Haut 8 PCB manufacturing and assembly factory in European 2023 années
Europe has always been an important territory in the PCB marker. It has a huge customer group and has always been a head consumer group in the high -end PCB field. There are also many Fabricants de PCB in Europe. This article will introduce the well -known PCB manufacturers in Europe. If you are looking for a Fabricant de PCB, you will be helpful to you after reading the article.
1、Leadsintec PCB Factory
This is a PCB manufacturer from China,Couvre l'usine de la zone de 8000 mètres carrés, à cause de 10 lignes de production, dont là 5 Ligne de production SMD à machine Juki à grande vitesse, 2 à travers le trou et 3 chaîne de montage.
Totalement il y a à propos 380 employees in our factory. Parmi eux, 18 engineers who have rich experience in PCB and PCBA industrie, 32QA qui inspectera chaque processus de production strictement, 5 PMC pour garantir la bonne quantité et la qualité des matériaux entrants ainsi que ce temps de production est maintenu à un niveau optimal, 6 Acheteur pour acheter et suivre les bons de commande pour s'assurer que le vendeur respecte l'accord d'achat à la livraison.
LeadSintec Fabrication de PCB Capability
Traitement de la surface | HASL / Plating gold / immersion gold / Plating gold finger /OSP / Flux |
Couches | 1~ 32 couches |
Épaisseur de cuivre | O.5oz ~ 5oz |
Épaisseur de planche | 0.2mm ~ 6,0 mm |
Taille du trou min | 0.2MM |
Largeur de ligne min | 0.1MM |
Espacement des lignes min | 0.1MM |
Max Board Size | 508mm * 609 mm |
Solder Mask Type | Green / Black / Red / Yellow / Blanc / Blue |
Silkscreen Color | White/ Yellow/ Black |
Data File Format | Fichier Gerber et fichier de forage correspondant, Série Protel, Liste naissé |
Base Material | FR4, CEM3, Ptfe, En aluminium, High Tg FR4, Carte haute fréquence, Rogers |
2、AT&S
AT&S is one of the leading PCB manufacturers in Europe, producing high-end prototypes in various fields such as medicine, aviation, and measurement technology. As global Substrat IC manufacturers for PCBs in Europe, AT&S produces semiconductor substrates for cameras, phones, computers, and portable music players. AT&S has more than 35 years of experience in the industry and is a trusted supplier for many leading companies.
PCB Manufacturing Capabilities
Standard Capability | Advanced Capability | |
Minimum Layer Count | 1 | 1 |
Maximum Layer Count | 16 | 30 |
Trace/Space | 0.006″ | 0.002″ |
Finished Hole Size | 0.010″ | 0.004″ |
Surface Finishes | HASL, Accepter, Hard Gold, Soft Gold (see all below) | ENEPIG, OSP, EPIG (see all below) |
Materials | FR-4, High Temp FR-4, Isola, Rogers | PTFE/Duroid, Polyimide, Flex |
Impédance contrôlée | +/- 10% | +/- 5% |
Annular Ring | 0.006″ | 0.003″ Mechanical, 0.001″ Laser |
Outer Layers Finished Copper | 1.5 oz to 2 oz | 1 oz to 5 oz |
Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 4 oz |
Soldermask Colors | Green, Black, Blue, Red, Blanc, Clear, Custom | Yellow, Custom |
