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Characteristics and Applications of Aluminum PCBs

05/20/2024 в /от

Aluminum PCBs are a type of metal-based copper-clad laminate known for their excellent heat dissipation properties. A typical single-sided aluminum PCB consists of three layers: the circuit layer (copper foil), the insulation layer, and the metal base layer. For high-end applications, double-sided designs are also available, featuring a structure of circuit layer, insulation layer, aluminum base, insulation layer, and another circuit layer. In rare cases, multilayer boards are used, combining standard multilayer boards with insulation layers and aluminum bases.

Advantages of Aluminum PCBs

  1. Eco-Friendly: Aluminum is non-toxic and recyclable. Its ease of assembly also contributes to energy savings. For PCB suppliers, using aluminum supports environmental sustainability.

  2. Тепло рассеяние: High temperatures can severely damage electronic components, so using materials that aid in heat dissipation is prudent. Aluminum effectively transfers heat away from critical components, minimizing its detrimental impact on the circuit board.

  3. Enhanced Durability: Aluminum provides a level of strength and durability that ceramic or fiberglass substrates cannot. It serves as a robust base material, reducing the likelihood of accidental damage during manufacturing, handling, and everyday use.

  4. Lightweight: Despite its remarkable durability, aluminum is surprisingly lightweight. It adds strength and resilience without adding significant weight.

Applications of Aluminum PCBs

  1. Светодиодное освещение: The primary application of aluminum PCBs is in LED lighting. LEDs generate significant heat during operation, and the excellent heat dissipation properties of aluminum PCBs ensure the stable functioning of LEDs, thereby enhancing the lifespan and reliability of the lighting fixtures.

  2. Автомобильная электроника: With the increasing degree of automotive electrification, the number and density of electronic components in vehicles are rising. The lightweight nature, excellent thermal management, and electrical performance of aluminum PCBs make them an ideal choice for automotive electronics.

  3. Renewable Energy: Aluminum PCBs play a crucial role in renewable energy sectors like solar and wind power. Например, solar panels need to efficiently convert solar energy into electrical energy, and the superior heat dissipation of aluminum PCBs helps maintain the stable operation of solar cells.

  4. Power Electronics: In power electronic devices such as inverters and converters, the use of aluminum PCBs ensures stable operation under high power densities.

  5. Промышленная автоматизация: In industrial automation control systems, the high reliability, стабильность, and excellent electrical performance of aluminum PCBs make them the preferred material for critical components.

Applications of Aluminum PCBs

Manufacturing Process of Aluminum PCBs

  1. Mechanical Processing:

    • Бурение: While aluminum PCBs can be drilled, any burrs on the edges of the holes are unacceptable as they can affect the withstand voltage test.
    • Milling the Outline: Milling the outline is challenging. Punching the outline requires high-quality molds, which is a critical aspect of aluminum PCB production.
    • Punching: After punching the outline, the edges must be very neat, free of any burrs, and the solder mask layer on the edges should remain intact. Punching involves intricate techniques such as using a blanking die, ensuring the board does not warp more than 0.5% after the process.

  2. Avoid Scratches on the Aluminum Base:

    • The aluminum base must remain untouched throughout the process to prevent discoloration or blackening due to chemical exposure or handling. Any damage to the aluminum base is unacceptable, as re-polishing is often not permitted by customers. Protective measures, like passivation or applying protective films before and after hot air leveling (Провести кровотечение), are essential to prevent damage.

  3. High Voltage Testing:

    • Aluminum PCBs for communication power supplies require 100% high voltage testing. Customers may specify either DC or AC testing, with voltages typically around 1500V or 1600V for durations of 5 к 10 seconds. Any dirt, burrs on holes or edges, jagged lines, or damage to the insulating layer can cause fires, утечка, or breakdowns during these tests. Issues such as delamination or bubbling during high voltage testing are grounds for rejection.

Aluminum PCB Manufacturing Specifications

  1. Copper Foil Thickness:

    • Aluminum PCBs are often used for power devices with high power densities, so the copper foil is typically thicker. For copper foil thicknesses of 3oz or more, the etching process requires precise line width compensation in the engineering design to ensure that the etched line width remains within tolerance.

  2. Protection of the Aluminum Base:

    • During the ПХБ производство процесс, the aluminum base must be protected with a protective film to prevent damage from chemical exposure, which can tarnish the surface. This protective film is prone to damage, requiring careful handling and placement of the boards in racks throughout the process.

  3. Milling Tools:

    • Milling tools used for fiberglass boards (FR-4) have lower hardness, whereas those for aluminum PCBs require higher hardness. The milling speed for fiberglass boards is relatively high, but it must be reduced by at least two-thirds when milling aluminum PCBs.

  4. Cooling During Milling:

    • For milling fiberglass boards, the machine’s built-in cooling system is typically sufficient. Однако, when milling aluminum PCBs, additional cooling, such as applying alcohol to the milling bit, is necessary to dissipate heat effectively.

Разница между высокоскоростной печатной платой и высокочастотной печатной платой.

05/13/2024 в /от

Печатная плата, or printed circuit board, is an indispensable component in electronic products. Different PCBs used in various applications have distinct characteristics and advantages. Среди них, high-frequency PCBs and high-speed PCBs are two special types, each with unique applications and benefits. В этой статье, we will introduce the differences and features of high-speed PCBs and high-frequency PCBs.

What are high-speed PCBs?

High-speed PCBs are printed circuit boards designed and manufactured considering factors such as signal transmission speed, transmission distance, и целостность сигнала. They are typically used in applications requiring high-frequency, высокоскоростной, and high-precision data transmission, such as communication equipment, computer hardware, и медицинские устройства.

What are high-frequency PCBs?

High-frequency PCBs are specifically designed for handling high-frequency signals. Their design, Производство, and material selection are optimized for the characteristics of high-frequency signal transmission to ensure stability, integrity, and low loss during transmission. High-frequency PCBs are commonly used in wireless communication, microwave communication, satellite communication, радиолокационные системы, and other fields where high demands are placed on signal transmission speed and stability. Поэтому, the performance of high-frequency PCBs directly impacts the overall performance of the system.

The Differences Between High-Speed PCBs and High-Frequency PCBs:

  1. Different Applications:

High-Frequency PCBs: Primarily used in applications such as wireless communication and radar systems that require transmission of high-frequency signals, with high demands for signal fidelity and stability.

High-Speed High-Frequency PCBs: Commonly found in computer motherboards, network devices, и т. д., supporting high-speed data transmission and processing to ensure signal integrity during transmission on the PCB, avoiding signal distortion and interference.

  1. Different Materials Used:

High-Frequency PCBs: Utilize substrates made from various dielectric constant materials, such as glass fiber and its derivatives, known for low dielectric loss and stable electrical properties.

High-Speed High-Frequency PCBs: Employ materials with low dielectric constants to ensure signal transmission speed, while also focusing on dielectric stability and absorption performance.

  1. Different Design Requirements:

High-Frequency PCBs: Design considerations include signal transmission performance factors such as crosstalk, attenuation, harmonics, as well as factors like board thickness, substrate pressure, and precision.

High-Speed High-Frequency PCBs: Design focuses on characteristics of transmission lines, impedance, balance of differential transmission lines, port signal integrity, crosstalk, and anti-interference measures to ensure stable and rapid signal transmission.

  1. Differences in Manufacturing Processes:

High-Frequency PCBs: Require strict control of circuit loss, electromagnetic radiation, и т. д., using high-quality materials and processes, such as special material selection, fine line width and spacing, electromagnetic shielding, и т. д..

High-Speed High-Frequency PCBs: Manufacturing processes involve complex design and techniques to ensure rapid and stable signal transmission, including routing, signal layer layout, grounding design, signal integrity analysis, и т. д..

  1. Differences in Testing and Validation:

High-Frequency PCBs require specialized testing equipment to verify signal integrity and impedance matching across various frequency ranges. High-Speed PCBs require the use of advanced equipment for extensive signal integrity testing to validate performance at high data rates. Testing of multilayer PCBs focuses on general circuit functionality and performance.

Заключение

With the continuous evolution of 5G communication technology, the requirements for PCB boards in high-frequency products are increasing. On one hand, high-frequency signal transmission demands smaller dielectric loss (Дф) and dielectric constant (Дк) to ensure stable signal transmission. С другой стороны, as products move towards miniaturization and standardization, PCB boards are inevitably moving towards high-layer and even HDI directions, placing higher demands on material processability. Поэтому, whether from the perspective of high-frequency or high-speed materials, polyphenylene ether (PPO or PPE) resin shows promising development prospects and will become an important direction for future high-frequency and high-speed PCB board materials.

