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Qual é o processo de montagem da PCB?

05/05/2025 em /por

Como todos sabemos, placa de circuito impresso (PCB) é um componente essencial indispensável em dispositivos eletrônicos modernos, enquanto a montagem da placa de circuito impresso (PCBA) é o processo de montar componentes eletrônicos em PCBs e torná-los conectados ao circuito por meio de soldagem e outros processos. Neste artigo, apresentaremos os conceitos relacionados ao PCBA e o fluxo de processamento do PCBA.

O que é montagem de PCB?

PCBA, ou montagem de placa de circuito impresso, é uma parte importante do projeto de circuitos eletrônicos.
Não é apenas uma simples placa de circuito impresso (PCB), mas componentes eletrônicos (como componentes SMD SMT e componentes plug-in DIP) são montados na placa PCB e formados em um sistema de circuito completo por meio de soldagem e outros processos.
PCBA é amplamente utilizado em todos os tipos de produtos eletrônicos, como TVs, computadores, telefones celulares, eletrônica automotiva e equipamentos médicos, etc.. É um componente central indispensável para conexão elétrica e transmissão de sinal nesses dispositivos.

Componentes básicos de conjuntos de placas de circuito impresso

1. Componentes da estrutura básica

Substrato: Feito de material isolante (E.G.. Resina epóxi FR-4) que fornece suporte mecânico e isolamento elétrico.
Camada de chumbo e folha de cobre: folha de cobre gravada para formar uma rede de condutores para a transmissão de corrente e sinais.
Almofadas de solda e vias: As almofadas de solda são usadas para soldar pinos e vias de componentes, conectando diferentes camadas do circuito.
Máscara de solda e serigrafia: A máscara de solda (revestimento verde) protege a camada externa do circuito, e a serigrafia rotula as localizações dos componentes e os identifica.
Orifícios de montagem e conectores: para consertar a placa ou conectar outros dispositivos.

2. Componentes ativos

Circuitos integrados (Ic): componentes principais, funções lógicas complexas integradas, como microprocessadores, memória.
Transistor (Tubo Triodo/Efeito de Campo): usado para amplificação de sinal, controle de comutação.
Diodo: condutividade unidirecional, usado para retificação, estabilização de tensão.
Sensores: detectar parâmetros ambientais (E.G.. temperatura, luz) e convertê-los em sinais elétricos.
Atuador (relé, motor): de acordo com o sinal de controle para executar a ação.

3. Componentes passivos

Resistor: limite de corrente, divisor de tensão e corrente.
Capacitor: armazenar energia elétrica, filtragem, acoplamento.
Indutor: armazenamento de energia magnética, filtragem, oscilação.
Transformador: conversão de tensão, correspondência de impedância.
Oscilador de cristal: fornecer sinais de relógio para garantir a operação estável do equipamento.

4. Componentes de conexão e proteção

Conector: conexão entre placas ou equipamentos (como fileiras de alfinetes, tomadas).
Fusíveis: proteção contra sobrecorrente.
Varistor / diodo de supressão transitória: tensão anti-surto.
Filtro: Suprime o ruído e melhora a qualidade do sinal.

O processo básico de montagem de PCB

Produção de PCBA, ou seja, Placa nua PCB através da colocação de componentes, plug-in, e complete o processo de soldagem. Este processo abrange uma série de procedimentos, incluindo processamento de posicionamento SMT, Processamento de inserção DIP, Teste PCBA, revestimento de três provas, e a inspeção visual final e envio da embalagem. Cada etapa é crítica e funciona em conjunto para garantir a qualidade e o desempenho do PCBA.

Processamento SMT SMD

1. Queda do tabuleiro
Este elo no início da linha de produção SMT desempenha um papel crucial, garante que as placas PCB possam ser transferidas para a linha de produção de maneira ordenada e eficiente, garantindo assim a continuidade e eficiência da produção.

2. Impressão de pasta de solda
A impressão em pasta de solda é uma parte fundamental do processamento de posicionamento SMT, que envolve a impressão precisa de pasta de solda na placa de circuito por meios manuais através do estêncil da máquina de impressão. Esta etapa não requer apenas uma máquina de impressão profissional (como mesa de impressão manual) e rodo, mas também requer um controle rigoroso da composição da pasta de solda, resolução de impressão, precisão, e espessura e uniformidade da pasta de solda.

3. Posicionamento na máquina
A colocação na máquina consiste nos componentes SMD de acordo com o diagrama do processo ou requisitos da BOM, através da programação da máquina SMD ou alinhamento manual, a montagem precisa na placa de circuito foi impressa com boa pasta de solda.

4.Soldagem por refluxo
Na impressão da pasta de solda e na máquina após o patch, a fim de garantir que os componentes possam ser firmemente soldados na placa PCB, soldagem por refluxo deve ser realizada. Este link através do aquecimento de alta temperatura para derreter a pasta de solda, de modo que os componentes e as placas de PCB estejam próximos uns dos outros, de modo a completar a soldagem.

5.Inspeção AOI
AOI pós-forno é um elo fundamental na linha de produção. É através do método de reconhecimento gráfico que a imagem digitalizada padrão do sistema AOI será armazenada e a detecção real da imagem para comparação, para obter os resultados do teste. Os pontos técnicos deste link incluem padrão de inspeção, força de detecção, taxa de detecção falsa, posição de amostragem, taxa de cobertura e ponto cego. Seus itens de inspeção cobrem uma ampla gama de possíveis problemas, como peças faltantes, reverter, vertical, solda quebrada, peças erradas, menos estanho, pernas deformadas, estanho contínuo e mais estanho.

Processamento de inserção DIP

Inserção DIP, também conhecida como embalagem DIP ou tecnologia de embalagem em linha de linha dupla, é um processo que empacota chips de circuito integrado na forma de inserção em linha de duas linhas.

1.Inserção manual
Neste link, o PCB é passado pela rotação da corrente, e os trabalhadores precisam inserir as peças e componentes moldados de forma precisa e correta na posição correspondente do PCB de acordo com as instruções de trabalho (aplicável a componentes de furo passante).

2. Solda de onda
A soldagem por onda é uma espécie de solda fundida com a ajuda da bomba, no tanque de solda para formar uma forma específica do processo de onda de solda. Durante o processo de soldagem, a PCB com componentes inseridos passa pela corrente transportadora e passa pela onda de solda em um ângulo e profundidade de imersão específicos, realizando assim uma conexão sólida das juntas de solda.

3. Corte manual dos pés
Depois que a soldagem por onda for concluída, a placa PCB precisa ser cortada manualmente. Esta etapa envolve componentes de plug-in manuais da placa PCB na superfície dos pinos expostos da almofada, de acordo com as disposições das instruções de operação para corte. O objetivo de cortar a operação do pé é garantir que a altura dos pinos componentes no lugar certo, evitando danos ao corpo do componente e sua almofada.

4. Soldagem manual
No processo de soldagem manual, a necessidade de anormalidades de soldagem da placa PCB, como solda falsa, vazamento de solda, menos estanho, estanho, etc., reparar em tempo hábil. Ao mesmo tempo, para os componentes da inserção de anormalidades, como distorcido, flutuando alto, menos peças, inserção errada, etc., também precisam ser tratados adequadamente para garantir a qualidade da soldagem.

Processamento de inserção DIP

Processamento de inserção DIP

Link de teste

1.Teste de TIC

O teste TIC é projetado para examinar as características básicas dos componentes para garantir um bom desempenho. Durante o processo de teste, de (não conforme) e tudo bem (qualificado) os produtos são colocados separadamente para facilitar o processamento posterior. Para obter os resultados do teste da placa de circuito OK, as etiquetas de teste de TIC correspondentes precisam ser afixadas, e separado da espuma, para facilitar o tubo subsequente.

2.Teste FCT

O teste FCT foi projetado para verificar de forma abrangente a integridade funcional da placa de circuito. No processo de teste, de (defeituoso) e tudo bem (qualificado) estritamente diferenciado, e estão devidamente colocados. Para placas de circuito com resultados de teste OK, eles precisam ser rotulados com os rótulos de teste FCT apropriados e isolados da espuma para facilitar o rastreamento e gerenciamento subsequentes. Ao mesmo tempo, se você precisar gerar um relatório de teste, você deve garantir que o número de série no relatório corresponda ao número de série na placa PCB. Para produtos GN, eles precisam ser enviados ao departamento de manutenção para reparo, e faça um bom trabalho registrando o relatório de manutenção do produto com defeito.

Revestimento de tinta de três provas

Tinta três provas, como uma espécie de revestimento com funções especiais, é amplamente utilizado na proteção PCBA. Sua função é fornecer proteção abrangente para componentes eletrônicos, resistir eficazmente à erosão da umidade, névoa salina e substâncias corrosivas. Pulverizando tinta de três provas, não apenas garante que os produtos funcionem de forma estável sob o ambiente hostil de alta umidade e alta névoa salina, mas também prolonga significativamente sua vida útil.

