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How to choose a PCB assembly company

11/06/2023 在： /通过：

Choosing a correct PCB assembly company can quickly complete your PCB project, and at the same time to ensure the quality of the product. The PCB project reaches the assembly stage, indicating that you have invested a lot of time and resources, so it is important to choose the correct assembly company. Good partners can help you reduce costs in all aspects. How to choose the correct assembly company takes time to inspect. Today we will discuss the steps of choosing PCB assembly companies.

What are the content of PCB assembly?

PCB assembly includes the following content:

1. Circuit board composition: The circuit board is mainly composed of pads, perforated, installation holes, wires, components, plug -in plug -ins, filling, electrical boundaries, etc.

2. Welding of components: Welding the component through the pad on the circuit board.

3. Layout of components: According to the function and design requirements of the circuit board, the component is reasonably layout on the circuit board.

4. Connection of the wire: According to the circuit diagram and design requirements, connect the wire correctly between the pads and components of the circuit board.

5. Fix the installation hole: On the back of the circuit board, make some installation holes as needed to fix the circuit board to the chassis or bracket.

6. Fill and coverage: Fill in some parts of the circuit board to fill the insulating material to protect the circuit board from environmental effects, and at the same time, it can also improve the mechanical strength of the circuit board.

7. Test and debugging: After completing the assembly, test and debug the circuit board to ensure that its functions are normal.

Select the steps of PCB assembly company

Determine the needs

Each PCB project is different, so the solution will be different. Therefore, when negotiating with PCB companies, you must first clear the needs and spend more time to improve the project.

Determine the experience level of PCB assembly company

Experience is another important factor to determine the choice of PCB assembly companies. An experienced company will stimulate confidence and trust. This is because they have professional teams to ensure high -quality PCBA and fast turnover time. If you want to know the experience of a company, you can go to their website to see, or talk to them directly with them.

Confirm the qualifications and certification

Ensure that the selected PCB assembly company has relevant qualifications and certifications, such as ISO 9001 quality management certification and UL certification, which can ensure the quality of the product and meet the relevant standards.

Confirm the production capacity

It is necessary to understand the production capacity of the PCB assembly company, including the number of production lines, the modernization of equipment, and the level of employee’s technical level to ensure that the production tasks are completed in a limited time and delivered in time in time.

View experience and reputation

Choosing a PCB assembly company with rich experience and good reputation can ensure the quality and reliability of product quality and delivery. You can learn its experience and reputation by viewing the manufacturer’s historical orders and customer evaluation.

Confirm the price and service

Choosing a PCB assembly company with reasonable prices and good services can reduce procurement costs and improve the procurement experience. It is necessary to consider factors such as manufacturers’ prices, after -sales service and distribution methods.

View technical ability

Choosing PCB assembly companies with high technical capabilities can ensure product quality and meet technical requirements. Considering factors such as manufacturers’ technical research and development strength, innovation ability, and patent quantity.

Examine the factory environment and equipment

Choose a PCB assembly company with modern equipment, clean process workshops and good production environment.
Examination of quality management system: Choosing a PCB assembly company with a complete quality management system and a ISO9001 certification company can ensure product quality and stability.

Dating and after -sales service

Choosing PCB assembly companies with small stress and good after -sales service can ensure the timelyness of the order and the quality of after -sales service.

By following these steps, you are much more likely to discover PCB assembly companies who will take care of your project. There is no company more qualified to do so than EEI Manufacturing. With expertise in PCB assembly services and a passion for customer satisfaction, we assure you that you will be pleased with the result of your project.

How to layout high frequency pcb

11/03/2023 在： /通过：

High-frequency PCB refers to the electromagnetic frequency of the higher special circuit boards for high-frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meters) in the field of PCB, is in the microwave substrate copper-clad laminate boards on the use of ordinary rigid circuit boards manufactured using some of the process or the use of special treatment methods and the production of circuit boards. High-frequency circuit board circuit design is a very complex process, the layout of each line must be in place, the next will focus on high-frequency circuit board layout methods.

How to layout high frequency pcb？

1. Multilayer board wiring

High-frequency circuits are often highly integrated, wiring density, the use of multi-layer board is both necessary for wiring, but also an effective means of reducing interference. In the PCB Layout stage, a reasonable choice of a certain number of layers of printed circuit board size, can make full use of the intermediate layer to set up shielding, a better realization of the proximity of grounding, and effectively reduce the parasitic inductance and shorten the length of the signal transmission, but also significantly reduce the signal cross-interference, etc., all of which are beneficial to the reliability of high-frequency circuitry.

2. High-speed electronic devices between the pins of the lead bends the less the better

High-frequency circuit wiring of the lead is best to use a straight line, the need to turn, available 45-degree fold or arc turn, this requirement in the low-frequency circuits are only used to improve the strength of the copper foil adhesion, while in the high-frequency circuits to meet this requirement can reduce the high-frequency signals to the outside of the launch and coupling between each other.

3. High-frequency circuit device pins between the lead the shorter the better

Signal radiation intensity is proportional to the length of the signal line, high-frequency signal leads the longer, the easier it is coupled to the components close to it, so for such signals as the clock, crystal, DDR data, LVDS lines, USB lines, HDMI lines, and other high-frequency signal lines are required as much as possible, the shorter the line, the better.

4. The fourth trick: high-frequency circuit device pins between the lead layer alternation the less the better!

The so-called “less alternation between the layers of the lead, the better” means that the components used in the connection process of the hole (Via) the less the better. According to the side, a hole can bring about 0.5pF of distributed capacitance, reduce the number of holes can significantly improve speed and reduce the possibility of data errors.