Что такое тестирование летающих зондов на печатной плате?

05/08/2024 в /от

Тестирование печатной платы является критическим аспектом Сборка печатной платы, позволяя нам выявлять серьезные проблемы с цепи и быстро их решать. Есть различные методы для PCBA тестирование, в том числе тестирование летающих зондов, AOI тестирование, тестирование приспособления, и т. д.. Эта статья углубится в детали тестирования летающих зондов на печатные платы.

Что такое тестирование летающих зондов?

Тестирование летающих зондов - это метод тестирования электронных цепи, в основном используемый для тестирования печатных плат (ПХБ). Использует подвижную систему зондов, которая по сути “мухи” над печатной платой, Создание электрического контакта с конкретными испытательными точками на печатной плате. В конечном счете, он идентифицирует дефекты и проверяет электрические характеристики цепи. Система тестирования полета состоит из нескольких ключевых компонентов, в том числе сами зонды, Тестовые приспособления, используемые для защиты печатной платы на месте, и программное обеспечение управления для управления процессом тестирования.

Структурные особенности тестирования летающих зондов печатной платы

Тестер летающего зонда-это улучшение по сравнению с традиционными тестерами, которые, Использование зондов вместо слоя ногтей. В нем есть четыре головы с восемью тестируемыми зондами, которые могут двигаться независимо на высоких скоростях по механизму X-Y, с минимальным зазором тестирования 0,2 мм. Во время работы, тестовый блок (Uut) передается в тестирующую машину через ремни или другие системы передачи UUT, где датчики затем зафиксированы, чтобы вступать в контакт с тестовыми прокладками и VIA на печатной плате, тем самым тестируя отдельные компоненты на UUT. Тестирующие зонды подключены к драйверам (сигнальные генераторы, питания, и т. д.) и датчики (цифровые мультиметра, частотные счетчики, и т. д.) через систему мультиплексирования для тестирования компонентов на UUT. Пока один компонент тестируется, Другие компоненты на UUT электрически защищены зондами для предотвращения помех для чтения. Тестер летающего зонда может обнаружить короткие замыкания, Открытые цепи, и значения компонентов. Кроме того, Во время тестирования летающих зондов используется камера, чтобы помочь в поиске недостающих компонентов и осмотре компонентов с четкими направленными формами, такие как поляризованные конденсаторы.

Возможности тестирования летающих зондов

В то время как тестирование летающих зондов может легко обнаружить короткие цирки и открытые схемы, Оснащение их специальными драйверами позволяет им также проверять более сложные параметры. Усовершенствованные зонды могут одновременно исследовать и проверять обе стороны многослойных досок, сокращение времени, необходимого для отдельного одностороннего тестирования. Различные архитектуры летающих зондов могут использоваться для различных решений, такой как:

Тестирование целостности сигнала: Использование рефлектоометрии временной области (Тр) или датчики рефлектометра временной области вместе со специализированными инструментами, Могут быть проверены различные характеристики трассов печатной платы, используемых для переноса высокоскоростных и высокочастотных сигналов.. Эта настройка обычно фиксирует и измеряет сигналы как во времени, так и в частотных доменах, чтобы охарактеризовать дефекты в сигнальных путях.

Измерение разности фазы: Использование специально разработанных зондов для отправки высокочастотных сигналов между эталонными следами и следами сигналов, Разница между ними может быть измерена. Этот тест устраняет необходимость отдельного тестирования изоляции для измерения перекрестных помех между трассами на печатной плате.

Тестирование с высоким напряжением: ПХД могут иметь дефекты изоляции, которые обычные электрические испытания могут не обнаружить. Сопротивление изоляции между двумя трассами на печатной плате может быть достаточно высоким, чтобы пройти традиционное тестирование сопротивления, но все же ниже, чем требования в спецификациях. Чтобы обнаружить это, Требуется высокое напряжение стресс -тестирование, Использование генератора высокого напряжения, соответствующие зонды, и счетчики с высоким сопротивлением.

Обнаружение микро короткого замыкания: Наличие крошечных усов может привести к микро коротким замыканиям на печатной плате. Иногда, Они могут сгореть во время тестирования стресса высокого напряжения, оставляя позади карбонизированные остатки на поверхности печатной платы, Формирование проводящих путей с высокой резистенцией. Датчики обнаружения микро короткого замыкания примените низкое напряжение, чтобы проверить сопротивление между двумя трассами на печатной плате, Постепенно увеличивая напряжение до уровня, подходящего для тестирования.

Кельвин, округ Колумбия: Это очень точная методика измерения постоянного тока, необходимая для тестирования BGA и аналогичных плотно упакованных шаблонов печатных плат. Это включает в себя силу и смысл в летающем зонде. Кельвинские соединения компенсируют убытки в тестируемом зонде.

Системы тестирования летающих зондов бывают разных размеров, С основной переменной является количество разъемов, которые использует система. Например, тестер может иметь 16 головы разъемов, с 8 сверху и 8 В нижней части печатной платы. Конечно, Стоимость системы увеличивается пропорционально количеством разъемов, которые она использует.

Преимущества тестирования летающих зондов

По сравнению с традиционными кроватью наголочка или приспособления ИКТ, Тестирование летающих зондов предлагает несколько преимуществ:

Не требуется приспособления:В отличие от светильников, Тестирование летающих зондов не требует настройки приспособления. Это экономит стоимость и время, обычно требуемое для настройки приспособлений ИКТ. Фактически, Производители могут создать летающие зонды сразу после того, как печатные платы выходят из производственной линии, Поскольку они имеют доступ к данным Гербера. С другой стороны, Проектирование и установка светильников ИКТ может занять недели.

Короткая и быстрая разработка программ: Поскольку сетевые списки и данные САПР являются основой для создания программ тестирования летающих зондов, И есть несколько программ с открытым исходным кодом для перевода этой информации, Время разработки программы короткое и требует минимального времени настройки. Это также означает, что изменения дизайна могут быть легко интегрированы.

Гибкость процесса: В отличие от приборов ICT-кровать навес, Настройки летающих зондов применимы к любой печатной плате, Принимая во внимание, что светильники ИКТ в кровати на нормы характерны для отдельных ПХБ и бесполезны для другого. Простые модификации внутренних программ - это все, что нужно для их адаптации к другой доске.

Нет необходимости в тестовых точках: Поскольку тестирование летающих зондов проводится на голых досках, Зонды могут использовать компонентные прокладки без необходимости дополнительных тестовых точек.

Контролируемый контакт зонда: Летающие зонды могут достичь точных соединений с более близкими интервалами по сравнению с сном.. Например, Высокие летающие зонды могут достичь тестирования такими же небольшими, как 5 микрометры, в то время как минимальный разрыв ИКТ 0.5 миллиметры. Это делает их очень полезными для густонаселенных круговых плат или для достижения более широкого охвата на небольших печатных платах.

Решения и методы переменного тестирования: Системы летающих зондов могут предлагать больше решений для тестирования, чем ИКТ или кровать налога. Это возможно, потому что с программируемыми интегрированными тестовыми системами, Могут быть использованы различные виды летных испытательных зондов.

Высокая точность измерения: Конкретные летные зонды используются для различных испытаний, с точным позиционированием зонда и дополнительными тестовыми инструментами, Обеспечение высокой точности измерения.

Быстрая обратная связь: Поскольку результаты испытаний летающего зонда могут быть получены на месте, передача информации на производственную линию может помочь им быстро внести соответствующие корректировки процесса. Сходным образом, Дизайнеры PCB могут получить быструю обратную связь при проектировании прототипа, позволяя им внести необходимые изменения перед производством.

Как работает тестирование летающих зондов

Тестирование летающих зондов (Фт) Как правило, является предпочтительным методом для тестирования на небольшую партийную и прототипную плату, а также сборку печатных плат из-за его экономической эффективности и удобства для этих меньших величин.

Основное преимущество заключается в способности завершать тестирование на скоростях от нескольких дней до нескольких часов, В зависимости от сложности прогорной платы, даже для больших количеств, и с высоким покрытием тестирования.

