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How to choose a PCB assembly company

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Choosing a correct Montagem da PCB company can quickly complete your PCB project, and at the same time to ensure the quality of the product. The PCB project reaches the assembly stage, indicating that you have invested a lot of time and resources, so it is important to choose the correct assembly company. Good partners can help you reduce costs in all aspects. How to choose the correct assembly company takes time to inspect. Today we will discuss the steps of choosing PCB assembly companies.

What are the content of PCB assembly?

PCB assembly includes the following content:

1. Circuit board composition: A placa de circuito é composta principalmente de almofadas, perforated, installation holes, fios, componentes, plug -in plug -ins, enchimento, electrical boundaries, etc..

2. Welding of components: Welding the component through the pad on the circuit board.

3. Layout of components: According to the function and design requirements of the circuit board, the component is reasonably layout on the circuit board.

4. Connection of the wire: According to the circuit diagram and design requirements, connect the wire correctly between the pads and components of the circuit board.

5. Fix the installation hole: On the back of the circuit board, make some installation holes as needed to fix the circuit board to the chassis or bracket.

6. Fill and coverage: Fill in some parts of the circuit board to fill the insulating material to protect the circuit board from environmental effects, E ao mesmo tempo, it can also improve the mechanical strength of the circuit board.

7. Test and debugging: After completing the assembly, test and debug the circuit board to ensure that its functions are normal.

Select the steps of PCB assembly company

Determine the needs

Each PCB project is different, so the solution will be different. Portanto, when negotiating with PCB companies, you must first clear the needs and spend more time to improve the project.

Determine the experience level of PCB assembly company

Experience is another important factor to determine the choice of PCB assembly companies. An experienced company will stimulate confidence and trust. This is because they have professional teams to ensure high -quality PCBA and fast turnover time. If you want to know the experience of a company, you can go to their website to see, or talk to them directly with them.

Confirm the qualifications and certification

Ensure that the selected PCB assembly company has relevant qualifications and certifications, such as ISO 9001 quality management certification and UL certification, which can ensure the quality of the product and meet the relevant standards.

Confirm the production capacity

It is necessary to understand the production capacity of the PCB assembly company, including the number of production lines, the modernization of equipment, and the level of employee’s technical level to ensure that the production tasks are completed in a limited time and delivered in time in time.

View experience and reputation

Choosing a PCB assembly company with rich experience and good reputation can ensure the quality and reliability of product quality and delivery. You can learn its experience and reputation by viewing the manufacturer’s historical orders and customer evaluation.

Confirm the price and service

Choosing a PCB assembly company with reasonable prices and good services can reduce procurement costs and improve the procurement experience. It is necessary to consider factors such as manufacturers’ prices, after -sales service and distribution methods.

View technical ability

Choosing PCB assembly companies with high technical capabilities can ensure product quality and meet technical requirements. Considering factors such as manufacturers’ technical research and development strength, innovation ability, and patent quantity.

Examine the factory environment and equipment

Choose a PCB assembly company with modern equipment, clean process workshops and good production environment.
Examination of quality management system: Choosing a PCB assembly company with a complete quality management system and a ISO9001 certification company can ensure product quality and stability.

Dating and after -sales service

Choosing PCB assembly companies with small stress and good after -sales service can ensure the timelyness of the order and the quality of after -sales service.

By following these steps, you are much more likely to discover PCB assembly companies who will take care of your project. There is no company more qualified to do so than EEI Manufacturing. With expertise in PCB assembly services and a passion for customer satisfaction, we assure you that you will be pleased with the result of your project.

Como fazer o layout de PCB de alta frequência

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High-frequency PCB refers to the electromagnetic frequency of the higher special circuit boards for high-frequency (frequency greater than 300MHZ or wavelength less than 1 metro) e microondas (frequency greater than 3GHZ or wavelength less than 0.1 metros) in the field of PCB, is in the microwave substrate copper-clad laminate boards on the use of ordinary rigid circuit boards manufactured using some of the process or the use of special treatment methods and the production of circuit boards. High-frequency circuit board circuit design is a very complex process, the layout of each line must be in place, the next will focus on high-frequency circuit board layout methods.

How to layout high frequency pcb？

1. Multilayer board wiring

High-frequency circuits are often highly integrated, wiring density, the use of multi-layer board is both necessary for wiring, but also an effective means of reducing interference. In the PCB Layout stage, a reasonable choice of a certain number of layers of printed circuit board size, can make full use of the intermediate layer to set up shielding, a better realization of the proximity of grounding, and effectively reduce the parasitic inductance and shorten the length of the signal transmission, but also significantly reduce the signal cross-interference, etc., all of which are beneficial to the reliability of high-frequency circuitry.

2. High-speed electronic devices between the pins of the lead bends the less the better

High-frequency circuit wiring of the lead is best to use a straight line, the need to turn, available 45-degree fold or arc turn, this requirement in the low-frequency circuits are only used to improve the strength of the copper foil adhesion, while in the high-frequency circuits to meet this requirement can reduce the high-frequency signals to the outside of the launch and coupling between each other.

3. High-frequency circuit device pins between the lead the shorter the better

Signal radiation intensity is proportional to the length of the signal line, high-frequency signal leads the longer, the easier it is coupled to the components close to it, so for such signals as the clock, crystal, DDR data, LVDS lines, USB lines, HDMI lines, and other high-frequency signal lines are required as much as possible, the shorter the line, Quanto melhor.

4. The fourth trick: high-frequency circuit device pins between the lead layer alternation the less the better!

O chamado “less alternation between the layers of the lead, Quanto melhor” means that the components used in the connection process of the hole (Via) the less the better. According to the side, a hole can bring about 0.5pF of distributed capacitance, reduce the number of holes can significantly improve speed and reduce the possibility of data errors.

5. Pay attention to the signal line close to the parallel alignment of the introduction of “Crosstalk”

High-frequency circuit wiring should pay attention to the signal lines in close proximity to the parallel alignment of the introduction of “Crosstalk”, crosstalk refers to the coupling phenomenon between the signal lines are not directly connected. As high-frequency signals along the transmission line is transmitted in the form of electromagnetic waves, the signal line will play the role of the antenna, the energy of the electromagnetic field will be emitted around the transmission line, the signal due to the mutual coupling of the electromagnetic field and the resulting undesired noise signal is called crosstalk. parameters of the PCB board layer, the spacing of the signal line, the driving end and the receiving end of the electrical characteristics, as well as the signal line termination method of the crosstalk have a certain impact. Então, in order to reduce the crosstalk of high-frequency signals Therefore, in order to reduce the crosstalk of high-frequency signals, it is required to do the following as much as possible when wiring:

Under the condition that the wiring space allows, insert a ground line or ground plane between two lines with serious crosstalk, which can play the role of isolation and reduce crosstalk. When the space around the signal line itself there is a time-varying electromagnetic field, if you can not avoid parallel distribution, parallel signal lines can be arranged on the opposite side of a large area of “chão” to significantly reduce the interference.