5. Pay attention to the signal line close to the parallel alignment of the introduction of “crosstalk”

High-frequency circuit wiring should pay attention to the signal lines in close proximity to the parallel alignment of the introduction of “crosstalk”, crosstalk refers to the coupling phenomenon between the signal lines are not directly connected. As high-frequency signals along the transmission line is transmitted in the form of electromagnetic waves, the signal line will play the role of the antenna, the energy of the electromagnetic field will be emitted around the transmission line, the signal due to the mutual coupling of the electromagnetic field and the resulting undesired noise signal is called crosstalk. parameters of the PCB board layer, the spacing of the signal line, the driving end and the receiving end of the electrical characteristics, as well as the signal line termination method of the crosstalk have a certain impact. So, in order to reduce the crosstalk of high-frequency signals Therefore, in order to reduce the crosstalk of high-frequency signals, it is required to do the following as much as possible when wiring:

Under the condition that the wiring space allows, insert a ground line or ground plane between two lines with serious crosstalk, which can play the role of isolation and reduce crosstalk. When the space around the signal line itself there is a time-varying electromagnetic field, if you can not avoid parallel distribution, parallel signal lines can be arranged on the opposite side of a large area of “ground” to significantly reduce the interference.

Under the premise of wiring space permits, increase the spacing between adjacent signal lines, reduce the parallel length of the signal lines, clock lines as perpendicular as possible with the key signal lines rather than parallel. If the parallel alignment within the same layer is almost unavoidable, in two adjacent layers, the direction of the alignment must be perpendicular to each other.

In digital circuits, the clock signal is usually a fast-edge signal, external crosstalk. Therefore, in the design, the clock line should be surrounded by ground wires and more ground holes to reduce the distribution capacitance, thereby reducing crosstalk. Clock on high-frequency signals try to use low-voltage differential clock signals and packet ground way, need to pay attention to the integrity of the packet ground hole punching.

Idle not used inputs do not hang, but will be grounded or connected to the power supply (power in the high-frequency signal loop is also the ground), because the suspended line may be equivalent to the transmitting antenna, grounding will be able to inhibit the emission. Practice has shown that this approach to eliminate crosstalk can sometimes be immediately effective.

6. IC block power supply pins to increase the high-frequency decoupling capacitance

Each integrated circuit block power supply pin near the increase of a high-frequency decoupling capacitance. Increase the power supply pin high-frequency decoupling capacitance, can effectively inhibit the power supply pin on the high-frequency harmonics form interference.

7. Isolation of high-frequency digital and analog signal ground lines

Analog ground, digital ground line to the public ground with high-frequency choke bead connection or direct isolation and choose a suitable place for single-point interconnection. High-frequency digital signal ground potential is generally inconsistent, there is often a certain voltage difference between the two directly; and, high-frequency digital signal ground is often with a very rich high-frequency signal harmonic components, when directly connected to the digital signal ground and analog signal ground, high-frequency signal harmonics will be coupled through the ground to the analog signal to interfere with the way.
In general, the high-frequency digital signal ground and analog signal ground is to do the isolation, can be used in the appropriate location of a single point of interconnection, or the use of high-frequency choke bead interconnection.

8. Avoid the formation of the loop alignment

Various types of high-frequency signal alignment try not to form a loop, if you can not avoid the loop area should be as small as possible.

9. Must ensure good signal impedance matching

Signal in the transmission process, when the impedance mismatch, the signal will occur in the transmission channel signal reflection, reflection will make the synthesized signal overshoot, resulting in the signal fluctuations in the vicinity of the logic threshold.
Eliminate the reflection of the fundamental approach is to make the transmission signal impedance is well-matched, due to the load impedance and the transmission line of the characteristic impedance of the larger the difference between the reflection of the larger, so should be as much as possible to make the signal transmission line of the characteristic impedance of the load impedance and load impedance is equal; at the same time, but also to pay attention to the PCB on the transmission line can not be a sudden change or corners, as far as possible to maintain the transmission line at all points of the impedance continuity, or in the transmission line between the various segments will be a reflection.

10. Maintain the integrity of the signal transmission

Maintain the integrity of the signal transmission, to prevent the “ground bounce phenomenon” caused by the division of the ground.

LST Technology participated in the Philippine Semiconductor and Electronics Show

10/30/2023 在： /通过：

On October 27, 2023, the 18th Philippine Electronics Exhibition (PSECE) ended successfully. As the largest and most authoritative electronic exhibition in the Philippines, merchants from countries from the United States, France, France, Germany, Japan, China, South Korea, etc. come to the exhibition. Enterprises including semiconductor manufacturing, consumer electronics, smart homes, PCB manufacturing, production equipment and other fields provide a variety of choices for the Philippines market.

As a PCB one -stop solution supplier, Shenzhen LST Technology has brought a variety of PACB samples and electronic manufacturing solutions to the audience. During the exhibition, we showed a series of high -performance, high -quality PCB circuit board products, including high -precision, high reliability, high integration PCB board, and customized solutions. We also introduced our product characteristics and technical advantages to visitors through brochure, display video and other methods.

Through the exhibition exchanges, let more customers know and understand LST, and we also know more clearly about market demand. We will adhere to the production concept of “efficient, transparent, high quality”, and provide high -quality design for global customers worldwide Production service.

Shenzhen LST Technology is a professional PCB manufacturing supplier. At the same time, we also provide a one -stop service of electronic manufacturing. Our service areas include smart homes, consumer electronics, new energy products, medical equipment, automotive accessories, etc. We welcome global customers to visit our company.

Introduction to PCB etching technology

10/23/2023 在： /通过：

PCB manufacturing requires a variety of processes, among which PCB etching is the most important link. Eclipse refers to the process of removing excess copper from the PCB light board, and the remaining PCB line diagram.

It sounds simple, but it contains a lot of complex craftsmanship. In order to help everyone better understand PCB etching technology, we deliberately prepare an operating guide for everyone to learn and discuss. The specific content is as follows.

What is PCB etching?

PCB etching is the process of removing unwanted copper from a printed circuit board. Once all of the excess copper has been removed from the PCB, only the required circuit remains.

Before the etching process begins, a layout for the board is generated. This desired layout for the board is transferred onto a PCB by a process called photolithography. This forms the blueprint that decides which pieces of copper must be removed from the board.

On the outer layer of the PCB, the tin plating acts as the etch resist. However, in the inner layer, the photoresist is the etch resist. Generally speaking, there are two approaches to inner layer and outer layer PCB etching. These are dry etching and wet etching. Here at ABL Circuits, we use a wet etching process using a Tech Win Alkali Etching Machine.

