Compared with the conventional PCB board, the IC packaging substrate has a wide width and smaller line spacing, and the size of the board is smaller, which can meet the harsh requirements of mainstream chips.
Количество производственных слоев: 1-48 слои
Количество линий SMT: 8 высокоскоростные линии спаривания SMT
SMT ежедневные производственные мощности: больше, чем 50 миллион очков
Инспекционное оборудование: Рентгеновский тестер, первая часть тестера, AOI Автоматический оптический тестер, Тестер ИКТ, Станция переработки BGA
Скорость монтажа: Скорость монтажа чипа (оптимальные условия) 0.036S/чип
Минимальный пакет: 0201, Точность до +0,04 мм
Минимальная точность устройства: PLCC, Млн, BGA, CSP и другие устройства могут быть вставлены, Расстояние расстояния до +0,04 мм
18 годы ПХБ производство опыт
Авторитетная производственная команда
Внедрение передовых технологий и производственного оборудования
Идеальная производственная система
Быстрый поворот
Зрелый ISO9001/IATF16949 Система управления качеством.
Идеальная система управления заказами ERP и MAS.
Инженеры по управлению профессиональными затратами
Сотрудничество со многими компаниями сырья.
Бесплатная проверка DFM файлов и боссов печатной платы.
Оценка инженерной печатной платы и советы.
Специализируется на медицинской, Автомобиль, потребительская электроника, Новая энергетическая печатная плата.
Служение глобальным предприятиям
IC Substrate PCB is the packaging substrate. The development of the HDI board is a technological innovation that adapts to the rapid development of electronic packaging technology. It has excellent characteristics such as high density, высокая точность, high performance, миниатюризация, and lightness. The complete chip is combined by a nude chip (wafer) and the packaging body (packaging substrate and firing material, lead, и т. д.).
As the core material of chip packaging, the packaging substrate can protect, fix, and support the chip on the one hand, enhance the heat and heat dissipation performance of the chip, and ensure that the chip is not physical damage. С другой стороны , To realize the functions of electrical and physical connection, power distribution, signal allocation, and communication chip internal and external circuits.
Integrated circuit IC substrates have a variety of attributes and characteristics. Some of them include:
Light weight: IC substrates are generally light. This is mainly because the materials they use are relatively thin.
Extremely reliable: These substrates form a protective layer around the integrated circuit. Поэтому, they must consist of solid materials.
There are fewer wiring and soldering points: IC substrates are usually smaller than typical PCB substrates. Поэтому, they need less wiring and welding joints.
Compact: IC substrates adopt a miniaturized design. Поэтому, they need less materials to pack.
Durable: Although some IC substrates are large in size, they are very strong.
Mobile Terminal Equipment
Спутниковое оборудование
Storage equipment
Медицинское оборудование
Different materials, технология, and crafts have different load attributes, and the scope of application is different. The mainstream classification method of the packaging substrate is classified by packaging process, substrate material and application field.
(1) The most widely used packaging process is the lead and inverted of the lead and inverted.
The lead key is combined with fine metal wires, and the use of heat, pressure, and ultrasonic energy to make the metal lead with the chip pad and the substrate pads tightly welded to realize the communication between the electrical interconnection between the chip and the substrate. RF module, storage chip, microcomputer system device packaging;
The inverted packaging is different from the lead key. It uses a welding ball to connect the chip and substrate, то есть, forming a welding ball on the pad of the chip, and then flip the chip to the corresponding substrate, and use the heating and melting welding ball to achieve the chip and the substrate plate and the substrate. Combining pads, the packaging process has been widely used in products such as CPU, GPU and Chipset.
(2) From the perspective of the substrate material, the IC carrier can be divided into ceramic substrates, plastic substrates and metal substrates.
Most of the world’s integrated circuit packaging is encapsulated by resin. Среди них, BT resin and ABF resin are most widely used.
BT resin is used to produce BT loads. Because BT resin has a variety of excellent characteristics such as heat resistance, hygrotic resistance, low -agent electric constant, low disappearance factors, и т. д., it is often used for stable size and prevents heat expansion and improves the benefits of equipment.
(3) From the perspective of the final application, according to the different types of IC finished products, the packaging substrate (IC Substrate) can be divided into storage chip packaging substrates, micro -electromechanical system packaging substrates, radio frequency module packaging substrates, processor chip packaging substrates, and high -speed communication packaging packaging packaging packaging The substrate, и т. д.. The storage chip packaging substrate is mainly used for the storage module and solid -state drive of smartphones and tablets;
Micro -electrical system packaging substrates are mainly used for sensors for smartphones, таблетки, and wearable electronic products; radio frequency module packaging substrates are mainly used for radio frequency modules for mobile communication products such as smartphones; processor chip packaging substrates are mainly used for smartphones and tablets. The baseband and application processor of the computer.
(4) Combining the packaging process with the packaging technology, and the packaging substrate can be divided into different types. Different packaging processes are used in the field of packaging substrates produced by packaging technology.
HDI Feature
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IC Substrate technical specification
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Количество слоев
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2 к 10
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Технологические выделения
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IC Substrate is PCB support for 1 Chip solder by Wire Bonding Process or Flip Chip Process
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Материалы
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BT (Bismaleimide Triazine)
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Базовая толщина меди
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0-12um depending upon substrate structure method
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Минимальный трек & интервал
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30/30µm (Advanced 20/20µm)
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Поверхностная отделка доступна
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Соглашаться & Enepic
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Minimum laser drill
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50µm
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Минимальная механическая тренировка
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100µm
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PCB thickness
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2L min. 130µm, 4L min. 210µm, 6L min. 300µm
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4 layer LGA substrate
6-layer BGA substrate
Storage card substrate
: 4/Фон,5/Фон,6/Ф. Синьюанский технологический парк, Гушу дорога по утрам, Xixiang Town Baoan District, Шэньчжэнь , Гуандун, Китай 518102
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: Виктор Чжан
:sales@leadsintec.com
