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Quick Turn PCB Manufacturing Guide: How to choose manufacturer

12/26/2023 在： /通过：

Quick Turn PCB manufacturing means that PCB can complete mass production in a short time, so it is named “Quick Turn PCB”. Fast PCB can help customers realize the rapid entering the market, while ensuring sufficient capacity. High -quality, high efficiency, and relatively low cost make the Quick Turn PCB manufacturing very popular.

The advantage of fast PCB manufacturing

The advantages of fast PCB manufacturing mainly include the following points:

1. Quick delivery: The traditional PCB manufacturing process may take several days or weeks to complete, and the Quick Turn PCB manufacturing can be completed in just a few hours, which greatly shortens the product listing time.

2. High -precision: Quick TURN PCB manufacture uses high -precision laser or lithography technology, which can make PCB with high precision lines and details, which improves the reliability of the circuit.

3. Low cost: Although the initial investment manufactured by Quick Turn PCB may be high, due to its fast and high -precision characteristics, it can save a lot of time and cost in the long run.

4. Flexibility: Quick Turn PCB manufacturing allows designers and engineers to ite and modify during the manufacturing process to better meet product needs.

5. Customization: Quick Turn PCB manufacturing can customize the size, shape and materials of PCB according to the needs of the customer, thereby meeting various application needs.

Quick Turn PCB Prototypes

A PCB prototype is a fabricated PCB that is created to check and evaluate the functionality and capability of the final PCB assembly that is the objective of production, to make sure it meets the current required technical and electrical applications.

These prototype PCBs are created with all the functionalities and properties that are expected from the final finished PCBs. Prototypes help prove the PCB design, providing the avenue to thoroughly test it and resolve any performance or regulatory compliance issues before full manufacture commences.

The prototype stage is where the correction, addition, or omission of features are done to ensure that the final PCB assembly is without any technical errors. This is done before the quick turn automation begins in earnest. Therefore, valuable time is invested in prototype testing to support efficiency and performance.

Early prototypes can be drastically different from the finished product. Therefore, the first batch of prototypes is usually done in smaller quantities. Prototypes are crucial because it is difficult to make changes to a finished PCB.

Quick turn PCB prototypes are therefore beneficial for the following reasons:

●Save significant manufacturing costs.

●Avoid manufacturing defects or spotting them at an early stage for correction.

●Save valuable delivery time by meticulously checking the design for manufacturability.

●Avoid manufacturing delays by reducing changes during production.

●Provide chances for manufacturers to make adjustments before full production, based on client and user feedback.

How to ensure the quality of Quick Turn PCB manufacturing

To ensure the quality of the Quick Turn PCB manufacturing, the following measures can be taken:

1. Choose high -quality manufacturers: Choose a fast PCB manufacturer with good reputation and rich experience to ensure that its production technology and equipment meet industry standards.

2. Provide clear design files: ensure clear and accurate design files provided to the manufacturer, including the correct component layout, size, spacing and other details to avoid errors in the manufacturing process.

3. Make quality inspection: In the process of PCB manufacturing, quality inspection is very important. This includes random inspections of various stages of the manufacturing process to ensure that the PCB produced meets design requirements and quality control standards.

4. Perform factory testing: After the PCB manufacturing is completed, it is necessary to conduct a comprehensive factory test. This includes electrical performance testing, appearance inspection and dimensional measurement to ensure the quality and reliability of PCB.

5. Use automation equipment: The use of automated equipment for PCB manufacturing and testing can reduce human errors and improve production efficiency, thereby ensuring product quality.

6. Strengthen communication and collaboration: Maintain close communication and collaboration with the manufacturer, timely solve the problems in the manufacturing process, and ensure that the quality of the product has been improved and improved in a timely manner.

7. Standards and specifications: Follow the relevant PCB manufacturing standards and specifications, such as IPC standards to ensure that the PCB created has good reliability and consistency.

What Are The Factors That Affect The Delivery Time Of Quick Turn PCB?

1. The complexity of PCB design. Many PCB manufacturers claim to provide the same day PCB, next day PCB, or 24 hours PCB manufacturing services. But please don’t be deceived by the simple statements. The simple design of single-sided PCB or double-sided PCB can be delivered within 24 hours, while the turnaround time for more complex designs of flexible PCB and rigid-flex PCB takes 7-10 days.

2. PCB materials. Different PCB types require different production materials, and not all PCB manufacturers have stocks of unique material. When ordering PCBs, it is necessary to consider the purchase time of PCB raw materials.

3. Difficulty factor of PCB process. We know that there are various holes on the PCB, such as plated through holes, blind holes, buried holes, etc. Each blind hole and buried hole needs to use a drill or laser drilling, and drilling, lamination, electroplating, etc. require additional time. HDI PCB takes more time.

4. The manufacturing capabilities of PCB manufacturers. You need to check your PCB manufacturers’ infrastructure to determine if they meet your fast turnaround time needs.

Some factors you need to consider are:

♦The size of the PCB manufacturing company;
♦Whether they have invested in advanced production equipment;
♦Whether they can control and influence material suppliers;
♦Whether they can purchase high-quality PCB raw materials;
♦Whether the PCB manufacturing company manufactures in-house or partially outsources;
♦Do they have professional PCB engineers;
♦Their logistics capabilities: logistics methods, relationships with logistics partners, etc.;

5. Pricing

Please believe in the eternal truth: the cheapest is not necessarily the best. All PCB manufacturers have their characteristics and strengths in terms of quality, turnaround time, and price. We need to evaluate based on the comprehensive capabilities of the PCB manufacturer and the complexity of the PCB itself.

How to choose a Quick Turn PCB manufacturer?

When choosing a Quick Turn PCB manufacturer, you need to consider the following aspects:

➤Quality assurance: First of all, the quality assurance system of the manufacturer needs to be examined, whether it has passed the quality certification such as ISO 9001, and whether there is a strict quality control process.

➤Experience and professionalism: Choose manufacturers with rich experience and professional knowledge to better understand your needs and provide high -quality services.

➤Equipment and technology: Examine the equipment and technical level of manufacturers, including manufacturing equipment, technical technology, testing equipment, etc. to ensure its ability to make fast and high -precision manufacturing.

➤Delivery time: Understanding the delivery time of the manufacturer can meet your emergency needs.

➤Price: Compared the price of different manufacturers, and at the same time, considering factors such as quality, delivery time, and the highest price -effective supplier.

➤Services and after -sales: Choose a manufacturer with good pre -sales and after -sales service, which can solve the problems of manufacturing and after -sales problems in a timely manner.

➤Cases and reference: View the cases and customer feedback of the manufacturer to understand their actual performance and reputation.

When choosing a fast PCB manufacturer, it is recommended to conduct field inspections to understand its actual production situation in order to make more accurate judgments. At the same time, you can refer to the recommendations and evaluations of the same industry in order to better choose a reliable manufacturer.