Wet PC B etching method

Wet etching is a etching process in which unwanted materials are dissolved when immersed in chemical solutions.

According to the erosion agent used, PCB manufacturer Tongyu adopts two wet etching methods:

1. Acid etching (iron chloride and copper chloride).

2. Alkaline etching (ammonia)

Acid etching process

The acidic method is used to etch the inner rigid PCB layer, which involves chemical solvents, such as iron chloride FECL3 or copper chloride (CUCI2). Compared to alkaline methods, acidic methods are more accurate, cheaper but more time-consuming. This method is suitable for the inner layer, because acid will not react with the photoresist, nor will it damage the required part. In addition, in this method, the bottom cut is the smallest.

The bottom cut is the horizontal corruption of the etching material below the most lead layer. When the solution encounters copper, it attacks copper and leaves a protected orbit. Use anti-corrosion electroplating or light shielding to protect the track. At the edge of the track, a certain amount of copper will always be removed below the resistance, which is called the bottom cut.

1. Copper etching

Copper chloride is the most widely used etching agent because it can accurately etch fewer characteristics. The ammonia process also provides a constant etching rate and continuous regeneration at a lower cost.

The maximum etching rate of the copper chloride system is a combination of copper hydride-sodium ammonia-HCI system. The combination provides a maximum turbid engraving rate of 55 seconds at 130 ° F. Therefore, this type of etching is used for the inner layer of etching the fine line

Note: The use of chlorine gas requires adequate ventilation, storage tanks and cylinders to store and leak detection equipment. In addition, it must be approved by the emergency agreement, personal protection equipment, trained operators, and the fire department.

2. Triscel oxide etching

Due to the high cost of copper etching agents, the use of iron chloride etching agents in industry is limited. However, iron chloride is an attractive spray etching because it is easy to use, the ability to maintain copper, and the ability to use it in rare batch applications. Iron chloride can be used with silk ink, lithography glue and gold pattern, but cannot be used with tin or tin/lead.

Generally, the iron chloride solution is dissolved in water, with a concentration range of 28-42% (by weight). HCI (5%) is also mixed with the solution to prevent the formation of insoluble hydroxide and iron oxide.

The iron chloride ratio is usually 36 BE, or about 4.0LB/Gal Feci3. The content (HCL) for commercial use is within 1.5 to 2%.

Alkaline etching process

Alkaline method is used to etch the PCB outer layer. Here, the chemicals used are copper chloride (CUCL2) ten hydrochloride (HCI)+hydrogen peroxide (H2O2)+water (H20) composition. The alkaline method is a fast process, and it is also a bit expensive. The parameters of this process must be carefully followed, because if you touch the solvents for a long time it will destroy the circuit board, the process must be well controlled.

The entire process is carried out in a high pressure air spray, and the PCB is exposed to the fresh etching spray. Some important parameters are required in the alkaline PCB etching. They are the amount of panel movement, chemical spray, and copper to be etched. This ensures that the etching process is completed uniformly through the straight end.

In the etching destruction, the points that are not required for copper etching are breakpoints. This is usually done from the midpoint of the atomicization chamber. For example, assuming the length of the atomization chamber is 2 meters, the breakpoint will be reached when the plate reaches the intermediate point.

PCB Etching Process

The PCB etching process must follow the following steps:

Step 1: The very first step of the etching process is designing the circuit, using the software of your choice. Once the design is ready, flip it, and then get it printed.

Step 2:On the transfer paper, print the circuit design. Make sure that the design is printed on the shiny side of the paper.

Step 3: Now, take the copper plate, and rub sand paper on it. This will make the surface of copper rough, and thus helps it to hold the design efficiently. There are certain points to remember step 3 till the last step:

Use safety gloves, while handling copper plate and etching solution. This will prevent the oil from hands getting transferred to copper plate, and will also protect your hands from the solution or chemicals.
When you are sanding the copper plate, make sure you do it properly especially at the edges of the plate.
Step 4: Now, wash the plate by some rubbing alcohol and water, so that any small particles of copper that get removed from the surface during sanding are washed off. Allow the plate to dry after washing.

Step 5: Cut the printed design properly, and place them on the copper plate facing down.

Step 6: The copper plate is now passed through the laminator several times until the plate gets heated.

Step 7: Take the plate out from the laminator, after it is hot, and hold it in a cold bath. Agitate the plate so that all the paper comes off and floats on the water. You will see a traced circuit in black on the copper plate.

Step 8: Now take the board out of the bath, and place it in the etching solution. Agitate the copper plate for around 30 minutes. Ensure that all the copper around the design is dissolved.

Step 9: Take out the copper plate and wash it in the water bath again. Keep it to dry. Once it has dried completely, you can use rubbing alcohol to remove the ink transferred to the printed circuit board.

Step 10: This completes the etching process of a printed circuit board. You can now drill the holes using proper tools with the required drill bit size.

About Us

LST Technology is a professional PCB and PCBA manufacturers. We provide one-stop production services for global customers. In 18 years, PCB manufacturing assembly experience. If you have PCB business needs, please leave a message to us. I will reply to you for a while.

2-layer PCB VS 4-layer PCB: Advantages and Disadvantages Introduction

10/17/2023 在： /通过：

When manufacturing electronic products, the selection of the type of circuit board is a relatively important step. For example, whether to use single-layer PCB, 2-layer PCB, or multilayer PCB. Of course, these issues are in the product design stage . Each type of PCB has unique advantages. We must choose according to the performance of the product.

Now we will discuss the advantages and disadvantages of 2-layer PCBs and 4-layer PCBs. The specific content is as follows:

Introduction to the concept

What is a 2-layer PCB?

A 2-layer circuit board is a circuit board with only two conductive layers and no gaps between the layers. Each layer can be wired for circuits, and the two layers do not lead to each other. This type of circuit board is generally used for simpler circuit designs, such as some small electronic devices, toys, etc. Its advantages are easy to manufacture, low cost, suitable for small-scale production, etc.

What is a 4-layer circuit board?