Under the premise of wiring space permits, increase the spacing between adjacent signal lines, reduce the parallel length of the signal lines, clock lines as perpendicular as possible with the key signal lines rather than parallel. If the parallel alignment within the same layer is almost unavoidable, in two adjacent layers, the direction of the alignment must be perpendicular to each other.

Em circuitos digitais, the clock signal is usually a fast-edge signal, external crosstalk. Portanto, no design, the clock line should be surrounded by ground wires and more ground holes to reduce the distribution capacitance, thereby reducing crosstalk. Clock on high-frequency signals try to use low-voltage differential clock signals and packet ground way, need to pay attention to the integrity of the packet ground hole punching.

Idle not used inputs do not hang, but will be grounded or connected to the power supply (power in the high-frequency signal loop is also the ground), because the suspended line may be equivalent to the transmitting antenna, grounding will be able to inhibit the emission. Practice has shown that this approach to eliminate crosstalk can sometimes be immediately effective.

6. IC block power supply pins to increase the high-frequency decoupling capacitance

Each integrated circuit block power supply pin near the increase of a high-frequency decoupling capacitance. Increase the power supply pin high-frequency decoupling capacitance, can effectively inhibit the power supply pin on the high-frequency harmonics form interference.

7. Isolation of high-frequency digital and analog signal ground lines

Analog ground, digital ground line to the public ground with high-frequency choke bead connection or direct isolation and choose a suitable place for single-point interconnection. High-frequency digital signal ground potential is generally inconsistent, there is often a certain voltage difference between the two directly; e, high-frequency digital signal ground is often with a very rich high-frequency signal harmonic components, when directly connected to the digital signal ground and analog signal ground, high-frequency signal harmonics will be coupled through the ground to the analog signal to interfere with the way.
Em geral, the high-frequency digital signal ground and analog signal ground is to do the isolation, can be used in the appropriate location of a single point of interconnection, or the use of high-frequency choke bead interconnection.

8. Avoid the formation of the loop alignment

Various types of high-frequency signal alignment try not to form a loop, if you can not avoid the loop area should be as small as possible.

9. Must ensure good signal impedance matching

Signal in the transmission process, when the impedance mismatch, the signal will occur in the transmission channel signal reflection, reflection will make the synthesized signal overshoot, resulting in the signal fluctuations in the vicinity of the logic threshold.
Eliminate the reflection of the fundamental approach is to make the transmission signal impedance is well-matched, due to the load impedance and the transmission line of the characteristic impedance of the larger the difference between the reflection of the larger, so should be as much as possible to make the signal transmission line of the characteristic impedance of the load impedance and load impedance is equal; ao mesmo tempo, but also to pay attention to the PCB on the transmission line can not be a sudden change or corners, as far as possible to maintain the transmission line at all points of the impedance continuity, or in the transmission line between the various segments will be a reflection.

10. Maintain the integrity of the signal transmission

Maintain the integrity of the signal transmission, to prevent the “ground bounce phenomenon” caused by the division of the ground.

LST Technology participou da Philippine Semiconductor and Electronics Show

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Em outubro 27, 2023, a 18ª Exposição de Eletrônica das Filipinas (CÃES) terminou com sucesso. Como a maior e mais confiável exposição eletrônica das Filipinas, comerciantes de países dos Estados Unidos, França, França, Alemanha, Japão, China, Coréia do Sul, etc.. venha para a exposição. Empresas, incluindo fabricação de semicondutores, eletrônica de consumo, casas inteligentes, Manufatura de PCB, equipamentos de produção e outros campos oferecem uma variedade de opções para o mercado das Filipinas.

Como fornecedor de soluções completas de PCB, A Shenzhen LST Technology trouxe uma variedade de amostras PACB e soluções de fabricação eletrônica para o público. Durante a exposição, mostramos uma série de alto desempenho, produtos de placa de circuito PCB de alta qualidade, incluindo alta precisão, alta confiabilidade, placa PCB de alta integração, e soluções customizadas. Também apresentamos as características de nossos produtos e vantagens técnicas aos visitantes por meio de folheto, exibir vídeo e outros métodos.

Através dos intercâmbios de exposições, permitir que mais clientes conheçam e entendam o LST, e também sabemos mais claramente sobre a procura do mercado. Vamos aderir ao conceito de produção de “eficiente, transparente, alta qualidade”, e fornecer design de alta qualidade para clientes globais em todo o mundo Serviço de produção.

Shenzhen LST Technology é um fornecedor profissional de fabricação de PCB. Ao mesmo tempo, também fornecemos um serviço completo de fabricação eletrônica. Nossas áreas de serviço incluem casas inteligentes, eletrônica de consumo, novos produtos energéticos, equipamento médico, acessórios automotivos, etc.. Congratulamo-nos com clientes globais para visitar nossa empresa.

Introdução à tecnologia de gravação de PCB

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Manufatura de PCB requires a variety of processes, among which PCB etching is the most important link. Eclipse refers to the process of removing excess copper from the PCB light board, and the remaining PCB line diagram.

It sounds simple, but it contains a lot of complex craftsmanship. In order to help everyone better understand PCB etching technology, we deliberately prepare an operating guide for everyone to learn and discuss. O conteúdo específico é o seguinte.

What is PCB etching?

PCB etching is the process of removing unwanted copper from a printed circuit board. Once all of the excess copper has been removed from the PCB, only the required circuit remains.

Before the etching process begins, a layout for the board is generated. This desired layout for the board is transferred onto a PCB by a process called photolithography. This forms the blueprint that decides which pieces of copper must be removed from the board.

On the outer layer of the PCB, the tin plating acts as the etch resist. No entanto, in the inner layer, the photoresist is the etch resist. De um modo geral, there are two approaches to inner layer and outer layer PCB etching. These are dry etching and wet etching. Here at ABL Circuits, we use a wet etching process using a Tech Win Alkali Etching Machine.

Wet PC B etching method

Wet etching is um etching process in which unwanted materials are dissolved when immersed in chemical solutions.

According to the erosion agent used, Fabricante de PCB Tongyu adopts two wet etching methods:

1. Acid etching (iron chloride and copper chloride).

2. Alkaline etching (ammonia)

Acid etching process

The acidic method is used to etch the inner rigid PCB camada, which involves chemical solvents, such as iron chloride FECL3 or copper chloride (CUCI2). Compared to alkaline methods, acidic methods are more accurate, cheaper but more time-consuming. This method is suitable for the inner layer, because acid will not react with the photoresist, nor will it damage the required part. Além disso, in this method, the bottom cut is the smallest.