Choose LST technology as your PCB manufacturer

We are Chinese professional fast PCB manufacturers. We have the industry’s leading on time and effectively solve many urgent problems for customers.
With our manufacturing facilities, we can provide all types of industries with fast circuit board manufacturing services and fast PCB prototype solutions, including medical, transportation, industrial applications, consumer goods, aerospace and military.
Each online PCB order includes a comprehensive engineering review before the start of circuit board manufacturing, eliminating delay and quality problems.

How to choose the correct PCB manufacturer in China?

12/21/2023 在： /通过：

If you are looking for a PCB manufacturer, China is undoubtedly a very good choice. China is currently the world’s largest PCB production base. It has advanced production technology and low production costs, so many companies choose to assemble PCB in China. Of course, China also has some small processing plants. Their strength is not so strong, and lacks certain competitiveness in high -end fields. Enterprises must also take comprehensive considerations when selecting PCB suppliers to ensure the smooth production plan.

We will focus on this article: how to choose the correct PCB manufacturer in China, we will discuss quality control measures, industry experience and customer support, and provide research and potentially communicating with potential manufacturers. At the end of this article, you will better understand what you should find among reliable PCB manufacturing partners, and how to find partners who meet your specific requirements.

Why choose China for your next PCB manufacturing project?

1.The country is emerging as a leading PCB manufacturing hub with an increasing global share of PCB output.

2.Almost all kinds of PCBs and various scales of manufacturing projects are efficiently dealt with in the country. Therefore, no matter what type of PCB manufacturing requirement you have, China has a company that offers you exactly the same.

3.Chinese manufacturers possess unmatched technical expertise, advanced technology and precise equipment to eliminate chances of errors and defects in the final product.

4.Like most electric and electronic components, custom-designed PCBs are also available at affordable prices in China.

5.In China, PCB manufacturers usually depict a top-notch level of professionalism. They offer exceptional client handling and service support. This helps customers stay updated throughout the manufacturing process. Chinese manufacturers prioritise communication which further helps build trust and a strong partnership between the customer and the manufacturing company.

What should you do before looking for PCB manufacturers?

Before looking for PCB manufacturers, you should be clear about your needs, including the specifications, types and functions of the PCB board, while understanding the product’s budget, mass production requirements, and the required delivery time. In this way, you can choose the right manufacturer to cooperate.

Specifically, you need to examine the professional level of the manufacturer, including the level of process, the degree of advancement of equipment and technology, and the operating efficiency of the production line. At the same time, paying attention to product quality, good manufacturers can not only meet the quality requirements, but also provide a longer warranty period. Considering the production capacity of the manufacturer, whether it can meet your production needs and ensure the timely delivery of orders. In addition, the price is also an important factor in choosing a manufacturer. It needs to evaluate whether the cost it costs costs cost -effective and whether it is in line with market price.

The factors that you need to consider when choosing a PCB manufacturing company

When choosing a PCB manufacturing company, you need to consider the following factors:

1. Production capacity: Ensure that the manufacturer has sufficient production capacity, can deliver orders on time and meet production needs.

2. Technical strength: Examine the technical strength of the manufacturer, including the technology, experience and equipment it own to ensure that it can provide high -quality products and solutions.

3. Quality control: Understand the manufacturer’s quality management system and quality control process to ensure that it can provide stable and reliable product quality.

4. Dating period: Dating is an important factor in measurement of the production capacity and efficiency of PCB manufacturing companies. It is necessary to ensure that the manufacturer can deliver orders on time and meet production needs.

5. Service level: Examine the level of pre -sales, mid -sales, and after -sales service levels, including technical support, maintenance, repairs, etc. to ensure that it can solve customer problems in time and provide technical support.

6. Cost benefits: Evaluate the price and delivery cycle of the manufacturer, whether it meets the budget and mass production requirements, and whether it can reduce the cost on the premise of ensuring the quality of the product.

7. Reputation: Understand the reputation and reputation of the manufacturer, including the rate of return of history and business, customer feedback information and evaluation rankings, etc., to ensure that it can ensure product quality and service level.

The way to find Chinese PCB manufacturers

Now you may want to know where and how to find the best company. To this end, you need to conduct thorough research and list the finalists according to the above list. To find your option:

1. Take a look at the Internet

2. Browse list platform/directory

3. Visit exhibitions, conferences and trade exhibitions

4. Recommended and recommended by colleagues or contacts in the industry

Communication with PCB Manufacturing Companies

Effective communication is key to establishing a successful partnership with a PCB manufacturing company in China. Here are two key aspects to consider when communicating with potential manufacturers:

▶Initial Contact
When reaching out to potential manufacturers, it’s important to prepare questions and information that will help you evaluate their capabilities and suitability for your project.

Ask about their quality control measures, industry experience, and customer support. Provide detailed information about your project requirements and ask if they have experience with similar projects.

Pay attention to how responsive the manufacturer is during initial contact. A prompt and thorough response is an indication of good customer service and a commitment to meeting your needs.

▶Follow-Up Communication
Once you’ve established contact with potential manufacturers, it’s important to maintain regular communication throughout the project.

Ask about their process for providing updates on progress and ensure that they assign a dedicated account manager to your project. Be prepared to provide feedback and ask questions as needed to ensure that the project stays on track.

Evaluate the manufacturer’s responsiveness and communication skills throughout the project. If issues arise, work with the manufacturer to find solutions and ensure that they remain committed to meeting your needs.

By maintaining open and effective communication with potential manufacturers, you can establish a strong partnership based on trust and shared goals.

China is the largest PCB manufacturing market. If you have PCB projects, you can definitely find a cost -effective production company in China. You can also contact us LSTPCB Manufacturing Company, we will quote you within 24 hours.

How to control the quality of pcb

12/13/2023 在： /通过：

Printed circuit boards are an integral part of electronic devices and are the core component that controls the entire device. pcb is used in a variety of applications including consumer electronics, automotive, aerospace, communications, medical devices and other industries.

Quality is the lifeblood of a product. pcb quality control processes, including visual inspection, functional testing and environmental testing. These processes are critical to detecting defects and ensuring that PCB assemblies function correctly and reliably.

In this article we will focus on the pcb component process, such as any control pcba quality, and emphasize the importance of quality control for the product. The details are as follows:

Basic Principles of Quality Control

IPC Standards
The IPC (Institute of Printed Circuits) sets industry standards for PCB design, assembly, and testing. IPC standards help businesses to maintain consistency and reliability in the final product.

Production Process Control
Production process control involves monitoring and controlling the entire production process to prevent defects and ensure consistency in the final product. This includes maintaining the temperature, humidity, and other environmental factors that may affect the quality of the final product.

Testing and Inspection
Testing and inspection are critical aspects of PCB assembly quality control. They involve using various methods such as automated optical inspection (AOI), X-ray inspection, and functional testing to detect and correct any issues that may arise during the assembly process.

PCB assembly quality control is a vital process that ensures that the final product meets the required performance standards and reliability. By implementing basic principles of quality control such as IPC standards, production process control, testing, and inspection, businesses can prevent defects and ensure consistency in the final product.

