High-Layer Impedance-Controlled PCBs | Cego & Buried Via PCBs | Circuit Boards for Servers, Controle industrial, and Medical Applications
15 Years of Expertise in High-Layer Manufatura de PCB | One-Stop Service for 24-Layer Prototipagem de PCB e produção em massa | Strict Control of Lamination Registration, Impedance Compliance, and Delamination-Free Quality
Get an Instant Quote for 24-Layer PCBs Today | Livre DFM Review and Design de PCB Análise
Our company specializes in the R&D, prototipagem, produção de lotes pequenos e médios, and large-scale manufacturing of high-layer PCBs ranging from 16 para 36 camadas. We focus on standardized production of 24-layer PCBs and have overcome six major industry challenges: multi-layer lamination misalignment, registration deviation, via copper cracking, dielectric inconsistency, impedance deviation, and board warpage.
The 24-layer PCB is a high-density interconnect (HDI) multilayer circuit board featuring high routing density, desempenho elétrico estável, strong EMI shielding, high integration capability, and strong computational load support. It is widely used as a core substrate in high-end industrial equipment, server computing systems, medical imaging devices, rail transit control systems, 5G communication base stations, e aeroespacial & eletrônica automotiva.
Unlike conventional low- and mid-layer PCBs, 24-layer PCBs undergo more than four sequential lamination cycles, blind and buried via alignment processes, inner-layer flow control design, and differential impedance management. They are designed to meet the requirements of miniaturization, alta integração, and high-frequency/high-speed circuit applications. We support customization with standard FR-4, high-TG materials, Rogers high-frequency laminates, and halogen-free substrates, ensuring long-term reliability under harsh industrial conditions.
| Parâmetro | Industry Standard Process | Our High-Precision Process |
|---|---|---|
| Material | Standard FR-4 TG130 | High-TG 170/180, Rogers, Shengyi/Nanya military-grade laminates, materiais sem halogênio |
| Finished Board Thickness | 2.4 ± 0.2 mm | 2.2–3.0 mm adjustable, tolerance ±0.08 mm |
| Minimum Trace/Space | 0.12 mm / 0.12 mm | 0.075 mm / 0.075 mm high-precision routing |
| Via Technology | Mechanical through-hole vias | Mechanical vias + 1st/2nd order blind & vias enterradas, laser microvias |
| Lamination Accuracy | Registration error ≤ 75 μm | Multi-layer registration error ≤ 35 μm, preventing layer misalignment short circuits |
| Tolerância de Impedância | ±10% | High-speed differential impedance control within ±5% |
| Acabamento superficial | Sangrar, lata de imersão | Concordar, Enepic, prata de imersão, Osp, anti-oxidation, thick gold plating |
| Confiabilidade | Standard reflow soldering | No delamination or blistering, 260°C thermal resistance test, UL/RoHS compliant |
We specialize in high-layer PCB production, focusing on solving critical manufacturing challenges of 24-layer circuit boards while delivering high reliability and consistency.
Optimized browning, laminação, and curing processes effectively release internal stress, preventing delamination and board blistering during high-temperature soldering. Final yield rate ≥ 98.5%.
Advanced fully automated optical alignment systems ensure precise layer stacking, guaranteeing reliability in ultra-dense routing and BGA areas.
Impedance modeling and full inspection for differential and signal traces ensure signal integrity and reduce crosstalk and attenuation.
Supports high-TG FR-4, Rogers high-frequency laminates, halogen-free and military-grade materials, ensuring long-term stability in high-speed, alta frequência, and harsh operating environments.
Supports prototyping, corridas piloto, and mass production. Standard lead time is 7–10 days, expedited delivery in 5 dias, with dedicated high-layer production lines ensuring consistency.
12-step quality inspection covering MI engineering to final testing. Free DFM review, process optimization support, and comprehensive after-sales service.
Featuring conventional multilayer lamination and plated through-hole (PTH) construction, this cost-effective solution is ideal for industrial control systems, power control boards, and other high-volume applications. It offers stable lead times and excellent cost efficiency for standardized mass production.
Designed with first-order and second-order blind/buried via structures, this HDI PCB reduces surface routing congestion, minimizes board size, and significantly increases routing density. It is widely used in server motherboards, AI computing backplanes, and advanced medical electronics.
Manufactured with high-frequency laminates and customized differential impedance control, this PCB provides excellent EMI resistance and minimal signal loss. It is ideal for 5G communication equipment, Módulos RF, and high-speed data transmission systems.
Available with 1 onças para 3 oz heavy copper inner layers, this design delivers higher current-carrying capacity and superior thermal performance. It is well suited for high-power industrial control equipment and railway power control applications.
Produced with halogen-free materials and environmentally friendly manufacturing processes, this PCB complies with international environmental standards, including RoHS requirements. It is commonly used in medical devices, eletrônica automotiva, and military-grade electronic systems for global markets.
Novos equipamentos de energia
Equipamento de comunicações por satélite
Equipamento médico
Equipamento industrial
Compared with lower-layer-count alternatives, a 24-layer PCB offers several significant advantages:
To maximize the success and reliability of a 24-layer PCB design, follow these proven best practices:
Customers provide Gerber files, Bom, fabrication requirements, stack-up information, and impedance specifications.
Our engineering team performs a comprehensive Design for Manufacturability (DFM) análise, evaluating stack-up structures, process feasibility, and potential design optimizations.
A detailed quotation is provided within 1 hora, including material selection, tempo de espera, surface finish options, and quality control requirements.
Stack-up Design → Inner Layer Imaging & Etching → Sequential Lamination → Drilling & Copper Plating → Circuit Formation → Surface Finishing
Vacuum moisture-proof packaging, secure global shipping, and dedicated post-delivery engineering support with quality assurance services.
This is a 24-layer IC test board that we custom-produced for our clients.
24-layer IC test board
Parâmetros do produto
| Item | Customer Requirement | Actual Result |
|---|---|---|
| Type | TG170 FR4 Halogen-Free | TG170 FR4 Halogen-Free |
| Espessura da placa | 4.750 ± 0.475 mm | 4.583–4.708 mm |
| Warp and Twist | ≤ 1% | 0.20% |
| Espessura de cobre (PTH) | ≥ 20 μm & Average ≥ 25 μm | #REF! |
| Espessura de cobre (Overall Surface Copper) | ≥ 29.3 μm | 0.00 mm |
| Acabamento superficial | Concordar + Selective Hard Gold Plating | Concordar + Selective Hard Gold Plating |
| Gold Thickness (Hard Gold Area) | ≥ 3 μm | 4.449 μm |
| Nickel Thickness (Hard Gold Area) | ≥ 0.05 μm | 0.055 μm |
| Gold Thickness (ENIG Area) | ≥ 0.762 μm | 0.896 μm |
| Nickel Thickness (ENIG Area) | / | / |
| Minimum Conductor Width | / | / |
| Minimum Spacing | CS 0.157–0.235 mm | 0.16 mm |
:4do 6º ao 6º andar, Xingyuan Technology Park, Estrada do Amanhecer, Gushu, Cidade de Xixiang, Distrito de Bao'an, Shenzhen, Província de Guangdong, China
:A3 区Área A3, Zona industrial de trégua de Phung Nenh (Nam Giang Industrial Park), Cidade de Viet Yen, Província de Bac Giang, Vietnã
WhatsApp：+86 15817390087
: +86-15817390087
: +86-755-23108895
: +86-755-29129721
: Victor Zhang
:sales@leadsintec.com