Silkscreen Colors | Green, Black, Blue, Red, Blanc, Clear, Custom | Yellow, Custom |
Filled Vias | Non-Conductive Fill | Non-Conductive Fill or Conductive Fill |
Smallest Mechanical Drill Diameter | 0.010″ | 0.004″ |
Smallest Laser Drill Diameter | N/A | 0.003″ |
Vias aveugles | No | Yes |
Vias enterrés | No | Yes |
Aspect Ratio | 10:01 | 15:01 |
Plated Hole to Copper | 0.008″ | 0.005″ |
Clearance – Copper to Edge of Board | Outer Layer – 0.010″ | Outer Layer – 0.005″ |
Inner Layer – 0.015″ | Inner Layer – 0.005″ | |
Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
Plated Slots | Routed | Routed or Nibbled |
Non-Plated Slots | Routed | Routed or Nibbled |
Plating in Holes | 0.0008″ | 0.0015″ |
Web (or Mask Width) | 0.006″ | 0.003″ |
Soldermask Swell | 0.003″ | 0.001″ |
Silkscreen Width | 0.003″ | 0.003″ |
Inspection & Testing Criteria | ||
IPC Class 2 | Yes | Yes |
IPC Class 3 | No | Yes |
Netlist Generation and Netlist Compare | Yes | Yes |
Trace / Space | ||
Outer Layers (finished copper) | 1 oz. Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .002″ Trace/Space |
2 oz. Cu – Min .008″ Trace/Space | 2 oz. Cu – Min .006″ Trace/Space | |
3 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .008″ Trace/Space | |
4 oz. Cu – Min .014″ Trace/Space | 4 oz. Cu – Min .012″ Trace/Space | |
Inner Layers | ||
0.3 oz Cu – Min .002″ Trace/Space | 0.5 oz Cu – Min .003″ Trace/Space | |
0.5 oz Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .005″ Trace/Space | |
1 oz. Cu – Min .006″ Trace/Space | 2 oz. Cu – Min .008″ Trace/Space | |
2 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .0012″ Trace/Space | |
Drilling | ||
Min drilled diameter, final board thickness 0.031″ or less | 0.008″ | 0.004″ |
Min drilled diameter, final board thickness between 0.031″ and 0.062″ | 0.010″ | 0.006″ |
Min drilled diameter, final board thickness between 0.062″ and 0.093″ | 0.012″ | 0.010″ |
Min drilled diameter, final board thickness between 0.093″ and 0.125″ | 0.015″ | 0.012″ |
Min laser diameter, dielectric thickness less than or equal to 0.004″ | N/A | 0.003″ |
Min laser diameter, dielectric thickness between 0.004″ and 0.005″ | N/A | 0.004″ |
Min laser diameter, dielectric thickness between 0.005″ and 0.007″ | N/A | 0.005″ |
Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
Pre-drilled core blind vias | No | Yes |
Sub-lamination blind vias | No | Yes |
Build-up technology | No | Up to 4-N-4, Any layer |
Buried vias | No | Yes |
Filled vias | Non-Conductive fill | Non-Conductive or Conductive fill |
Nibbling | No | Yes |
Largest hole | 0.247″ plated, 0.250″ non-plated | No maximum |
Slots | Plated or non-plated, routed | Plated or non-plated, routed or nibbled |
Plating in holes | 0.0008″ | 0.0015″ |
Plated hole to copper | 0.008″ | 0.005″ |
Surface Finish | ||
Hot Air Solder Level (HASL – Lead) | Yes | Yes |
Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
Electroless Nickel Immersion Gold (Accepter) | Yes | Yes |
Immersion Silver | Yes | Yes |