A 4-layer circuit board is a circuit board that has four conductive layers with vias connecting the layers. This type of board is often used for more complex circuit designs, such as communication equipment, computer networks, etc. It has the advantage of providing more circuitry. Its advantages include more wiring space, higher signal quality and more stable performance.

4-layer circuit boards are more difficult to design and fabricate, and require a higher level of technology and equipment, so their cost is also relatively high. However, it can provide better signal quality and more stable performance, and is suitable for application scenarios that require higher circuit performance.

2-Layer PCB Advantages and Disadvantages

Advantages

▶ Lower Cost – double sided PCBs are less expensive than 4-layer designs. This difference can be considerable depending on the number of units you intend to order.

▶ Simpler Design and Production – simpler design and production not only means you get your printed circuit boards faster. The simpler your design is, the less vulnerable it is to costly errors during the design or manufacturing process. In certain applications, the ability to repair your PCB at a later date is also important; when compared to more complex 4-layer PCBs, it is inherently easier to repair double sided printed circuit boards.

▶ High Volume – Whenever projects require mass production, eliminating unnecessary layers is vital. If your project is going to be a high-volume order, 2-layer boards are typically preferred to optimize manufacturing speed, cost, and efficiency.

▶ Short Lead Time – For large and small projects, a shorter lead time is often required to quickly make a prototype. 2-layer PCBs have an advantage over other multilayer printed circuit boards, because they are extremely fast to produce.

Disadvantages

▶ Simplistic Design – Oftentimes opting for a double sided circuit board means sacrificing some bells and whistles. A 4-layer PCB has more room for more components and routing options, while a 2-layer PCB typically has a simple design.

▶ Slower Speed and Lower Operating Capacity – If speed is an issue, the more layers, the better. Depending on the application, you may find that 2 layers isn’t enough to give you the necessary speed and capacity for your project. The jump from 2 layers to 4 layers includes considerably more speed and operating capacity.

▶ Larger Size and Higher Weight – Despite 4-layer printed circuit boards having more layers, double sided PCBs are typically quite large and bulky in comparison to make room for components and leads. If you need to fit your printed circuit board into a compact space, adding more layers is often the best design choice.

4-Layer PCB Advantages and Disadvantages

Advantages

▶ Useful for More Complicated Projects – The more complex your project is, the more useful you will find the additional layers of a 4-layer PCB. Being able to increase your creative design choices including layouts, routing, and additional components, gives you the opportunity to make the best end product possible.

▶ High Quality – For even simple products that demand the highest quality, going from a 2-layer to a 4-layer PCB design is an obvious choice. If cost is not an issue, 4-layer boards offer a higher quality result.

▶ Added Power – The ability to handle more power is a considerable advantage for 4-layer PCBs. When you are deciding whether you need a double sided or 4-layer printed circuit board, keep in mind how much power your design will require.

▶ Increased Durability – The more layers your design has, the more durable your PCB will be. A 4 layer design will be much more substantial than a 2-layer printed circuit board, despite typically being smaller in size.

▶ Smaller Size and Lighter Weight – While many people conflate a larger number layers with a larger sized board, 4-layer boards are actually often much smaller and lighter than 2-layer PCBs. This is because they require less room for components and wiring.

Disadvantages

▶ Higher Costs – Since 4-layer PCBs use more materials and are more difficult to manufacture, they can be quite a lot more than 2-layer printed circuit boards. When costs are an issue, minimizing the number of layers is usually the best option.

▶ More Complicated Design and Production – When you need to quickly design and produce printed circuit boards for a project, the more layers you have, the longer each step of the process is going to take.

▶ Less Availability – You will find that the more complex your design is, the harder it is to find a manufacturer who can accommodate your needs. That being said, 4-layer designs are very common these days, so this becomes more of an issue as your PCB designs begin to get even more complicated.

▶ Longer Lead Times – For projects that are in a time crunch, adding layers to your design isn’t ideal. The smaller your timeframe is, the more important it will be to use as few layers as possible for your project.

▶ More Complex Repairs – Double-sided printed circuit boards have an advantage over 4-layer designs when it comes to ease of repairs. While everything is essentially exposed on 2-layer designs, any necessary repairs for 4-layer PCBs are going to be more difficult. For some applications, this is extremely important and should be taken into consideration.

2 Layer PCB vs 4 Layer PCB

Designs of 2 Layer PCB vs 4 Layer PCB

Vias in 2 layer PCB are used to create electrical connections that enable the routing of the traces so that they reach the opposite side of the board. Even more surface area is available for traces in a 4 layer PCB design than that in a 2 layer PCB. The 4 layer PCB design involves a prepreg layer that bonds two layers and a double-sided boards together by applying heat and pressure. Prepreg provides dielectric between the layers.

Functionality of 2 Layer PCB vs 4 Layer PCB

If the microstrip traces comprising a ground plane are utilized, the 2 layer PCB delivers more functionality as there are no propagation delays or other problems. However, a 4-layer PCB design consisting of ground and VCC plane layers and 2 signal layers is more preferred. This design struggle with impedance and propagation delays.

Cost of 2 Layer PCB vs 4 Layer PCB

Due to complexity of design, higher sensitivity, the higher levels of signal integrity and reduced interference levels, the 4 layer PCB is more expensive than a 2 layer PCB. The price of 2 layer PCB can be as low as $2/piece, and the cost of 4 layer pcb can be as low as $6.5/piece in ALLPCB.com.

Lead Time of 2 Layer PCB vs 4 Layer PCB

The After your payment, your 2 layer pcb order with standard manufacturing specifications can be shipped within 24 hours and the lead time of your 4 layer pcb order can be within 48 hours on ALLPCB.com. Order now, we offer worldwide free shipping service!

Introduction to the process and processing steps of ceramic PCB

10/16/2023 在： /通过：

Ceramic PCB has the advantages of high heat dissipation, high insulation, low expansion coefficient, corrosion resistance, etc., and is widely used in aerospace, automotive electronics, smart lighting, biomedical, and 5G interconnection. In recent years, more and more products use ceramic PCB, according to the relevant data survey: the global ceramic substrate market size reached 1.13 billion U.S. dollars in 2022, and is expected to reach 4.15 billion U.S. dollars in 2029, with a compound annual growth rate of 18.23%.