The bottom cut is the horizontal corruption of the etching material below the most lead layer. When the solution encounters copper, it attacks copper and leaves a protected orbit. Use anti-corrosion electroplating or light shielding to protect the track. At the edge of the track, a certain amount of copper will always be removed below the resistance, which is called the bottom cut.

1. Copper etching

Copper chloride is the most widely used etching agent because it can accurately etch fewer characteristics. The ammonia process also provides a constant etching rate and continuous regeneration at a lower cost.

The maximum etching rate of the copper chloride system is a combination of copper hydride-sodium ammonia-HCI system. The combination provides a maximum turbid engraving rate of 55 seconds at 130 ° F. Portanto, this type of etching is used for the inner layer of etching the fine line

Observação: The use of chlorine gas requires adequate ventilation, storage tanks and cylinders to store and leak detection equipment. Além disso, it must be approved by the emergency agreement, personal protection equipment, trained operators, and the fire department.

2. Triscel oxide etching

Due to the high cost of copper etching agents, the use of iron chloride etching agents in industry is limited. No entanto, iron chloride is an attractive spray etching because it is easy to use, the ability to maintain copper, and the ability to use it in rare batch applications. Iron chloride can be used with silk ink, lithography glue and gold pattern, but cannot be used with tin or tin/lead.

Geralmente, the iron chloride solution is dissolved in water, with a concentration range of 28-42% (by weight). HCI (5%) is also mixed with the solution to prevent the formation of insoluble hydroxide and iron oxide.

The iron chloride ratio is usually 36 BE, or about 4.0LB/Gal Feci3. O content (HCL) for commercial use is within 1.5 para 2%.

Alkaline etching process

Alkaline method is used to etch the PCB outer layer. Aqui, the chemicals used are copper chloride (CUCL2) ten hydrochloride (HCI)+hidrogênio peroxide (H2O2)+water (H20) composição. The alkaline method is a fast process, and it is also a bit expensive. The parameters of this process must be carefully followed, because if you touch o solvents for a long time it will destroy the circuit board, the process must be well controlled.

The entire process is carried out in a high pressure air spray, and the PCB is exposed to the fresh etching spray. Some important parameters are required in o alkaline PCB etching. They are the amount of panel movement, chemical spray, and copper to be etched. This ensures that the etching process is completed uniformly through the straight end.

Em o etching destruction, the points that are not required for copper etching are breakpoints. This is usually done from the midpoint of the atomicization chamber. Por exemplo, assuming the length of the atomization chamber is 2 metros, the breakpoint will be reached when the plate reaches the intermediate point.

PCB Etching Process

The PCB etching process must follow the following steps:

Etapa 1: The very first step of the etching process is designing the circuit, using the software of your choice. Once the design is ready, flip it, and then get it printed.

Etapa 2:On the transfer paper, print the circuit design. Make sure that the design is printed on the shiny side of the paper.

Etapa 3: Agora, take the copper plate, and rub sand paper on it. This will make the surface of copper rough, and thus helps it to hold the design efficiently. There are certain points to remember step 3 till the last step:

Use safety gloves, while handling copper plate and etching solution. This will prevent the oil from hands getting transferred to copper plate, and will also protect your hands from the solution or chemicals.
When you are sanding the copper plate, make sure you do it properly especially at the edges of the plate.
Etapa 4: Agora, wash the plate by some rubbing alcohol and water, so that any small particles of copper that get removed from the surface during sanding are washed off. Allow the plate to dry after washing.

Etapa 5: Cut the printed design properly, and place them on the copper plate facing down.

Etapa 6: The copper plate is now passed through the laminator several times until the plate gets heated.

Etapa 7: Take the plate out from the laminator, after it is hot, and hold it in a cold bath. Agitate the plate so that all the paper comes off and floats on the water. You will see a traced circuit in black on the copper plate.

Etapa 8: Now take the board out of the bath, and place it in the etching solution. Agitate the copper plate for around 30 minutos. Ensure that all the copper around the design is dissolved.

Etapa 9: Take out the copper plate and wash it in the water bath again. Keep it to dry. Once it has dried completely, you can use rubbing alcohol to remove the ink transferred to the printed circuit board.

Etapa 10: This completes the etching process of a printed circuit board. You can now drill the holes using proper tools with the required drill bit size.

Sobre nós

LST Technology is a professional PCB and PCBA fabricantes. We provide one-stop production services for global customers. Em 18 anos, PCB manufacturing assembly experience. If you have PCB business needs, please leave a message to us. I will reply to you for a while.

2-layer PCB VS 4-layer PCB: Advantages and Disadvantages Introduction

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When manufacturing electronic products, the selection of the type of circuit board is a relatively important step. Por exemplo, whether to use single-layer PCB, 2-layer PCB, ou PCB multicamadas. Claro, these issues are in the product design stage . Each type of PCB has unique advantages. We must choose according to the performance of the product.

Now we will discuss the advantages and disadvantages of 2-layer PCBs and 4-layer PCBs. O conteúdo específico é o seguinte:

Introduction to the concept

What is a 2-layer PCB?

A 2-layer circuit board is a circuit board with only two conductive layers and no gaps between the layers. Each layer can be wired for circuits, and the two layers do not lead to each other. This type of circuit board is generally used for simpler circuit designs, such as some small electronic devices, brinquedos, etc.. Its advantages are easy to manufacture, baixo custo, suitable for small-scale production, etc..

What is a 4-layer circuit board?

A 4-layer circuit board is a circuit board that has four conductive layers with vias connecting the layers. This type of board is often used for more complex circuit designs, como equipamento de comunicação, computer networks, etc.. It has the advantage of providing more circuitry. Its advantages include more wiring space, higher signal quality and more stable performance.

4-layer circuit boards are more difficult to design and fabricate, and require a higher level of technology and equipment, so their cost is also relatively high. No entanto, it can provide better signal quality and more stable performance, and is suitable for application scenarios that require higher circuit performance.

2-Layer PCB Advantages and Disadvantages

Vantagens

▶ Lower Cost – double sided PCBs are less expensive than 4-layer designs. This difference can be considerable depending on the number of units you intend to order.

▶ Simpler Design and Production – simpler design and production not only means you get your printed circuit boards faster. The simpler your design is, the less vulnerable it is to costly errors during the design or manufacturing process. In certain applications, the ability to repair your PCB at a later date is also important; when compared to more complex 4-layer PCBs, it is inherently easier to repair double sided printed circuit boards.