Inspeção visual para embalagem e envio

Antes de embalar e enviar, inspeção manual deve ser realizada para garantir a qualidade do produto, O padrão IPC610 é uma base importante para inspeção, focusing on checking whether the direction of the components on the PCBA is correct, such as IC, diodos, transistores, tantalum capacitors, aluminum capacitors and switches and so on. Ao mesmo tempo, it is also necessary to carefully check the defects after welding, such as short circuit, open circuit, fake parts, false welding, etc., to ensure that the products can work stably and meet customer requirements.

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What are the advantages of using flexible PCB?

04/28/2025 em /por

In the realm of printed circuit boards (PCBs), flexible PCBs stand out as a unique category, complementing their traditional rigid counterparts. In a wide range of applications, flexible PCBs demonstrate capabilities that rival — and sometimes surpass — those of rigid PCBs. To explore the charm and versatility of flexible PCBs, this article offers an in-depth analysis of their various types and real-world applications.

What Is a Flexible Circuit Board?

An FPC (Flexible Printed Circuit), often referred to as a “placa macia,” is a member of the PCB family. Made with flexible substrates such as polyimide or polyester films, FPCs boast high wiring density, lightweight construction, thin profiles, and exceptional bendability and flexibility. These boards can endure millions of dynamic flexing cycles without damaging the circuitry, making them ideal for complex spatial layouts and three-dimensional assembly. By integrating component mounting and wiring into a single structure, FPCs achieve a level of performance that rigid PCBs often cannot match.

Basic Structure of an FPC

Copper Film (Copper Foil Substrate)

  • Copper Foil: A crucial material in FPCs, copper foil is available in two types — electrolytic copper and rolled annealed (RA) copper — with common thicknesses of 1oz, 1/2Oz, and 1/3oz.

  • Substrate Film: Supports the copper foil and typically comes in thicknesses of 1 mil or 1/2 mil.

  • Adhesive: Used during manufacturing to bond layers, its thickness varies depending on customer requirements.

Capa (Protective Cover Film)

  • Cover Film: Primarily used for surface insulation, usually with thicknesses of 1 mil or 1/2 mil, applied together with adhesive layers.

  • Release Paper: Employed during manufacturing to prevent foreign matter from adhering to the adhesive before lamination, simplifying the production process.

Stiffener (PI Stiffener Film)

  • Stiffener: Enhances the mechanical strength of the FPC, facilitating surface-mount assembly. Tipicamente, stiffeners range from 3 mil to 9 mil in thickness and are bonded with adhesives.

  • EMI Shielding Film: Protects the internal circuits from external electromagnetic interference, ensuring the stability and reliability of electronic devices.

Types of Flexible PCBs

Types of Flexible PCBs

Types of Flexible PCBs

As a major innovation within the PCB industry, flexible PCBs not only offer exceptional performance but also come in a wide variety of types. Their versatility greatly enriches the design possibilities for electronic products and meets the demands of increasingly complex applications. Below is an overview of the most common types of flexible PCBs and their typical uses:

  1. Single-Sided PCB flexível
    Featuring a simple structure with a single conductive layer, these PCBs are cost-effective and ideal for basic applications.

  2. Double-Sided Flexible PCB
    With copper layers on both sides connected through metallized vias, double-sided flexible PCBs offer greater functionality for more complex scenarios.

  3. Multilayer Flexible PCB
    Built with multiple layers of copper and dielectric material stacked alternately, these PCBs achieve high elasticity while delivering superior performance.

  4. PCB rígido-flex
    Combining both rigid and flexible circuits into a single board, rigid-flex PCBs support high-density wiring and sophisticated layout designs.

  5. HDI Flexible PCB
    Featuring high-density interconnect (HDI) projetos, these boards are lightweight, compact, altamente integrado, and offer excellent electrical performance.

  6. Sculptured Flexible Circuit
    Designed with variable trace thicknesses to meet specific localized requirements, these circuits are ideal for intricate electronic applications.

  7. Polymer Thick Film Flexible PCB
    Manufactured using screen-printing techniques, these low-cost flexible circuits are best suited for low-voltage applications.

  8. Dual Access/Backside Flexible PCB
    A single-sided design that allows circuit access from both sides, simplifying the layout of complex circuitry.

  9. Single-Layer Flexible FPCB
    Comprising a base layer, adhesive, and a copper layer, this straightforward structure emphasizes protection of the conductive areas.

  10. Dual Access/Backside FPCB
    Similar in structure to a single-layer FPCB but with laser-drilled openings to access the copper layer, significantly enhancing design flexibility.

Features of Flexible PCBs

  1. Flexibility:
    Flexible PCBs can bend and fold without compromising circuit functionality, allowing for freedom of movement in three-dimensional spaces.

  2. Lightweight and Thin:
    Compared to rigid PCBs, flexible PCBs are significantly thinner and lighter.

  3. Miniaturized Design:
    Thanks to their ability to bend in 3D space, flexible PCBs enable the creation of more compact electronic products.

  4. Alta confiabilidade:
    Flexible PCBs offer greater resistance to vibration and shock compared to rigid boards, enhancing overall reliability.

  5. High-Temperature Resistance:
    These PCBs can operate reliably in high-temperature environments, demonstrating outstanding thermal stability.

In-Depth Analysis of Core Advantages of Flexible PCBs

In-Depth Analysis of Core Advantages of Flexible PCBs

In-Depth Analysis of Core Advantages of Flexible PCBs

PCBs flexíveis (CPFs) have become increasingly indispensable in modern electronics due to their unique physical properties and design advantages. Below is a detailed exploration of their core strengths:

1. Exceptional Flexibility and Spatial Adaptability

  • Bendable and Foldable Design:
    Utilizing flexible substrates such as polyimide (Pi) or polyester (BICHO DE ESTIMAÇÃO), FPCs can bend, fold, or even roll within three-dimensional space, breaking the two-dimensional limitations of traditional rigid PCBs. Por exemplo, in foldable smartphones, FPCs are used in hinge areas, enduring hundreds of thousands of folds without failure.

  • Space Optimization:
    With thicknesses as low as 0.1 mm and weighing only 50%-70% of a rigid PCB, FPCs significantly enhance space utilization inside devices. In smartphones, FPCs seamlessly connect the mainboard to the display and camera modules, enabling “zero-gap” projetos.

2. Lightweight Design and High Reliability

  • Weight Reduction and Cost Savings:
    The lightweight nature of FPCs makes them ideal for aerospace and wearable devices. Por exemplo, satellite electronics systems utilizing FPCs see weight reductions of over 30%, while also minimizing the need for bulky connectors and reducing overall assembly costs.

  • Environmental Resistance:
    PI substrates withstand temperatures up to 250°C and exhibit excellent chemical and vibration resistance, making them suitable for harsh environments such as automotive engine compartments and industrial control systems.

3. Design Freedom and Integration Capabilities

  • 3D Routing:
    FPCs can route along curved surfaces, supporting innovative structural designs. In smartwatches, FPCs are integrated into the straps to flexibly connect sensors to the mainboard.

  • High-Density Integration:
    With technologies like laser drilling and fine-line patterning, FPCs can achieve line widths and spacings as small as 20μm/20μm, meeting the miniaturization demands of devices such as implantable medical equipment (Por exemplo, neural stimulators) for multi-channel signal transmission.

4. Dynamic Adaptability and Durability

  • Extended Flexing Lifespan:
    Designs using serpentine routing patterns and rolled annealed (RA) copper allow FPCs to endure over 100,000 bending cycles, ideal for dynamic applications like flip phones.

  • Shock Absorption:
    Flexible substrates absorb mechanical stresses, reducing the risk of solder joint failures caused by vibrations. In automotive electronics, FPCs are used in airbag control modules to ensure signal stability even under extreme collision conditions.

5. Cost Efficiency and Manufacturing Productivity

  • Long-Term Cost Benefits:
    Although the unit cost of FPCs may be higher, their ability to reduce the need for connectors and simplify assembly processes lowers overall system costs in mass production. Por exemplo, integrated FPC modules in smartphones are 15%-20% more cost-effective than traditional cable harness solutions.

  • Rapid Production Support:
    FPCs can be produced with robotic automation, supporting small-batch, multi-variety manufacturing, ideal for the fast-paced iteration cycles of consumer electronics.

Typical Application Scenarios

  • Eletrônica de consumo:
    Display connections and camera modules in smartphones and tablets.

  • Dispositivos médicos:
    Implantable pacemakers and miniature diagnostic device sensor circuits.

  • Eletrônica Automotiva:
    Lightweight wiring for engine management systems and advanced driver-assistance systems (ADAS).

  • Aerospace:
    Radiation-resistant flexible circuits for satellite antennas and UAV control systems.

Conclusão

With the rapid rise of wearable devices, monitores flexíveis, and smart technologies, the demand for flexible PCBs is experiencing explosive growth. In an era where electronic products increasingly prioritize lightweight, afinar, compact, and highly efficient designs, ultra-thin and stretchable flexible circuits are poised to unlock immense market potential and drive the next wave of advancements in electronic devices and related technologies.