Давайте разбим его операцию на шаги:

  1. Создание программы тестирования FPT

Конструкция направлена ​​на проверку всей платы и обычно завершается с использованием автономного компьютера с приложением генератора программы тестирования FTP. Это обычно требует Герберса, Бомб, и файлы ECAD. На машине с материнской платой, Определите значения тестируемых компонентов, Тестовые точки, Форматы компонентов, смещения, отладка, и т. д., и в конечном итоге завершайте дизайн тестовой программы.

  1. Загрузка программы в тестер FTP

Компоненты протестированной платы размещаются на конвейерной ленте в тестере FTP и транспортируются в область, где эксплуатируются зонды.

  1. Применение электрических и сигналов теста питания

Эти тесты проводятся в точках зонда, а затем проводятся показания. Этот процесс определяет, соответствуют ли конкретные разделы PCB ожидаемые результаты (компоненты). Любые сбои или отклонения от установленного плана и ожиданий указывают на дефекты внутри единицы, в результате провала теста.

Тестирование летающих зондов является важнейшей технологией в области электроники, обеспечение качества и функциональности электронных компонентов и систем. Эти тесты используют специализированное оборудование для выполнения различных контактных и неконтактных электрических испытаний на печатных платах (ПХБ), Печатные проводки (PWBS), Сборки печатной платы (PCBAS), отдельные компоненты, и целые системы. Предоставляя гибкий и эффективный метод для выявления дефектов и проверки производительности, Тестирование летающих зондов стало важным инструментом для производителей и инженеров.

Каковы цвета печатной платы?

05/06/2024 в /от

The color of a PCB typically refers to the hue of the solder mask on the board’s surface. PCB board staining pigments are a type of hardened resin, with the primary resin being colorless or nearly transparent. Зеленый, as with other colors, is achieved through the addition of pigments.

We employ silk-screen printing to apply colors onto the PCB. PCBs come in various colors such as green, черный, синий, yellow, purple, красный, and brown. Some manufacturers have ingeniously developed PCBs in multiple colors like white and pink.

Physical Properties of PCB Colors

When selecting a PCB color, one must consider the physical properties of the PCB material. Typically composed of fiberglass and epoxy resin, PCB materials have densities, thermal conductivity coefficients, coefficients of thermal expansion, tensile strengths, and other physical attributes that directly impact performance and reliability. Different-colored PCBs may utilize varied production processes and materials, thereby exhibiting differing physical properties.

Chemical Properties of PCB Colors

In addition to physical properties, the color of a PCB also influences its chemical characteristics. PCB boards undergo heating and chemical treatments during production, and PCBs of different colors may require distinct chemical processes. This affects properties such as annealing temperature, acid and alkali resistance, and corrosion resistance. Some colored PCBs may employ more complex production processes and materials, resulting in enhanced chemical corrosion resistance.

Yellow PCB

Characteristics of Different Colored PCBs

  1. Green PCB

Green PCBs are the most popular color choice, enhancing clarity by providing a sharp contrast with white text, thus improving readability. Кроме того, the surface treatment of green PCBs reflects less light, aiding in reducing glare.

  1. White PCB

White PCBs present a clean and neat appearance in various settings, gaining popularity. Однако, due to their tendency to obscure traces, white PCBs are not the top choice. Yet, the contrast with black silk-screen printing is notably distinct on white PCBs.

  1. Yellow PCB

Yellow PCBs cater swiftly to diverse requirements such as style, cleanliness, and visibility. Однако, a significant drawback of yellow PCBs is their poor contrast with traces and silk-screen printing.

  1. Blue PCB

Blue PCBs are considered thick boards suitable for labeling due to their significant contrast in silk-screen printing. While not as attention-grabbing as green, черный, or white PCBs, blue PCBs are preferred for their excellent aesthetic appeal. Installing blue PCBs on LCDs is preferable as they avoid sharp contrast edges and bright background colors.

  1. Red PCB

Due to its advantages, many PCB manufacturers are keen on adopting red PCBs. Red PCBs offer excellent visibility and clearly define the contrast of traces, planes, and blank areas. Silk-screen printing appears particularly elegant against the backdrop of red PCBs.

  1. Black PCB

Black PCBs are as popular as white PCBs. Both colors produce low contrast, facilitating easy labeling of critical components. Однако, the primary drawbacks of black and white PCBs are the potential focal points and minor shadows, making tracing difficult. Поэтому, black PCBs are unsuitable for various high-temperature applications as they may cause silk-screen printing to discolor. Более того, black PCBs are a blend of cobalt and carbon, potentially resulting in poor conductivity.

Black PCB

How pcb colors are made

The color of a PCB (Печатная плата) is primarily achieved by applying a layer of special solder mask during the manufacturing process. Here are the general steps involved in producing PCB colors:

  1. During the manufacturing process of a PCB, a thin layer of copper foil is first laid on the substrate, forming the conductive layer of the PCB. If producing a double-sided or multilayer board, both sides or multiple layers of the PCB substrate will be covered with copper foil.

  2. Следующий, the designed PCB circuit pattern is “printed” onto the metal conductor using a technique called subtractive transfer. In this process, the entire surface is covered with a layer of copper foil, and excess copper foil is removed through etching techniques to form the desired circuit pattern.

  3. After forming the circuit pattern, to separate the soldering and non-soldering parts of the PCB during soldering and prevent copper oxidation (pure copper surfaces quickly undergo oxidation reactions when exposed to air, and oxidized copper becomes a poor conductor of electricity, greatly damaging the electrical performance of the entire PCB), engineers apply a layer of solder mask on the surface of the PCB. This solder mask layer blocks the contact between copper and air, protecting the copper layer from oxidation.

  4. The color of the solder mask can be adjusted as needed. Since small text needs to be printed on the PCB, engineers typically add various colors to the solder mask to create different PCB colors. Например, черный, красный, синий, dark green, and dark brown are common PCB colors.

  5. After applying the solder mask, a series of post-processing steps such as hot air leveling, milling the outline, electrical testing, final inspection, и т. д., are required to ensure that the quality and performance of the PCB meet the requirements.

Why are most PCB green now?

The prevalence of green PCBs stems from several factors:

  1. Glass Epoxy Resin Material:

    • Historically, green was the standard color for the solder mask made from glass epoxy resin, which is commonly used in ПХБ производство. While other colors have been introduced, green remains the preferred choice.

  2. Contrast with White Printed Text:

    • Green PCBs offer simplicity and time efficiency for assembly workers, as scanning them is straightforward and quick due to their familiarity with the color. Кроме того, green creates less eye strain during scanning compared to other colors and provides contrast with white printed text on the circuit board.

  3. Military Applications:

    • Military standards have a significant influence on the preference for green PCBs. Many believe that green is highly effective for military purposes, leading to a demand for green PCBs from suppliers who also serve other clients. Следовательно, green PCBs become surplus products for military suppliers, further reinforcing their acceptance.

  4. Exposure Rate of Solder Mask:

    • While other colors like blue, white, or brown exist, they may not offer a higher solder mask exposure rate compared to green. Darker colors tend to have higher pigment deposition, resulting in darker solder masks. White and black solder masks have high exposure rates, but green provides adequate shading for worker exposure and design tolerances.

  5. Better Machine Recognition:

    • During PCB manufacturing processes such as board fabrication and surface-mount component soldering, visual inspection is crucial. Green PCBs offer better visibility in yellow-lit environments, aiding machine recognition and calibration for tasks like solder paste application and automated optical inspection (Аои).

  6. Comfort for Workers:

    • In some manual inspection processes (although increasingly replaced by automated testing), workers may observe PCBs under strong lighting. Green PCBs are more comfortable for the eyes in such conditions.

  7. Cost Reduction:

    • Green PCBs have widespread use, enabling economies of scale in production and procurement. Standardizing on one color reduces production line costs, as bulk purchasing of the same-color solder mask lowers procurement costs. Следовательно, green solder mask is advantageous in terms of manufacturing costs and lead times.

  8. Relative Environmental Friendliness:

    • Green PCBs are relatively environmentally friendly, as they do not release toxic gases during high-temperature recycling of waste boards. Other PCB colors, such as blue and black, contain cobalt and carbon, which pose risks of short circuits due to weaker conductivity.

Кроме того, darker-colored PCBs, such as those in black, purple, или синий, may increase difficulty in board inspection and present challenges in manufacturing control.

The influence of PCB color on circuit boards is multifaceted. It affects not only the cost and appearance of the PCB but also directly impacts the physical and chemical properties of the PCB materials, thereby influencing the performance and reliability of the PCB. Поэтому, when selecting PCB colors, it is necessary to consider a comprehensive range of factors such as the application environment, требования, and costs of the product. Meanwhile, manufacturers need to enhance the quality and performance of PCBs through more sophisticated production processes and materials to meet the production needs of PCBs in different colors.