▶ High Volume – Whenever projects require mass production, eliminating unnecessary layers is vital. If your project is going to be a high-volume order, 2-layer boards are typically preferred to optimize manufacturing speed, custo, and efficiency.

▶ Short Lead Time – For large and small projects, a shorter lead time is often required to quickly make a prototype. 2-layer PCBs have an advantage over other multilayer printed circuit boards, because they are extremely fast to produce.

Desvantagens

▶ Simplistic Design – Oftentimes opting for a double sided circuit board means sacrificing some bells and whistles. A 4-layer PCB has more room for more components and routing options, while a 2-layer PCB typically has a simple design.

▶ Slower Speed and Lower Operating Capacity – If speed is an issue, the more layers, Quanto melhor. Depending on the application, you may find that 2 layers isn’t enough to give you the necessary speed and capacity for your project. The jump from 2 layers to 4 layers includes considerably more speed and operating capacity.

▶ Larger Size and Higher Weight – Despite 4-layer printed circuit boards having more layers, double sided PCBs are typically quite large and bulky in comparison to make room for components and leads. If you need to fit your printed circuit board into a compact space, adding more layers is often the best design choice.

4-Layer PCB Advantages and Disadvantages

Vantagens

▶ Useful for More Complicated Projects – The more complex your project is, the more useful you will find the additional layers of a 4-layer PCB. Being able to increase your creative design choices including layouts, routing, and additional components, gives you the opportunity to make the best end product possible.

▶ High Quality – For even simple products that demand the highest quality, going from a 2-layer to a 4-layer Design de PCB is an obvious choice. If cost is not an issue, 4-layer boards offer a higher quality result.

▶ Added Power – The ability to handle more power is a considerable advantage for 4-layer PCBs. When you are deciding whether you need a double sided or 4-layer printed circuit board, keep in mind how much power your design will require.

▶ Increased Durability – The more layers your design has, the more durable your PCB will be. UM 4 layer design will be much more substantial than a 2-layer printed circuit board, despite typically being smaller in size.

▶ Smaller Size and Lighter Weight – While many people conflate a larger number layers with a larger sized board, 4-layer boards are actually often much smaller and lighter than 2-layer PCBs. This is because they require less room for components and wiring.

Desvantagens

▶ Higher Costs – Since 4-layer PCBs use more materials and are more difficult to manufacture, they can be quite a lot more than 2-layer printed circuit boards. When costs are an issue, minimizing the number of layers is usually the best option.

▶ More Complicated Design and Production – When you need to quickly design and produce printed circuit boards for a project, the more layers you have, the longer each step of the process is going to take.

▶ Less Availability – You will find that the more complex your design is, the harder it is to find a manufacturer who can accommodate your needs. That being said, 4-layer designs are very common these days, so this becomes more of an issue as your PCB designs begin to get even more complicated.

▶ Longer Lead Times – For projects that are in a time crunch, adding layers to your design isn’t ideal. The smaller your timeframe is, the more important it will be to use as few layers as possible for your project.

▶ More Complex Repairs – Double-sided printed circuit boards have an advantage over 4-layer designs when it comes to ease of repairs. While everything is essentially exposed on 2-layer designs, any necessary repairs for 4-layer PCBs are going to be more difficult. For some applications, this is extremely important and should be taken into consideration.

2 Layer PCB vs 4 Layer PCB

Designs of 2 Layer PCB vs 4 Layer PCB

Vias in 2 layer PCB are used to create electrical connections that enable the routing of the traces so that they reach the opposite side of the board. Even more surface area is available for traces in a 4 layer PCB design than that in a 2 layer PCB. O 4 layer PCB design involves a prepreg layer that bonds two layers and a double-sided boards together by applying heat and pressure. Prepreg provides dielectric between the layers.

Functionality of 2 Layer PCB vs 4 Layer PCB

If the microstrip traces comprising a ground plane are utilized, o 2 layer PCB delivers more functionality as there are no propagation delays or other problems. No entanto, a 4-layer PCB design consisting of ground and VCC plane layers and 2 signal layers is more preferred. This design struggle with impedance and propagation delays.

Cost of 2 Layer PCB vs 4 Layer PCB

Due to complexity of design, higher sensitivity, the higher levels of signal integrity and reduced interference levels, o 4 layer PCB is more expensive than a 2 layer PCB. The price of 2 layer PCB can be as low as $2/piece, and the cost of 4 layer pcb can be as low as $6.5/piece in ALLPCB.com.

Lead Time of 2 Layer PCB vs 4 Layer PCB

The After your payment, your 2 layer pcb order with standard manufacturing specifications can be shipped within 24 hours and the lead time of your 4 layer pcb order can be within 48 hours on ALLPCB.com. Order now, we offer worldwide free shipping service!

Introdução ao processo e etapas de processamento de PCB cerâmico

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Ceramic PCB has the advantages of high heat dissipation, high insulation, low expansion coefficient, resistência à corrosão, etc., and is widely used in aerospace, eletrônica automotiva, smart lighting, biomédico, and 5G interconnection. Nos últimos anos, more and more products use ceramic PCB, according to the relevant data survey: the global substrato cerâmico market size reached 1.13 billion U.S. dollars in 2022, and is expected to reach 4.15 billion U.S. dollars in 2029, with a compound annual growth rate of 18.23%.

Ceramic PCB production process many people still do not know, then we will give you a detailed introduction to the production process of ceramic PCB and manufacturing process, to help you better understand the ceramic PCB.

What is ceramic PCB?

Ceramic PCB is a ceramic-based printed circuit board, using thermally conductive ceramic powder and organic binder preparation, thermal conductivity of 9-20W/m. Ceramic PCB has excellent electrical insulation properties, alta condutividade térmica, excellent soft brazing and high adhesion strength, and can be etched like PCB boards can be a variety of graphics, has a large current-carrying capacity. In high-power power electronic circuit structure technology and interconnection technology, ceramic PCB has become the basic material.

What are the processes of ceramic PCB?

1.direct copper plating ceramic substrate process

DPC substrate has the advantages of high graphic accuracy, vertical interconnection, etc., mainly used in high-power packaging.

2.direct bonding process of copper ceramic substrate

The DBC line layer is thicker, better heat resistant, mainly used in high power, high temperature variations of the IGBT package.

3.thick film printing ceramic substrate process

TPC thick ceramic substrate heat resistance, baixo custo, but poor line layer accuracy, mainly used in automotive sensors and other fields.

4.thin film ceramic substrate process

In the plane ceramic substrate, thin film ceramic substrate TFC substrate graphic accuracy, but the metal layer is thin, mainly used in small current optoelectronic device packaging.

5. AMB active brazing process

The AMB substrate line layer is thicker, better heat resistance, mainly used in high power, large temperature variations of the IGBT package.