Como remover revestimentos de proteção de PCBs

04/24/2025 em /por

Before production and processing, a protective conformal coating is typically applied to the surface of a PCB to safeguard it from environmental damage. This coating helps prevent water, pó, salt, and dirt from coming into contact with sensitive components, thus preserving the performance of the mainboard.

Removing conformal coatings can be challenging due to their durability and resistance to wear. If rework is needed, alcohol is not the ideal choice for removing these coatings. While alcohol is inexpensive and readily available, it lacks the solvent strength to effectively dissolve the coating and often requires extended soaking to have any effect. Neste artigo, we will explore effective methods for removing protective coatings from PCBs.

Types of Conformal Coatings

There are five common types of conformal coatings available on the market:

  1. Acrylic Resin
    Acrylic resins dissolve easily in many organic solvents, making them convenient for board rework. They offer selective chemical resistance, dry quickly, resist mold, do not shrink during curing, and provide good moisture resistance. No entanto, they have low abrasion resistance and are prone to scratching, cracking, and peeling.

  2. Epoxy Resin
    Typically composed of two parts that begin to cure upon mixing, epoxy resins offer excellent abrasion resistance, chemical resistance, and decent moisture protection. No entanto, they are difficult to remove and rework. Because film shrinkage occurs during polymerization, a buffer solution is recommended around precision components. Curing at lower temperatures can help minimize shrinkage.

  3. Polyurethane
    Polyurethane coatings provide strong moisture and chemical resistance. Due to their robust chemical properties, removing them usually requires strippers, which may leave ionic residues behind. These residues must be thoroughly cleaned to avoid baseboard corrosion. Although rework through soldering is possible, it often results in brown discoloration that can affect the product’s appearance.

  4. Silicone
    Silicone is typically a single-component compound that begins to cure when exposed to moisture in the air and a certain temperature. Once cured, it forms a uniform, well-adhering layer across all surfaces of electronic components or modules. It is suitable for high-temperature environments (>120° c), as well as settings that require moisture sensitivity, chemical resistance, corrosion protection, and antifungal properties.

  5. Urethane (Polyurethane Carbamate)
    Urethane offers strong protection, hardness, and high solvent resistance. It provides excellent abrasion resistance and low moisture permeability. While it performs well in cold environments, it is not suitable for high-temperature applications. Most urethane coatings are difficult or impossible to rework or repair.

pcba

Common Types of Protective Coatings and Removal Methods

  1. Chemical Solvent Method

Applicable Types:

  • Polyurethane: Methanol/ethylene glycol ether with an alkaline activator, or toluene/xylene.

  • Acrylic: Methylene chloride, chloroform, ketones (Por exemplo, acetone), γ-butyrolactone, or butyl acetate.

  • Silicone: Methylene chloride or specific hydrocarbon solvents.

  • Epoxy: Difficult to remove once cured; for small areas, methylene chloride with an acidic activator and a cotton swab may be used.

Procedure:
Apply the solvent to the coating surface. Once the coating swells, gently wipe with a cotton swab or soft cloth. Avoid letting the solvent spread to unintended areas.

  1. Physical Removal Methods

Heat Method:

  • Ferramentas: Soldering iron or hot air gun.

  • Observação: Carefully control the temperature (do not exceed component tolerance). Suitable for high-temperature resistant components. Work quickly to avoid damaging the laminate.

Micro-abrasion Method:

  • Ferramentas: Specialized abrasive equipment (Por exemplo, walnut shell or glass bead media).

  • Observação: Mask surrounding areas to prevent electrostatic buildup. Should be performed by trained personnel.

Mechanical Scraping:

  • Ferramentas: Razor blade or small knife.

  • Passos: Cut a V-groove at the solder point, apply solvent, then lift the coating. Best for localized rework.

  1. Specialized Cleaning Agents

Recommendation: Use eco-friendly cleaning agents (Por exemplo, Kyzen ES125A).
Método: Ultrasonic cleaning or soaking. Suitable for large areas or complex PCBs.

  1. Localized Replacement Method

Use Case: When only specific components need replacement.
Passos: Use a soldering iron to heat and remove the coating on the component, replace the part, clean the area, and reapply conformal coating.

Resumo

PCB protective coatings are surface-applied materials designed to protect circuit boards from moisture, pó, chemicals, and high temperatures, thus improving product reliability. Common types include:

  • Acrylic (easy to apply, requires specific solvents for removal),

  • Polyurethane (strong protection, difficult to remove, may emit toxic fumes when heated),

  • Silicone (heat-resistant and reworkable), e

  • Epoxy (very tough once cured, hard to remove).

Removal methods should be selected based on coating type and may include chemical solvents (Por exemplo, methylene chloride, methanol), physical methods (aquecer, abrasion), special cleaning agents, ou localized replacement. Always prioritize safety and environmental responsibility, and take care to avoid damaging the PCB or its components.

Guia abrangente de design de PCB e prototipagem de 8 camadas

04/21/2025 em /por

No campo da fabricação de eletrônicos, Placas de circuito impresso (PCBs) desempenhar um papel crítico. Com avanços rápidos na tecnologia, PCBs multicamadas tornaram -se amplamente utilizadas em vários dispositivos eletrônicos devido ao seu desempenho elétrico superior e utilização de espaço otimizada. Este artigo fornece uma breve visão geral e explicação centralizadas na prototipagem de PCBs de 8 camadas.

Estrutura básica de um PCB de 8 camadas

8-Camada pcbs

Uma PCB de 8 camadas consiste em oito camadas condutivas (normalmente cobre) intercalado com sete camadas isolantes (Geralmente materiais dielétricos). Esta estrutura permite roteamento de circuito mais complexo, Aumenta a integração do circuito, e melhora o desempenho geral. Cada camada condutora pode ser roteada conforme necessário de acordo com o design, Enquanto as camadas isolantes garantem o isolamento elétrico entre as camadas.

8-Camada PCB Stack-Up

1. Camada de sinal (PRINCIPAL)

Camada de sinal

Camada de sinal

A primeira camada de sinal, também conhecido como a camada superior, é a superfície visível da PCB física e é usada para montar componentes eletrônicos. Como mostrado no diagrama, Esta camada tem uma alta densidade de traços. Uma razão é que os componentes são colocados nessa mesma camada, permitindo o roteamento direto sem a necessidade de Vias alternar as camadas. Isso evita vias que interferem no roteamento em outras camadas. No design da placa multicamada, via colocação requer consideração cuidadosa.

2. Plano de potência (VCC)

Plano de potência
Esta camada não mostra roteamento porque é dedicada à rede de energia. Durante o design, Rastreios específicos são usados ​​para dividir diferentes domínios de potência. É essencial colocar componentes com o mesmo requisito de tensão na mesma região para que eles possam ser conectados à zona de potência correspondente através de vias - eliminando a necessidade de roteamento adicional.

3. Camada de sinal (Camada interna 3)

Camada interna 3

Camada interna 3


Esta camada é usada principalmente para roteamento de sinal, Embora algumas linhas de energia também estejam presentes. No diagrama, Os traços mais espessos representam linhas de energia, Enquanto os mais finos são traços de sinal.

4. Camada de sinal (Camada interna 4)

Camada interna 4
Esta camada é semelhante em função à anterior, usado para roteamento de sinal e energia.

5. Plano de aterramento (Gnd)

Plano de aterramento
Esta camada serve como rede de terra, interconectado através de vias.

6. Camada de sinal (Camada interna 5)

Camada interna 5
Usado para roteamento de sinal.

7. Plano de aterramento (Gnd)
Esta camada reflete a camada 5 e também funciona como parte da rede terrestre.

8. Camada inferior

Camada inferior
A camada inferior, Como a camada superior, é comumente usado para rotear pequenos componentes. Rastreios para muitos dos chips menores são normalmente encontrados na camada superior ou inferior.

Espessura padrão de PCBs de 8 camadas

A espessura padrão para PCBs de 8 camadas normalmente varia de 1.6 mm (63 Mils) para 2.4 mm (94 Mils), Dependendo da espessura da folha de cobre e da escolha de materiais pré -gravados/núcleos. No entanto, A espessura final também pode ser influenciada por vários fatores -chave:

  • Espessura de cobre (Por exemplo, 1 Oz, 2 Oz)

  • Espaçamento dielétrico entre camadas

  • Tipo de materiais usado na pilha de PCB

Espessura padrão de PCBs de 8 camadas

Espessura padrão de PCBs de 8 camadas

PCBs mais espessos oferecem maior resistência mecânica e são menos propensos a deformação, tornando -os ideais para aplicações industriais. PCBs mais finos, por outro lado, são mais adequados para dispositivos compactos, como smartphones e eletrônicos portáteis.

Em design prático, o padrão Espessura da PCB deve ser determinado com base nas características do circuito - como o controle de impedância é necessário, Se houver requisitos de gerenciamento térmico, e as capacidades de fabricação do fabricante de PCB. Uma espessura apropriada garante que o PCB possa ser montado corretamente dentro do gabinete, alinhado com conectores, e integrado suavemente no conjunto do produto final.