Hard Gold Fingers with ENIG | Yes | Yes |
Hard Gold Fingers with HASL | Yes | Yes |
Electrolytic Soft Gold | Yes | Yes |
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
Organic Surface Protectant (OSP) | Yes | Yes |
Bare Copper | Yes | Yes |
Electroless Palladium Immersion Gold (EPIG) | No | Yes |
Tin Nickel | No | Yes |
White Tin | Yes | Yes |
Carbon Ink | No | Yes |
Soldermask | ||
Colors | Green, Black, Blue, Red, Blanc, Clear, Custom | Yellow, Custom |
Finish/Texture | Semi-gloss, Matte | Semi-gloss, Matte |
Tented Vias | Yes | Yes |
Soldermask Plugged Vias | Yes | Yes |
Soldermask Thickness over Copper | 5 micron to 25 micron | 5 micron to 25 micron |
Soldermask Web | 5 mil | 3 mil |
Soldermask Gap to Pad | 4 mil | 2 mil |
Copper Ring Under Mask-Defined Pad | 3 mil | 1 mil |
Peelable Soldermask | No | Yes |
LPI Soldermask | Yes | Yes |
Dry Film Soldermask | No | Yes |
Silkscreen | ||
Colors | Green, Black, Blue, Red, Blanc, Clear, Custom | Yellow, Custom |
Minimum Legend Width | 3 mil | 3 mil |
Space between Silkscreen and Pad | 5 mil | 4 mil |
Impédance contrôlée | ||
Couches | 0-10 Couches | 0-30 Couches |
Impedance Tolerance | Single-ended +/- 10% | Single-ended +/- 5% |
Impedance Tolerance | Differential Pairs +/- 10% | Differential Pairs +/- 5% |
Impedance Tolerance | Coplanar Waveguide +/- 10% | Coplanar Waveguide +/- 5% |
TDR Testing | Yes, Included | Yes, Included |
Épaisseur de planche | ||
1-Layer or 2-Layer | Min .015″ | Max .200″ | Min .008″ | Max .250″ |
4-Layer | Min .020″ | Max .200″ | Min .015″ | Max .250″ |
6-Layer | Min .031″ | Max .200″ | Min .025″ | Max .250″ |
8-Layer | Min .047″ | Max .200″ | Min .031″ | Max .250″ |
10-Layer | Min .062″ | Max .200″ | Min .040″ | Max .250″ |
12-Layer | Min .062″ | Max .200″ | Min .047″ | Max .250″ |
14-Layer | Min .062″ | Max .200″ | Min .054″ | Max .250″ |
16-Layer | Min .062″ | Max .200″ | Min .062″ | Max .250″ |
CNC / Routing / Score / Mechanical Rules | ||
Router Bit Size | 0.078″ | Min 0.021″, Max. 0.078″ |
Spacing for Tab Rout Array | 0.100″ | |
Standard V- Score Angle | 30° | 20°, 30°, 45°, 60° |
V-Score Depth | One third of board thickness (min 0.010″) | |
Jump Score | No | Yes, overshoot up to 0.35″ |
Scoring Direction | Vertical and Horizontal | Routed Scoring |
Bevel Angle | 20, 30, 45, ou 60 Degree Gold Finger Bevel | Milling/Offset or Recessed Beveling |
Countersinks | 60, 82, 90, 100 Degree Countersink ** | 60, 82, 90, 100 Degree Countersink ** |
Counterbores | Yes | Yes |
Edge Castellations | No | Castellated Edges Min .040″ |
Plated Edges | No | Yes |
Cross Section | Level 1 | Level 1, Level 2, Level 3 |
3、Elvia PCB
Elvia PCB Group (Cartes de circuits imprimés) whose headquarters are located in Coutances (Normandy, France) is one of the European leaders in the Aerospace, Defence and Railway sectors. The group has five production facilities, each with a specific area of expertise and market position. It has a turnover of close to 50 million euros and 430 employés.