The importance of PCB quality control

The importance of PCB quality control is mainly reflected in the following aspects:

1. Ensure product performance: PCB is the core component of electronic equipment, its quality directly affects the performance of the entire product. Through strict quality control, you can ensure the quality of PCB manufacturing process, materials, layers, layout and wiring and other aspects of the quality, so as to ensure stable and reliable product performance.

2. Improve production efficiency: In the PCB production process, if there is a quality problem, it may lead to low production efficiency, or even need to rework or rework. Through quality control, we can find and solve the problem in time, avoid waste and delay in the production process, and improve production efficiency.

3. Reduce costs: PCB quality problems may lead to product damage, return or repair, etc., which will increase the cost of the enterprise. Through quality control, we can reduce the occurrence of these problems, thus reducing the cost of the enterprise.

4. Enhance corporate image: a strict quality control system can enhance the image and reputation of the enterprise, so that customers more trust and recognition of the enterprise’s products and services.

How to control the quality of pcb

First, the design stage: optimize PCB layout and circuitry

In order to improve the performance and quality of the PCB board, the design phase is crucial. Designers need to give full consideration to circuit layout, component selection and thermal management. In circuit design, factors such as electrical performance, signal integrity and electromagnetic compatibility should be given full attention. At the same time, the use of PCB design software, such as Altium Designer, Eagle, etc., can effectively reduce design errors, optimize the layout and improve design efficiency.

 

Second, the choice of materials: the selection of high-quality substrates and copper foils

The performance and quality of the PCB board depends largely on the materials used. In the manufacturing process, the selection of high-quality substrates and copper foil is critical. High-quality base materials can ensure the thermal performance and mechanical strength of the PCB, thus improving the reliability of the product. In addition, the selection of high-purity copper foil can improve conductivity, reduce resistance and improve circuit performance.

 

Third, the production process: strict control of process parameters

PCB production process process parameters to ensure the quality and performance of the PCB board is critical. These parameters include: copper sinking, etching, drilling, plating, screen printing, hot air leveling, etc.. Through strict control of these parameters, you can ensure that the size of the PCB board, line width, aperture, etc. to meet the design requirements, improve product reliability and performance.

 

Fourth, detection and testing: to ensure that products meet quality standards

For PCB board manufacturers, comprehensive inspection and testing of PCB boards produced is the key to ensure quality and performance. This includes visual inspection, automatic optical inspection (AOI), X-ray inspection, electrical testing and so on. Through these inspection and testing methods, problems in the production process can be effectively identified and eliminated to ensure that the product meets the design and quality standards.

 

Fifth. Quality management system: continuous terminal quality control and continuous improvement

To ensure the quality and performance of PCB boards, manufacturers should establish a comprehensive quality management system. Through the implementation of ISO 9001, ISO 14001, IATF 16949 and other international quality certification, not only to ensure that the company’s production processes and quality control system in line with international standards, but also to continuously improve and optimize the production process to improve product quality and performance. At the same time, regular training of employees to improve their skills and quality awareness is an important part of ensuring the quality and performance of PCB boards.

 

Sixth, environmental considerations: the implementation of green production strategy

In order to ensure the quality and performance of PCB boards at the same time, manufacturers should also pay attention to environmental protection, the implementation of green production strategies. This includes optimizing the production process, reduce waste and emissions of hazardous substances, the use of environmentally friendly materials, as well as the promotion of lead-free and halogen-free technologies. By implementing green production strategies, manufacturers can improve the environmental performance of their products while enhancing their corporate image and competitiveness.

Nine major quality problems and solutions of the PCB board

n the entire production process of the PCB circuit board, there are many quality control points. If it is not rigorous, the quality problem of the PCB line board is endless. This is also a headache, because there is only one of them, so big, so big, so big Most devices are not available. Next, introduce the 9 major quality problems and solutions of the PCB board.

1. [Layers]

Stratification is the difficulty of the boss of PCB, ranking first in common problems. The cause of it may be roughly as follows:
(1) Improper packaging or preservation, moisture;
(2) The preservation time is too long, exceeding the preservation period, and the PCB board is tide;
(3) Supplier’s materials or process issues;
(4) Design materials and copper surfaces are not well distributed.

 

2. [Poor weld]
Weldability is also one of the more serious issues, especially batch problems. The possible cause is plate surface pollution, oxidation, black nickel, nickel thick abnormalities, anti -welding SCUM (shadow), too long storage time, moisture absorption, PAD on the anti -welding, too thick (repair). The pollution and hygroscopic problems are relatively easy to solve, and other problems are more troublesome, and there is no way to find it through feeding inspection. At this time, it is necessary to pay attention to the process capacity and quality control plan of the PCB board factory. For anti -welding PAD and poor repairs, you need to understand the standards of PCB suppliers on the formulation of maintenance. Inspectors and inspectors have a good assessment system, and at the same time, it is clear that the dense area of the pads cannot be repaired.

 

3. [Board bending plates]
The reasons that may cause the plate bending plates are: supplier selection problems, abnormal production processes, poor control of heavy labor, improper transportation or storage, not strong enough design of the broken hole, and the differences in copper area of each layer are too large. In the last 2 points, the design of the design needs to be avoided in the early stage. At the same time, the PCB factory simulation stickers IR conditions can be required to test, so as not to occur in the back of the furnace. For some thin plates, you can need to add a wooden slurry plate to the packets when the packaging is used to avoid subsequent deformation. At the same time, add a fixture to prevent the device from overweighting the curved plate.

 

4, [scrape, dew copper]
Scratches and bronze are the defects that test the management system and execution of the PCB plant. This problem is not serious, but it will indeed bring quality concerns. Many PCB companies will say that this problem is difficult to improve. The author once promoted the improvement of scratches of many PCB factories, and found that many times it is not that it is not good, but whether to change it or not to change it. All PCB factories that seriously promote the project have improved significantly.

 

5. [Poor impedance]
Impedance is an important indicator of the radio frequency performance of the mobile phone board. Generally, the common problem is that the impedance differences between the PCB batches are relatively large. Since the current impedance test bar is generally on the side of the PCB, it will not ship with the board, so the supplier can pay the batch of impedance strips and test reports for each time they ship. Comparison data of the edge line diameter and the inner line diameter.

 

6. [BGA welding empty hole]
BGA welded cavities may cause poor main chip function, and may not be found in the test that hidden risks are high. So many patch factories now have X-Ray for inspection after the part. The cause of this kind of bad may occur is the residual liquid or impurities in the PCB hole, vaporization after high temperature, or poor laser hole type on the BGA pad. Therefore, many HDI boards now require electroplating pores or half -filled holes to avoid this problem.

 

7. [Foam/Show off for anti -welding]
Such problems are usually abnormal in the control of the PCB welding process, or the use of anti -welding ink is not suitable (cheap goods, non -chemical inks, not suitable for installing welded welds), or may be too high in patch and heavy work. To prevent batch problems, PCB suppliers need to formulate corresponding reliability test requirements and control them at different stages.