The status of packaging substrate in the PCB industry

04/30/2024 в /от

If the PCB industry were a pyramid, undoubtedly, the substrate would be the gleaming jewel perched at its apex.

Firstly, it holds immense importance.

The substrate is the core material in the chip packaging process, characterized by its high density, точность, производительность, миниатюризация, and thinness. Это, along with the die and leads, forms the chip after packaging and testing. А IC Substrate not only provides support, тепло рассеяние, and protection for the chip but also serves as the electronic connection between the chip and the PCB, playing a pivotal “linking and enabling” role, and can even embed passive or active devices to achieve certain system functions.

Secondly, its barriers are exceptionally high.

According to the minutes of the investor survey by Xinsen Technology, newcomers in the substrate field require at least 2 к 3 years to establish a team, acquire land and build factories, complete decoration and debugging, pass large customer certifications, and ramp up production capacity. Looking at the recent projects of domestic manufacturers in substrate production, the construction phase alone takes up to 2 годы, with several more years needed for capacity ramp-up. Более того, projects involving high-end substrates like FC-BGA require even higher investment amounts due to the exorbitant equipment prices. Just consider, any random substrate project easily surpasses 2 billion yuan in investment, making it a “fighter jet” in the industry’s “burning money” battle.

Aside from raising the investment threshold, the high processing difficulty is also a core barrier in substrate production. From the perspectives of product layers, board thickness, line width and spacing, and minimum annular width, substrates tend to lean towards precision and miniaturization. Более того, with a unit size smaller than 150*150 мм, they represent a higher-end category of PCBs. Среди них, the line width/spacing is the core differentiation, with the minimum line width/spacing of substrates ranging from 10 к 130 микрометры, far smaller than the 50 к 1000 micrometers of ordinary multilayer rigid PCBs. Ordinary PCB factories cannot handle such high-difficulty technical tasks.

Thirdly, its market prospects are incredibly vast.

With the rapid advancement of technology in the electronics industry, terminal application products are trending towards miniaturization, intelligence, and customization, making the demand for high-end PCB products more prominent. Более того, driven by a new wave of computational power, China’s substrate supply fails to meet the robust market demand, presenting the industry chain with expansive market space.

From the global demand perspective of IC substrates, these products are primarily applied in fields such as CPUs, графические процессоры, and high-end servers.

В последние годы, with the widespread application of technologies like 5G, AI, и облачные вычисления, the demand for high-computational chips has been continuously increasing, thereby propelling the growth of substrate production value. This trend has stimulated a significant growth in the demand for chips and advanced packaging in the electronics industry, indirectly promoting the development of the global substrate industry.

In terms of market size, the Chinese substrate market reached 20.1 billion yuan in 2022, a year-on-year increase of 1.5%. According to forecasts from the China Industry Research Institute, к 2023, this market size will reach 20.7 billion yuan, with a growth rate of 3%. Simultaneously, the production volume of Chinese substrates has been increasing year by year. В 2022, the production reached 1.381 million square meters, an 11.73% increase year-on-year. It is expected to reach 1.515 million square meters by 2023, with a growth rate of 9.7%.

Looking at the medium to long term, the IC substrate market is expected to maintain rapid growth. According to Prismark’s forecast, к 2027, the market size of IC substrates will reach 22.286 billion US dollars, with a compound annual growth rate (CAGR) of 5.10% between 2022 и 2027. It is estimated that by 2027, the overall size of China’s IC substrate industry will reach 4.387 billion US dollars, with a CAGR of 4.60% between 2022 и 2027.

The recent surge in Chiplet packaging technology has injected new vitality into the growth of IC substrates. The rapid growth in the market size of Chiplet processor chips will drive the demand for ABF substrates. Advanced packaging technologies will increase the consumption of ABF substrates, and the introduction of 2.5/3D IC high-end technologies into products may enter mass production in the future, inevitably bringing greater growth momentum.

Fourthly, its players are industry giants.

Currently, IC substrate companies from Japan, Южная Корея, and the Taiwanese region hold absolute leading positions. According to statistics from the Taiwan Printed Circuit Association, the top ten global substrate suppliers and their market shares in 2022 were as follows: Unimicron (17.7%), Nan Ya Printed Circuit Board (10.3%), Ibiden (9.7%), Samsung Electro-Mechanics (9.1%), Shinko Electric Industries (8.5%), JCET Group (7.3%), LG Innotek (6.5%), AT&S (6.1%), Daeduck Electronics (4.9%), and Compeq Manufacturing (4.7%).

The top five global BT substrate manufacturers were LG Innotek (14.2%), Samsung Electro-Mechanics (11.9%), Compeq Manufacturing (10.3%), JCET Group (9.5%), and Unimicron (7.7%). The top five global ABF substrate manufacturers were Unimicron (26.6%), Ibiden (14.6%), Nan Ya Printed Circuit Board (13.5%), Shinko Electric Industries (12.8%), and AT&S (8.0%).

Although China’s IC substrate industry started relatively late, strong players have emerged continuously. Major suppliers include Shennan Circuit, Xinsen Technology, and Zhuhai Youya, which primarily possess mass production capabilities for BT substrates. Более того, since 2019, some manufacturers primarily engaged in PCB products have also begun investing in IC substrate projects, indicating a quietly evolving industrial landscape.

В заключение, factors such as technological difficulty, industry players, investment barriers, market prospects, and critical roles have firmly established substrates at the forefront of the industry, rightfully earning them the title of the gleaming jewel atop the PCB pyramid.

Wave soldering operation guide for pcb assembly

04/28/2024 в /от

What is wave soldering?

Wave soldering refers to the process of forming a solder wave of melted solder alloy, typically using an electric pump or an electromagnetic pump, to achieve the desired solder wave height. Alternatively, nitrogen gas can be injected into the solder pot to create the wave. During wave soldering, a printed circuit board (Печатная плата) with pre-mounted components passes through the solder wave, forming a specific shape of solder fillet on the liquid solder surface. Этот процесс, in which the PCB with components is passed through the solder wave at a specific angle and with a certain immersion depth to achieve solder joint connections, is called wave soldering.

Historical Development of Wave Soldering

  1. Origin of Manual Wave Soldering Wave soldering, as an electronic soldering technology, originated in the early 1960s. At that time, manually operated wave soldering equipment was widely used. Due to its simple structure, complex operation, and low efficiency, the application of manual wave soldering equipment was somewhat limited.

  2. Automation Control of Wave Soldering Equipment In the early 1970s, wave soldering equipment began to transition towards automation control. With the continuous development of electronic technology, the equipment gradually achieved automation control, greatly improving production efficiency. During this period, various automatic control systems for wave soldering equipment, including PLCs and microcontrollers, began to appear.

  3. Digitization of Wave Soldering Equipment Since the 21st century, wave soldering equipment has been advancing towards digitization. The application of digital technology has enabled wave soldering equipment to achieve higher precision, more stable quality, increased production efficiency, and reduced production costs. В частности, the application of CAD technology in wave soldering equipment has resulted in more stable and consistent soldering effects.

The working principle of wave soldering

The fundamental principle of wave soldering is to utilize molten solder to form a wave on the soldering surface. The soldering material is heated and melted as it passes through the wave, then contacts the soldering surface to create a solder joint. The key to wave soldering lies in controlling the temperature and flowability of the solder to ensure joint quality.

  1. Formation of molten solder: Initially, molten solder is formed in the solder pot through pump pressure, creating a specific shape of solder wave on its surface.

  2. Transport of circuit board: The circuit board is conveyed through the wave soldering machine on a chain conveyor, passing through the preheating zone to ensure temperature control during soldering.

  3. Soldering process: As the circuit board passes through the solder wave at a certain angle, its pins pick up solder from the liquid solder, which solidifies during cooling to form solder joints. The solder wave wets the soldering area and extends to fill, facilitating the soldering process.

  4. Soldering quality: Wave soldering technology is suitable for soldering a variety of metals and non-metals, including aluminum, медь, steel, as well as plastics, керамика, and other non-metallic materials. It is widely used in electronics, машины, automotive manufacturing, and other fields, providing efficient, быстрый, and precise soldering to meet high-precision, high-reliability, and high-quality soldering requirements.

The Process of Wave Soldering

The wave soldering process involves the following steps:

  1. Preparation: Ensure the quality of the PCB and electronic components to be soldered, and perform necessary surface treatments such as cleaning and oxide removal.