Considerações de design-chave para PCBs de 8 camadas

1. Controle de impedância
Traços de sinal de alta velocidade (Por exemplo, Ddr4, HDMI) requer correspondência de impedância diferencial (normalmente 100Ω). Isso é conseguido pela largura de traço de ajuste fina, espaçamento, e a distância para referir aviões.
Usar Ferramentas de simulação SI/PI (Integridade do sinal/potência) Para otimizar o layout de rastreamento.

2. Rede de distribuição de energia (Pdn)
Os aviões de energia e terra dedicados reduzem o ruído e garantem a integridade da energia.
Capacitores de desacoplamento (Por exemplo, 0.1μF) são colocados perto dos pinos de energia para suprimir a interferência de alta frequência.

3. Roteamento de pares diferenciais
Linhas de sinal diferenciais (Por exemplo, USB 3.0) deve ser roteado com o mesmo comprimento e espaçado em paralelo.
Evite ângulos de 90 ° - use 45° dobras Para reduzir a reflexão do sinal e manter a integridade.

4. Design de interface

  • Ethernet: Transformadores magnéticos devem ser colocados perto do chip phy; Pares diferenciais devem ter despejada de cobre para baixo para minimizar a diafonia.

  • HDMI: As bobinas de modo comum e os componentes de proteção ESD devem ser colocados perto do conector; manter Skew intra-par ≤ 5 Mils.

5. Gerenciamento térmico
Para componentes de alta potência (Por exemplo, CPUs), adicionar Vias térmicas ou materiais condutores abaixo do componente para dissipar o calor e prevenir a instabilidade do sinal induzido térmico.

8-Processo de prototipagem de PCB de camada

O processo de prototipagem para um PCB de 8 camadas normalmente envolve as seguintes etapas importantes:

  1. Projeto
    Use o software profissional de design eletrônico para criar o diagrama esquemático, e convertê -lo em um arquivo de layout da PCB.

  2. Análise
    Realize uma revisão completa dos arquivos de design para garantir que o layout do circuito seja preciso e atenda aos requisitos de fabricação.

  3. Fotoplotação
    Converta os arquivos de layout da PCB verificados em arquivos de fotoplotes, que são usados ​​no processo de exposição.

  4. Fabricação de circuito da camada interna
    Importar os arquivos de fotoplotes para uma máquina de exposição. Usando processos de exposição e desenvolvimento, Crie o circuito da camada interna.

  5. Laminação
    Alterne as camadas internas com camadas isolantes, e unir -os sob alta temperatura e pressão para formar uma estrutura multicamada.

  6. Perfuração
    Buracos de perfuração na pilha laminada com base nas especificações do projeto para permitir a montagem de componentes e conexões entre camadas.

  7. Fabricação de circuito da camada externa
    Crie padrões de circuito nas camadas externas de cobre e execute o acabamento superficial necessário (Por exemplo, arremesso de ouro, Sangrar).

  8. Inspeção
    Realize verificações rigorosas de qualidade no PCB de 8 camadas acabado, incluindo inspeção visual e teste elétrico, Para garantir o desempenho e a confiabilidade.

  9. Envio
    Uma vez que os PCBs passam inspeção, Eles são embalados e enviados para o cliente.

8-Processo de prototipagem de PCB de camada

8-Camada Prototipagem de PCB Processo

Aplicações de PCBs de 8 camadas

8-Os PCBs de camada são amplamente adotados em vários setores devido ao seu excelente desempenho elétrico e integridade superior de sinal. As áreas de aplicação comuns incluem:

  1. Equipamento de telecomunicações
    No setor de comunicações-principalmente em alta frequência, sistemas de alta velocidade, como estações base 5G e dispositivos de comunicação óptica-PCBs de 8 camadas reduzem efetivamente a diafonia de sinal e melhoram a qualidade da transmissão e a estabilidade.

  2. Computadores e servidores
    Ambientes de computação modernos, especialmente servidores e data centers de alto desempenho, requer design intrincado de circuito e gerenciamento preciso de energia. A arquitetura multicamada de PCBs de 8 camadas atende às diversas demandas de circuitos e aprimora a eficiência do processamento de dados.

  3. Eletrônica de consumo
    Dispositivos como smartphones, comprimidos, e os sistemas de áudio doméstico de ponta de última geração dependem cada vez mais de PCBs de 8 camadas. À medida que a funcionalidade do dispositivo se expande, O mesmo acontece com a densidade do componente. Essas placas permitem maior integração e estabilidade dentro de fatores de forma compactos.

  4. Dispositivos médicos
    Equipamentos complexos, como máquinas de ultrassom e scanners de TC, se beneficiam do layout otimizado e da precisão do sinal fornecida por PCBs de 8 camadas. Isso garante processamento preciso de sinal, o que é crítico para a confiabilidade diagnóstica.

  5. Sistemas de controle industrial
    Sistemas de automação e robôs industriais exigem alta confiabilidade e complexidade funcional. A robusta distribuição de energia e imunidade de ruído de PCBs de 8 camadas os tornam adequados para ambientes industriais severos e exigentes.

8-camada pcbs, com seu design colaborativo multicamada, abordar os principais desafios, como integridade de sinal de alta velocidade, Supressão de ruído de potência, e gerenciamento térmico. Eles estão se tornando componentes essenciais em campos emergentes como 5G Comunicação e Você tem hardware. À medida que as tecnologias de materiais evoluem-como dielétrico ultrafino e perfuração a laser-os limites de desempenho dos PCBs de 8 camadas continuarão a expandir.

Introdução aos módulos de PCBA de áudio automotivo

04/17/2025 em /por

Automotive Audio Control Module (ACM) is one of the core components of in-vehicle infotainment system (Infotainment System), which is responsible for the management, processamento, and regulation of audio signal input, output, and function control in the vehicle. With the development of automotive electronics technology, the audio PCB module is constantly upgraded in terms of integration, performance and functionality, and has become a key indicator of the strengths and weaknesses of the car audio system.

Automotive audio pcba module functions

1. Audio signal processing

Input source management: integrates multiple audio inputs (E.G.. AM/FM radio, Bluetooth, USB/AUX interface, in-car navigation voice, cell phone casting audio, etc.), supports signal switching and priority control.

Digital Signal Processing (DSP): including equalizer (EQ) adjustment, frequency crossover, noise reduction, surround sound (such as Dolby Atmos) effect enhancement.

Volume Dynamic Compensation: Automatically adjusts the volume according to the speed of the vehicle (E.G.. Speed-Volume Compensation) to offset the interference of environmental noise.

2. User Interactive Controls

Functions are operated via physical buttons, touch screen or voice commands (E.G.. “Turn up the volume”).

Linkage with the instrument panel or HUD (Heads Up Display) to display information on the current audio source, volume, etc..

3. Network communication

interacts with other vehicle modules (E.G.. BCM body control module) via CAN/LIN bus, realizing functions such as mute door opening and closing, reverse radar tone mixing and so on.

Support OTA (over-the-air upgrade) to update the audio algorithm or function expansion.

Automotive audio control modules

Composition of Automotive Audio PCB Module

1. Signal Input and Processing Unit
Receives audio signals from radio, Bluetooth, USB, AUX and other input sources.
Includes ADC (analog-to-digital converter) and DAC (digital-to-analog converter) to convert analog signals to digital signals.
Integrated DSP (Digital Signal Processor) for sound effects adjustment (such as equalizer, reverb, sound field positioning) and noise suppression.

2. Power amplifier unit

amplifies the processed audio signal to a power level sufficient to drive the speakers.
Classificação:
Class AB amplifier: balancing efficiency and sound quality, suitable for mid-range models.
Class D amplifier: high efficiency, low power consumption, widely used in modern car audio.
Class G/Class H amplifier: Dynamically adjusts the power supply voltage to improve the energy efficiency ratio.

3.Audio Output Unit

Connects speakers (tweeter, midrange, bass, subwoofer) and subwoofer.
Supports multi-channel output (E.G.. 5.1-canal, 7.1-canal) to realize immersive sound.

4. Control and interface unit
provides user interaction interface (E.G.. knob, touch screen, voice control).
Integrate CAN bus, LIN bus and other communication protocols to link with in-vehicle infotainment system (IVI).

Software Architecture

Bottom driver: control hardware resources (E.G.. I2S audio bus, GPIO key detection).

Middleware: audio framework (E.G.. AAOS Audio HAL for Android Automotive), Bluetooth protocol stack (A2DP/HFP).

Application layer:

sound algorithms (E.G.. Bose’s Centerpoint virtual surround technology).

Voice recognition integration (E.G.. Amazon Alexa, Baidu DuerOS).

Troubleshooting (supports UDS protocol, can read DTC fault codes).

Key Technologies for Automotive Audio PCB Modules

1. Highly integrated design
Adopting SoC (System-on-Chip) or SiP (System-in-Package), the processor, amplifier, DAC and other functions are integrated into a single chip, reducing PCB area and wiring complexity.