6.multilayer htcc high temperature co-firing process

High temperature co-fired ceramic materials are mainly alumina, mullite and aluminum nitride as the main components of ceramics. HTCC ceramic powder does not join the glass material. Conductor slurry uses materials for tungsten, molybdenum, molybdenum, manganese and other high melting point metal heat resistant slurry. Sintering temperature of 1600 ° ~ 1800 °.

7. multilayer ltcc low temperature co-firing process

Low temperature co-fired ceramics to ensure that the low temperature co-firing conditions have a high sintering density, usually added to the amorphous glass component, crystallized glass, low melting point oxides to promote sintering. Glass and ceramic composites are typical low-temperature co-fired ceramic materials. Sintering temperature 900 ° ~ 1000 °, LTCC using high conductivity and low melting point of Au, Ag, Cu and other metals as a conductor material, is mainly used in high-frequency wireless communications, aeroespacial, memória, motoristas, filters, sensores, and automotive electronics and other fields.

Production Process of Ceramic PCB

Ceramic PCB board is a high-performance circuit board with excellent thermal conductivity, high temperature resistance and corrosion resistance. It is widely used in high-end electronic products. The following is a detailed introduction to the production process of ceramic PCB.

1. Raw material preparation

Em primeiro lugar, you need to prepare the raw materials needed to make ceramic PCB boards, including ceramic powder, aglutinante orgânico, additives and metal wires.

2. Board processing

After mixing ceramic powder with organic binder, ceramic plates are made by pressing and molding. Metal wires or other conductive materials are then attached to the plate and fine-tuned and cut to conform to design requirements.

3. Soco

Holes are punched into ceramic plates, usually by laser drilling or mechanical drilling. This step requires great care to ensure that the holes are in the correct position.

4. Graphicization of the inner circuit

Inner circuit patterning refers to the conversion of the designed circuit pattern into an actual circuit layout. This step is usually performed using photolithography, wherein the circuit pattern is printed on the inner layer of the ceramic board by photolithography.

5. Goldizing

After completing the patterning of the inner layer circuit, metallization is required. This step includes copper etching and gold plating operations to ensure that the circuit board has good conductive properties.

6. Outer layer circuit patterning

Outer layer circuit patterning refers to the design of the external circuit layout . The actual circuit layout of this step is usually similar to the inner layer circuit patterning photolithography.

7. Soldering and Assembly

After completion of the outer layer of circuit patterning, the need for soldering and assembly operations. This step includes patching, plug-in, connector and other operations to ensure that the entire electronic product has good functional performance.

8. Testing and inspection

After the completion of the ceramic PCB board, you need to carry out testing and inspection operations. This step usually includes appearance inspection, teste funcional, voltage testing, high temperature testing and other aspects to ensure that the product meets the design requirements and has stable and reliable performance.

LST Technology specializes in ceramic Montagem da PCB e processamento, if you want to get more information about ceramic PCB, please leave us a message, we will contact you in 24 horas.

O que é serviço de montagem de construção de caixa?

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A produção eletrônica envolve muitas peças e componentes, e precisamos coordenar com os fornecedores para coordenar os materiais necessários um por um. Quando realizamos produção em massa, alguns fabricantes podem ajudá-lo a concluir a tarefa de montagem com mais eficiência. O montagem de construção de caixa serviço é uma boa maneira.

O serviço de montagem em caixa não é adequado para todos os produtos eletrônicos. Felizmente, você tem uma escolha. A fabricação de caixas eletrônicas é um desenvolvimento relativamente novo no fabricação eletrônica indústria. Para integração completa do sistema, a construção de caixas pode ser a escolha certa para o seu próximo projeto.

O que é montagem de construção de caixa?

A montagem da caixa refere-se ao processo de montagem, integrando, e testar vários componentes e módulos eletrônicos em um produto totalmente funcional dentro de um gabinete ou “caixa”. Envolve levar placas de circuito impresso carregadas com componentes (conhecidos como conjuntos de PCB), interconectando-os com chicotes elétricos, e adicionando fontes de alimentação, conectores, peças eletromecânicas como interruptores e sensores, e outros hardwares. Todas essas peças são montadas e montadas em estruturas ou gabinetes feitos de metal ou plástico resistente que podem suportar ambientes físicos exigentes.

O resultado final do processo de construção da caixa é uma unidade de produto eletrônico completamente montada e pronta para integração na aplicação final, como dispositivos médicos, sistemas de controle industriais, equipamento de telecomunicações, e muitos outros produtos eletrônicos que usamos diariamente. A montagem da caixa requer colaboração entre engenheiros de projeto, especialistas em sourcing, e técnicos de fabricação para levar um produto desde o conceito inicial até a prototipagem, teste, corridas piloto, e produção em massa final.

Quais são algumas aplicações comuns de montagem de PCB e caixa?

Imagem da montagem da caixa em produçãoTudo, desde o telefone celular até o monitor do computador, requer montagem de placa de circuito impresso. Exemplos comuns de aplicações de montagem em caixa incluem os seguintes.

Caixa é construída como painéis
Os painéis de controle são essenciais para a indústria de manufatura e orientam a operação de máquinas pesadas. Além das placas de circuito, um painel de controle pode conter interruptores, transformadores, acionamentos de motor, empreiteiros, disjuntores, e outros componentes elétricos que mantêm o maquinário funcionando de forma segura e confiável. A NAI pode fabricar qualquer painel de controle que sua empresa exija.

Use construções de caixa para circuitos integrados
ICs são usados ​​em praticamente tudo, de computadores a telefones celulares e eletrodomésticos. Um circuito integrado (ou CI) é o alicerce fundamental de todos os dispositivos eletrônicos modernos.

Um IC é um sistema integrado de numerosos componentes miniaturizados e interconectados incorporados em um fino substrato de material semicondutor.. Os ICs permitem velocidades mais rápidas e maior capacidade, ao mesmo tempo que evoluem para tamanhos cada vez menores. Veja nossos recursos completos de projeto eletromecânico para ver como a NAI pode ajudar em seu próximo projeto.

Escolha seus conjuntos de cabos de montagem em caixa
Você pode encontrar cabos em setores que vão desde serviços públicos, fabricação, tecnologia, e mais. Trabalhando com LST, um fabricante de montagem de cabos personalizados, eles podem ajudá-lo a escolher o melhor tipo de cabo, opções de conector, blocos terminais, materiais de isolamento, e mais. Oferecemos opções de produtos para cobre, fibra óptica, e conjuntos de cabos híbridos.