  2. Application of solder paste: Apply solder paste to the appropriate soldering areas on the PCB, typically covering the contact surfaces of component pins and PCB pads.

  3. Component placement: Precisely mount electronic components onto the PCB at predetermined locations. This can be done using automated pick-and-place machines or manual methods.

  4. Wave soldering machine setup: Configure the wave soldering machine according to the soldering requirements and specifications, including soldering temperature, wave height, preheating zone, and soldering speed.

  5. Soldering process: Move the assembled PCB through the conveyor system to the solder wave area. The molten solder in the wave area makes contact with the PCB pads and component pins, forming solder joints.

  6. Cooling and solidification: Once the PCB exits the solder wave area, the solder joints are rapidly cooled and solidified through a cooling process, establishing stable solder connections.

  7. Inspection and quality control: Inspect and perform quality control checks on the soldered PCB, including visual inspection, X-ray testing, and solder joint reliability testing, to ensure that the soldering quality meets the requirements.

Operation Guide for Wave Soldering Equipment

  1. Preparing for Wave Soldering

(1) Turn on the main power switch according to the equipment’s operating schedule and control the solder pot switch time via the time electromagnetic valve.

(2) Check if the solder pot temperature indicator is functioning properly: Measure the temperature around 15mm below and above the solder pot’s liquid level with a thermometer, and ensure that the actual set temperature remains within a range of ±5°C.

(3) Check the operation of the lead cutter: Adjust the height of the cutter head based on the thickness of the PCBA, aiming for component pin lengths between 1.4 to 2.0mm.

(4) Verify the normal supply of flux: Pour flux into the fluxer, adjust the air inlet valve, and activate the fluxer to check for foaming or spraying of flux. Adjust the flux ratio to meet the requirements.

(5) Check the solder level height; if it is below 12-15mm from the solder pot, add solder promptly. Add solder in batches, not exceeding 10 kilograms each time.

(6) Clean the solder dross from the solder surface, and add anti-oxidant after cleaning.

(7) Adjust the angle of the transport rail: Adjust the total width of the rail according to the total width of the PCBAs to be soldered, ensuring moderate clamping force. Adjust the rail slope based on the pin density of the soldered components.

  1. Startup Process for Wave Soldering

(1) Turn on the flux switch, adjusting the foam adjusting plate thickness to half of “l” during foaming. For spraying, ensure the board is symmetrical, with moderate spray volume, preferably avoiding spraying on component surfaces.

(2) Adjust the air knife airflow to allow excess flux on the board to drip back into the foam groove, preventing drips on the preheater that could cause a fire.

(3) Turn on the transport switch and adjust the transport speed to the desired value.

(4) Turn on the cooling fans.

  1. Post-Wave Soldering Procedure

(1) Turn off the switches for the preheater, solder pot wave, fluxer, transport, cooling fans, and lead cutter.

(2) Во время работы, replace the flux in the foam groove every two weeks and measure it regularly.

(3) After shutdown, clean the wave soldering machine and claws thoroughly, soaking the nozzles in a cleaning solvent.

Волна пайки

Advantages and Disadvantages of Wave Soldering

Преимущества:

High Efficiency: Wave soldering can simultaneously solder a large number of through-hole components, increasing production efficiency and output.

Welding Quality: Through strict control of welding parameters such as temperature, soldering time, and solder flux flow, wave soldering ensures stable welding quality.

Low Cost: Wave soldering can use standardized components and equipment, reducing production costs.

Недостатки:

Component Limitations: Wave soldering can only solder through-hole components and cannot solder surface mount components.

Large Size Limitations: Wave soldering requires the PCB to be tilted on the soldering pallet, so there are certain limitations on the size and shape of the PCB.

Maintenance Difficulty: Wave soldering machines require regular maintenance and cleaning, which can be challenging.

Applications of Wave Soldering

Wave soldering technology has been widely applied in various electronic products, including consumer electronics, Коммуникационное оборудование, компьютеры, и еще. Here are the main application areas of wave soldering:

● Household Appliances: Wave soldering has become the primary welding technology in the manufacturing of household appliances, including TVs, DVDs, stereos, и еще.

● Automotive Electronics: Wave soldering technology has been applied in automotive electronic products, including in-vehicle entertainment systems, safety control systems, и т. д., enhancing the reliability and safety of automotive electronic products.

● Communication Equipment: Wave soldering technology has been widely used in communication equipment such as base stations, маршрутизаторы, и т. д., enabling high-density and high-speed circuit designs.

● Industrial Control: Wave soldering technology has been applied in the field of industrial control, including PLCs, industrial computers, и т. д., improving the reliability and stability of equipment.

Future Development of Wave Soldering

With the trend of miniaturization and high-density electronic products, wave soldering technology is continuously innovating and developing. Here are the future development directions of wave soldering:

● Increased Automation: The automation level of wave soldering machines will continue to increase, including automation of component feeding and solder liquid supply.

● Improved Welding Quality: The welding quality of wave soldering machines will continue to improve, including more precise control of welding parameters such as temperature, welding time, solder flux flow, и т. д..

● Innovation in Welding Materials: With the growing environmental awareness, the welding materials used in wave soldering machines will continue to innovate and improve, including the adoption of lead-free solder and other environmentally friendly materials.

● Expansion of Application Areas: Wave soldering technology will be applied in more electronic products, including smart homes, the Internet of Things (IoT), и т. д..

В итоге, as an important электронный компонент welding technology, wave soldering has been widely applied in various electronic products. With continuous technological innovation and development, it will play an increasingly important role in the future.

Вершина 8 PCB manufacturers in Thailand

04/24/2024 в /от

As an important economy in Southeast Asia, Thailand is actively attracting the investment of global ПХБ производство Компании. В настоящий момент, many PCB manufacturers from China, Южная Корея, Япония, and the United States have established factories in Thailand. От 2022 к 2027, the compound growth rate of the global PCB output value was about 3.8%. It is expected that by 2027, the global PCB output value will reach about 98.388 billion US dollars. This global growth trend provides a good external environment for the development of the Thai PCB industry. Today we will count Top 8 PCB manufacturers in Thailand.

1.Shennan Circuits Co., ООО.

Shennan Circuits Co., ООО. (hereinafter referred to as “SCC”), Основано в 1984 , is headquartered in Shenzhen, Гуандун, Китай. Its main manufacture facilities are located in Shenzhen, Wuxi and Nantong, Jiangsu, Китай. Its business is all over the world, and there are subsidiaries in North America and R&D sites in Europe.

Производственная мощность

Items Mass Sample
Слои 2~68L 120Л
Максимум. Толщина доски 10mm（394mil） 14mm（551mil）
Мин. Ширина Inner Layer 2.2mil/2.2mil 2.0mil/2.0mil
Outer Layer 2.5/2.5мил 2.2/2.2мил
Registration Same Core ±25um ±20um
Layer to Layer ±5mil ± 4 мили
Максимум. Толщина меди 6Унция 30Унция
Мин. Drill Hole Dlameter Mechanical ≥0.15mm(6мил) ≥0.1mm(4мил)
Laser 0.1mm（4mil） 0.050mm（2mil）
Максимум. Размер (Finish Size) Line-card 850mmX570mm 1000mmX600mm
Backplane 1250mmX570mm 1320mmX600mm
Aspect Ratio (Finish Hole) Line-card 20:1 28:1
Backplane 25:1 35:1
Материал FR4 EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF
High Speed Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933
High Frequency Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27
Others Полиимид, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,
Поверхностная отделка HASK, Соглашаться, Погружение, Оп, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，Enepic

2.Kinwong Electronics

Kinwong Electronics

Установлен в 1993, Jingwang Electronics is a world’s leading high -tech enterprise developing, producing and selling high -tech research and development, production and sales of high -end electronic materials. Establish 11 offices worldwide to provide FAE localized instant service.

Kinwong’s products cover conventional PCB, Flex PCB, Metal Base PCB, Жесткая пласка, HDI PCB, High Layer Count PCB, Substrate Like PCB，RF PCB, Copper Inlay, и т. д.. We are one of the few domestic manufacturers that covers rigid circuit boards, flexible circuit boards and metal base circuit boards. Kinwong provides customers with competitive, reliable products, solutions and services in the fields of Automotive, Telecom, Computing, Smart Terminal, Промышленное & Медицинский, Power Supply and Consumer.