2. Low noise and anti-interference technology
Power supply decoupling design: use multi-layer PCB and low ESR capacitors to suppress power supply noise.
Shielding technology: metal casing, ground isolation, differential signal transmission, reduce electromagnetic interference (Emi).
Grounding optimization: star grounding or single-point grounding to avoid ground loop interference.

3. High-efficiency heat dissipation design
High-power amplifier generates a lot of heat, which needs to be dissipated by heat sink, heat pipe or liquid cooling system.
PCB layout optimization: dispersed arrangement of heat generating components to avoid local overheating.

4. High Reliability Design
meets AEC-Q100/Q200 and other automotive grade component standards.
High temperature, vibration and humidity resistant design to adapt to the harsh automotive environment.

Automotive audio pcba module application cases

High-end models: such as BMW 7 Series, Mercedes-Benz S-Class, with multi-channel DSP amplifier, supporting active noise reduction and personalized sound customization.
New energy vehicles: Tesla Model 3/Y and other models, integrated 14-speaker + subwoofer system, sound effect optimization through the central processor.
Aftermarket: Third-party manufacturers (Por exemplo, JBL, Harman Kardon) provide modular audio solutions, adapting to different models.

Resumo

Automotive audio control modules are evolving from single-function to highly integrated and intelligent, becoming the key to enhancing the driving experience. With the popularization of electric vehicles and the advancement of autonomous driving technology, the requirements for real-time, sound quality and multi-modal interaction will further increase. If you need automotive audio modules, please contact LSTpcb, we have PCBA modules designed specifically for automotive audio, with powerful functions to meet all automotive audio applications.

Placa de circuito FPC: a complete analysis from materials to processes

04/03/2025 em /por

In the electronics manufacturing industry, flexible printed circuit boards (CPFs) play a vital role. With the rapid development of science and technology, higher requirements are placed on the processing technology of FPCs. In order to meet market demand and improve production efficiency, we need to continuously innovate and optimize FPC processing technology. Neste artigo, we will make a comprehensive analysis of FPC from materials to processing technology to help everyone better understand flexible circuit boards.

FPC concept

CPF, the full name of Flexible Printed Circuit, is a flexible printed circuit board, or soft board for short. It uses photo-imaging pattern transfer and etching technology on a flexible substrate to construct a conductor circuit, realize the electrical interconnection of the inner and outer layers of double-sided and multi-layer circuit boards, and protect and insulate through PI and glue layers. FPC is known for its high wiring density, light weight and thin design, and is widely used in many electronic products such as mobile phones, laptops, PDAs, digital cameras and LCMs.

Main raw materials of FPC

The main raw materials of FPC include: substrate, cover film, reinforcement material and other auxiliary materials. These materials play a vital role in the manufacturing process of FPC and together constitute the basis of flexible printed circuit boards.

1. Substrato:

As the supporting core of FPC, it determines the basic performance of the product. There are many types of substrates, and the selection should be based on the specific application scenarios and needs.

1.1 Glue substrate

Glue substrate, mainly composed of copper foil, glue and PI materials, is divided into single-sided substrate and double-sided substrate. Single-sided substrate is covered with copper foil only on one side, while double-sided substrate is covered with copper foil on both sides.

1.2 Glue-free substrate

Glue-free substrate, aquilo é, substrate without glue layer, has a simpler structure than ordinary glue substrate, and is composed of only two parts: copper foil and PI. The advantages of this substrate are its thinner characteristics, excellent dimensional stability, excellent heat resistance, bending resistance and excellent chemical resistance. For this reason, glue-free substrate has been widely accepted and applied in various fields today.

In terms of copper foil, the common thickness specifications on the market include 1OZ, 1/2OZ and 1/3OZ. Recently, thinner 1/4OZ copper foil has been introduced. Although such materials have been used in China, their advantages are more obvious when making products with ultra-fine lines (line width and line spacing of 0.05MM and below). With the increasing demand of customers, this specification of copper foil is expected to be more widely used in the future.

2. Covering film

The covering film is mainly composed of release paper, glue layer and PI. Durante o processo de produção, the release paper plays a role in protecting the glue layer to prevent it from being contaminated with foreign matter. But in the end, the release paper will be torn off, and the glue layer and PI together constitute an important part of the product.

3. Reinforcement material

Reinforcement material is specially designed for FPC to enhance the support strength of specific parts of the product, thereby improving the overly “soft” characteristics of FPC. There are many types of common reinforcement materials on the market.
1) FR4 reinforcement: It is mainly made of glass fiber cloth and epoxy resin glue, which is exactly the same as the FR4 material used in PCB.

2) Steel sheet reinforcement: This reinforcement material is mainly composed of steel, which is not only outstanding in hardness, but also has strong supporting strength.

3) PI reinforcement: It is similar to the cover film, consisting of PI and adhesive release paper, but the special thing is that its PI layer thickness can be customized from 2MIL to 9MIL.
Pure glue: This thermosetting acrylic adhesive film consists of protective paper/release film and a layer of glue. It is mainly used to bond layered boards, soft-hard boards, and FR-4 and steel sheet reinforcement boards.
Electromagnetic protective film: It is designed to be attached to the board surface to play a shielding role.
Pure copper foil: This material is composed only of copper foil and is a key material in the production process of hollow boards.

Unique advantages of flexible circuit boards

Flexible printed circuit boards, with their flexible insulating substrate as their feature, create many superior properties that rigid printed circuit boards do not have:

1. Flexibility: Flexible circuit boards can bend, roll and fold freely, fully adapting to the needs of spatial layout, while achieving easy movement and stretching in three-dimensional space, thus efficiently integrating component assembly with wire connection.

2. Size and weight advantages: With the help of flexible circuit boards, the volume and weight of electronic products can be significantly reduced, perfectly matching the trend of electronic products towards high density, miniaturization and high reliability. For this reason, flexible circuit boards have been widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras and other fields or products.

3. Excellent characteristics: Flexible circuit boards not only have good heat dissipation and solderability, but also are easy to install and connect, and the overall cost is relatively low. Its soft and hard combination design makes up for the slight lack of flexible substrate in component carrying capacity to a certain extent.

Types of FPC

There are many types of flexible circuit boards, including single-sided flexible, double-sided flexible and multi-layer flexible. Entre eles, the cover layer of the single-sided PCB flexível is bonded to the single-sided FPC core without adhesive, while the double-sided flexible PCB is a double-sided FPC core without adhesive with cover layers bonded on both sides and plated through holes. Multi-layer flexible PCB contains three or more conductive layers with plated through holes, and its manufacturing capacity can reach more than 12 camadas. Além disso, there are special types of flexible circuit boards such as hollow boards, layered boards, and soft-rigid boards.

Detailed explanation of FPC production process

Single-sided board process flow:
Cutting: Primeiro, cut out the board of suitable size according to the design requirements.
Baking: Preheat the board to increase its machinability.
Dry film: Paste a layer of dry film on the board as a protective layer for subsequent processes.
Exposição: Transfer the circuit pattern to the dry film through the exposure machine.
Development: Wash off the unexposed dry film with chemical solution to expose the circuit pattern.
Gravura: Etch off the part not covered by the dry film with etching liquid to form a circuit.
Demolding: Peel off the dry film from the board.
Pretreatment: Clean and activate the board to enhance surface adhesion.
Coating film: Paste a layer of covering film on the board to protect the circuit.
Laminação: Lay the covering film and the board together to form a circuit layer.
Curing: Cure the lamination layer by heating and pressurizing.
Surface treatment: Surface treatment of the circuit to enhance its corrosion resistance and conductivity.
Electrical measurement: Detect the connectivity and performance of the circuit through electrical measurement equipment.
Conjunto: Assemble the circuit board with other components.
Pressing: Press the circuit board again to ensure that the connection between the components is firm.
Curing: Heat and pressurize again to cure the assembly layer.
Text: Print logos and instructions on the circuit board.
Forma: Cut the shape of the circuit board according to the design requirements.
Final inspection: Perform a final inspection on the circuit board to ensure that its quality and performance meet the requirements.
Packaging and shipment: Qualified circuit boards are packaged and then shipped.

Resumo

Flexible Manufatura de PCB requires full-link coordination from material selection, process parameters to testing standards. No futuro, as AIoT devices develop towards high frequency and miniaturization, flexible PCBs will evolve towards ultra-thick copper layers (>3Oz), embedded components, self-healing materials, etc., becoming the core technology supporting the innovation of smart hardware.

14 Métodos de teste de PCBA

03/27/2025 em /por

PCBA (Conjunto da placa de circuito impresso) testing is a critical step in the electronics manufacturing process. It ensures that circuit boards and their mounted electronic components function correctly according to design specifications, achieving the expected performance and reliability. PCBA testing encompasses various aspects, including functional testing, performance evaluation, reliability assessment, and environmental adaptability testing.

