How to recognize the authenticity of electronic components

With the rapid development of the semiconductor industry, there is an ever-increasing variety of electronic components on the market. However, the surge in demand and model updates also bring new challenges, one of which is the risk of counterfeit components. In order to ensure the reliability of the whole machine and reduce the probability of using counterfeit components, it is especially important to carry out authenticity checks at the product selection stage. In this article, we will introduce in detail the methods of recognizing the authenticity of electronic components, strictly controlling the quality of electronic components and ensuring the function of pcb.

Authentic components inspection methods

Documentation and Packaging Verification
This section mainly checks whether the supporting documents provided by the supplier are consistent with the actual purchased products, such as the product model, name, batch number, quantity, manufacturer and other information in the Certificate of Conformity or Delivery Note. At the same time, it is necessary to carefully confirm the information in the BOM table of the device, such as the identification of important parts, part model, manufacturer and quantity. In addition, when checking the appearance of the outer packaging, you should pay attention to whether there are appropriate signs, such as anti-static, placement direction, light handling and other reminders, and to ensure that these signs are clearly pasted or printed in a conspicuous position.

Visual Inspection of Appearance Quality
This step is to make a careful observation of the device appearance and compare whether the markings on the device such as model number, batch number, serial number, etc. are consistent with the documentation and packaging information. At the same time, check whether the pins have traces of use, whether the size is in line with the specifications, and whether there are a large number of tiny parallel scratches on the surface of the shell, so as to preliminarily determine whether the device has been polished after marking refurbishment.

Detailed inspection of marking and refurbishment
For the possible existence of marking refurbishment, a detailed inspection can be carried out in accordance with the solvent resistance test in GJB548B-2005 Microelectronic Device Test Methods and Procedures. The specific operation is to use a white cotton swab dipped in a mixture of isopropyl alcohol and mineral spirits to gently wipe the marked part of the device. If there is a possibility of refurbishment of the device, the swab will turn black after wiping and the marking portion will become blurred.

X-Ray Structural Inspection
This test is designed to check the structural compliance of the device, including the diameter and number of bonding wires, bonding locations, chip size, and frame dimensions, etc., as specified in the design. At the same time, X-rays can also be utilized to assess the package reliability of hermetic devices, observing the void condition of the bonding surface and whether there are any redundancies inside.

Micro-area Composition Analysis
This segment mainly focuses on in-depth profiling of device materials, usually utilizing comparative testing methods to carefully scan key areas such as frame elements, pin plating, and so on. This test not only helps to verify the accuracy of the documentation, but also reveals the consistency of the materials, processes, and plating quality used in each batch. Under normal circumstances, the materials, processes, and plating quality should remain the same for devices that have not undergone design changes. Therefore, by comparing the elemental spectra of the same device, it is possible to determine its authenticity or the presence of traces of use. Figure 2 illustrates a relevant test case.

Open Internal Inspection
This test mainly utilizes metallurgical microscopy to make a detailed observation of the internal structure of the device as well as the top layer of the chip. By doing this, we can check whether the model number of the chip matches the record in the BOM table, and whether the position of the logo is accurate. In addition, we will also combine the results of the X-ray test to further compare the consistency of the bonding interconnect status. A relevant test case can be seen in Figure 3.

Scanning Electron Microscopy Inspection

Through scanning electron microscopy, we can make an in-depth observation of the chip structure and compare whether there are significant process differences in the passivation and metallization layers between different devices. During the observation process, we typically magnify the passivation layer steps 5,000 to 20,000 times, while the metallization layer is magnified 1,000 to 6,000 times. In addition, we observe the contact windows, thickness of the metallization layer, adhesion, and corrosion defects at a tilt angle of 0° to 85°, depending on the specific model of the sample. At the same time, through the magnified measurements, we can accurately determine the distance between the metalized lines to further confirm the authenticity of the device. A related test case can be seen in Figure 4.

Thermal Test
During device operation, heat will be generated, and this heat will be emitted in all directions through the tube casing. If the heat dissipation performance is poor or the heat generation is too high, the temperature in these areas will rise. Thermal testing by monitoring the temperature change of the device, comparing the heat generation area and temperature rise index between different samples under test, to provide a reference for identifying the authenticity.

Electrical Testing
The most obvious performance differences between counterfeit products are usually reflected in the electrical aspects. By testing the electrical performance parameters according to the instruction manual of the samples, we can compare the degree of conformity between the measured results and the parameter ranges, as well as the consistency of the measurement results of similar parameters between the samples, so as to determine the authenticity of the device.

Aging test
Counterfeit products may have poor reliability due to design defects or improper refurbishment. The aging test provides a basis for identifying the authenticity of the counterfeit by conducting a long time performance test on the suspected samples and comparing the performance changes and parameter measurement results before and after the test.

Summarize

In the process of PCBA processing, the identification of counterfeit electronic parts by means of appearance inspection, marking inspection, X-ray inspection, electrical performance test and original factory traceability verification can not only safeguard the product quality, but also effectively enhance the trust of customers. The identification of counterfeit electronic parts is not the application of a single method, but the combination of multiple methods, and the selection of appropriate inspection means according to the actual situation helps to build an efficient quality management system. the efforts of PCBA factories in guaranteeing the quality of materials are the important basis for winning the trust of the market and customers.