Ceramic PCB production process many people still do not know, then we will give you a detailed introduction to the production process of ceramic PCB and manufacturing process, to help you better understand the ceramic PCB.

What is ceramic PCB?

Ceramic PCB is a ceramic-based printed circuit board, using thermally conductive ceramic powder and organic binder preparation, thermal conductivity of 9-20W/m. Ceramic PCB has excellent electrical insulation properties, high thermal conductivity, excellent soft brazing and high adhesion strength, and can be etched like PCB boards can be a variety of graphics, has a large current-carrying capacity. In high-power power electronic circuit structure technology and interconnection technology, ceramic PCB has become the basic material.

What are the processes of ceramic PCB?

1.direct copper plating ceramic substrate process

DPC substrate has the advantages of high graphic accuracy, vertical interconnection, etc., mainly used in high-power packaging.

2.direct bonding process of copper ceramic substrate

The DBC line layer is thicker, better heat resistant, mainly used in high power, high temperature variations of the IGBT package.

3.thick film printing ceramic substrate process

TPC thick ceramic substrate heat resistance, low cost, but poor line layer accuracy, mainly used in automotive sensors and other fields.

4.thin film ceramic substrate process

In the plane ceramic substrate, thin film ceramic substrate TFC substrate graphic accuracy, but the metal layer is thin, mainly used in small current optoelectronic device packaging.

5. AMB active brazing process

The AMB substrate line layer is thicker, better heat resistance, mainly used in high power, large temperature variations of the IGBT package.

6.multilayer htcc high temperature co-firing process

High temperature co-fired ceramic materials are mainly alumina, mullite and aluminum nitride as the main components of ceramics. HTCC ceramic powder does not join the glass material. Conductor slurry uses materials for tungsten, molybdenum, molybdenum, manganese and other high melting point metal heat resistant slurry. Sintering temperature of 1600 ° ~ 1800 °.

7. multilayer ltcc low temperature co-firing process

Low temperature co-fired ceramics to ensure that the low temperature co-firing conditions have a high sintering density, usually added to the amorphous glass component, crystallized glass, low melting point oxides to promote sintering. Glass and ceramic composites are typical low-temperature co-fired ceramic materials. Sintering temperature 900 ° ~ 1000 °, LTCC using high conductivity and low melting point of Au, Ag, Cu and other metals as a conductor material, is mainly used in high-frequency wireless communications, aerospace, memory, drivers, filters, sensors, and automotive electronics and other fields.

Production Process of Ceramic PCB

Ceramic PCB board is a high-performance circuit board with excellent thermal conductivity, high temperature resistance and corrosion resistance. It is widely used in high-end electronic products. The following is a detailed introduction to the production process of ceramic PCB.

1. Raw material preparation

First of all, you need to prepare the raw materials needed to make ceramic PCB boards, including ceramic powder, organic binder, additives and metal wires.

2. Board processing

After mixing ceramic powder with organic binder, ceramic plates are made by pressing and molding. Metal wires or other conductive materials are then attached to the plate and fine-tuned and cut to conform to design requirements.

3. Punching

Holes are punched into ceramic plates, usually by laser drilling or mechanical drilling. This step requires great care to ensure that the holes are in the correct position.

4. Graphicization of the inner circuit

Inner circuit patterning refers to the conversion of the designed circuit pattern into an actual circuit layout. This step is usually performed using photolithography, wherein the circuit pattern is printed on the inner layer of the ceramic board by photolithography.

5. Goldizing

After completing the patterning of the inner layer circuit, metallization is required. This step includes copper etching and gold plating operations to ensure that the circuit board has good conductive properties.

6. Outer layer circuit patterning

Outer layer circuit patterning refers to the design of the external circuit layout . The actual circuit layout of this step is usually similar to the inner layer circuit patterning photolithography.

7. Soldering and Assembly

After completion of the outer layer of circuit patterning, the need for soldering and assembly operations. This step includes patching, plug-in, connector and other operations to ensure that the entire electronic product has good functional performance.

8. Testing and inspection

After the completion of the ceramic PCB board, you need to carry out testing and inspection operations. This step usually includes appearance inspection, functional testing, voltage testing, high temperature testing and other aspects to ensure that the product meets the design requirements and has stable and reliable performance.

 

LST Technology specializes in ceramic PCB assembly and processing, if you want to get more information about ceramic PCB, please leave us a message, we will contact you in 24 hours.

What is box build assembly service?

10/12/2023 在： /通过：

Electronic production involves many parts and components, and we need to coordinate with suppliers to coordinate the materials needed one by one. When we carry out mass production, some manufacturers can help you complete the assembly task more efficiently. The box build assembly service is a good way.

The box build assembly service is not suitable for all electronic products. Fortunately, you have a choice. Electronic box manufacturing is a fairly new development in the electronic manufacturing industry. For complete system integration, box construction may be the right choice for your next project.

What Is Box Build Assembly?

Box build assembly refers to the process of assembling, integrating, and testing various electronic components and modules into a fully functional product inside an enclosure or “box”. It involves taking printed circuit boards loaded with components (known as PCB assemblies), interconnecting them with wiring harnesses, and adding in power supplies, connectors, electromechanical parts like switches and sensors, and other hardware. All these pieces get assembled and mounted into frames or enclosures made of metal or heavy-duty plastics that can withstand demanding physical environments.

The end result of the box build process is a completely assembled electronic product unit that is ready for integration into the final application, such as medical devices, industrial control systems, telecom equipment, and many other electronic products we use daily. Box build assembly requires collaboration between design engineers, sourcing specialists, and manufacturing technicians to take a product from initial concept through prototyping, testing, pilot runs, and final mass production.

What Are Some Common PCB And Box Build Assembly Applications?

Image Of Box Build Assembly In ProductionEverything from your cell phone to your computer monitor requires printed circuit board assembly. Common examples of box build assembly applications include the following.

Box Builds As Panels
Control panels are integral to the manufacturing industry and drive the operation of heavy machinery. In addition to circuit boards, a control panel may contain switches, transformers, motor drives, contractors, breakers, and other electrical components that keep the machinery running safely and reliably. NAI can manufacture whatever control panel your business requires.