Conventional circuit board manufacturing ability

Количество слоев: 2L/4L/6L/8L/10L
Максимум. Delivery Panel Size: 699mm×594mm
Максимум. Медный вес (Inner/Outer Layer): 12унция
Max.Board Thickness: 5.0мм
Максимум. Aspect Ratio: 15:1
Поверхностная отделка: LF-HASL, Соглашаться, Imm-Ag, Imm-Sn, Оп, Enepic, Gold Finger

3.Shengyi Electronics Co., ООО.

Shengyi Electronics Co., ООО. was established in 1985. It is headquartered in Dongguan City, Гуандонская провинция. It is a national high -tech enterprise specializing in high -precision, высокая плотность, and high -quality printing circuit board. Shengyi Electronics provides customers with a one -stop printing circuit board solution, which is widely used in the fields of communication equipment, cars, aerospace and other fields.

Technology capability

Shengyi Electronics

4.APCB Electronics (Thailand)

APCB Inc. Founded in August 1981, it is a multi -layer PCB factory located in Taipei, Taiwan. The main PCB projects are mainly produced by consumer electronics.
After years of hard work through the APCB team, whether it is developing new technology or investment in advanced production equipment, we have successfully expanded production capacity and improved quality. Делая это, we can expand our product line to various applications, including electronic products, computer -related accessories, communication products, и т. д..

Technology capability

5.Circuit Industries

Circuit Industries was founded in 1990. It is the leading manufacturer of printed circuit board (Печатная плата) or printed circuit board (PWB) in Thailand engaged in PCB manufacturing; aluminum PCB и так далее. The company has obtained the following certification: UL File E-115789 safe printed circuit board (Печатная плата); Iso 9001:2015 Система управления качеством; Iso 14001:2015 environmental management system; Iso 45001:2018 occupational health and safety management system; automotive parts manufacturer quality management system IATF 16949:2016; and TLS 8001:2010.

Technology capability

Предмет
Small Volume
Mass Volume
Remarks
Максимум. Количество слоев 10 Слои 10 Слои Through hole type only. For HDI sequential lamination Max. 6 Слой
PTH Aspect Ratio 10 : 1 8 : 1 Material Thickness : Drill diameter
Мин. Drill Size 0.15 мм 0.2 мм –
Мин. Толщина доски (Final) 0.8 мм 0.8 мм –
Максимум. Толщина доски (Final) 3.0 мм 3.0 мм FR-4 Multilayer only
Мин. Prepreg Thickness 0.075 мм 0.075 мм –
Мин. Finished Copper Thickness 1 OZ (35 μm.) 1 OZ (35 μm.) –
Inner Layer Max. Finished Copper Thickness 2 OZ (70 μm.) 2 OZ (70 μm.) –
Outer Layer Max. Finished Copper Thickness 3 OZ (105 μm.) 3 OZ (105 μm.) –
Мин. Line Spacing (Inner Layer) 0.1 мм (4 mil.) 0.125 мм (5 mil.) Higher Copper Thickness Requires Wider Line and Spaceing
Мин. Line Spacing (Outer Layer) 0.1 мм (4 mil.) 0.125 мм (5 mil.) –
Мин. Annular Ring 0.125 мм (5 mil.) 0.125 мм (5 mil.) –
Drill Accuracy (+/-) 35 мкм. 35 мкм. –
Multilayer Layer Registration (+/-) 35 мкм. 35 мкм. –
Solder Mark Registration (+/-) 75 мкм. 75 мкм. –
Rout / Score Tolerances (+/-) 0.2 мм 0.2 мм –
Blind Via YES YES Mechanical Blind Via
Blind Via Aspect Ratio 1:1 1:1 Via Plug / Filled and Capped NOT AVAILABLE
Buried Via YES YES

6.Team Precision Public

Team Precision is Thailand Эм and has more than 20 years of experience in the industry. The range of manufacturing services includes global procurement and various types of production assembly via the Internet, such as Tongkou assembly, SMT Assembly, thin spacing BGA, FLIP Chip, Початка (Chip-on-Board) dust-free room environment assembly, DI (DE- Ionized) Water-Cleaning, Chemical Compound EncapSuration, Box Build and Retail Packing Ready to Sell.

Technology capability

●11 SMT lines in 2 factories
●Through whole auto insertion machines.
●FLIP CHIP Technology
●Chip-On-Board (Початка)
●Flexible Printed Circuit Assembly (FPCA)
●In line solder past inspection
●In line Automatic Optical Inspection (Аои)
●X-Ray Inspection
●DI water cleaning
●In house laser engraving
●Conformal coating eg. Spray, Dip etc.
●Potting process eg. poly urethane or epoxy etc.
●In circuit and functional test
●Static walk-in burn in chamber
●Dynamic burn in chamber
●Complete Product Assembly : Box-Build to retail packing assembly
●Failure analysis equipment
●Various logistics from order fulfillment service to warehousing services eg.

●Direct shipment to end customers, Milk run delivery in overseas market, hub for the region etc. with on line monitoring.
●Kanban and certified Lean-Sigma and IPC team
●ROHS/REACH compliance

7.Besttech Manufacturing

BestTech Manufacturn Co., LTD was originally established in 2003 and is a small electronic subcontracting manufacturer service plant. The demand for high quality and fast turning Сборка печатной платы services in Pathumthani (Thailand) has been recognized. It is a subcontractor manufacturer serving the electronics industry. It uses conventional or hybrid technology to produce surface mount modules free of charge.

Technology capability

Тип материала SS PCB DS PTH MULTILAYER PCB
Laminate Used FR-1, FR-2, CEM-1, CEM-3, FR-4 CEM-3, FR-4 FR-4
Doosan, Hitachi,Isola Doosan,Shenyi, Kingboard Doosan,Shenyi,Kingboard
High CTI Laminate Available High CTI Laminate Available High CTI Laminate Available
Halogen Free Laminate High TG Performance Laminate High TG Performance Laminate
Upon Request Upon Request Upon Request
Overall Thickness 0.80mm to 2.00mm 0.40mm to 2.00mm , Максимум. 2 Слои 0.40mm to 2.00mm , Максимум. 4-16 Слои
Copper Foil Thickness 35um, 70um 35um, 70um, 105um 35um, 70um ,105 um
Pattern Image Line / Spacing 0.20mm Line / Spacing 0.10mm Line / Spacing 0.10mm
Припаяя маска Укр, PISR Upon Request PISR PISR
Tamura/Union/Taiyo/Coates Мин. opening 0.10mm Мин. opening 0.10mm
Coates, Taiyo, Peters, Vantico Coates, Taiyo, Peters, Vantico
Зеленый, Желтый, Синий, Черный Зеленый, Желтый, Синий, Черный
Legend Укр Укр Укр
Мин. Feature Width 0.18mm Мин. Feature Width 0.18mm Мин. Feature Width 0.20mm
Product dentification Week Code Printed On Legend Week Code Printed On Legend Week Code Printed On Legend
Peelablemask Maximum Tenting hole size 2.80mm Maximum Tenting hole size 2.80mm Maximum Tenting hole size 2.80mm
Изготовление Minimum Hole Size For NC Drill 0.30mm, for Punch 0.65mm Minimum Hole Size For NC Drill 0.25mm, for Punch 0.30mm Minimum Hole Size For NC Drill 0.25mm, for Punch 0.30mm
Minimum Punch Soft Tool Shelf Life 200k Minimum Punch Harden Tool Shelf Life 150k Minimum Punch Harden Tool Shelf Life 150k
Minimum Punch Harden Tool Shelf Life 150k FR-4 Not Recommended to Punch Hole FR-4 Not Recommended to Punch Hole
FR-4 Not Recommended to Punch Hole V-Cut is available V-Cut is available
V-Cut is available Chamfering is Available Chamfering is Available
Chamfering is Available
Поверхностная отделка Electrolytic Ni/Au Plating for SS PCB Соглашаться Соглашаться
Rosin Flux Coating OSP Coating OSP Coating
OSP Coating HAL or HASL HAL or HASL
Roller Tin on SS PCB, HAL on CEM-3, FR-4 Products
Products Acceptance Criteria Follow IPC-A-600 Acceptance Criteria Follow IPC-A-600 Acceptance Criteria Follow IPC-A-600 Acceptance Criteria

8.Headsin Technology Co.ltd

LST-универсальный поставщик услуг EMS, который интегрирует PCBlayout, ПХБ производство, PCBA solution and product design,Компонентная закупка, Пост, Погрузитесь в сборку готового продукта и тестирование.

