4 | Rogers |
|---|---|---|
| Dielectric constant Dk | 4.2~4.7 (unstable) | 2.2~3.5 (écurie) |
| Loss factor Df | ≤0.02 | 0.001~0.004 |
| High frequency performance | Significant loss above 1GHz | Suitable for 10GHz~100GHz |
| Coût | Faible | Haut (3~10×) |
| Application | Electronique générale | 5G, radar, RF antennas |
Conclusion: FR4 is suitable for low/mid-frequency circuits; Rogers is used for RF and microwave applications.
4.2. FR4 vs CEM-1 / CEM-3 (low-cost boards)
| Article | FR4 | CEM-1 / CEM-3 |
|---|---|---|
| Substrat | Glass epoxy | Paper + glass composite |
| Force | Haut | Medium-low |
| Layer capability | 2~30 layers | Single/double layer |
| Coût | Moyen | Inférieur |
| Thermal resistance | Good | Poor |
Conclusion: CEM materials are used for low-end electronics (jouets, Lumières LED); FR4 is industrial-grade mainstream.
4.3. FR4 vs Polyimide (PI)
| Article | FR4 | PI |
|---|---|---|
| Flexibilité | Rigide | Flexible |
| Temperature resistance | ≤170°C (Tg élevée) | 200~400°C |
| Application | PCB rigide | Flexible circuits (FPC) |
| Coût | Low–medium | Haut |
Conclusion: FR4 is for rigid structures; PI is for flexible circuits or extreme high-temperature environments.
4.4. FR4 vs Aluminum substrate (MCPCCB)
| Article | FR4 | PCB en aluminium |
|---|---|---|
| Conductivité thermique | 0.3~0.4 W/m·K | 1~10 W/m·K |
| Dissipation thermique | Weak | Strong |
| Application | Signal/control boards | LED power, high-power drivers |
| Coût | Faible | Moyen |
Conclusion: FR4 is for signal boards; aluminum substrates are for high-power heat-generating devices.
5. Application Guidelines by Tg Grade
5.1. TG130 applications (low-cost room temperature devices)
- Low-end toy PCBs
- Simple power adapters
- Door control switch boards
- Prototype boards, student labs
- Simple LED controller boards
Restrictions: not allowed for lead-free, multicouche, or high-temperature environments.
5.2. TG150 applications (électronique grand public / IoT mainstream)
Used in about 80% of consumer smart devices:
- IoT: ESP32 boards, LoRaWAN nodes, Wi-Fi/Bluetooth sensors
- Maison intelligente: smart plugs, caméras, routeurs, capteurs
- Électronique grand public: Bluetooth earphones, power banks, set-top boxes
- Light industrial: PLC modules, capteurs, small inverters
5.3. TG170 applications (haute fiabilité / automobile / industriel)
(1) Électronique automobile (mandatory high Tg)
- ECU engine controllers
- EV battery BMS
- Vehicle DC-DC power boards
- Systèmes ADAS, tableaux de bord, capteurs (-40°C ~ 125°C cycles)
(2) Automatisation industrielle & systèmes électriques
- Onduleurs, servo drives
- Furnace controllers
- Solar inverters, 5Bornes de base G
- Thick copper high-power multilayer boards
(3) High-end communication & Cartes HDI
- 8+ layer high-speed signal boards
- HDI microvia boards
- Server control boards
- BGA precision boards
(4) New energy, médical, aerospace low-mid systems
- Energy storage systems
- Medical instruments
- Aerospace control boards
6. PCB Engineer FR4 Tg Selection Pitfall Guide
Lead-free reflow soldering must not use TG130:
The peak temperature of lead-free reflow soldering (260° C) is far above the Tg of 130°C. En production de masse, this will cause large-scale board bursting and scrap failures. For limited budgets, TG150 should be prioritized; for high-temperature conditions, TG170 should be used directly.
Nombre de couches > 8 must use TG170:
Multilayer boards undergo multiple lamination cycles and repeated high-temperature processes. Low Tg materials have large interlayer stress differences and are prone to delamination.
Automotive and outdoor sealed devices require minimum TG170:
Environmental temperature fluctuations are large. Low Tg materials may suffer via cracking and circuit open failures after long-term aging.
LoRaWAN / ESP32 IoT terminals generally use TG150:
For indoor constant-temperature environments and 2–4 layer boards, TG150 balances cost and soldering yield. Outdoor solar-powered LoRa data acquisition boards should be upgraded to TG170.
Cost optimization logic:
Non-high-temperature consumer products should use TG150 and avoid blindly upgrading to TG170 to increase material cost. Automotive-grade, électronique de puissance, and multilayer projects must not downgrade material selection to save cost.
7. Limitations of FR4
Although FR4 is widely used, it is not a universal material and has clear limitations in certain scenarios:
Haute fréquence / high-speed application limitations:
FR4 has relatively high and unstable dielectric constant and relatively large loss tangent. In GHz-level high-frequency signal transmission, signal attenuation is severe. High-speed signals above 10Gbps typically require low-loss substrate materials instead.