As an indispensable part of PCB manufacturing, PCBA testing helps detect issues in a timely manner, enabling engineers to address problems quickly and ensuring high product quality. Neste artigo, we will explore 14 PCBA testing methods in detail, helping you understand their applications and select the most appropriate approach for your needs.

14 commonly used PCB testing methods.

Functional Testing

1. Teste no circuito (TIC)

Teste no circuito

Teste no circuito

TIC, or Automated In-Circuit Testing, is an essential and powerful tool for modern PCB manufacturers. It uses test probes to contact designated test points on the PCB layout, detecting open circuits, curtos circuitos, and component failures while providing clear diagnostic feedback.
ICT offers broad applicability, high measurement accuracy, and precise fault indication, making it easy for even less-experienced workers to handle defective PCBs. It significantly improves production efficiency and reduces manufacturing costs.

2. Teste de sonda voadora

Both Flying Probe Testing and ICT are highly effective in identifying manufacturing defects, but flying probe testing is a particularly cost-effective method for enhancing PCB quality. Unlike traditional ICT, which relies on fixed test probes, flying probe testing uses two or more independently controlled probes that move dynamically based on software instructions.
Since flying probe testing does not require fixed test points, it has a lower initial cost and can be modified via software rather than hardware adjustments. This makes it ideal for small-batch production. No entanto, ICT is faster and less prone to errors, making it more economical for high-volume production.

3. Functional Testing

Functional Testing


Functional System Testing employs specialized test equipment at various stages of production to verify circuit board functionality. It primarily includes Final Product Testing and Hot Mock-Up Testing.
Unlike ICT, functional testing does not provide in-depth data (such as pin positions or component-level diagnostics) for process improvement. Instead, it requires dedicated testing equipment and custom-designed test programs, making it complex and less suited for most production lines.

4. Inspeção óptica automatizada (Aoi)

Inspeção óptica automatizada

AOI utilizes either a single 2D camera or dual 3D cameras to capture PCB images and compare them to a detailed schematic. If discrepancies are detected, the system flags them for manual inspection.
Since AOI does not power up the PCB, it cannot detect all potential defects, making it most effective when combined with other testing methods, como:

  • Aoi + Teste de sonda voadora

  • Aoi + TIC

  • Aoi + Functional Testing

5. Inspeção de raios-X

Inspeção de raios-X

X-Ray Testing uses low-energy X-rays to quickly identify open circuits, curtos circuitos, solder voids, and other defects.
It is particularly useful for inspecting ultra-fine-pitch and high-density PCBs, detecting assembly issues like bridging, missing chips, and misalignment. Adicionalmente, X-ray inspection can utilize tomography to identify internal defects within IC chips. It remains the only reliable method for evaluating BGA solder quality and embedded components, offering the advantage of fixture-free testing.

6. Laser Inspection

This is one of the latest advancements in PCB testing tecnologia. It involves scanning the PCB with a laser beam to collect measurement data, which is then compared to preset acceptance thresholds.
Laser inspection has been successfully validated for bare board testing and is being explored for assembled PCB testing. It provides fast output, requires no fixtures, and offers clear visual access. No entanto, its main drawbacks include high initial costs and maintenance challenges.

7. Aging Test

Aging Test

Aging testing simulates real-world conditions to accelerate product wear and evaluate its long-term stability and reliability. The product is exposed to controlled temperature and humidity conditions while operating continuously for 72 hours to 7 dias. Performance data is recorded and analyzed to refine the production process, ensuring the product meets market demands. Aging tests primarily focus on electrical performance but can also include drop tests, vibration tests, and salt spray tests.

8. Teste de soldabilidade

Solderability testing ensures robust surface adhesion and enhances the likelihood of forming reliable solder joints. This test, based on the wetting balance method, evaluates the solderability of components, PCB pads, solder materials, and fluxes both qualitatively and quantitatively.

9. PCB Contamination Testing

PCB contamination testing detects ionic residues from flux, cleaning agents, umidade, plating, solda de onda, and reflow soldering. These contaminants can lead to corrosion and other reliability issues. Identifying and eliminating them is crucial for maintaining PCB integrity.

10. Análise de seção transversal

Análise de seção transversal

Cross-section analysis examines defects, circuitos abertos, curtos circuitos, and other failures by slicing the PCB for microscopic inspection. It provides insights into structural and material integrity.

11. Reflectometria no Domínio do Tempo (TDR) Teste

TDR testing

TDR testing is recommended for diagnosing faults in high-speed or high-frequency PCBs. It quickly identifies open and short circuits while pinpointing the exact failure location, making it a crucial tool for signal integrity analysis.

12. Peel Test

Peel Test

The peel test evaluates the adhesion strength between copper foil and the PCB substrate or brown oxide layer. It assesses bonding integrity under various conditions, including normal states, thermal stress, and high temperatures, ensuring mechanical reliability.

13. Solder Float Test

This test determines a PCB’s resistance to thermal stress, particularly for plated-through holes, surface conductors, e almofadas. The sample is immersed in molten solder for up to 5 minutos, with a depth not exceeding 50% of its thickness. After removal, it remains level until the solder solidifies, ensuring structural resilience.

14. Wave Soldering Test

Wave soldering testing evaluates the PCB’s ability to withstand the soldering process. Parameters such as fixture type, conveyor speed, preheating conditions, oxidation prevention, process control, board inclination, and soldering temperature are carefully recorded and analyzed to ensure optimal soldering quality.

Conclusão

These testing methods provide a comprehensive evaluation of PCBA performance. Manufacturers can select the most suitable tests based on the product’s specific applications and environmental requirements. By implementing rigorous testing, the risk of field failures is significantly reduced, enhancing product reliability and market competitiveness.

Guia de fabricação e uso de bobinas de PCB

03/25/2025 em /por

PCB de bobina refere-se a um componente do tipo indutor criado, roteando diretamente traços para uma forma de bobina em um PCB. Esta tecnologia oferece excelente resistência à voltagem, alto fator Q, forte consistência, roteamento flexível, e alta capacidade de transporte de corrente, tornando -o amplamente utilizado em aplicações de antena. Uma bobina de PCB é uma bobina fabricada diretamente em uma placa de circuito impressa usando traços de condutores nas camadas da placa de circuito.

Neste artigo, Forneceremos uma introdução detalhada às bobinas de PCB, cobrindo seu conceito, vantagens, Aplicações, processos de fabricação, e outras características importantes para ajudar os usuários a obter uma compreensão abrangente das bobinas de PCB.

O que é uma bobina de PCB?

Uma bobina de PCB é um dispositivo que usa traços de metal com precisão em uma placa de circuito impresso para formar uma bobina de uma forma selecionada. Interessantemente, Este processo pode ser implementado em várias camadas, dependendo de diferentes formas e modelos.
Adicionalmente, PCBs consistem em camadas e condutores isolantes alternados que se entrelaçam para formar bobinas de PCB agrupadas.
Além disso, Este componente inclui uma camada de condutor com faixas, permitindo que ele se encaixe em uma forma de arco apropriado enquanto é dividido em várias seções condutivas.

Estrutura básica das bobinas de PCB

As bobinas de PCB consistem principalmente nos seguintes componentes:

  • Condutor de bobina: Normalmente feito de folha de cobre, formado em formas espirais ou outras especiais através de processos de roteamento de PCB.

  • Camada de isolamento: Comumente feito de FR4, poliimida (Pi), ou substratos cerâmicos para garantir o desempenho adequado do isolamento.

  • Vias: Usado para conectar traços de bobina em PCBs multicamadas, melhorar a capacidade de transporte de corrente ou aumentar a indutância.

  • Tratamento de superfície: Inclui enig (Gold de imersão em níquel com eletrólito), Osp (Conservador de solda orgânica), arbusta de solda com chumbo/sem chumbo, etc., para melhorar a confiabilidade e a condutividade da solda.

Tipos de bobinas de PCB

(1) Classificação por contagem de camadas

  • PCB de camada única Bobina: A estrutura da bobina é estabelecida apenas em um lado do PCB, apresentando um design simples adequado para aplicações de baixa potência.

  • PCB multicamada Bobina: Usa várias camadas de PCB empilhadas e conectadas via Vias para aumentar a indutância e a capacidade de transporte de corrente.

  • PCB flexível Bobina (Bobina FPC): Feito de materiais flexíveis como Pi, Adequado para aplicações dobráveis ​​e ultrafinas, como bobinas de carregamento sem fio.

(2) Classificação por forma

  • Bobina em espiral: A estrutura mais comum, com a bobina distribuída em espiral ao longo da superfície da PCB. Amplamente utilizado em carregamento sem fio e antenas RFID.

  • Bobina serpentina: Projetado para aplicações de sensor e de alta frequência, reduzindo a capacitância parasita.

  • Bobina retangular/anel: Usado em projetos estruturais especializados, como blindagem eletromagnética e aplicações de transformador.

Bobina de PCB

Como funciona uma bobina de PCB?