Elvia ’s PCB Manufacturing Capabilities
Technical index | Mass Batch | Small batch | Sample | |||
Base Material | FR4 | Normal Tg | Shengyi S1141, KB6160,Huazhen H140(not suitable for lead free process ) | |||
Middle Tg | For HDI, multi layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662; | |||||
High Tg | For thick copper、high layer:SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA:FR408R; 370HEURE; TU-752; | |||||
Halogen Free | Middle Tg :SY S1150G、HuazhengH150HF、H160HF;high Tg: SY S1165 | |||||
High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A; | |||||
High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | |||||
High Speed | SY S7439;TU-862HF、TU-872SLK;ISOLA:I-Speed、I-Tera@MT40;Huazheng:H175、H180、H380 | |||||
Flex Material | Base | Glue-free:Dupont AK XingyangW-type, Panosonic RF-775; | ||||
Coverlay | SY SF305C、Xingyang Q-type | |||||
Special PP | No flow PP: VT-447LF,Taiguang 370BL Arlon 49N | |||||
Ceramic filled adhesive sheet: Rogers4450F | ||||||
PTFE adhesive sheet: Arlon6700、Taconic FR-27/FR-28 | ||||||
Double-sided coatingPI: xingyang N-1010TF-mb | ||||||
Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | |||||
Special | High heat resistance rigidity PI: Tenghui VT-901、Arlon 85N,SY S260(Tg250) | |||||
High thermal conductivity material:92Ml | ||||||
Pure ceramic material:alumina ceramic、Aluminum nitride ceramics | ||||||
BT material: Taiwan Nanya NGP-200WT | ||||||
Couches | FR4 | 24 | 36 | 64 | ||
Rigid&Flex /(Flex) | 16(12) | 20(12) | 24(16) | |||
High Frequency Mixed Lamination | 12 | 18 | 24 | |||
100% Ptfe | 4 | 12 | 18 | |||
HDI | 2 steps | 3 steps | 4 steps | |||
Delivery Size | Max(MM) | 460*560 | 460*560 | 550*900 | ||
(MM) | Min(MM) | 20*20 | 10*10 | 5*10 | ||
Width / Gap | Inner(mil) | 0.5OZ base copper: 3/3 1.0OZ base copper: 4/4 2.0OZ base copper: 5/6 | ||||
3.0OZ base copper: 7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15 | ||||||
6.0OZ base copper: 12/18 10 OZ base copper: 18/24 12 OZ base copper: 20/28 | ||||||
Outer(mil) | 1/3OZ base copper: 3/3 0.5OZ base copper: 4/4 1.0OZ base copper: 5/5 | |||||
2.0OZ base copper: 6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13 | ||||||
5.0OZ base copper: 10/16 6.0OZ base copper: 12/18 10 OZ base copper: 18/24 | ||||||
12 OZ base copper: 20/28 15 OZ base copper: 24/32 | ||||||
Line Width Tolerance | >5.0 mil | ±20% | ±20% | ±1.0mil | ||
≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |||
Épaisseur de cuivre | Inner layer(OZ) | 4 | 6 | 12 | ||
Out layer(OZ) | 4 | 6 | 15 | |||
Board thickness(mm) | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | |||
Final Board Thickness | >1.0 mm | ±10% | ±8% | ±8% | ||
≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
Board thickness/drill bit | 10:01 | 12:01 | 13:01 | |||
Contour | Bevel edge | 20~60 degree;±5degree | ||||
Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% |
4、NCAB Group
NCAB Group is one of the fastest growing PCB producers, whose focus has from the start, been on customer & market presence. The timeline traces our journey from PCB trader to Integrated PCB Producer.
NCAB Group ’s PCB Manufacturing Capabilities
No. | Item | Manufacturing Capabilities |
1 | Material | FR-4 (Fiberglass) |
2 | Number of Layers | 1 Layer, 2 Couches, 4 Couches, 6 Layer, 8 Couches, |
10 Couches | ||
3 | TG Grade | TG130~140, TG150~160, TG170~180 |
4 | Max PCB Size | 1 couche & 2 couches: 1200*300mm or 600*500mm |
Multi-layers: 600*500MM | ||
5 | Min PCB Size | 5mm*5mm |
6 | Board Size Tolerance(Outline) | ±0.2mm(CNC routing) |