Use Box Builds For Integrated Circuits
ICs are used in virtually everything, from computers to cell phones to home appliances. An integrated circuit (or IC) is the fundamental building block of all modern electronic devices.

An IC is an integrated system of numerous miniaturized and interconnected components embedded into a thin substrate of semiconductor material. ICs allow for faster speeds and greater capacity all while evolving into smaller and smaller sizes. View our full electro-mechanical design capabilities to see how NAI can assist in your next project.

Choose Your Box Build Assembly Cable Assemblies
You can find cables in industries ranging from utilities, manufacturing, technology, and more. By working with LST, a custom cable assembly manufacturer, they can help you choose the best cable type, connector options, terminal blocks, insulation materials, and more. We offer product options for copper, fiber optic, and hybrid cable assemblies.

The Box Build Process

The box build process can vary as much as the design calls for. It is specific to each project. However, it typically includes the installation of sub-assemblies and other components, routing of cabling or wire harnesses, and fabrication of enclosures. It is all the assembly work involved in an electromechanical system complete with moving parts and sub-assemblies.

The most common box build assembly process also includes configuration and testing, as well as warehousing and shipping. You provide the drawings or the device for your CM to reverse engineer, and they do the rest. This is why it is imperative to choose the right electronic manufacturer.

Benefits of Using box build assembly service

Using a box build assembly approach offers several benefits, especially when compared to assembling products using separate components or in-house manufacturing. The key benefits include:

Simplified Supply Chain Management

One big advantage of box build assembly is streamlining your supply chain. Instead of managing a bunch of different vendors sending you individual components and subassemblies, you’re sourcing a complete, ready-to-go product from just one supplier.

Save Time and Money

Outsourcing box build assembly streamlines production and reduces costs. Instead of handling multiple vendors, assembly, testing, and quality control processes separately, you streamline these activities by relying on a single provider.

Expertise and Specialization

Rather than trying to master the many intricate assembly and test processes yourself, you can lean on the assembler’s seasoned knowledge. Take advantage of the skills they’ve perfected over years of box build production. Their engineering teams have tons of experience to ensure a high-quality end product.

Ensure Quality

Reputable box build assembly providers maintain strict quality control. This can result in a higher-quality final product since the provider focuses on consistent assembly and thorough testing.

Scalability

A great advantage of using a box build assembler is their flexibility to scale production up and down. For both small prototype batches or massive production runs, reputable assemblers have the capabilities to manufacture any number you need. With extensive facilities, advanced equipment, and skilled staff, they can handle any quantity of box build assembly. They can easily adapt to produce exactly the volume you need when you need.

If you are looking for a box assembly manufacturer, LST is a very good choice. We have more than 10 years of experience in electronic manufacturing. We have a very professional technical team that can quickly and efficiently start your box building manufacturing business. Contact us and get the offer for free.

Design analysis of PCB power supply system

10/09/2023 在： /通过：

Today, it is difficult to successfully design high-speed electronic systems without a thorough understanding of the power supply system characteristics of the chip, package structure and PCB. In fact, in order to meet the requirements of lower supply voltages, faster signal flip-flops, higher integration, and many more challenging requirements, many companies at the forefront of electronic design have invested a lot of money, manpower, and resources in the analysis of power supply systems to ensure the integrity of power supplies and signals during the product design process.

Power supply system (PDS) analysis and design is becoming increasingly important in the field of high-speed circuit design, especially in the computer, semiconductor, communications, networking and consumer electronics industries. With the inevitable further isotropic shrinkage of ultra-large-scale integrated circuit technology, the supply voltage of integrated circuits will continue to decrease. As more and more manufacturers move from 130nm technology to 90nm technology, it is expected that the supply voltage will drop to 1.2V or even lower, while at the same time the current will increase significantly. From DC IR voltage drop to AC dynamic voltage fluctuation control, this development trend poses a great challenge to the design of power supply systems as the allowable noise range becomes smaller and smaller.

The design of PCB power supply system mainly involves the following aspects:

➤ Circuit design: according to the needs of the equipment, design a reasonable power supply circuit. This requires consideration of factors such as circuit stability, efficiency, safety and cost.

➤ Component selection: According to the circuit design, select appropriate components such as resistors, capacitors, inductors, etc. to meet the performance and cost requirements.

➤ Wiring Arrangement: Determine the layout and alignment of components on the circuit board to reduce the internal resistance of the power supply, avoid electromagnetic interference, and improve the reliability of the system.

➤ Heat dissipation design: Considering that the power supply generates heat during operation, it is necessary to design a reasonable heat dissipation scheme to ensure the stability and reliability of the power supply system.

Technical Challenges

In the design of PCB power supply system, the following technical challenges may be encountered:

▲ Circuit stability: The stability of the power supply circuit directly affects the performance of the entire device. Unstable or fluctuating power supply circuits may cause the device to malfunction or not work properly.

▲Component durability: Components in the power supply system may wear out or fail during operation. How to improve the durability and reliability of components is an important issue to be addressed in the design of the power supply system.

▲System anti-interference ability: power supply system in the working process, may be subject to electromagnetic interference from the outside world, how to improve the anti-interference ability of the system in the power supply design, is also an important technical challenge.

Solutions

In response to the above technical challenges, the following are some possible solutions:

〓 Circuit Design Optimisation: Adopt reasonable circuit topology and component layout to improve the stability and efficiency of the power system. For example, power supply circuits that require high stability, mature and stable power supply topologies such as LDOs (Low Noise Linear Regulators) or switching power supplies can be used.

〓 Component Quality Assurance: Select components with reliable and durable quality, and consider factors such as component tolerance and thermal characteristics in the design process. For example, grade X and Y resistors and capacitors are selected to meet the needs of high temperature, high humidity and harsh environments.

〓 wiring arrangement is reasonable: in the circuit board layout and alignment design, the power supply internal resistance and electromagnetic interference should be fully considered. For example, the main power line and ground line should be thickened to reduce internal resistance; at the same time, a reasonable signal line layout and filtering design should be adopted to reduce electromagnetic interference.