Os princípios eletromagnéticos das bobinas de PCB são idênticos aos de bobinas com enrolamento de arame ou quaisquer outros indutores:

  • Elemento condutor: Os traços de cobre atuam como componentes condutores, substituindo os enrolamentos de arame em indutores discretos.

  • Campo magnético induzido: Quando uma corrente alternada ou pulsada flui através dos traços, gera um campo magnético em expansão e contratação.

  • Armazenamento de energia: Devido à indutância da bobina, O campo magnético armazena temporariamente energia em cada ciclo da corrente CA.

  • Tensão induzida: Qualquer mudança na corrente aplicada induz uma tensão na bobina proporcional à taxa de mudança, devido à indutância.

  • Impedância: A bobina apresenta uma impedância que varia com a frequência, principalmente devido à reatância indutiva.

Por isso, Uma bobina de PCB funciona essencialmente como um indutor padrão, com seus parâmetros determinados por sua estrutura e materiais.

Considerações de design -chave para bobinas de PCB

(1) Cálculos de parâmetros da bobina

O design de uma bobina de PCB envolve principalmente os seguintes parâmetros -chave:

  • Indutância (L): Depende do número de voltas, Largura do rastreamento, espaçamento, e material de substrato.

  • Resistência (R): Determinado pela espessura da folha de cobre, Largura do rastreamento, e comprimento, afetando diretamente as perdas de energia.

  • Fator Q (Fator de qualidade): Um fator Q mais alto indica perdas mais baixas, tornando-o adequado para aplicações de alta eficiência.

  • Frequência ressonante (f₀): O ponto ressonante deve ser considerado para evitar interferências ou perdas de sinal.

(2) Considerações de layout da bobina

  • Largura e espaçamento de rastreamento: Deve ser selecionado com base nos níveis de corrente e na frequência para evitar superaquecimento ou interferência eletromagnética (Emi).

  • Conexões entre camadas (Via design): Via diâmetro e enchimento de cobre, deve ser otimizado para reduzir a impedância e aumentar a confiabilidade.

  • Blindagem e aviões terrestres: Para aplicações de alta frequência, Aviões de terra ou camadas de blindagem podem ser usados ​​para minimizar a interferência externa.

PCB COIL-1

Processo de fabricação de bobinas de PCB e controle de precisão

A fabricação de bobinas de PCB envolve fotolitografia, gravura, e processos de eletroplacionamento. O fluxo de trabalho típico é o seguinte:

Processo de fotolitografia

  • Passos: Revestimento fotorresistente → exposição UV (Usando o filme ou a LDI Direct Imaging) → Desenvolvimento → gravura → Resista a remoção.

  • Precisão: Ldi (Imagem direta a laser) A tecnologia permite a largura/espaçamento da linha ≤ 25μm, atendendo aos requisitos de bobinas de alta frequência.

Tecnologia de espessamento da camada de cobre

  • Cobre eletroplinado: A deposição eletrolítica aumenta a camada de cobre de 1 oz para 10 onças, reduzindo significativamente a resistência. (Por exemplo, em 1 mm de largura, 10mm bobina longa, 1Oz cobre tem ~ 5mΩ Resistência, enquanto o cobre de 10 onças o reduz a ~ 0,5mΩ.)

  • Aplicações: Indutores ou transformadores de alta potência exigem um equilíbrio entre o custo e a dissipação de calor.

Processo PCB multicamada

  • Laminação & Vias: As folhas de cobre multicamadas são laminadas usando folhas prévias, com vias formadas por laser ou perfuração mecânica para estabelecer conexões elétricas entre camadas.

  • Vantagens: Transformadores planares (Por exemplo, uma placa de 4 camadas com bobinas primárias e secundárias acopladas verticalmente) Melhorar a eficiência do acoplamento magnético.

Tecnologia de corte a laser

  • Adequado para: Bobinas de PCB flexíveis, Linhas de meandros de alta frequência, eliminando a necessidade de gravação cortando diretamente a camada de cobre.

  • Precisão: Os lasers de CO₂ ou UV atingem ± 10μm de precisão.

Aplicações de bobinas de PCB

(1) Carregamento sem fio

  • Usado em transmissores de carregamento sem fio de Qi (Tx) e receptores (Rx).

  • Os projetos de bobina em espiral multicamadas melhoram a eficiência da transferência de energia.

(2) Comunicação de RF e NFC

  • Usado no RFID, Aplicativos NFC, como cartões inteligentes e dispositivos de pagamento eletrônico.

  • A otimização de frequência de ressonância da bobina garante a compatibilidade com bandas de frequência alvo (Por exemplo, 13.56MHz).

(3) Sensores e medição

  • Aplicado em sensores de indução magnética e sensores de corrente.

  • Os projetos diferenciais da bobina de PCB aumentam a sensibilidade ao sinal.

(4) Blindagem de energia e eletromagnética

  • Usado em transformadores de PCB e supressão de emi.

  • As voltas e ajustes de forma de bobina otimizam a compatibilidade eletromagnética (Emc).

Conclusão

Como um componente magnético essencial em sistemas eletrônicos modernos, O design da bobina de PCB requer consideração cuidadosa dos materiais, processos de fabricação, desempenho eletromagnético, e gerenciamento térmico. Com demandas crescentes por alta frequência, integrado, e designs flexíveis, A tecnologia de bobina de PCB continuará evoluir para obter um desempenho mais alto e aplicativos mais amplos. Através de design otimizado e inovação de processo, As bobinas de PCB desempenharão um papel crucial em campos emergentes, como a comunicação 5G, IoT, e veículos elétricos.

Fabricante de montagem de PCB acessível na China

03/21/2025 em /por

In the electronics manufacturing industry, “alta qualidade” e “baixo custo” often seem like conflicting goals. No entanto, through optimized manufacturing processes, precise supply chain management, and efficient quality control, LSTPCB is able to provide high-quality and highly cost-competitive Montagem da PCB (PCBA) serviços, helping you bring your products to market quickly.

We have provided PCB services to thousands of enterprises worldwide, earning an excellent reputation. LSTPCB is dedicated to offering the most affordable Manufatura de PCB and assembly services globally without compromising quality. We strive to provide the best PCB assembly solutions for every customer. Whether you need low-cost SMT PCB assembly, budget-friendly turnkey PCB assembly, or an economical full-service PCB assembly, LSTPCB is your trusted PCBA partner.

Why Choose Affordable PCB Assembly Services?

Opting for low-cost PCB assembly services offers multiple advantages, especially for startups, small R&Equipes D, or individual designers. Below is an in-depth analysis of why affordable PCB assembly services make sense:

1. Lower R&D Costs

✅ Direct Cost Reduction

  • Discounted Prototyping Fees: Many manufacturers offer low-cost or even free Prototipagem de PCB serviços. Thanks to automated production and intelligent manufacturing processes, production costs are minimized, allowing for more competitive pricing on prototyping.
  • Bulk Prototyping Discounts: If your project requires multiple prototypes, many suppliers provide volume discounts, further reducing the per-unit cost.

✅ Indirect Cost Savings

  • Avoid Initial Investment: PCB assembly requires expensive equipment (such as surface mount technology (Smt) machines and quality inspection systems) and skilled personnel. Outsourcing eliminates the need for upfront investments, lowering financial risks.
  • Save on Facility Costs: No need to build factories or warehouses to store equipment and raw materials, significantly cutting rental and maintenance expenses.

2. Accelerate the R&D Cycle

✅ Fast Turnaround
Many low-cost PCB assembly providers have streamlined production processes and rapid response mechanisms, significantly reducing the time from design submission to prototype delivery. This helps accelerate product development and ensures faster time-to-market.

✅ Early Problem Detection
With one-stop PCBA services, manufacturers can review design files before production to identify potential issues. This prevents costly modifications and rework during the manufacturing process.

LSTPCB ensures you get the best balance of cost, qualidade, and efficiency for your PCB assembly needs. Contact us today to discuss how we can support your next project!

How to Achieve Low-Cost PCB Assembly?

Achieving affordable PCB assembly requires strategic design, cost-effective materials, efficient production, supply chain optimization, and strict quality control. Below are the key methods to reduce costs while maintaining high quality:

1. Optimize PCB Design to Reduce Manufacturing Costs

Design directly impacts cost. A well-planned PCB layout can significantly cut down production expenses:

✅ Reduce Layer Count – Whenever possible, use 2-6 layer PCBs instead of expensive 8+ layer HDI designs, unless absolutely necessary.

✅ Standardized Component Packages – Select widely available SMD components to avoid custom or obsolete parts, which can increase sourcing difficulty and costs.

✅ Improve Routing & Material Utilization – Minimize unnecessary copper fill, optimize PCB shape, and ensure efficient use of materials to reduce waste.

2. Choose Cost-Effective PCB Materials

Different PCB materials vary in cost. For consumer electronics, we recommend:

✅ FR-4 Material – Use standard 140TG or 170TG FR-4, which offers the best cost-performance ratio.

✅ Optimize Copper Thickness – Using 1oz copper instead of 2oz reduces material expenses.