±0.5mm(V-scoring) | ||
7 | Surface Finish | HASL with lead, HASL lead free, Immersion gold(Accepter), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None |
8 | Épaisseur de planche | 1 Layer/2 Layers: 0.2~2.4mm |
4 Couches: 0.4~2.4mm | ||
6 Couches: 0.8~2.4mm | ||
8 Couches: 1.0~2.4mm | ||
10 Couches: 1.2~2.4mm | ||
Note: Customized PCB thickness and Layer stackup are acceptable. | ||
9 | Board Thickness Tolerance | Thickness≥1.0mm: ±10% |
Thickness<1.0MM: ±0.1mm | ||
Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. | ||
10 | Outer Layer Copper Thickness | 1oz/2oz/3oz |
(35μm/70μm/105μm) | ||
Note: | ||
2oz | ||
PCB thickness≥1.2mm, | ||
Via size≥0.25mm, | ||
Min Track/Spacing≥0.15mm | ||
3oz | ||
PCB thickness≥2.0mm, | ||
Via size≥0.3mm, | ||
Min Track/Spacing≥0.2mm | ||
11 | Inner Layer Copper Thickness | 1oz/1.5oz |
(35μm/50μm) | ||
12 | Outer layer Min track/spacing | ≥3mil |
13 | Inner layer Min track/spacing | ≥4mil |
14 | Annual ring size | ≥0.13mm |
15 | Grid Line track/spacing | ≥0.2mm |
16 | Coil board Line track/spacing | ≥0.2mm |
17 | BGA pad size | ≥0.2mm |
18 | BGA Distance | ≥0.12mm |
19 | Board Outlines | Track to Outline: ≥0.3mm |
Trace to V-cut line: ≥0.4mm | ||
20 | Finished Hole Size Tolerance | ±0.08mm |
21 | Finished Hole Diameter(CNC) | 0.2mm~6.3mm |
1. PCB Thickness=2.0mm, Min | ||
hole size is 0.3mm | ||
2. PCB Thickness=2.4mm, Min | ||
hole size is 0.4mm | ||
3. Copper Thickness=2OZ, Min | ||
hole size is 0.25mm | ||
4. Copper Thickness=3OZ, Min | ||
hole size is 0.3mm | ||
22 | TH Via Distance | Equipotential: 0.15MM |
Isoelectric: 0.25MM | ||
23 | Plated Slot Size | ≥0.5mm |
Note: | ||
L:W=2.5: 1 (Should be 2.5:1 ou | ||
higher. If it is less than this, the holes may be misaligned.) If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Aussi, it is okay to draw the oblong hole in Profile Layer instead of Drilling Layer. | ||
24 | Castellated Holes | ≥0.6mm |
25 | Non-Plated Holes | ≥0.8mm |
26 | NPTH to Copper Line | ≥0.2mm |
27 | Soldermask | Green, Red, Yellow, Blanc, Black, Blue, Purple, Matte Green,Matte Black,None |
28 | Soldermask Thickness | 20~30um |
29 | Soldermask Bridge | Green: ≥0.1mm |
Others: ≥0.15mm | ||
30 | Soldermask to soldering pad distance | ≥0.05mm |
31 | Silkscreen | Blanc, Black, Yellow, None |
32 | Minimum Character Width(Legend) | ≥0.15mm |
Note: Characters of less than 0.15mm wide will be too narrow to be identifiable. | ||
33 | Minimum Character Height (Legend) | ≥0.75mm |
Note: Characters of less than 0.8mm high will be too small to be recognizable. | ||
34 | Character Width to Height Ratio (Legend) | 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio) |
35 | Silkscreen to Soldermask Distance | ≥0.1mm |
36 | V-cut Line | ≥75mm |
Note: | ||
PCB thickness≥0.6mm | ||
Details refer to right side | ||
picture | ||
37 | V-cut Line Distance | ≥3.5mm |
38 | Distance betwen Board to Board | ≥0.8mm |
39 | Stamp-hole Width | ≥2.0mm |
Note: PCB size and thickness are subject to review by PCBGOGO. |
5、KSG PCB
KSG GmbH is one of the Printed Circuit Board market leaders in Europe with a strong focus on technology and innovation. The company has two plants, one located in Gornsdorf, Germany and another in Austria. All products are manufactured exclusively within Europe to ensure the highest quality for their international customer base. At KSG, forward-looking technologies are developed from samples to large-scale production . They strive to continually be at the forefront RF solutions as well as high-current and thermal management issues that may arise.