〓 heat dissipation design: according to the actual working condition, choose the appropriate heat dissipation scheme. For example, for power modules with large power, active heat dissipation methods such as heat sinks or fans can be used; for power chips with small power, natural heat dissipation can be used.

Conclusion

PCB power supply system design is an important part of electronic equipment. In the actual design, we must give full consideration to technical challenges such as circuit stability, component durability and system anti-interference ability, and improve the performance and reliability of the power supply system by optimizing circuit design, ensuring component quality, and rationally arranging wiring and heat dissipation design. In the future electronic equipment, with the continuous progress of technology and the continuous expansion of application scenarios, the design of PCB power supply systems will face more new challenges. Therefore, we need to constantly update our design concepts and methods to adapt to changing market demand and technology trends.

Cost and Price of Flexible PCBs

10/08/2023 在： /通过：

Flexible PCB, also known as FPC, is a flexible PCB made of polyimide or polyester film as a substrate. It has the characteristics of flexibility, light weight, compactness, folding and bending, three-dimensional wiring , etc., relative to the traditional PCB hardboard, with higher production efficiency, wiring density and light weight, thin thickness and other advantages.

Flexible PCB in the electronics industry intelligent, portable, thin and light trend is widely used in flexible displays, wearable devices, smart phones and other fields, but also in recent years PCB industry segments in the fastest growing category. The main raw materials in the upper reaches of the industry chain include Flexible Copper Clad Laminate (FCCL), covering film, components, shielding film, adhesive paper, steel, plating additives, dry film and other eight categories, of which FCCL sheet film is commonly found in polyimide film (PI), polyester (PET), polyethylene glycol naphthalene dicarboxylate (PEN), LCD high polymer (LCP), and other polymer materials such as plastic film. The midstream is FPC manufacturing, and the downstream is for various applications, including display/touch modules, fingerprint identification modules, camera modules, etc. The final applications include consumer electronics, communications equipment, automotive electronics, industrial control medical, aerospace and other fields.

What are the components of a flexible PCB?

Flexible PCB is mainly composed of the following parts:

    1. Flexible substrate: The substrate of a flexible PCB is usually made of polyimide film or other polymer materials, which are flexible and flexibile.
    2. conductive layer: flexible PCB usually contains one or more conductive layer, these conductive layer made of copper or other metals, used to transmit signals and electricity.
    3. Insulation: Insulation is used to isolate the conductive layers to prevent short circuits and electromagnetic interference. The insulating layer can be made of polyimide, polyester or other polymer materials.
    4. Protective Layer: A protective layer can be added to the surface of the flexible PCB to prevent environmental factors (such as moisture, dust, contaminants, etc.) on the circuit board.
    5. Connectors: Flexible PCBs usually contain connectors to make connections with other circuit boards or components.
Together, these components make up the flexible PCB, allowing it to conform to a variety of curved and twisted shapes while maintaining reliable electrical performance

Factors affecting the price of flexible PCBs include the following:

1. Substrate and material: The substrate and material of flexible PCB have a significant impact on its price. For example, the use of high quality FR-4 materials is more expensive than the use of low quality materials, and special materials (such as PTFE) will also affect the price.

2. Number of layers: The number of layers of a flexible PCB is also one of the factors that affects the price. Fewer layers are usually less expensive than more layers.

3. Line width and spacing: Flexible PCB line width and spacing will also affect the price. Narrower lines and spacing require higher manufacturing precision and technology, so the price is higher.

4. Production quantities: The price of flexible PCBs usually increases as the number of flexible PCBs decreases, and mass-produced flexible PCBs are usually cheaper than small quantities of flexible PCBs.

5. Delivery time: The delivery time of the flexible PCB is also a factor in the price. If a flexible PCB needs to be delivered quickly, the manufacturer may need to work overtime or use more expensive manufacturing methods, so the cost will be higher.

6. Design complexity: The design complexity of flexible PCB is also one of the factors affecting the price. Complex designs require higher technology and more manufacturing steps, and therefore cost more.

7. Copper trace width and size

Copper trace width is another key factor in the cost of flexible PCBs. Since copper traces play a vital role in signal transmission and current conduction, proper space is needed to improve flex design and reduce flex PCB costs. If the alignment is too tight, the cost of the flexible PCB will be high and difficult to design; therefore, the copper alignment should be kept at a proper distance from each other to improve the cost and reliability of the flexible PCB.

8. Copper trace thickness

The thicker the copper traces, the higher the cost of flexible PCBs. Since the inner layer of the flexible PCB requires a thicker copper layer, more prepreg is needed to complete the lamination, which increases the cost of the flexible PCB. To control the cost of flexible PCBs, use thin copper alignment. You’d better use a half ounce. Copper trace on the inner layer and 1 oz. on the outer trace.

How to Reduce the Cost of Flexible PCBs

To reduce the cost of flexible PCBs, you can consider the following aspects:

1. Optimize design: Optimizing PCB design can reduce costs. For example, reduce the number of components, reduce the number of layers, reduce the width and spacing of the line. In addition, considering PCB maintainability and repairability is also an important aspect of optimization.

2. Choosing the right material can reduce the cost of flexible PCBs. For example, choose cost-effective substrate and wire materials, as well as insulation materials that meet your needs.

3. Reduce waste in the manufacturing process: When manufacturing flexible PCBs, waste should be minimized as much as possible. For example, optimize the cutting and splicing process, reduce the generation of defective products, and improve material utilization.

4. Consider mass production: Mass production of flexible PCBs can reduce costs. Because mass production can achieve economies of scale, improve production efficiency, while reducing material waste.

5. Choose a reputable manufacturer: choosing a reputable manufacturer can ensure the quality of flexible PCB and after-sales service, but also can reduce costs. Because manufacturers can improve manufacturing efficiency and optimize the production process to reduce costs.

6. Consider transportation and delivery time: transportation and delivery time are also factors that affect the cost of flexible PCBs. Choosing fast, reliable transportation can reduce delivery time and transportation costs. At the same time, minimizing inventory can reduce inventory costs.