O processo de construção da caixa

O processo de construção da caixa pode variar tanto quanto o design exigir. É específico para cada projeto. No entanto, normalmente inclui a instalação de subconjuntos e outros componentes, roteamento de cabos ou chicotes de fios, e fabricação de gabinetes. É todo o trabalho de montagem envolvido em um sistema eletromecânico completo com peças móveis e subconjuntos.

O processo de montagem de construção de caixa mais comum também inclui configuração e teste, bem como armazenamento e transporte. Você fornece os desenhos ou o dispositivo para o seu CM fazer engenharia reversa, e eles fazem o resto. É por isso que é fundamental escolher o fabricante eletrônico certo.

Benefícios de usar o serviço de montagem de construção de caixa

Usar uma abordagem de montagem em caixa oferece vários benefícios, especialmente quando comparado à montagem de produtos usando componentes separados ou fabricação interna. Os principais benefícios incluem:

Gerenciamento simplificado da cadeia de suprimentos

Uma grande vantagem da montagem em caixa é agilizar sua cadeia de suprimentos. Em vez de gerenciar vários fornecedores diferentes, enviando componentes e submontagens individuais, você está adquirindo um completo, produto pronto para uso de apenas um fornecedor.

Economize tempo e dinheiro

A terceirização da montagem da caixa agiliza a produção e reduz custos. Em vez de lidar com vários fornecedores, conjunto, teste, e processos de controle de qualidade separadamente, você agiliza essas atividades contando com um único fornecedor.

Experiência e Especialização

Em vez de tentar dominar você mesmo os muitos processos intrincados de montagem e teste, você pode contar com o conhecimento experiente do montador. Aproveite as habilidades que eles aperfeiçoaram ao longo de anos de produção de caixas. Suas equipes de engenharia têm muita experiência para garantir um produto final de alta qualidade.

Garanta a qualidade

Fornecedores respeitáveis ​​de montagem de caixas mantêm rigoroso controle de qualidade. Isso pode resultar em um produto final de maior qualidade, já que o fornecedor se concentra na montagem consistente e em testes completos.

Escalabilidade

Uma grande vantagem de usar um montador de caixa é sua flexibilidade para aumentar ou diminuir a produção. Tanto para pequenos lotes de protótipos quanto para grandes tiragens de produção, montadores respeitáveis ​​têm a capacidade de fabricar qualquer número que você precisar. Com amplas instalações, equipamento avançado, e pessoal qualificado, eles podem lidar com qualquer quantidade de montagem em caixa. Eles podem se adaptar facilmente para produzir exatamente o volume que você precisa quando precisa.

Se você está procurando um fabricante de montagem de caixas, LST é uma escolha muito boa. Temos mais do que 10 anos de experiência em fabricação eletrônica. Temos uma equipe técnica muito profissional que pode iniciar seu negócio de fabricação de caixas de forma rápida e eficiente. Entre em contato conosco e receba a oferta gratuitamente.

Análise de projeto do sistema de fonte de alimentação PCB

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Hoje, it is difficult to successfully design high-speed electronic systems without a thorough understanding of the power supply system characteristics of the chip, package structure and PCB. Na verdade, in order to meet the requirements of lower supply voltages, faster signal flip-flops, higher integration, and many more challenging requirements, many companies at the forefront of electronic design have invested a lot of money, manpower, and resources in the analysis of power supply systems to ensure the integrity of power supplies and signals during the product design process.

Power supply system (PDS) analysis and design is becoming increasingly important in the field of high-speed circuit design, especially in the computer, semicondutor, comunicações, networking and consumer electronics industries. With the inevitable further isotropic shrinkage of ultra-large-scale integrated circuit technology, the supply voltage of integrated circuits will continue to decrease. As more and more manufacturers move from 130nm technology to 90nm technology, it is expected that the supply voltage will drop to 1.2V or even lower, while at the same time the current will increase significantly. From DC IR voltage drop to AC dynamic voltage fluctuation control, this development trend poses a great challenge to the design of power supply systems as the allowable noise range becomes smaller and smaller.

The design of PCB power supply system mainly involves the following aspects:

➤ Circuit design: according to the needs of the equipment, design a reasonable power supply circuit. This requires consideration of factors such as circuit stability, eficiência, safety and cost.

➤ Component selection: According to the circuit design, select appropriate components such as resistors, capacitores, Indutores, etc.. to meet the performance and cost requirements.

➤ Wiring Arrangement: Determine the layout and alignment of components on the circuit board to reduce the internal resistance of the power supply, avoid electromagnetic interference, and improve the reliability of the system.

➤ Heat dissipation design: Considering that the power supply generates heat during operation, it is necessary to design a reasonable heat dissipation scheme to ensure the stability and reliability of the power supply system.

Technical Challenges

In the design of PCB power supply system, the following technical challenges may be encountered:

▲ Circuit stability: The stability of the power supply circuit directly affects the performance of the entire device. Unstable or fluctuating power supply circuits may cause the device to malfunction or not work properly.

▲Component durability: Components in the power supply system may wear out or fail during operation. How to improve the durability and reliability of components is an important issue to be addressed in the design of the power supply system.

▲System anti-interference ability: power supply system in the working process, may be subject to electromagnetic interference from the outside world, how to improve the anti-interference ability of the system in the power supply design, is also an important technical challenge.

Soluções

In response to the above technical challenges, the following are some possible solutions:

〓 Circuit Design Optimisation: Adopt reasonable circuit topology and component layout to improve the stability and efficiency of the power system. Por exemplo, power supply circuits that require high stability, mature and stable power supply topologies such as LDOs (Low Noise Linear Regulators) or switching power supplies can be used.

〓 Component Quality Assurance: Select components with reliable and durable quality, and consider factors such as component tolerance and thermal characteristics in the design process. Por exemplo, grade X and Y resistors and capacitors are selected to meet the needs of high temperature, high humidity and harsh environments.

〓 wiring arrangement is reasonable: in the circuit board layout and alignment design, the power supply internal resistance and electromagnetic interference should be fully considered. Por exemplo, the main power line and ground line should be thickened to reduce internal resistance; ao mesmo tempo, a reasonable signal line layout and filtering design should be adopted to reduce electromagnetic interference.

〓 heat dissipation design: according to the actual working condition, choose the appropriate heat dissipation scheme. Por exemplo, for power modules with large power, active heat dissipation methods such as heat sinks or fans can be used; for power chips with small power, natural heat dissipation can be used.

Conclusão

PCB power supply system design is an important part of electronic equipment. In the actual design, we must give full consideration to technical challenges such as circuit stability, component durability and system anti-interference ability, and improve the performance and reliability of the power supply system by optimizing circuit design, ensuring component quality, and rationally arranging wiring and heat dissipation design. In the future electronic equipment, with the continuous progress of technology and the continuous expansion of application scenarios, the design of PCB power supply systems will face more new challenges. Portanto, we need to constantly update our design concepts and methods to adapt to changing market demand and technology trends.