У нас есть богатый опыт производства и профессиональная техническая команда для предоставления услуг PCB для глобальных клиентов, Наши продукты покрывают автомобильную, медицинский, Промышленный контроль, коммуникация, Интернет вещей, потребительская электроника, обеспечение качества и доступная цена.

Technology capability

Number of layers 1-48 слои
Материалы FR4, Tg=135150170180210, cem-3, cem-1, aluminum substrate, PTFE, Роджерс, Nelco
Copper thickness 1/2унция, 1унция, 2унция, 3унция, 4унция, 5унция
Толщина доски 8-236мил (0.2-6.0мм)
Minimum line width/spacing 3/3 миллион (75/75um)
Minute drilling size 8 миллион (0.2 мм)
Min HDI laser drill size 3 миллион (0.067 мм)
Aperture tolerance 2 миллион (0.05 мм)
PTH copper thickness 1 миллион (25 Микроны)
Resistance welding color Зеленый, Синий, Желтый, Белый, Черный, Красный
Strippable solder mask layer да
surface treatment Провести кровотечение (ROHS), ENING, Оп, sinking silver, sinking tin, shining gold, golden fingers
Gold thickness 2-30u “(0.05-0.76um)
Blind hole/buried hole да
V-shaped cutting да

Detailed guide for PCBA processing

04/22/2024 в /от

А PCBA processing process covers the entire process from raw material procurement to finished product shipment, including SMT chip mounting, DIP plug-in processing, Тестирование PCBA, Трехэффективное покрытие, and finished product assembly. Each step strictly follows the process requirements to ensure the quality and performance of the final product. В этой статье, we will detail the manufacturing process of PCBA, with the specific contents as follows.

SMT Chip Mounting Process

The process of SMT chip mounting includes: solder paste mixing → solder paste printing → SPI → mounting → reflow soldering → AOI → rework.

  1. Solder Paste Mixing

After taking the solder paste out of the refrigerator and thawing it, it is mixed manually or by machine to be suitable for printing and soldering.

  1. Припаяная печать

Place the solder paste on the steel mesh and use a scraper to print the solder paste onto the PCB pads.

  1. SPI

SPI, namely solder paste thickness detector, can detect the printing condition of solder paste, playing a role in controlling the effect of solder paste printing.

  1. Mounting

Various components are automatically mounted on the circuit board using machine equipment.

  1. Стрелка пайки

The assembled PCB board is reflow soldered, where the solder paste is heated to become liquid through high temperature inside and then cooled and solidified to complete the soldering.

  1. Аои

Аои, namely automatic optical inspection, can scan and detect the soldering effect of the PCB board, identifying any defects.

  1. Переработка

Defects identified by AOI or manual inspection are reworked.

DIP Plug-in Processing Process

The process of DIP plug-in processing includes: plug-in → волна пайки → trimming → post-solder processing → cleaning → quality inspection.

  1. Plug-in

Process the pin of the plug-in material and install it on the PCB board.

  1. Волна пайки

Pass the assembled board through wave soldering, where liquid tin is sprayed onto the PCB board, and then cooled to complete the soldering.

  1. Trimming

The pins of the soldered board need to be trimmed if they are too long.

  1. Post-solder Processing

Manual soldering of components is performed using an electric soldering iron.

  1. Cleaning

After wave soldering, the board may be dirty and requires cleaning using cleaning solution and washing tank, or by using a cleaning machine.

  1. Качественная проверка

Inspect the PCB board, and defective products need to be reworked before qualified products can proceed to the next process.

Тестирование PCBA

PCBA testing includes ICT testing, ПКТ-тестирование, aging testing, vibration testing, и т. д..

PCBA testing is a comprehensive process, and the testing methods adopted vary depending on the product and customer requirements. ICT testing checks the soldering of components and the continuity of circuits, while FCT testing examines the input and output parameters of the PCBA board to ensure compliance with requirements.

PCBA Three-proof Coating

The process of PCBA three-proof coating includes: brushing Side A → air drying → brushing Side B → room temperature curing. The spraying thickness is 0.1mm to 0.3mm. All coating operations should be carried out under conditions of not less than 16°C and relative humidity below 75%. PCBA three-proof coating is widely used, especially in harsh environments with high temperature and humidity. The coating provides excellent insulation, moisture resistance, leak resistance, shock resistance, dust resistance, коррозионная стойкость, anti-aging, anti-mildew, anti-loosening of components, and insulation against electric arcing. It can extend the storage time of PCBA, isolate external erosion, pollution, и т. д.. Среди них, the spraying method is the most commonly used coating method in the industry.

Final Assembly

The PCBA boards that have been tested OK after coating are assembled into the outer casing, followed by testing, and finally ready for shipment.

PCBA production is a chain of processes, and any problem in any link can have a significant impact on the overall quality. It requires strict control over each process.

Overall, PCBA processing requires meticulous attention to detail and adherence to industry standards to produce reliable and high-quality electronic devices.

Процесс производства медицинской печатной платы

04/17/2024 в /от

По мере быстрого развития технологий, the medical industry’s demand for electronic products is also growing. Among the various electronic components, PCBs undoubtedly play an indispensable role in medical devices. Однако, the requirements and standards for PCBs in the medical industry far exceed those in other sectors. Why is this so? This article will explore the high demands and standards of the medical industry for PCBs. В этой статье, we will discuss the manufacturing process of medical PCBs.

Importance of PCBAs in Medical Devices

  1. Точность: Medical devices require a high level of precision to ensure accurate diagnosis and effective treatment. Any defects or errors in the circuit board could lead to equipment failure or provide incorrect information, posing serious risks to patients’ health.
  2. Надежность: Medical devices often need to operate in continuous working environments, placing high demands on the reliability of the circuit boards. Sudden equipment failures could result in surgery interruptions, data loss, or other medical accidents.
  3. Safety: Medical devices are directly related to patients’ lives and health, so the design and manufacturing of their circuit boards must comply with strict safety standards. This includes, but is not limited to, электромагнитная совместимость, overheat protection, and fire prevention.
  4. Миниатюризация: С технологическими достижениями, many medical devices are pursuing smaller sizes and higher levels of integration. This requires circuit board designs to be more compact, with finer connections between components.

Material Selection and Performance

In the surface mounting process of medical device PCBA, the selection of PCB materials is crucial. Commonly used PCB materials include FR-4 (glass fiber reinforced epoxy resin), Металлические субстраты (such as aluminum substrates), ceramic substrates, и так далее. Different materials have different performance characteristics, and it is necessary to choose the appropriate materials according to the operating environment and requirements of medical devices.

▶ Thermal Stability: Medical devices may operate in high-temperature environments, so the thermal stability of PCBs is crucial to avoid performance issues caused by thermal expansion and contraction in high-temperature environments.

▶ Mechanical Strength: PCBs need to have sufficient mechanical strength to prevent breakage during transportation, installation, or use, ensuring the stability and durability of medical devices.

Hierarchy Structure and Design Layout

Medical devices typically require high integration, so the hierarchy structure and design layout of PCBs are particularly important. A reasonable hierarchy structure and layout design can minimize signal interference, improve circuit stability, and reliability to the maximum extent.

▶ Layered Design: For complex medical devices, multi-layer PCBs can be used to distribute different functional modules on different layers, reducing signal interference and improving the circuit’s anti-interference ability.

▶ Reasonable Wiring: A reasonable wiring design can reduce signal transmission paths, decrease signal delay, increase signal transmission speed, and avoid interference caused by signal cross-talk.

Pad Design and Process Requirements

The design of pads on the PCB and the process requirements for surface mounting are closely related. Proper pad design and process can ensure a good connection between surface-mount components and the PCB, preventing soldering defects and cold joints.

▶ Pad Size and Spacing: Different sizes and types of surface-mount components require pads of appropriate size and spacing to ensure soldering stability and reliability.

▶ Pad Shape: Different shapes of pads are suitable for different types of soldering processes, such as Surface Mount Technology (Пост) and through-hole soldering technology. Choosing the appropriate pad shape can improve soldering efficiency and quality.

Medical PCB manufacturing

Manufacturing Process of Medical PCBA

  1. Дизайн печатной платы: Engineers use professional software to design the circuit board according to the requirements and specifications of the device. Once the design is completed, а Производитель печатной платы produces the bare board based on the design.

  2. Компонентная закупка: The procurement team purchases the required electronic components based on the Bill of Materials (Категория). These components may include resistors, конденсаторы, индукторы, ICs (integrated circuits), и т. д..