 

8. 【Poor Confucius】
Poor holes are mainly caused by insufficient technical capabilities of the PCB plant or simplified technology. Its manifestations are not full of plug holes. It may cause insufficient welding volume, short circuit with patch or assembly devices, and residual impurities in the hole. This problem can be found in the appearance inspection, so it can be controlled by the feeding inspection and requires the PCB plant to improve.

 

9. [Poor size]
There are many possible reasons for the poor size. It is easy to shrink in the PCB production process. Suppliers have adjusted the drilling program / graphics ratio / molding CNC program, which may cause problems such as biased bias and poor structural parts. Because it is difficult to check such problems, it can only be controlled by the supplier’s good process, so special attention needs to be paid to it when choosing the supplier.

Emphasizing quality control in PCB assembly is critical to improving product quality, reducing costs and protecting intellectual property. Therefore, we encourage our customers to select suppliers with strong quality control systems to ensure the reliability of their products.

At LST, we understand the importance of quality control in PCB assembly and are committed to providing our customers with high quality products. With our extensive experience in the field and state-of-the-art equipment, we can produce PCBs that meet the highest industry standards.

The working principle and application of Wireless charging

12/06/2023 在： /通过：

Charging mobile terminal devices is a necessary thing, and the most common charging method is to use a charger with a cable. But yes, with the rapid development of science and technology, wireless charging method has become the choice of more and more people. Wireless charging is convenient and quick, as long as the phone is elegantly placed on top of a small, coaster-like thing, without the need to connect the wire can be easily charged. Today we will focus on wireless charging.

What is wireless charging?

Wireless charging is actually using the principle of electromagnetic induction to generate a changing magnetic field in a changing electric field, and the changing magnetic field is generating a changing electric field in the receiving coil of the cell phone to charge the cell phone, which can be regarded as a separate transformer, putting the coil of the transmitter and the coil of the receiver into two separate devices, and when the power is fed into the coil of the transmitter, it will generate a magnetic field, which will detect the coil of the receiver and generate an electric current. coil, generating an electric current, and thus we have created a radio transmission system.

There are three main types of wireless charging technology:

1, electromagnetic induction type: the primary coil of a certain frequency of alternating current, through electromagnetic induction in the secondary coil to produce a certain current, so as to transfer the energy from the transmitting end to the receiving end.

2, magnetic field resonance: by the energy transmitting device, and energy receiving device, when the two devices adjusted to the same frequency, or resonate at a specific frequency, they can exchange each other’s energy.

3, radio wave type: microwave transmitting device and microwave receiving device consists of microwave, can be captured from the wall bounced back to the radio wave energy, with the load to make adjustments at the same time to maintain a stable DC voltage.

Advantages of wireless charging

1. Convenience: wireless charging technology eliminates the need for traditional charging cables, users do not need to plug and unplug the cable, just put the phone and other devices on the charging mat, which greatly improves the user’s convenience.

2. Environmental protection: wireless charging process does not involve plugging and unplugging action, thus reducing the wear and tear of the charging interface, thus extending the service life of the device. At the same time, this also reduces the generation of waste, which is conducive to environmental protection.

3. Safety: Wireless charging technology has no physical contact during the charging process, thus avoiding safety problems caused by poor contact or overcharging.

4. Universality: Wireless charging technology adopts a standardized scheme, so that devices of different brands and models can use the same wireless charging device as long as they support the same standard.

5. High efficiency: wireless charging technology adopts high efficiency charging mode, which can quickly provide power for devices and improve charging efficiency.

6. Energy-saving: Wireless charging technology adopts energy-saving technology, which can reduce energy consumption while ensuring charging efficiency.

7. Wide applicability: Wireless charging technology can be used not only for mobile devices such as cell phones, but also for transportation such as electric cars, electric bicycles and other devices that need to be charged.

8. Cost reduction: wireless charging technology can reduce the manufacturing cost and maintenance cost of charging equipment, improve the reliability and service life of the equipment.

9. Efficient management: wireless charging technology can realize remote monitoring and management, which is convenient for users to manage and maintain the charging equipment.

Application Scenarios of Wireless Charging

1. Mobile device charging: The initial application of wireless charging technology is to charge mobile devices, such as smartphones, tablets and so on. Users only need to put the mobile device on the wireless charging mat, no need to plug and unplug the cable, you can charge the device.

2. Electric vehicle charging: Electric vehicles are an important application area for wireless charging technology. Some electric cars have been equipped with wireless charging devices, users only need to park the vehicle on the wireless charging mat, the vehicle can be automatically charged.

3. Smart home: wireless charging technology can be applied in the field of smart home, such as smart speakers, smart lights and so on. Users only need to put the smart device on the wireless charging mat, it can provide power for the device.

4. Medical devices: Wireless charging technology can also be applied to the field of medical devices, such as wireless medical sensors, wireless medical monitoring devices. These devices can be placed in or near the human body to provide power to the device through wireless charging technology.

5. Industrial applications: wireless charging technology can also be used in the industrial field, such as wireless sensors, wireless remote control devices. These devices can work in harsh environments and provide power to the devices through wireless charging technology.

What is the TG value of PCB and how to choose?

12/05/2023 在： /通过：

It is well known that the base material polymer or glass) is changing from a glassy, solid, rigid state to a rubbery state when the temperature rises to a certain region, so the temperature at this point is called the glass transition temperature (Tg). In other words, Tg is the mechanical property that specifies the glass transition temperature, i.e., the maximum temperature at which the glass remains rigid.

TG in PCB boards means temperature resistance. the higher the Tg point, the higher the temperature requirement when pressing the board, the harder and more brittle the board will be, which will affect the quality of the mechanically drilled holes to a certain extent in the subsequent process.

PCB board TG value classification

Common board TG value can be roughly divided into three major categories:

TG130: general TG value of the board, temperature resistance of about 140 ℃, common such TG value of the board is Sheng Yi S1141 and Kingboard KB-6164F

TG150: Medium TG value plate, temperature resistance 150℃~170℃, common such TG value plate is SangYi S1141 150 and Kingboard KB-6165F.

TG170: Higher TG value boards, temperature resistance above 170℃, common such TG value boards are SangYi S1170 and Kingboard KB-6167F, the cost of higher TG value boards is also relatively high.

How to choose pcb with different TG values?

PCBs with different TG (glass transition temperature) have their own advantages and application scenarios, which one is the best to choose depends on the specific application needs. The following are some common TG PCBs and their characteristics.
1.FR-4(TG 130°C-180°C):FR-4 is one of the most common and widely used TG PCB circuit board materials. It has good mechanical strength, electrical properties and heat resistance.FR-4 is suitable for most general applications of electronic equipment and is relatively low cost.

