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The introduction and advantage of Rogers PCB
What is Rogers PCB
Rogers PCB is a high frequency board produced using materials sourced only from Rogers. It uses ceramic substrate as high frequency material without glass fiber and has excellent dielectric constant and temperature stability, low loss angle tangent and high thermal conductivity. It is widely used in microwave communication, 5g, military radar and other high-frequency PCB and high-reliability fields.
Characteristics of Rogers pcb
①Low dielectric constant (Dk): Rogers PCB materials have a low dielectric constant, typically between 2.2 and 3.5, which means that they can maintain signal integrity and minimize signal loss at high frequencies and over long distances.
②Low loss tangent (Df): Rogers PCB materials have a low loss tangent, typically between 0.001 and 0.002, which means that they can minimize signal attenuation and distortion.
③High thermal conductivity: Rogers PCB materials have a high thermal conductivity, typically between 0.5 and 2 W/mK, which means that they can effectively dissipate heat and maintain stable performance even at high temperatures.
④Dimensional stability: Rogers PCB materials have a low coefficient of thermal expansion (CTE), typically between 10 and 17 ppm/°C, which means that they are less likely to warp or deform under temperature changes.
⑤Uniform material structure: Rogers PCB materials have a uniform material structure, which means that they provide consistent performance across the board.
Rogers Types and Their Properties
Rogers 3003 is a PTFE composite material with added ceramic fillers. This material gives Rogers 3003 an extremely high temperature stability of its dielectric constant. The thermal stability coefficient (Z-direction) of its dielectric constant can be as high as -3 ppm/°C when the temperature changes from -50°C to +150°C. At the same time, Rogers 3003 maintains a high dielectric constant frequency stability and can be used over a wide frequency range.
Rogers 4003C is a high-frequency PCB material manufactured by Rogers. It has excellent electrical and mechanical properties and is widely used in high frequency circuit design and high reliability electronic equipment.
Rogers 4003C uses a special polytetrafluoroethylene (PTFE) substrate with a low dielectric constant and dielectric loss, which can effectively reduce signal transmission loss and interference. It also has high temperature resistance and mechanical strength to meet the needs of high-reliability applications.
Rogers 4350 is a high performance material for PCB signals consisting of hydrocarbon resin/ceramic filler reinforced glass fibers instead of PTFE.It offers cost savings compared to conventional microwave laminates because it does not require special THT through-hole processing. The material has a stable dielectric constant over a wide frequency range and a low temperature coefficient, making it an ideal substrate for broadband applications.
Rogers 4830 is a thermoset laminate material specifically designed for 77 GHz and 79 GHz millimeter wave radar sensors. It is based on the Rogers RO4000 series of hydrocarbon resin and ceramic filler material systems, featuring a dielectric constant that matches the low dielectric constant (Dk3.24), as well as extremely low insertion loss characteristics with the same ease of processing as the RO4000 series.
Rogers 4835T is a high-frequency PCB material characterized by low loss, high mechanical strength, and dimensional stability. It is made of hydrocarbon resin and ceramic filler and has excellent electrical and mechanical properties.
Rogers 5880 is made of glass staple fibers filled with PTFE resin, which has a very low dielectric constant and loss factor to effectively reduce signal transmission loss and interference, and improve signal transmission speed and stability. In addition, it has high mechanical strength and excellent dimensional stability to meet the needs of high-reliability applications.
|Rogers Materials||Dielectric Constant||Other Properties|
|Rogers 3003||3.00 +/- .04.||Dissipation factor：0.0010 to 10 GHz|
|Substrate thickness: 0.02 “(0.5 mm)|
|The thickness of copper: 0.5 ounces|
|Low X, Y and Z axis CTE of 17, 16 and 25 ppm/°C, respectively|
|Rogers 4003C||3.38 +/- 0.05||Dissipation factor: 0.0027 at 10 GHz|
|Low Z-axis coefficient of thermal expansion at 46 ppm/°C|
|The volume resistance: 1.7×10&10|
|Surface resistance: 4.2*10&9|
|Rogers 4350||3.48 +/- 0.05||Dissipation factor: 0.0037 at 10 GHz|
|Low Z-axis coefficient of thermal expansion at 32 ppm/°C|
|Glass transition temperature (TG) of over 280°C|
|Surface speed of less than 500 SFM|
|Chip Load less than 0.05 mm during perforation|
|Rogers 4830||3.24||Insertion loss : 2.2 db/in at 77 GHz|
|UL 94 V-0 flame retardant rating|
|Dielectric thicknesses of laminates: 0.005 and 0.0094|
|Rogers 4835T||3.3||Density 1.92gm/cm3|
|Thermal conductivity 0.66w/m/k|
|Flame retardant laminate, UL 94 V-0 rated|
|Glass transition temperature Tg of over 280 degrees|
|Rogers 5880||2.20 +/- .02||Dissipation factor of .0009 at 10GHz|
|Extremely low density of 1.37g/cm3|
|Z-axis TCDk as low as +22ppm/°C|