  3. SMT Mounting: Electronic components are precisely mounted onto the PCB using a pick-and-place machine. This process is automated to ensure speed and accuracy.

  4. Пайрь: Components are soldered onto the PCB using reflow soldering or other soldering methods.

  5. Тестирование и проверка: The completed PCBA undergoes quality inspection and functional testing using AOI (Автоматическая оптическая проверка) equipment and other testing tools to ensure it meets design requirements and quality standards.

  6. Assembly and Encapsulation: The tested and qualified PCBA is assembled with other components (such as displays, батареи, и т. д.) to form a complete medical device.

Challenges and Trends in Medical Device PCBA

  1. Technological Challenges: With the continuous advancement of medical technology, the requirements for circuit boards in devices are also increasing. Например, many advanced imaging systems require processing large amounts of data, placing high demands on the transmission speed and processing capabilities of circuit boards.

  2. Соответствие нормативным требованиям: The medical device market is subject to strict regulatory oversight, and manufacturers must ensure that their products comply with various safety and performance standards. This requires PCBA manufacturers to have a high sense of responsibility and expertise.

  3. Управление цепочками поставок: Due to the uncertainty of the global supply chain and issues of component shortages, medical device manufacturers need to pay more attention to supply chain management and optimization to ensure production stability and cost-effectiveness.

  4. Sustainable Development: With the increasing environmental awareness, manufacturers need to consider sustainability issues in the manufacturing process, such as using environmentally friendly materials and reducing waste generation.

Medical PCBA is closely related to patient health, so it is essential to maintain the accuracy and stability of the equipment. Поэтому, when choosing a medical PCB manufacturer, it is necessary to consider multiple factors. If you need medical PCBs, you can choose LST, с 16 years of experience in medical ПХБ производство and a professional team worthy of trust.

Руководство по производству и применению совета по разработке

04/15/2024 в /от

Платы по разработке - это круги, используемые для разработки встроенной системы, Включая серию аппаратных компонентов, включая центральные обработки, память, входные устройства, Выходные устройства, Пути данных/шины, и внешние интерфейсы ресурсов. Обычно, Разработчики встроенных систем настраивают доски разработки в соответствии с их потребностями в разработке, или пользователи могут разрабатывать их самостоятельно. Платы разработки служат средством для начинающих, чтобы понять и узнать как оборудование, так и программное обеспечение систем. Кроме того, Некоторые советы по разработке предоставляют основные интегрированные среды развития, исходный код программного обеспечения, и аппаратная схема. Общие типы советов по разработке включают 51, РУКА, FPGA, и доски разработки DSP.

Роль плат развития:

Платы разработки служат интегрированными платформами, которые облегчают разработку встроенных систем, одновременно снижая барьеры и риски, связанные с ней. Они играют следующие роли:

  1. Прототипирование и проверка: Платы разработки позволяют разработчикам быстро создавать прототипы встроенных систем и выполнять совместную программную и аппаратную отладку и тестирование для проверки функциональности и производительности системы. Они также имитируют реальные среды, сокращение неопределенности и рисков в процессе разработки.

  2. Разработка приложений: Платы разработки предоставляют различные аппаратные платформы и поддержку программного обеспечения для различных потребностей приложений, Обеспечение того, чтобы разработчики были удобны для создания приложений. Они обычно предлагают обильные периферические интерфейсы и библиотеки программного обеспечения, Включение быстрой реализации различных прикладных функций.

  3. Образование и обучение: Правления развития также используются для образования и обучения, Помощь студентам и начинающим понять принципы и методы развития встроенных систем. Они часто имеют низкие затраты и просты в использовании, сделать их подходящими для практического обучения и экспериментов.

  4. Повышение эффективности обучения: С точки зрения обучения, Правления разработки могут эффективно повысить эффективность обучения и сократить процесс разработки.

Преимущества советов по развитию:

  1. Быстрое прототипирование: Советы по разработке помогают разработчикам быстро разрабатывать прототипы и эффективно подтвердить их проекты.
  2. Легкая переносимость: Платы разработки очень универсальны и могут быть легко перенесены на другие аппаратные платформы.
  3. Обильные периферийные устройства: Доски разработки обычно предлагают богатый набор периферийных устройств и интерфейсов, Управление с различными сценариями применения.
  4. Экономия затрат: По сравнению с проектированием и производством аппаратных прототипов с нуля, Использование плат разработки может сэкономить на затратах на разработку.
  5. Системная поддержка по умолчанию и программное обеспечение: Многие платы разработки поставляются с системой по умолчанию и поддержке программного обеспечения, Сокращение рабочей нагрузки для разработчиков.

Совет по развитию-4

Компоненты совета по разработке

Доска разработки является сложной сборкой нескольких электронных компонентов, каждый из которых служит определенной целью. Основные элементы можно разделить на несколько категорий:

Микроконтроллер/микропроцессор
Этот компонент - мозг совета по разработке, Запуск программ и контроль других периферийных устройств.

Память
Он включает в себя обоих летучие (БАРАН) и не волатильный (Вспышка, Eeprom) хранилище для хранения и выполнения кода программы.

Ввод/ Вывод (Ввод) Интерфейсы
Они позволяют совету общаться с другими устройствами или частями. Примеры включают цифровой ввод -вывод, аналоговые входы, и интерфейсы связи, такие как USB, Uart, и SPI.

Производство процесса разработки круговой платы

  1. Определите требования и функции Совета по развитию: Прежде чем сделать совет по развитию, Важно уточнить его требования и функции, включая необходимые интерфейсы, рабочая частота, Тип процессора, и т. д.. Только с четким пониманием функций и требований совета директоров может продолжаться последующий проект и производство.

  2. Спроектировать схему схемы: После определения требований и функциональности Совета по разработке, Схема схемы должна быть разработана. При разработке схемы, Соображения должны включать методы соединения между различными модулями схемы, Конкретные параметры цепных модулей, и т. д.. Профессиональное программное обеспечение для дизайна схемы, такое как Altium Designer, Протел, и т. д., обычно используется для этого процесса.

  3. Дизайн макета печатной платы: После завершения схемы схемы схемы, Дизайн макета печатной платы следует. Конструкция макета печатной платы включает в себя расположение компонентов и трассов из схемы схемы на фактическую плату. Факторы, которые следует учитывать при проектировании макета, включают размеры совета директоров, Расстояния между компонентами, трассировка маршрутизации, и т. д.. Профессионал Дизайн печатной платы Программное обеспечение как накладки, Алтиус Дизайнер, и т. д., используется для этого процесса.

  4. Изготовление платы печатной платы: После завершения конструкции макета печатной платы, Проектированная плата печатных плат должна быть изготовлена. Изготовление платы печатных плат обычно включает в себя такие методы, как фотолитография, травление, и т. д., и процесс должен быть проведен в чистой лабораторной среде. Изготовленная доска печатных плат должна пройти качественное тестирование, чтобы убедиться, что нет таких проблем, как утечки меди, Короткие цирки, и т. д..

  5. Компонент пайки: После изготовления платы печатной платы, Различные компоненты должны быть припаяны на плату печатной платы. Паянка требует внимания к таким факторам, как температура, продолжительность, и т. д., Для обеспечения качества пайки. После пайки, Тестирование проводится для обеспечения хорошего качества сустава.

  6. Программное программирование: После завершения оборудования, Программное программирование требуется. Программное программирование обычно включает использование языков программирования, таких как C, Ассамблея, и т. д., Для написания программ, контролирующих различные модули совета по разработке. Письменным программам необходимо тестирование, чтобы обеспечить правильность и стабильность.

  7. Отладка и тестирование: После программного программирования, отладка и тестирование проводится. Этот процесс включает в себя использование инструментов и инструментов профессионального тестирования, таких как осциллографы, Логические анализаторы, и т. д., Для обеспечения нормальной работы модулей платы разработки.

  8. Инкапсуляция и производство: После завершения отладки и тестирования, Совет по разработке может быть инкапсулирован и введен в производство. Инкапсуляция включает в себя помещение Совета по развитию в оболочку, чтобы защитить его от внешних экологических влияний. Производство включает в себя массовое производство Совета по развитию для удовлетворения рыночного спроса.

Краткое содержание:

Платы разработки играют решающую роль в области производства электроники, предлагая отличные решения проблем в электронном дизайне. Если вам нужны платы разработки, Пожалуйста, свяжитесь с нами.