2. High TG PCB ( TG 150°C-200°C):High TG PCBs have a higher glass transition temperature than regular FR-4, providing better stability and reliability in high temperature environments. They are suitable for applications that require operation in high temperature environments, such as automotive electronics, industrial controls and aerospace.

3. High Frequency TG PCBs: High Frequency TG PCBs are designed for high frequency signal transmission with excellent impedance control and signal integrity. These boards are typically made of low dielectric constant and low loss materials to ensure optimal signal transmission.

4. Metal Substrates:Metal Substrates are a special type of TG PCB that has a layer of metal (usually aluminum or copper) covering the substrate for heat dissipation and conductivity. Metal substrates are suitable for high power applications, LED lighting and power electronics where good thermal performance is required.

The best choice of TG PCB depends on your application needs, such as operating environment, signal requirements, temperature requirements, cost constraints, etc.

The basic characteristics and development prospects of FR4 pcb material

11/27/2023 在： /通过：

FR4 glass epoxy resin is currently the most used substrate in the pcb market. more than 80% of the pcb is manufactured with FR4, what is FR4, what are its characteristics, this article will focus on giving you an introduction.

FR4 is a glass fiber epoxy resin copper cladding board, it is based on chlorite, quartz sand, limestone, dolomite, boron calcium stone, boron magnesium stone six kinds of minerals as raw materials by high temperature melting, drawing, winding, weaving and other processes manufactured. The diameter of its monofilament for a few microns to more than two dozen microns, equivalent to a hair strand of 1/20 ~ 1/5, each bunch of fiber raw silk is composed of hundreds or even thousands of monofilaments.
The FR prefix refers to the flammability rating of the resin system used in the laminated composites that make up the substrate of a printed circuit board. The addition of bromine compounds to the resin produces flame retardant properties that are self-extinguishing and combustible.

FR4 Basic Characteristics

●Vertical laminar bending strength A: normal: E-1/150, 150±5℃≥340Mpa

●Parallel laminar impact strength (simply supported beam method): ≥230KJ/m

●Insulation resistance after water immersion (D-24/23): ≥5.0×108Ω

●Vertical laminar electrical strength (in 90±2℃ transformer oil, plate thickness 1mm): ≥14.2MV/m

●Parallel layer to the breakdown voltage (in 90 ± 2 ℃ transformer oil): ≥ 40KV

●Relative dielectric constant (50Hz): ≤5.5

●Relative dielectric constant (1MHz): ≤5.5

●Dielectric loss factor (50Hz): ≤0.04

●Dielectric loss factor (1MHz): ≤0.04

●Water absorption (D-24/23, plate thickness 1.6mm): ≤19mg

●Density: 1.70-1.90g/cm³.

●Flammability: FV0

What are the properties of FR4 substrates?

Flame Retardant

Chemicals used on materials to prevent or retard the spread of fire are known as flame retardants.FR4 substrates have excellent thermal, mechanical and electrical properties, making them perfect for a wide range of electronic applications. Flame retardant laminates and prepregs are very versatile, suitable for a variety of manufacturing procedures and produce predictable results.

Good Electrical Properties

The electrical properties of PCB materials are critical to signal integrity and impedance considerations. They determine how quickly an electrical signal can propagate through the material and how much charge it can retain in a given volume.

Low Moisture Absorption

Moisture absorption is the ability of a PCB material to resist absorbing water when immersed in water. It is given by the percentage increase in weight of the circuit board material due to water absorption under controlled conditions.FR4 material has a low moisture absorption of 0.10% after 24 hours of immersion in water.

 

Limitations of FR4 circuit board materials

FR4 has been used in printed circuit boards for many years. It is inexpensive and provides adequate electrical insulation. However, when FR4 is used in high-speed applications, the following problems may occur:

Insulation Stability
Although FR4 is a good insulator, it has its limitations when subjected to high power, high voltage or high heat. If certain limits are exceeded, the insulating properties of the material will deteriorate and they will begin to conduct electricity. This can lead to board failure.

Controlled Impedance
FR4 does not provide a uniform dielectric constant like high speed circuit board materials. As frequency increases, Dk changes. While high-speed materials have a dielectric constant tolerance of less than 2%, FR4 has a tolerance of up to 10%. the change in Dk in FR4 poses a challenge while maintaining the impedance value. Therefore, this material is not a preferred choice for controlling impedance boards.

Signal Loss
Signal loss is an important aspect of PCB design, especially in high-frequency applications.FR4 is not the best material for these applications because it has a larger Df (dissipation factor) than high-frequency materials.

FR4 Performance Classification

Standard F4
Baseline electric grade F4 epoxy glass provides the most economical, general purpose substrate for typical consumer electronics and digital circuit boards without pushing extreme frequency limits.

High Frequency F4
Multi-glass bodies like rf-35 control dielectric values below +/-0.05 across the microwave region. These tightly aligned low loss materials become critical to RF device integrity.

High Temperature F4
Through resin modification or bismaleimide-triazine blends, some FF4 formulations withstand temperatures above 230°C to meet the needs of aerospace and automotive electronics equipment.

Highly reliable F4
Isola’s “HR” family and Allen family 85N laminates utilize high resin content and glass weaving to punch holes in multilayers and are elastically rigid designed to resist crack propagation.

Development Prospect of FR-4 Copper Clad Laminate

FR-4 copper clad laminate is the core material of printed circuit boards, which is widely used in electronics, communications, computers, automotive, aerospace and other fields. With the development of 5G, Internet of Things, intelligent manufacturing and other emerging industries, FR-4 laminates have a very broad market outlook.

First of all, the development of 5G will promote the demand for FR-4 laminates, 5G communication technology requires superior high-frequency transmission performance, so the performance of FR-4 laminates also need to be improved. For example, the dielectric constant of the sheet needs to be increased and the dielectric loss of the sheet needs to be reduced. In addition, the miniaturization and lightweight of 5G equipment also put forward higher requirements for the performance of FR-4 boards, such as the need to optimize the thickness of the board. Therefore, with the rapid development of 5G in the future, FR-4 copper cladding board market demand growth prospects.

Secondly, the widespread application of the Internet of Things (IoT) will also drive the growth of FR-4 copper-clad laminates market demand. The Internet of Things requires higher performance indicators (such as high-frequency transmission, high-speed transmission, etc.), in addition to the miniaturization of the Internet of Things terminal equipment requires thinner and lighter FR-4 copper cladding boards, which will promote the FR-4 cladding board market demand continues to increase.

Again, the rapid development of intelligent manufacturing will have a positive impact on FR-4 laminate market demand. Intelligent manufacturing has become a national strategy, the transformation and upgrading of the manufacturing industry requires more intelligent equipment. These devices require high-speed transmission of high-frequency transmission and other performance indicators such as stringent FR-4 copper cladding boards, the market demand will also continue to increase.