KSG PCB ’s PCB Manufacturing Capabilities
ITEM | TECHNICAL PARAMETER |
LAYERS | 1-60 |
Max.Board Size | 680mm×1000mm |
Épaisseur de planche | 0.25-6.0mm 10mil-152.4mil |
Min. Line Width | 0.075mm 3mil |
Min Space | 0.075mm 3mil |
Min Hole Size(Mechanical) | 0.2mm 8mil |
Min Hole Size (Laser) | 0.10mm 4mil |
PTH Wall Thickness | >0.025mm 1mil |
PTH Hole Dia Tolerance | ±0.076mm 3mil |
Non PTH Hole Dia Tolerance | ±0.05mm 2mil |
Hole Position Deviation | ±0.05mm 2mil |
Outline Tolerance | ±0.13mm 3mil |
V-cut | 30°/45°/60° |
Impedance Control | +/- 7% |
Fire Resistance | 94V0 |
Max copper weight(inner) | 6 oz |
Peel-off Strength | 1.4N/mm |
Soldermask Abrasion | >7H |
Solderability Test | 260℃20 second |
Flammability | 94v0 |
E-test Voltage | 50-300v |
Bow/Twist | ≤0.75% |
6、JLCPCB Factory
Fondé dans 2006, JLCPCB has been at the forefront of the PCB industry. With over 15-year continuous innovation and improvement based on customers’ need, we have been growing fast, and becoming a leading global PCB manufacturer, who provides the rapid production of high-reliability and cost-effective PCBs and creates the best customer experience in the industry.
JLCPCB ’s PCB Manufacturing Capabilities
Caractéristiques | Capability | Notes |
Layer count | 1,2,4,6 couches | The number of copper layers in the board. |
Impédance contrôlée | 4/6 couche, default layer stack-up | Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator |
Material | FR-4 | FR-4 Standard Tg 130-140/ Tg 155 |
Dielectric constant | 4.5(double-side PCB) | 7628 structure 4.6 |
2313 structure 4.05 | ||
2116 structure 4.25 | ||
Max. Dimension | 400x500mm | The maximum dimension JLCPCB can accept |
Dimension Tolerance | ±0.2mm | ±0.2mm for CNC routing, and ±0.4mm for V-scoring |
Épaisseur de planche | 0.4/0.6/0.8/1.0/1.2/1.6/2.0MM | The thickness of finished board. |
Thickness Tolerance | ± 10% | par exemple. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%) |
( Thickness≥1.0mm) | ||
Thickness Tolerance | ± 0.1mm | par exemple. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1). |
( Thickness<1.0MM) | ||
Finished Outer Layer Copper | 1 oz/2 oz (35um/75um) | Finished copper weight of outer layer is 1oz or 2oz. |
Finished Inner Layer Copper | 0.5 oz (17um) | Finished copper weight of inner layer is 0.5oz only. |
7、PCBWay Factory
With more than a decade in the field of Prototype PCB and fabrication, we are committed to meeting the needs of our customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requests. As one of the most experienced PCB manufacturers in China, Can provide customers with various types of PCB manufacturing services.