Limited heat dissipation capability:
The thermal conductivity of FR4 is only about 0.25 W/m·K, making it insufficient for high-power device heat dissipation requirements.
Long-term high-temperature reliability:
Although high-Tg FR4 improves thermal resistance, FR4 is still an organic material. In extreme high-temperature environments, its long-term reliability is inferior to ceramic substrates or polyimide materials.
8. FR4 PCB Cost and Pricing Influence Factor Analysis
Although FR4 is a standardized PCB material, its price is affected by multiple factors. Different Tg grades and structural designs lead to significant cost differences.
8.1. Price range of different FR4 Tg grades
(Based on common industry 2–4 layer PCBs)
| Material grade | Relative price | Cost characteristics |
|---|---|---|
| TG130 | Référence (lowest) | Simple process, mature material |
| TG150 | +10% ~ +15% | Mainstream consumer electronics standard |
| TG170 | +18% ~ +30% | Haute fiabilité, high-temperature resin system |
Note:
The higher the Tg, the more complex the resin system, the narrower the lamination process window, and the higher the yield control cost.
8.2. Key factors affecting FR4 PCB cost
(1) Tg grade
Tg is one of the core cost drivers:
Higher Tg → higher resin cross-link density → increased material cost
En même temps, higher lamination temperature → increased manufacturing cost
(2) Épaisseur du cuivre (Poids du cuivre)
Common specifications:
- 0.5 oz (low-cost signal boards)
- 1 oz (standard mainstream)
- 2 oz / 3 oz (power boards)
Plus le cuivre est épais:
- Coût plus élevé
- More difficult etching
- Better thermal dissipation capability
(3) Nombre de couches
| Nombre de couches | Cost impact |
|---|---|
| 2 couches | Référence |
| 4 couches | +30% ~ +50% |
| 6–8 couches | +80% ~ +150% |
| 10+ couches | Exponential increase |
Reasons:
- More layers → more lamination cycles
- Higher alignment precision required
- Increased defect rate
(4) Via technology (HDI / micro-vias)
- Standard through-hole: faible coût
- Buried/blind vias: medium to high cost
- HDI laser microvias: high cost (+30% ~ +100%)
(5) Surface finish process
| Processus | Coût | Application |
|---|---|---|
| Saigner (nivellement de soudure à air chaud) | Faible | General boards |
| Accepter (Or d'immersion nickel électrolaire) | Medium–high | BGA / haute fiabilité |
| OSP | Faible | One-time assembly |
8.3. FR4 PCB cost structure breakdown
Typique Coût des PCB composition:
- Material cost (FR4 + feuille de cuivre): 30% ~ 50%
- Fabrication (forage / gravure / laminage): 30% ~ 40%
- Surface finishing: 10% ~ 20%
- Testing and yield loss: 5% ~ 15%
8.4. Cost optimization selection recommendations
- Non-high-temperature products → prioritize TG150 (best cost-performance ratio)
- Do not blindly choose TG170 (unless automotive / industrial requirement)
- Low-cost consumer electronics → TG130 + 1 oz copper is sufficient
- Haute fréquence / high-speed signals → do NOT try to save cost using FR4 (losses will be greater)
9. Résumé
As the “main substrate” of the PCB industry, FR4 occupies an irreplaceable position in consumer electronics, contrôle industriel, électronique automobile, and communication equipment due to its excellent comprehensive performance, mature manufacturing process, and good cost efficiency.
The Tg value is the core parameter for FR4 classification, directly determining thermal resistance, stabilité dimensionnelle, et la fiabilité. Understanding the differences and application scenarios of TG130, TG150, and TG170 is fundamental knowledge for every PCB engineer.
FAQ
T1: Is higher FR4 Tg always better?
UN: Non. Higher Tg increases material procurement cost. TG150 is sufficient for standard indoor consumer electronics; only high-temperature, multicouche, and automotive applications require TG170. Blindly selecting high Tg increases unnecessary cost.
T2: Should ESP32 LoRaWAN gateway PCBs use TG150 or TG170?
UN: Indoor constant-temperature gateways should use TG150. Outdoor solar-powered, sealed metal enclosure, poor heat dissipation, or long-term sun-exposed LoRa acquisition nodes should use TG170 FR4.
T3: Can TG130 be used for lead-free soldering?
UN: Not recommended. Lead-free reflow peak temperature (260° C) is far above 130°C glass transition temperature. Under high temperature, Z-axis expansion is severe, and mass production defect rate (délaminage, board bursting) exceeds 30%.
T4: What are the main advantages of high-Tg FR4 (TG170) compared to standard materials?
UN: Lower Z-axis thermal expansion coefficient, higher thermal resistance threshold, ability to withstand multiple reflow cycles, improved resistance to thermal cycling warpage and delamination, and significantly improved HDI and BGA soldering reliability. It is suitable for harsh industrial and automotive environments.
Q5: How to choose between FR4, substrat en aluminium, et polyimide (PI)?
UN: FR4 is used for general signal and low-to-medium power circuits; aluminum substrates are used for high-power LED and heat-intensive power boards; PI materials are used for flexible circuits and ultra-high-temperature military-grade applications.