FR4 has been widely used in electronic equipment for its high reliability, good processability, heat resistance and excellent electrical properties. Its dielectric constant and dielectric loss angle tangent and other electrical performance parameters are controlled with high precision, which can ensure stable signal transmission. In addition, FR4 sheet has good thermal stability and can remain stable in high-temperature environments, making it suitable for applications under various environmental conditions. Therefore, FR4PCB is an excellent electronic material, providing a strong guarantee for the performance and reliability of electronic equipment.

Function and application of solar charging controller

11/21/2023 在： /通过：

The solar charging controller is used in the solar power generation system. It controls the automatic control equipment of the multi -way solar cell square matrix to the battery charging and the battery to the solar inverter. It stipulates and controls the charging and discharge conditions of the battery, and controls the electric energy output of the load and the battery to the load according to the power supply requirements of the load. It is the core control part of the entire photovoltaic power supply system.

Type of solar charging controller

1. Ordinary solar controller: This is the first generation of technology. The working principle is to directly hang the output of the solar panel to the battery port. When the battery is sufficient, it is disconnected. Because of the internal resistance of the battery, it is difficult to fill up the battery, and the solar panel is not fully utilized. The MPPT tracking efficiency is only 70 ~ 76%, which has been eliminated by the market, and it is basically used.

2.PWM Solar Controller: This is the second -generation technology. Now the market is the most. The working method is to use the PWM control method. Compared with the ordinary solar controller, it has improved a lot. It can solve the problem of battery dissatisfaction. MPPT tracking efficiency It is 75 ~ 80%, but solar panels are not fully used.

3.Mppt Solar controller: MPPT is the abbreviation of the maximum power point tracking. The MPPT charging controller adjusts the battery charging voltage and current by tracking the maximum point of the output power of the solar panel, thereby achieving the charging control of the battery. It is efficient and intelligent. , Accurate features.

Features of Solar Charge Controller

Solar charge controllers come with a variety of features and functions to enhance the performance and protection of the solar power system. Here are some key features you might find in these controllers:

Battery Temperature Compensation

Battery temperature compensation is a critical feature that adjusts the charging parameters based on the ambient temperature. This helps prevent overcharging in high temperatures and ensures adequate charging in cold conditions, extending the battery’s lifespan.

Overload and Short Circuit Protection

Most solar charge controllers include built-in protection mechanisms to safeguard the system from overloads and short circuits. These safety features prevent damage to the controller, battery, and connected devices.

LED/LCD Display

Many modern charge controllers are equipped with LED or LCD displays that provide real-time information about the system’s performance. Users can monitor battery voltage, charging current, and other relevant data at a glance.

USB Ports

Some charge controllers come with USB ports, allowing users to charge small electronic devices directly from the solar system. This feature can be invaluable during power outages or when off-grid and when in remote locations.

Communication and Data Logging

Advanced charge controllers can be connected to a computer or smartphone for remote monitoring and data logging. This enables users to track the system’s performance over time and make adjustments as necessary.

Function of solar charging controller

The main functions of solar charging controller include:

1. Power adjustment function: Through MPPT technology, control the output power of solar panels to achieve adjustment of battery charging voltage and current.

2. Communication function: Solar charging controllers can exchange data through communication interfaces with other devices (such as battery management systems, charging piles, etc.) to achieve remote monitoring and control.

3. Protection function: Solar charging controller has a complete protection function, which can protect the battery overcharge and release, extend the life of the battery, prevent the solar battery square, the power of the battery, and prevent the load and controller and other other. Internal short circuit of the device.

4. Self -check function: When the controller is affected by natural factors or artificial operation, it can allow the controller to self -check, let people know whether the controller is intact, and reduces many unnecessary working hours.

5. Restore interval function: It is a recovery interval made by overcharge or overlap protection to avoid the work jitter of load caused by wire resistance or self -recovery characteristics of batteries.

6. Temperature compensation function: monitor the temperature of the battery, modify the recharge and let the battery work in an ideal state.

7. Optical control function: Mostly used for automatic lamps. When the environment is bright enough, the controller will automatically turn off the load output; and the load will be automatically turned on after the environment is dark to realize the automatic control function.

Application of solar charging controller

Solar charge controllers are a vital component in various solar energy applications. Here are some of the primary uses of these controllers:

Off-Grid Solar Systems

Off-grid solar systems, which are not connected to the utility grid, rely on solar charge controllers to regulate the charging and discharging of batteries. This ensures a steady power supply even when the sun is not shining.

Grid-Tied Solar Systems with Battery Backup

Grid-tied solar systems with battery backup use charge controllers to manage the battery storage component. These systems can store excess energy generated during the day and use it during grid outages or during peak demand periods to reduce electricity costs.

Solar Street Lighting

Solar charge controllers are used in solar street lighting systems to manage the energy flow between the solar panels, batteries, and LED lights. They ensure efficient energy utilization and help extend the lifespan of the batteries.

Remote Monitoring and Telemetry

Solar charge controllers are also employed in remote monitoring and telemetry systems, such as those used in weather stations, communication equipment, and data loggers. These controllers enable reliable power supply in remote locations.

The role of solar charging controllers in the field of new energy

The role of solar charging controllers in the field of new energy is very critical. As an important part of the solar photovoltaic power generation system, the solar charging controller is responsible for effectively controlling the electrical energy generated by the solar panel to ensure that the charging and discharge process of the battery is safe and reliable. It monitors the voltage and current of the battery to achieve intelligent management of the charging process. When the battery is fully charged, the controller will automatically cut off the charging to prevent overload; when the battery is insufficient, the controller will automatically cut off the load to prevent override. This can not only protect the batteries from damage to excessive charging and excessive discharge, but also improve the efficiency of the use of electricity.

In addition, the solar charging controller can also achieve maximum power point tracking (MPPT) function, so that the solar panel is always output at the maximum power to improve the charging efficiency. This helps reduce energy loss and improve the overall efficiency of the system.

In the field of new energy, solar charging controllers are widely used in scenarios and other scenarios of separation power generation systems, grid -connected power generation systems, and electric vehicle charging stations. In these scenarios, solar charging controllers can not only provide safe and reliable charging control for batteries, but also provide stable power supply for loads. This makes solar energy a reliable and sustainable source of energy, and has made positive contributions to the development of green energy and reducing carbon emissions.

It should be noted that with the continuous development of new energy technology, the performance and functions of solar charging controllers are constantly being upgraded and improved. In the future, with the further development of the new energy field, solar charging controllers will be applied in a wider range of fields, making greater contributions to promoting the transformation of global energy structure and achieving sustainable development.

SMD Soldering Guide: Technology Sharing

11/15/2023 在： /通过：

SMD (Surface Mount Device) is a packaging method for electronic components that uses surface mount technology to solder electronic components to the surface of a circuit board. This type of packaging is characterized by small size, light weight, material saving, high reliability and powerful performance.SMD soldering involves placing electronic components in specific locations on the circuit board and then soldering them by melting the solder to firmly connect the components to the board.