PCBWay ’s PCB Manufacturing Capabilities
Items | Spec. | |
Number of Layers | General PCB board | 2-40 |
Buried IC | yes | |
HDI(buried and blind vias) | HDI(5+N+5) | |
staggered and stacked vias | ||
Materials | FR4(shengyi) | yes |
High Tg | Tg-220 | |
EHalongen Free | yes | |
High Frequency | yes | |
Maximum board size | 20*35inch(508*889MM) | |
Board thickness | 0.21-6.0MM | |
Minimum track line | 2mil-inner 2mil-outer | |
Minimum Spacing line | 2mil-inner 2mil-outer | |
Outer layer copper thickness | 7oz | |
Inner layer copper thickness | 7oz | |
Min. finished hole size(Mechanical) | 0.15MM | yes |
Min. finished hole size(laser hole) | 0.076MM | yes |
Aspect ratio | 12:01 | |
Solder Mask Types and brand | NAYA(LP_4G) | yes |
Tamura(TT19G) | yes | |
TAIYO(PSR2200) | yes | |
Solder Mask Color | green;blue;red;white;black | yes |
Impedance Control Tolerance | ±10%,50Ω and below:±5Ω | yes |
Plug via hole | Min.size can be plugged: | 0.1MM |
Max.size can be plugged: | 0.7MM | |
Min. annular ring can be kept | 3mil | |
Min. distance between the IC pads | 8mil | |
can keep SM bridge | ||
Min. SM bridge for green soldermask | 3mil | |
Min. SM bridge for black soldermask | 4mil | |
Traitement de surface | HASL | yes |
Accepter | yes | |
OSP | yes | |
LEAD FREE HASL | yes | |
GOLD PLATING | yes | |
IMMERSION Ag | yes | |
IMMERSION Sn | yes | |
V-Cut | CNC V-cut, degree | 20304560 |
V-cut by hand, degree | 20304560 | |
Outline Profile | CNC | |
Chamfer | The angle typeof the chamfer: | 203045 |
Min. distance of jumping chamfer: | 5MM | |
Tolerance of the dimension size | ±0.1mm | |
Tolerance of the board thickness | 0.21-1.0 | ±0.1 |
1.0-2.5 | ±7% | |
2.5-6.3 | ±6% | |
Tolerance of the finished hole size | 0-0.3MM | ±0.08mm |
0.31-0.8MM | ±0.08mm | |
0.81-1.60MM | ±0.05mm | |
1.61-2.49MM | ±0.75mm | |
2.5-6.0MM | +0.15/-1MM | |
>6.0MM | +0.3/-1MM | |
Certificates(copies are needed) | Ul | yes |
ISO9001 | yes | |
ISO14000 | yes | |
ROHS | yes | |
TS16949 | yes |
8、ICAPE Group
Since 1999, ICAPE Group has had longtime experience in the production and manufacturing of Printed Circuit Boards and Customized Technical Parts. 3000 customers in more than 70 countries trust the quality and service offered by the Group and remain recurring clients even now.
ICAPE Group ’s PCB Manufacturing Capabilities
Assemblage PCB Capabilities | |
Lead Time | 2 – 5 Days, 1 – 2 Weeks and Scheduled Deliveries |
Parts Procurement | Full Turnkey, Partial Turnkey and Kitted/Consigned |
Assembly Types | Surface Mount (Smt), Par trond, Mixed Technology (SMT/Thru-hole), Single and Double Sided SMT/PTH, Large Parts on Both Sides, BGA on Both Sides |
Board Type | Rigid Boards, Flex Boards and Rigid-Flex Boards |
Stencils | Laser Cut Stainless Steel and Nano-coating |
Components | Passive Components Smallest Size 01005, Fine Pitch Components Smallest Size 8 Mils Pitch, Leadless Chip Carriers/BGA, VFBGA, FPGA & DFN, Connectors and Terminals |
Largest PCB Size | 18” x 20” |
Smallest PCB Size | 1.2” large |
Largest QFP Size | 75 mm x 75 MM |
BGA Pitch Range | From 0.20 mm to 3 MM |
Smallest QFP Pitch Range | From 0.20 mm to 3 MM |
Component packaging | Reels, Cut tape, Tube and Loose Parts |
Inspection | X-ray Analysis, AOI and Microscope to 20X |
Solder Type | Leaded and Lead-free/RoHS Compliant |
Assembly surface mount connectors | Yes |
Wave Soldering | Yes |
PCB Finish | SMOBC/HASL, Electrolytic Gold, Electroless Gold, Electroless Silver, Immersion Gold, Immersion Tin and OSP |
Panelized PCB | Tab Routed, Breakaway Tabs, V-Scored and Routed + V-scored |
Design File Format | Gerber RS-274X, Eagle and AutoCAD’s DXF, DWG BOM (Sauvetage) and Pick and Place file (XYRS) |