Custo e preço de PCBs flexíveis

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PCB flexível, também conhecido como FPC, é um PCB flexível feito de filme de poliimida ou poliéster como substrato. Tem as características de flexibilidade, peso leve, compacidade, dobrar e dobrar, fiação tridimensional , etc., em relação ao painel duro PCB tradicional, com maior eficiência de produção, densidade de fiação e peso leve, espessura fina e outras vantagens.

PCB flexível na indústria eletrônica inteligente, portátil, tendência fina e leve é ​​amplamente utilizada em displays flexíveis, dispositivos vestíveis, telefones inteligentes e outros campos, mas também nos últimos anos segmentos da indústria de PCB na categoria de crescimento mais rápido. As principais matérias-primas na parte superior da cadeia industrial incluem laminado revestido de cobre flexível (FCCL), filme de cobertura, componentes, filme de proteção, papel adesivo, aço, aditivos de chapeamento, filme seco e outras oito categorias, dos quais o filme em folha FCCL é comumente encontrado em filme de poliimida (Pi), poliéster (BICHO DE ESTIMAÇÃO), dicarboxilato de naftaleno de polietilenoglicol (CANETA), LCD de alto polímero (LCP), e outros materiais poliméricos, como filme plástico. O midstream é a fabricação de FPC, e o downstream é para diversas aplicações, incluindo módulos de display/toque, módulos de identificação de impressão digital, módulos de câmera, etc.. As aplicações finais incluem produtos eletrônicos de consumo, equipamento de comunicação, eletrônica automotiva, controle industrial médico, aeroespacial e outros campos.

Quais são os componentes de um PCB flexível?

PCB flexível é composto principalmente pelas seguintes partes:

1. Substrato flexível: O substrato de um PCB flexível é geralmente feito de filme de poliimida ou outros materiais poliméricos, que são flexíveis e flexíveis.
2. camada condutora: PCB flexível geralmente contém uma ou mais camadas condutoras, esta camada condutora feita de cobre ou outros metais, usado para transmitir sinais e eletricidade.
3. Isolamento: O isolamento é usado para isolar as camadas condutoras para evitar curtos-circuitos e interferência eletromagnética. A camada isolante pode ser feita de poliimida, poliéster ou outros materiais poliméricos.
4. Camada Protetora: Uma camada protetora pode ser adicionada à superfície do PCB flexível para evitar fatores ambientais (como umidade, pó, contaminantes, etc.) na placa de circuito.
5. Conectores: PCBs flexíveis geralmente contêm conectores para fazer conexões com outras placas de circuito ou componentes.
Junto, esses componentes constituem o PCB flexível, permitindo que ele se adapte a uma variedade de formas curvas e torcidas, mantendo um desempenho elétrico confiável

Os fatores que afetam o preço dos PCBs flexíveis incluem os seguintes:

1. Substrato e material: O substrato e o material do PCB flexível têm um impacto significativo no seu preço. Por exemplo, o uso de materiais FR-4 de alta qualidade é mais caro do que o uso de materiais de baixa qualidade, e materiais especiais (como PTFE) também afetará o preço.

2. Número de camadas: O número de camadas de um PCB flexível também é um dos fatores que afeta o preço. Menos camadas são geralmente mais baratas do que mais camadas.

3. Largura e espaçamento da linha: A largura e o espaçamento flexíveis da linha PCB também afetarão o preço. Linhas e espaçamentos mais estreitos exigem maior precisão e tecnologia de fabricação, então o preço é mais alto.

4. Quantidades de produção: O preço dos PCBs flexíveis geralmente aumenta à medida que o número de PCBs flexíveis diminui, e PCBs flexíveis produzidos em massa são geralmente mais baratos do que pequenas quantidades de PCBs flexíveis.

5. Prazo de entrega: O prazo de entrega do PCB flexível também é um fator no preço. Se um PCB flexível precisar ser entregue rapidamente, o fabricante pode precisar trabalhar horas extras ou usar métodos de fabricação mais caros, então o custo será maior.

6. Complexidade do projeto: A complexidade do design do PCB flexível também é um dos fatores que afetam o preço. Projetos complexos exigem tecnologia mais avançada e mais etapas de fabricação, e portanto custa mais.

7. Largura e tamanho do traço de cobre

A largura do traço de cobre é outro fator chave no custo de PCBs flexíveis. Como os traços de cobre desempenham um papel vital na transmissão de sinais e na condução de corrente, é necessário espaço adequado para melhorar o design flexível e reduzir os custos de PCB flexível. Se o alinhamento estiver muito apertado, o custo do PCB flexível será alto e difícil de projetar; portanto, o alinhamento do cobre deve ser mantido a uma distância adequada um do outro para melhorar o custo e a confiabilidade do PCB flexível.

8. Espessura do traço de cobre

Quanto mais espessos os traços de cobre, quanto maior o custo dos PCBs flexíveis. Como a camada interna do PCB flexível requer uma camada de cobre mais espessa, mais pré-impregnado é necessário para completar a laminação, o que aumenta o custo do PCB flexível. Para controlar o custo de PCBs flexíveis, use alinhamento de cobre fino. É melhor você usar meia onça. Traço de cobre na camada interna e 1 Oz. no traço externo.

Como reduzir o custo de PCBs flexíveis

Para reduzir o custo de PCBs flexíveis, você pode considerar os seguintes aspectos:

1. Otimize o design: Otimizando Design de PCB pode reduzir custos. Por exemplo, reduzir o número de componentes, reduzir o número de camadas, reduzir a largura e o espaçamento da linha. Além disso, considerar a capacidade de manutenção e reparo do PCB também é um aspecto importante da otimização.

2. Escolher o material certo pode reduzir o custo de PCBs flexíveis. Por exemplo, escolha substratos e materiais de arame econômicos, bem como materiais de isolamento que atendam às suas necessidades.

3. Reduza o desperdício no processo de fabricação: Ao fabricar PCBs flexíveis, o desperdício deve ser minimizado tanto quanto possível. Por exemplo, otimizar o processo de corte e emenda, reduzir a geração de produtos defeituosos, e melhorar a utilização de materiais.

4. Considere a produção em massa: A produção em massa de PCBs flexíveis pode reduzir custos. Porque a produção em massa pode alcançar economias de escala, melhorar a eficiência da produção, enquanto reduz o desperdício de material.

5. Escolha um fabricante confiável: escolher um fabricante confiável pode garantir a qualidade do PCB flexível e do serviço pós-venda, mas também pode reduzir custos. Porque os fabricantes podem melhorar a eficiência da fabricação e otimizar o processo de produção para reduzir custos.