✅ Avoid Over-Engineering – Features like blind/buried vias increase complexity and cost. Keep the design as simple as possible while meeting performance requirements.

3. Efficient SMT Assembly & Manufacturing Process

Em lstpcb, we utilize fully automated SMT production lines, which reduce manual intervention and improve yield rates. Key cost-saving strategies include:

✅ Batch Production Reduces Unit Cost – After prototyping and finalizing the design, switching to mass production significantly lowers per-unit expenses.

✅ DFM (Design para Manufaturabilidade) Optimization – Optimizing the design early minimizes assembly difficulties, improving production efficiency.

✅ High-Speed SMT + Controlled Reflow Soldering – Precise temperature curve control reduces soldering defects and minimizes rework costs.

4. Supply Chain Integration for Lower Component Costs

LSTPCB leverages a stable global component supply chain to help customers:

✅ Bulk Purchase Discounts – Lower procurement costs through volume purchasing.

✅ Localized Component Substitution – Reduce import duties and shipping fees by sourcing alternatives locally.

✅ BOM Optimization – Suggest cost-effective alternative components to ensure the best pricing and stable supply.

5. Quality Control to Minimize Rework Costs

High-quality manufacturing means fewer defects, less rework, and lower overall costs. Em lstpcb, we implement:

✅ 100% Aoi (Inspeção óptica automatizada) – Detect soldering and assembly defects in real time.

✅ X-ray Inspection for BGA Soldering – Ensure no hidden soldering defects, eliminating rework risks.

✅ ICT (Teste no circuito) + Fct (Functional Testing) – Guarantee 99.9%+ final product pass rate, reducing failure-related expenses.

By combining these strategies, LSTPCB delivers affordable, high-quality PCB assembly services that help businesses minimize costs without sacrificing reliability. Contact us today to optimize your PCB manufacturing!

Cheap PCB Assembly Factory in China

LSTPCB is a leading PCBA supplier in China, providing a wide range of affordable PCB assembly services for global customers. We offer comprehensive PCB solutions across various industries, including new energy products, eletrônica de consumo, dispositivos médicos, sistemas de controle industriais, and AI smart products. Whether you require turnkey PCB assembly or consigned PCB assembly, we have the expertise to deliver cost-effective and reliable solutions. Our pricing is highly competitive, ensuring maximum value for our clients.

Service Type

Description

Key Features

Contract PCB Assembly Solutions

PCBasic offers cheap contract PCB assembly services, covering the entire process from component sourcing to final assembly.

Cost-effective

Full PCB assembly service

Flexible contract options

Teste de montagem de PCB Serviços

Cheap price with premium services, ensuring each PCB undergoes rigorous testing to meet performance standards. Including cheap SMT PCB assembly, two-sided PCB assembly, and turnkey PCB assembly.

Efficient Automated Optical Inspection (Aoi)

Thorough Circuit Testing

Meets budget requirements

Cheap Medical PCB Assembly

PCBasic’s cheap medical PCB assembly services meet the rigorous safety and reliability standards of the healthcare industry.

Complies with medical industry standards

Provides high reliability and safety

Suitable for various medical devices and applications

Your Trusted PCBA Service Partner!

LSTPCB is a reliable PCBA service provider, dedicated to offering efficient, high-quality, and cost-effective solutions tailored to your needs.

Famous Flexible PCB Assembly Manufacturer

03/18/2025 em /por

Flexible PCBs are increasingly being used in various electronic devices. Compared to traditional rigid PCBs, flexible PCBs can bend, fold, and twist, making them adaptable to different product designs. This article provides an in-depth discussion on the fundamentals of flexible PCBs, their advantages, application areas, and leading manufacturers.

What is a Flexible PCB?

A flexible printed circuit board (FPCB) is a type of printed circuit made using a flexible insulating substrate. These circuits offer excellent electrical performance, catering to the demands of miniaturization and high-density designs while reducing assembly steps and enhancing reliability. As the only viable solution for compact and mobile electronic products, flexible PCBs can bend, roll, and fold freely, enduring millions of dynamic bending cycles without damaging the conductive traces. They can be arranged according to spatial layout requirements and move or extend in three-dimensional space, enabling seamless component integration and interconnection. Consequentemente, flexible PCBs significantly reduce the size and weight of electronic products, meeting the industry’s demand for high-density, miniaturized, and highly reliable designs.

Advantages of Flexible PCBs

  • Alta confiabilidade
    Constructed with multiple layers of thin films bonded by adhesive layers, flexible PCBs ensure strong impedance control and signal integrity, providing exceptional reliability and stability.

  • Reduced Weight and Thickness
    Unlike rigid PCBs, flexible PCBs utilize lightweight, flexible substrates, which not only reduce the overall product weight and thickness but also contribute to sleeker and more aesthetically appealing designs.

  • Superior Durability and Heat Resistance
    Flexible PCBs maintain excellent performance under repeated mechanical stress, including bending, folding, and twisting. Adicionalmente, they exhibit outstanding thermal resistance, making them suitable for high-temperature environments.

Application Fields of Flexible PCBs

  • Eletrônica de consumo – Used in displays, touch panels, and other components of smartphones, comprimidos, and laptops.
  • Dispositivos médicos – Applied in medical cameras, electrocardiograms, prosthetics, and bone scaffolds.
  • Eletrônica Automotiva – Found in in-car displays, DVD systems, and intelligent driving assistance devices.
  • Industrial Control Equipment – Used in automotive manufacturing robots, printing robots, e mais.

PCBs flexíveis

Famous Flexible PCB Assembly Manufacturer

The following companies are leaders in the FPC industry, excelling in technological expertise, product quality, and market share:

1. Zhen Ding Tech – Taiwan

Overview: Zhen Ding Tech, a subsidiary of Foxconn Group, is one of the world’s largest PCB manufacturers, specializing in high-end flexible PCBs (CPFs) and Rigid-Flex PCBs.

Vantagens:

  • Key supplier for Apple, Huawei, and other global brands

  • Expertise in high-layer-count FPCs and precision Rigid-Flex PCBs

  • Advanced automated production lines to improve yield and efficiency

2. Nippon Mektron – Japan

Overview: A veteran Japanese FPC manufacturer and global market leader, focusing on high-precision, high-density FPCs.

Vantagens:

  • Strong R&D capabilities for premium consumer electronics, médico, and automotive markets

  • Leading technologies in 5G, foldable devices, e eletrônica automotiva

  • Strict quality control compliant with high-standard certifications

3. Career Technology – Taiwan

Overview: A major global FPC supplier, prominent in smartphones, wearables, e eletrônica automotiva.

Vantagens:

  • Key clients include Apple, Samsung, and Tesla

  • Mass production of complex FPCs and multi-layer Rigid-Flex PCBs

  • Automated manufacturing and material optimization for cost reduction

4. Flexium Interconnect – Taiwan

Overview: A specialized FPC manufacturer and core supplier to Apple, targeting high-end consumer electronics.

Vantagens:

  • Expertise in smartphones and wearables

  • Capabilities in FOPLP (Flexible Organic Package Substrate) and high-frequency FPCs

  • Advanced automated production and quality inspection systems

5. Sumitomo Electric Printed Circuits – Japan

Overview: The PCB division of Sumitomo Electric focuses on high-end FPCs, excelling in automotive and high-frequency communication fields.

Vantagens:

  • Advanced PI materials and copper foil technology for enhanced performance

  • Strong presence in automotive, aeroespacial, and medical industries

  • Innovations in high-temperature-resistant and high-frequency FPCs

6. Interflex Co., Ltd. – South Korea

Overview: A leading Korean FPC manufacturer supplying Samsung and expanding into automotive electronics.

Vantagens:

  • Expertise in flexible OLED displays and foldable device FPCs

  • High-precision FPCs with ultra-fine circuits and dense designs

  • Integrated global supply chain for consumer electronics

7. MFS Technology – Singapore

Overview: Specializes in high-reliability FPCs for industrial, médico, e aplicações automotivas.

Vantagens:

  • Customized FPC solutions for niche applications

  • Certificações: ISO 13485, IATF 16949 (medical/automotive standards)

  • Capabilities in high-layer-count FPCs and Rigid-Flex PCBs

8. LSTPCB – China

Overview: A leading Chinese FPC manufacturer serving consumer electronics, Automotivo, and data centers.

Vantagens:

  • Produces 1-10 layer FPCs, 1-40 layer rigid PCBs, e 2-50 layer Rigid-Flex PCBs

  • Uses premium materials (Por exemplo, PI substrates, RA/ED copper foil) and surface treatments (Concordar, Enepic)

  • Complies with IPC 6013 Class 2/3 standards for reliability

Future Trends in Flexible PCBs

As demand for lightweight, miniaturized, and flexible electronics grows, the future of flexible PCBs looks promising. Technological advancements will make FPCs thinner, more durable, and more stable. Compared to rigid PCBs, FPCs offer superior cost efficiency and market competitiveness. Their applications will expand into smart homes, wearable devices, and next-generation robotics, creating diverse and innovative possibilities.