Thick Film Ceramic Hybrid Circuit Board
♦Name:Ceramic PCB
♦Plate material: 96% alumina, aluminum nitride or customized according to customer needs
♦Plate thickness: 0.25mm-0.38mm-0.635mm (most economical)-0.8mm-1-1.2mm
♦Conductor material: gold plating process, nickel-palladium gold process, silver plating process, nickel plating process, tin plating process, etc.
♦Conductor thickness greater than 10um, up to 20 microns (0.02mm)
♦Minimum line width 0.2mm
♦Accuracy 0.1mm
♦Compressive strength ≧450MPa
Product Description
Thick film ceramic hybrid circuit board is an advanced printed circuit board that combines the advantages of thick film process and ceramic substrate. Its core feature is that the thickness of the conductor layer reaches 10~13 microns (μm), which is far more than that of thin film ceramic circuit board (<1μm). Conductive paste (such as gold, silver, palladium) is screen printed on the ceramic substrate, and high-temperature sintering is used to form conductive traces, resistors, capacitors and other components, and supports multi-layer interconnection structure. This process makes it outstanding in power density, heat dissipation performance and reliability.
Technical advantages and performance characteristics
Multi-layer wiring and three-dimensional interconnection capabilities
Through repeated printing and sintering processes, multi-layer circuit structures can be constructed to meet the needs of complex circuit design. For example, electric vehicle drive controllers achieve high power density integration through three-dimensional interconnection.
Significant cost-effectiveness
Compared with thin film process, thick film process equipment investment is reduced by more than 40%, and production efficiency is increased by 30%, which is suitable for large-scale production. Its low cost characteristics are widely used in the field of consumer electronics.
Adaptability to extreme environments
Heat resistance: The thermal conductivity of ceramic substrates (such as alumina and aluminum nitride) is 20~230 W/m·K, and can withstand high temperatures of 850℃.
Mechanical strength: The bending strength is 450 MPa, which is suitable for aerospace vibration environments.
Thermal expansion matching: The thermal expansion coefficient is close to that of silicon chips (4.5~10.9×10⁻⁶/K), reducing the risk of thermal stress failure.
High reliability design
The insulation resistivity of the ceramic substrate is >1×10¹⁴ Ω·cm, and the breakdown voltage is 20 kV/mm.
After laser trimming, the accuracy of the thick film resistor can reach ±1%, and the temperature coefficient is as low as 50 ppm/℃.
Product Applications
Application fields and typical scenarios
Automotive electronics
In the battery management system (BMS) of electric vehicles, thick film circuit boards realize current sampling and balancing control, with an operating temperature range of -55℃~125℃.
The on-board charger (OBC) uses aluminum nitride substrates, which improves heat dissipation efficiency by 50%.
Aerospace
The satellite communication module integrates power amplifiers, and the thick film process achieves 50Ω impedance matching with insertion loss <0.5 dB.
The airborne radar system uses the lightweight characteristics of ceramic substrates, which is 60% lighter than traditional PCBs.
Power devices
In the power module, the thick film circuit board carries more than 100A of current, and the thermal resistance is as low as 0.2℃/W.
The high-voltage DC converter (HVDC) uses multi-layer wiring with voltage isolation of 5 kV.
RF/microwave field
LTCC (low-temperature co-fired ceramic) technology realizes 5G filter integration, covering frequencies from 24 to 40 GHz.
The T/R components of phased array radars are reduced by 40% through thick film processes, and the phase consistency is <±2°.
Manufacturing process
Substrate preparation
Select 96% alumina or aluminum nitride ceramics with a surface roughness of Ra<0.3 μm to ensure the adhesion of the slurry.
Screen printing
Use a 300-mesh stainless steel screen with a printing accuracy of ±5 μm.
The viscosity of the conductor slurry (silver-palladium alloy) is controlled at 80~120 Pa·s to prevent printing defects.
High-temperature sintering
Sinter at 850℃ for 2 hours in a nitrogen atmosphere to form a chemical bond between the slurry and the substrate, with a bonding strength of >45 MPa.
Laser resistance trimming
Use ultraviolet laser (355 nm) to correct the resistance value with an accuracy of ±0.1%, and the resistance stability after resistance trimming is <0.5%/1000 hours.
Surface mounting and packaging
The welding temperature is controlled below 260℃ to avoid thermal stress cracking of the ceramic substrate.
The airtight packaging uses parallel seam welding with a leakage rate of <1×10⁻⁹ Pa·m³/s.
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