SMD Soldering Tools

Surface mount device soldering requires some specialized tools in order to handle tiny components and make precision solder joints. Here are some of the essential items you’ll need:

Soldering Iron – A fine-tipped soldering iron in the 15-30W power range is ideal for SMD work. Tips as small as 0.5mm can be used. Temperature control features help avoid overheating.

Solder paste– Solder paste consists of a mixture of powdered solder alloy and flux cream. It allows solder to be precisely applied to SMD pads before components are placed.

Microscope – A stereo microscope or magnifying glasses are indispensable for inspecting small solder joints and component placement. A microscope with 20x to 40x magnification is typical.

Tweezers – Fine-tip tweezers allow precise handling and placement of SMD components as small as 0201 or 01005 sizes (0.25mm x 0.125mm). Anti-static tweezers are preferred.

Soldering Helping Hands – Helping hands tools with magnifying lenses allow hands-free positioning of PCBs under a microscope during soldering.

Stencil–PCB stencils are thin metal sheets laser-cut with a pattern of openings matching the PCB’s solder pad layout. To apply solder paste, the stencil is aligned to the PCB and the paste is screened onto the pads through the stencil’s openings. Using a stencil allows precise and efficient solder paste application prior to SMD component placement.

Jigs – Jigs help position boards at an angle which improves visibility and access to solder joints underneath components during hand soldering.

Solder Sucker/Desoldering Tools – Specialized vacuum tools are used to remove or rework solder joints and desolder components for repair work.

Surface Mounting Steps

▶Mounting the substrate: Fix the substrate on the countertop.

▶ Point paste or glue: according to the size of the components, the SMD adhesive coated in the pre-determined position, if the assembly process using reflow soldering, it is necessary to apply the paste in the substrate pads, the current commonly used in the medium-high temperature level Sn-Ag solder paste.

▶ Mounting of SMD: Generally, automated professional mounter is used, which mainly includes: suction and loading head for picking and placing SMD, X-Y working table, program control system and feeding part.

▶ Thermal curing: carried out after the dispensing, SMD, under a certain temperature, time control through the curing oven to make the adhesive curing. The curing oven is controlled by a certain temperature and time to improve the adhesive strength of the SMD, and to avoid the components being shifted by vibration and shock during storage and transportation.

▶ SMD soldering: Wave soldering with SMD adhesive bonding and reflow soldering with solder paste bonding are used.

▶Cleaning: Remove residual adhesive to prevent corrosion of the substrate.

▶Inspection and testing: Solderability is inspected according to standards and test requirements.

SMD soldering needs to pay attention to the following points:

1. Keep the soldering iron tip clean to avoid oxidizing or staining its surface with impurities, which may hinder the heat conduction between the tip and the soldered parts.

2. Before soldering, solder paste should be evenly applied to the pads of the PCB, and make sure that the amount of solder paste applied is appropriate.

3. Components should be accurately placed on the PCB to avoid misalignment or tilting.

4. The temperature of the reflow oven should be strictly controlled to ensure that the solder paste melts and solidifies at the correct time and position.

5. The soldering time should be properly adjusted to ensure the quality of soldering.

6. Soldering pressure should be properly adjusted to ensure the density and strength of the solder.

7. Reflow soldering process parameters should be strictly controlled, including the temperature, time and pressure of the preheating zone, uniform heat zone, reflow zone and cooling zone.

8. The welding environment should be kept clean to avoid external factors interfere with the welding quality.

9. Process inspection should be carried out to ensure that the welding quality meets the requirements.

Common SMD package size

Common SMD mounting method is divided into SO mounting, QFP mounting, LCCC mounting and PLCC mounting four.

(1) SO mounting is divided into SOP mounting and SOL mounting, the use of wing-shaped electrode pin shape, pin spacing 1.27mm, 1.0 m m, 0.8mm, 0.65mm and 0.5mm.

(2) PQFP mounting rectangle on all sides of the wing-shaped electrode pins, the thickness of 1.0mm or 0.5mm. QFP packaged chips are generally large-scale integrated circuits, the number of electrode pins for the 20 to 400, the minimum pin pitch is 0.4mm, the largest is 1.27mm.

The minimum pin spacing is 0.4mm and the maximum is 1.27mm.

(3) LCCC mounting is not a pin mounting, the chip is mounted on a ceramic carrier, no lead electrode soldering ends are arranged on the bottom of the four sides of the mounting surface, the number of electrode pins 18 ~ 156, the spacing of 1.27mm.

(4) PLCC mounting is a rectangular mounting of integrated circuits, its pins hooked back to the inside, the number of electrode pins 16 ~ 84, the pitch is 1.27mm.

SMD soldering is a very delicate work, which is nowadays done by fully automated production lines. Of course, for beginners to understand and learn manual welding is also very necessary. Because this way we can more quickly familiar with the entire welding process, and better able to find problems, solve problems.

How to choose the plating and thickness of the PCB board?

11/09/2023 在： /通过：

Once the board has passed through the standard PCB manufacturing process, the bare copper in the PCB is ready for surface treatment.PCB plating is used to protect any copper in the PCB that would be exposed through the soldermask, whether it be pads, vias, or other conductive components. Designers usually default to tin-lead plating, but other plating options may be better suited for your board application.

In this article, I will cover the different PCB plating material options and their advantages in PCBs. There are a variety of options available and depending on your reliability or application needs, you may want to check if the manufacturer can apply the plating you need in your design. We will look at these options and briefly discuss how plating affects loss.

Types of PCB Plating

There are a variety of PCB plating materials. I have summarized the popular materials that designers should know and understand in the following sections. I have never met a manufacturer that does not offer all of these options. If your target manufacturer does not explicitly state that they offer one of the options in the list below, you can always email them for a list of their capabilities, including their PCB plating material options.

Tin Lead and Immersion Tin Plating
This PCB finish may be the least expensive option, but it is not RoHS compliant due to the use of lead in the plated finish.Dip tin is a lead-free alternative for entry-level boards.

Advantage:
▶ Ultra-flat surface
▶ Inexpensive
▶ Compatible with standard solder

Disadvantages:
▶ Not conducive to multiple assembly processes or rework
▶ Forms tin whiskers over time
▶ Tin diffusion into copper may reduce shelf life depending on intermetallic compound content
▶ May damage soldermask during plating process

 

Hot Air Solder Leveling (HASL) and Lead Free HASL
HASL was once a very popular finishing option, but it is not as reliable as other plating materials. It is inexpensive and has a lead-free option, so it can be used as an entry-level plating option.
Advantage:
▶ Inexpensive
▶ Can be repaired
▶ Due to poor wettability

Disadvantages:
▶Uneven surface makes it less useful for small SMD devices
▶ May be damaged by thermal shock
▶May be difficult to solder

 

Electroless Nickel Immersion Gold Plating (ENIG)
Considering the drawbacks of SnPb and immersion tin plating, ENIG is now arguably the most popular surface treatment in the industry. In this plating material, nickel acts as a barrier between the copper and the thin gold surface layer of the component to be soldered.