6. Considere transporte e prazo de entrega: transporte e prazo de entrega também são fatores que afetam o custo de PCBs flexíveis. Escolhendo rápido, transporte confiável pode reduzir o tempo de entrega e os custos de transporte. Ao mesmo tempo, minimizar o estoque pode reduzir os custos de estoque.

PCB flexível é muito comumente usado em dispositivos eletrônicos inteligentes e dispositivos vestíveis, em que as vantagens do PCB flexível são totalmente utilizadas, como flexível, afinar, luz, compactar, alta confiabilidade, alta estabilidade , etc., que fornecem importante suporte para o desenvolvimento de produtos eletrônicos.

Se você está procurando PCB flexível, então você pode entrar em contato conosco. Nossa empresa é especializada na produção e processamento de PCB flexível, mais do que 10 anos de experiência na indústria, e oferece flexibilidade Montagem da PCB serviços para empresas em todo o mundo.

Os benefícios da placa de cópia PCB

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Circuit board copy board, aquilo é, under the premise of having electronic products and circuit boards, reverse analysis technology is used to reverse analyze the circuit board, as well as PCB original product files and bill of materials (Bom)) documents, schematic files and other technical documents and PCB silkscreen production documents according to 1:1 recovery, and then these technical documents and production documents for PCB boards, circuit board soldering, teste de sonda voadora, circuit board debugging. The original circuit is finished. A complete copy of the circuit board template.

Purpose of PCB copying board

1. Through the analysis of existing product technical documents, in terms of design ideas, structural features, process technology, etc.. It can provide feasibility study and competitive reference for its own new product development and improve competitiveness.

2. Through the extraction and modification of technical data files, it can update and further develop various electronic products. According to the document diagram and schematic diagram, PCB can also be optimized according to customer requirements, and a more balanced solution can be found directly between demand and cost.

3. You can quickly add new functions and upgrades on the original basis, improve the competitiveness of the product and further gain an advantage in the market.

What are the benefits of PCB copy boards?

1. Accelerate product development and time-to-market: The traditional product development process requires design and manufacturing from scratch, while PCB copyboards greatly shorten the development cycle by copying and improving others’ projetos, so that the product can be brought to market more quickly and seize the first opportunity.

2. Reduce R&D costs: PCB copying can avoid the high R&D costs of designing and manufacturing from scratch, while saving human, material and time resources. This fast and efficient method can greatly reduce R&D costs and improve the competitiveness of enterprises.

3. Simplify the production process: PCB copy can directly refer to existing PCB samples or design drawings, which reduces the research and development costs of the production process, reduces the error rate in production, and greatly improves the production efficiency and product quality.

4. Optimization of product performance: by copying and improving the original product, it can be combined with market demand and technological development, to further optimize product performance and functionality. Not only can we improve the characteristics of the product in terms of hardware, but we can also optimize the software to enhance the overall user experience.

5. Market Opportunity: In a competitive market environment, PCB copy can help companies quickly launch similar or better products to seize the first opportunity in the market. By analyzing and copying competitors’ products, we can better understand market demand and trends, and promote product innovation and progress.

PCB copy board application fields

PCB copy board technology is widely used in various industries. Por exemplo, eletrônica de consumo, equipamento de comunicação, eletrônica automotiva, medical equipment and other industries can realize the rapid development and production of products through PCB copy board. Especially in some high-tech products, the application of PCB copy board is more common, such as artificial intelligence devices, drones, robots and so on. It can be said that PCB copy board has become an indispensable technical means in the modern electronics industry.

Double-sided plate copying method

1. Scan the upper and lower layers of the board and save two BMP images. 2.

2. Open Quickpcb2005 board copying software, point “file” “open bottom picture”, open a scanned picture. Use PAGEUP to enlarge the screen, see the pads, according to PP to place a pad, see the line according to PT line… Like a child tracing the same, in this software tracing again, point “Save” to generate a B2P file.

3. Then point “File” para “Open the bottom of the map”, open another layer of scanning color map; 4. Then point “File” para “Open the bottom of the map”, open another layer of scanning color map.

4. And then click “File” “Abrir”, open the previously saved B2P file, we see just copied board, stacked on top of this picture – the same PCB board, holes in the same location, only the line connection is different. The same PCB board, holes in the same location, just different line connections. So we press “Options” – “Layer Settings”, where we turn off the display of the top layer of the line and the silkscreen, leaving only the multilayer vias.

5. The perforations on the top layer are in the same position as the perforations on the bottom layer. Now we trace the lines on the bottom layer as we did in childhood. Now we can trace the lines of the bottom layer as we did in childhood. Then click “Save” – the B2P file will have information about the top and bottom layers.

6. Point “File” “Export as PCB file”, you can get a PCB file with two layers of information. You can then change the board or schematic or directly to PCB board factory production.

Multilayer board copying method

1.scan the item layer board, save the picture, name it top.jpg .

2.Scan the bottom layer board, save the picture, name it bottom.jpg.

3.the middle layer 1 with coarse sandpaper grinding out, leaking copper skin, getting clean and scanned, named mid1jpg

4.The middle layer 2 with coarse sandpaper to grind out, leak copper skin, clean scan, named mid2.jpg.

5.In PHOTOSHOP at each picture level, will be the bottom of the map to do horizontal mirroring, and the top and bottom of the map in the same direction, the upper and lower holes in the same position; and then each picture will be saved as a BMP file, como: top.bmp, bottom.bmp , etc..

6.Open the color copy board software, enter the main menu “file”, “open BMP file”, select the top.bmp file to open.

7.Set up a good DPI, you can copy the top layer of the map, the first layer selected to the top layer, and then start putting components, holes, wires and so on.

8.The top layer to put everything in, save the temporary file, named top-1.dpb.

9.Close the current picture window (only one picture at a time, do not open more than one picture).

10.Enter the main menu “File”, “Open BMP file”, select the bottom of the picture bottom.bmp, and then open the temporary file top-1.dpb, then you will find that the top layer of the picture and the bottom of the picture are not aligned with the background picture, press Ctrl A combination, the top layer of the picture and the bottom of the background picture is not aligned. Ctrl A combination of keys, put all the selected pictures, according to the keyboard cursor keys or numeric keys to move the whole, select a few reference points and the corresponding point of the aligned background map, then you can choose the current layer for the bottom, then go to the bottom of the line, pad, fill and so on. After copying the bottom layer, save the temporary file as bottom-1.dpb, or save the PCB file as bottom-1.pcb, this time the file is already a two-layer alignment, combined layer of the file.

11.The same intermediate layer of the board copying process is the same, repeating steps 9 para 10, the final output of the PCB file, is the same as the four-layer PCB board diagram.