High-Layer Impedance-Controlled PCBs | Blind & Buried Via PCBs | Circuit Boards for Servers, Industrial Control, and Medical Applications
15 Years of Expertise in High-Layer PCB Manufacturing | One-Stop Service for 24-Layer PCB Prototyping and Mass Production | Strict Control of Lamination Registration, Impedance Compliance, and Delamination-Free Quality
Get an Instant Quote for 24-Layer PCBs Today | Free DFM Review and PCB Design Analysis
Our company specializes in the R&D, prototyping, small-to-medium batch production, and large-scale manufacturing of high-layer PCBs ranging from 16 to 36 layers. We focus on standardized production of 24-layer PCBs and have overcome six major industry challenges: multi-layer lamination misalignment, registration deviation, via copper cracking, dielectric inconsistency, impedance deviation, and board warpage.
The 24-layer PCB is a high-density interconnect (HDI) multilayer circuit board featuring high routing density, stable electrical performance, strong EMI shielding, high integration capability, and strong computational load support. It is widely used as a core substrate in high-end industrial equipment, server computing systems, medical imaging devices, rail transit control systems, 5G communication base stations, and aerospace & automotive electronics.
Unlike conventional low- and mid-layer PCBs, 24-layer PCBs undergo more than four sequential lamination cycles, blind and buried via alignment processes, inner-layer flow control design, and differential impedance management. They are designed to meet the requirements of miniaturization, high integration, and high-frequency/high-speed circuit applications. We support customization with standard FR-4, high-TG materials, Rogers high-frequency laminates, and halogen-free substrates, ensuring long-term reliability under harsh industrial conditions.
| Parameter | Industry Standard Process | Our High-Precision Process |
|---|---|---|
| Material | Standard FR-4 TG130 | High-TG 170/180, Rogers, Shengyi/Nanya military-grade laminates, halogen-free materials |
| Finished Board Thickness | 2.4 ± 0.2 mm | 2.2–3.0 mm adjustable, tolerance ±0.08 mm |
| Minimum Trace/Space | 0.12 mm / 0.12 mm | 0.075 mm / 0.075 mm high-precision routing |
| Via Technology | Mechanical through-hole vias | Mechanical vias + 1st/2nd order blind & buried vias, laser microvias |
| Lamination Accuracy | Registration error ≤ 75 μm | Multi-layer registration error ≤ 35 μm, preventing layer misalignment short circuits |
| Impedance Tolerance | ±10% | High-speed differential impedance control within ±5% |
| Surface Finish | HASL, immersion tin | ENIG, ENEPIG, immersion silver, OSP, anti-oxidation, thick gold plating |
| Reliability | Standard reflow soldering | No delamination or blistering, 260°C thermal resistance test, UL/RoHS compliant |
We specialize in high-layer PCB production, focusing on solving critical manufacturing challenges of 24-layer circuit boards while delivering high reliability and consistency.
Optimized browning, lamination, and curing processes effectively release internal stress, preventing delamination and board blistering during high-temperature soldering. Final yield rate ≥ 98.5%.
Advanced fully automated optical alignment systems ensure precise layer stacking, guaranteeing reliability in ultra-dense routing and BGA areas.
Impedance modeling and full inspection for differential and signal traces ensure signal integrity and reduce crosstalk and attenuation.
Supports high-TG FR-4, Rogers high-frequency laminates, halogen-free and military-grade materials, ensuring long-term stability in high-speed, high-frequency, and harsh operating environments.
Supports prototyping, pilot runs, and mass production. Standard lead time is 7–10 days, expedited delivery in 5 days, with dedicated high-layer production lines ensuring consistency.
12-step quality inspection covering MI engineering to final testing. Free DFM review, process optimization support, and comprehensive after-sales service.
Featuring conventional multilayer lamination and plated through-hole (PTH) construction, this cost-effective solution is ideal for industrial control systems, power control boards, and other high-volume applications. It offers stable lead times and excellent cost efficiency for standardized mass production.
Designed with first-order and second-order blind/buried via structures, this HDI PCB reduces surface routing congestion, minimizes board size, and significantly increases routing density. It is widely used in server motherboards, AI computing backplanes, and advanced medical electronics.
Manufactured with high-frequency laminates and customized differential impedance control, this PCB provides excellent EMI resistance and minimal signal loss. It is ideal for 5G communication equipment, RF modules, and high-speed data transmission systems.
Available with 1 oz to 3 oz heavy copper inner layers, this design delivers higher current-carrying capacity and superior thermal performance. It is well suited for high-power industrial control equipment and railway power control applications.
Produced with halogen-free materials and environmentally friendly manufacturing processes, this PCB complies with international environmental standards, including RoHS requirements. It is commonly used in medical devices, automotive electronics, and military-grade electronic systems for global markets.
New energy equipment
Satellite communications equipment
Medical equipment
Industrial equipment
Compared with lower-layer-count alternatives, a 24-layer PCB offers several significant advantages:
To maximize the success and reliability of a 24-layer PCB design, follow these proven best practices:
Customers provide Gerber files, BOM, fabrication requirements, stack-up information, and impedance specifications.
Our engineering team performs a comprehensive Design for Manufacturability (DFM) analysis, evaluating stack-up structures, process feasibility, and potential design optimizations.
A detailed quotation is provided within 1 hour, including material selection, lead time, surface finish options, and quality control requirements.
Stack-up Design → Inner Layer Imaging & Etching → Sequential Lamination → Drilling & Copper Plating → Circuit Formation → Surface Finishing
Vacuum moisture-proof packaging, secure global shipping, and dedicated post-delivery engineering support with quality assurance services.
This is a 24-layer IC test board that we custom-produced for our clients.
24-layer IC test board
Product Parameters
| Item | Customer Requirement | Actual Result |
|---|---|---|
| Type | TG170 FR4 Halogen-Free | TG170 FR4 Halogen-Free |
| Board Thickness | 4.750 ± 0.475 mm | 4.583–4.708 mm |
| Warp and Twist | ≤ 1% | 0.20% |
| Copper Thickness (PTH) | ≥ 20 μm & Average ≥ 25 μm | #REF! |
| Copper Thickness (Overall Surface Copper) | ≥ 29.3 μm | 0.00 mm |
| Surface Finish | ENIG + Selective Hard Gold Plating | ENIG + Selective Hard Gold Plating |
| Gold Thickness (Hard Gold Area) | ≥ 3 μm | 4.449 μm |
| Nickel Thickness (Hard Gold Area) | ≥ 0.05 μm | 0.055 μm |
| Gold Thickness (ENIG Area) | ≥ 0.762 μm | 0.896 μm |
| Nickel Thickness (ENIG Area) | / | / |
| Minimum Conductor Width | / | / |
| Minimum Spacing | CS 0.157–0.235 mm | 0.16 mm |
:4th–6th Floors, Xingyuan Technology Park, Tongda Road, Gushu, Xixiang Town, Bao’an District, Shenzhen, Guangdong Province, China
:A3 区Area A3, Phung Nenh Truce Industrial Zone (Nam Giang Industrial Park), Viet Yen City, Bac Giang Province, Vietnam
WhatsApp：+86 15817390087
: +86-15817390087
: +86-755-23108895
: +86-755-29129721
: Victor Zhang
:sales@leadsintec.com