Advantage:
▶ Ultra-flat surface
▶ PTH holes can be easily plated
▶ Widely available
▶Easy soldering
▶Suitable for fine-pitch components
▶Highly reliable against mechanical damage
▶Wire bondable (aluminum)

Disadvantages
▶ Not favorable for multiple assembly processes or rework
▶ May experience phosphorus penetration between gold and nickel layers, known as black pad syndrome
▶ Rough interfaces can cause signal loss at high frequencies

 

Organic Solderability Preservative (OSP)
This organic, water-based finish selectively binds to copper to provide a highly flat surface finish. As an organic material, it is sensitive to handling and contaminants, although the application process is simpler than other PCB plating materials. It also has very low losses at high frequencies.

Advantage:
▶ Ultra-flat surface
▶ Repairable after application
▶Simple application process
▶Very low interconnection loss at high frequencies
▶Wire bondable (aluminum)

Disadvantages:
▶Easy to damage
▶Short shelf life

 

Immersion Silver Plating
This is my preferred PCB plating material for high frequency applications. It forms a smooth interface with the bare copper and therefore does not increase conductor losses as other PCB finishes do. The main disadvantage is that it loses its luster on the bare board, so it should be soldered and encapsulated as soon as possible after fabrication.

Advantage:
▶ Easy aluminum soldering and wire bonding
▶ Ultra-flat surface
▶ Suitable for fine pitch
▶ Better suited for high-frequency interconnections in high-reliability systems
▶Wire bondable (aluminum)

Disadvantages:
▶ Silver whiskering over time
▶Exposed (unsoldered) conductors lose luster over time, although added OSP helps prevent this ▶May be difficult to plate into small-diameter vias

 

Hard Gold
This plating material is essentially ENIG, but has a very thick outer layer of gold, making it one of the most expensive PCB plating materials. The gold layer creates a hard surface that can be damaged, but its thickness makes it difficult to fully expose the nickel layer.

Advantage:
▶ Wire bondable (aluminum and gold)
▶ Very durable surface

Disadvantages.
▶ Very expensive
▶ Not applicable to solderable areas
▶ Requires additional process steps for selective applications
▶ May experience brittle cracking

 

How to specify PCB plating material and thickness

Typical PCB plating thickness values are about 100 micro inches. For immersion silver and OSP, typical thicknesses can be as low as about 10 micro inches. If you are producing a prototype and the manufacturer has a standard quotation, you will have the opportunity to specify the type of plating on their forms. On these forms, they may not ask you to provide the thickness, so be sure to specify it if you need a specific thickness. After specifying the desired plating value, your manufacturer will need to ensure that the plating can be reliably deposited to the desired thickness.

Why is the thickness of the plated material important? There are two reasons. First, the IPC-2221A standard specifies minimum plating thicknesses for each IPC product category (see Table 4.3). If you want your product to comply with any of the standard IPC product categories, then you need to make sure that the plating thickness meets its specifications. Normally, if you specify the product category, as you normally do in your manufacturing notes, the minimum plating thickness will be implied. Just make sure you don’t contradict yourself, otherwise the manufacturer will email you asking for plating comments.

Another reason to worry about PCB plating thickness is its effect on losses. At low frequencies, you probably won’t notice any effect on frequency, so low-speed digital signals and sub-GHz radios don’t need to worry much about PCB plating thickness. I’ve completed custom printed transmitters running at 5.8GHz WiFi with ENIG (not the best choice for high frequencies) that swamped the receiver in our test setup, so if your circuit design is correct, you can even bypass most plating at these frequencies.

The loss problem arises at millimeter-wave frequencies, such as short-range radar (24 GHz) and higher. At these frequencies, the roughness of the copper becomes a very noticeable factor in loss, especially on low loss RF substrates like Rogers. The thickness of the plating will determine the roughness experienced by the signal as it propagates, and this will be reflected in the skin effect resistance.

How to cut PCB (the latest guide)

11/07/2023 在： /通过：

The PCB required for different electronic products is also different. How to match the compatible shape requires cutting PCB. How to cut PCB into the required size, and then introduce the PCB cutting guide in detail.

Why we need to cut pcb ?

There are several reasons why you might want to cut your PCB to the right size for your current project. Many projects require PCB sizes and dimensions that are not readily available. In these types of cases, cutting the size you need from a larger PCB might be the only option.

Moreover, a lot of professionals and enthusiasts prefer ordering larger PCBs and cutting custom sizes. This is a common practice as larger PCBs often cost less per unit of size. Therefore, this practice can help make projects more economical and cost-effective.

Cutting your own custom-sized PCBs can also help you save time. If you are in the middle of a time-critical project and have large PCBs lying around, cutting the size you need gives you access to the right board immediately. This way, you do not have to waste time waiting for custom-size boards to arrive from your supplier.

How to cut PCB

There are many ways to cut the circuit board. The following are the main methods:

1. Cutting: Cutting is the first step of the mechanical operation of the printed circuit board. By cutting, it can give a rough shape and outline. The basic cutting method is suitable for a variety of substrates, usually the thickness does not exceed 2mm. When the cutting board is more than 2mm, the edges of the cut will appear rough and uneven, so this method is generally not adopted.

2.V cutting machine: Most factories use special V -type cutting machines for PCB cutting.

3. Template and Punching: Use the template to form a groove around the PCB material, and then use the punch to break the PCB. However, this method may lead to cracks in the final product and lower efficiency.

4. PCB router machine, V-CUT PCB machine, PCB milling cutter, PCB sawing machine, dedicated PCB cutting tool: These tools may be more applicable when dealing with PCB of different materials and sizes.

PCB cutting process

1. Determine the cutting position: Before cutting, you need to determine the position and shape of the cut. This can help determine by using templates or manual drawing.

2. Select the right cutting tool: Select the appropriate cutting tool according to the PCB material and size of the cut. Common cutting tools include V-CUT machines, PCB router machines, PCB milling cutters, PCB sawing machines, etc.

3. Adjust the cutting depth: For some PCBs that need to be cut into a certain depth, you need to adjust the cutting depth. This can be achieved by setting the cutting depth of cutting or using the template on the cutting machine.

4. Control the cutting speed: When cutting, you need to control the cutting speed to avoid excessive or insufficient cutting. Generally speaking, the slower cutting speed can provide better cutting quality and less calories.

5. Use coolant: When cutting, you can use coolant to help reduce temperature and reduce the production of thermal stress. This can prevent the PCB board from deforming or rupturing.

6. Check the cutting quality: After the cutting is complete, check the cutting quality to ensure that the cutting meets the requirements. If the cutting is poor, you can adjust the cutting tool or re -adjust the cutting parameters.

Cutting is an important process of PCB assembly. Correct cutting can better complete the product assembly. For enthusiasts, knowing how to cut PCB is beneficial, because it can help save the cost and time of major projects. With this guide, you should be able to learn how to cut PCB, what tools do you need, and how to use them to achieve the best results.