Flexible PCB is very commonly used in smart electronic devices and wearable devices, in which the advantages of flexible PCB are fully utilized, such as flexible, thin, light, compact, high reliability, high stability , etc., which provide important support for the development of electronic products.

If you are looking for Flexible PCB, then you can contact us. Our company specializes in the production and processing of flexible PCB, more than 10 years of experience in the industry, and provides flexible PCB assembly services for companies around the world.

The Benefits of PCB Copy Board

09/27/2023 在： /通过：

Circuit board copy board, that is, under the premise of having electronic products and circuit boards, reverse analysis technology is used to reverse analyze the circuit board, as well as PCB original product files and bill of materials (BOM)) documents, schematic files and other technical documents and PCB silkscreen production documents according to 1:1 recovery, and then these technical documents and production documents for PCB boards, circuit board soldering, flying probe test, circuit board debugging. The original circuit is finished. A complete copy of the circuit board template.

Purpose of PCB copying board

1. Through the analysis of existing product technical documents, in terms of design ideas, structural features, process technology, etc.. It can provide feasibility study and competitive reference for its own new product development and improve competitiveness.

2. Through the extraction and modification of technical data files, it can update and further develop various electronic products. According to the document diagram and schematic diagram, PCB can also be optimized according to customer requirements, and a more balanced solution can be found directly between demand and cost.

3. You can quickly add new functions and upgrades on the original basis, improve the competitiveness of the product and further gain an advantage in the market.

What are the benefits of PCB copy boards?

1. Accelerate product development and time-to-market: The traditional product development process requires design and manufacturing from scratch, while PCB copyboards greatly shorten the development cycle by copying and improving others’ designs, so that the product can be brought to market more quickly and seize the first opportunity.

2. Reduce R&D costs: PCB copying can avoid the high R&D costs of designing and manufacturing from scratch, while saving human, material and time resources. This fast and efficient method can greatly reduce R&D costs and improve the competitiveness of enterprises.

3. Simplify the production process: PCB copy can directly refer to existing PCB samples or design drawings, which reduces the research and development costs of the production process, reduces the error rate in production, and greatly improves the production efficiency and product quality.

4. Optimization of product performance: by copying and improving the original product, it can be combined with market demand and technological development, to further optimize product performance and functionality. Not only can we improve the characteristics of the product in terms of hardware, but we can also optimize the software to enhance the overall user experience.

5. Market Opportunity: In a competitive market environment, PCB copy can help companies quickly launch similar or better products to seize the first opportunity in the market. By analyzing and copying competitors’ products, we can better understand market demand and trends, and promote product innovation and progress.

PCB copy board application fields

PCB copy board technology is widely used in various industries. For example, consumer electronics, communication equipment, automotive electronics, medical equipment and other industries can realize the rapid development and production of products through PCB copy board. Especially in some high-tech products, the application of PCB copy board is more common, such as artificial intelligence devices, drones, robots and so on. It can be said that PCB copy board has become an indispensable technical means in the modern electronics industry.

Double-sided plate copying method

1. Scan the upper and lower layers of the board and save two BMP images. 2.

2. Open Quickpcb2005 board copying software, point “file” “open bottom picture”, open a scanned picture. Use PAGEUP to enlarge the screen, see the pads, according to PP to place a pad, see the line according to PT line… Like a child tracing the same, in this software tracing again, point “Save” to generate a B2P file.

3. Then point “File” to “Open the bottom of the map”, open another layer of scanning color map; 4. Then point “File” to “Open the bottom of the map”, open another layer of scanning color map.

4. And then click “File” “Open”, open the previously saved B2P file, we see just copied board, stacked on top of this picture – the same PCB board, holes in the same location, only the line connection is different. The same PCB board, holes in the same location, just different line connections. So we press “Options” – “Layer Settings”, where we turn off the display of the top layer of the line and the silkscreen, leaving only the multilayer vias.

5. The perforations on the top layer are in the same position as the perforations on the bottom layer. Now we trace the lines on the bottom layer as we did in childhood. Now we can trace the lines of the bottom layer as we did in childhood. Then click “Save” – the B2P file will have information about the top and bottom layers.

6. Point “File” “Export as PCB file”, you can get a PCB file with two layers of information. You can then change the board or schematic or directly to PCB board factory production.

Multilayer board copying method

1.scan the item layer board, save the picture, name it top.jpg .

2.Scan the bottom layer board, save the picture, name it bottom.jpg.

3.the middle layer 1 with coarse sandpaper grinding out, leaking copper skin, getting clean and scanned, named mid1jpg

4.The middle layer 2 with coarse sandpaper to grind out, leak copper skin, clean scan, named mid2.jpg.

5.In PHOTOSHOP at each picture level, will be the bottom of the map to do horizontal mirroring, and the top and bottom of the map in the same direction, the upper and lower holes in the same position; and then each picture will be saved as a BMP file, such as: top.bmp, bottom.bmp , etc.

6.Open the color copy board software, enter the main menu “file”, “open BMP file”, select the top.bmp file to open.

7.Set up a good DPI, you can copy the top layer of the map, the first layer selected to the top layer, and then start putting components, holes, wires and so on.

8.The top layer to put everything in, save the temporary file, named top-1.dpb.

9.Close the current picture window (only one picture at a time, do not open more than one picture).

10.Enter the main menu “File”, “Open BMP file”, select the bottom of the picture bottom.bmp, and then open the temporary file top-1.dpb, then you will find that the top layer of the picture and the bottom of the picture are not aligned with the background picture, press Ctrl A combination, the top layer of the picture and the bottom of the background picture is not aligned. Ctrl A combination of keys, put all the selected pictures, according to the keyboard cursor keys or numeric keys to move the whole, select a few reference points and the corresponding point of the aligned background map, then you can choose the current layer for the bottom, then go to the bottom of the line, pad, fill and so on. After copying the bottom layer, save the temporary file as bottom-1.dpb, or save the PCB file as bottom-1.pcb, this time the file is already a two-layer alignment, combined layer of the file.

11.The same intermediate layer of the board copying process is the same, repeating steps 9 to 10, the final output of the PCB file, is the same as the four-layer PCB board diagram.