pcb manufacturing process

pcb manufacturing process complete flow: from raw materials to finished products

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As electronic products continue to evolve and gain widespread adoption, printed circuit boards (PCBs), as their core components, have become increasingly significant. PCB manufacturing is a highly technical process that involves multiple steps, requiring meticulous attention to detail and expertise from raw materials to finished products. This article will provide a comprehensive overview of the production techniques and process flow involved in PCB manufacturing, offering readers an in-depth understanding of the process and its technical highlights. Additionally, we will include detailed flowcharts and diagrams to give readers a more intuitive grasp of the entire PCB manufacturing process, which comprises a total of 21 steps.

1.PCB Cutting:
The insulating substrate is cut into circuit boards of the required dimensions using cutting tools, based on PCB design specifications.

PCB cutting

2.Drilling:
A CNC drilling machine creates holes in the circuit board as per design requirements, facilitating component installation and circuit connectivity.

PCB drilling

3.Copper Deposition:
Copper is evenly deposited on the circuit board using chemical methods to enhance conductivity and connectivity.

Copper wire

4.Lamination:
A protective film, such as copper-clad or coverlay, is applied to the board surface to shield the copper layer from corrosion and mechanical damage.

PCB lamination

5.Exposure:
Using photolithography, the circuit design is transferred onto the board surface. The board is placed in an exposure machine where light and masks imprint the circuit pattern onto the photoresist.

exposure

6.Developing:
The exposed board is immersed in a developer solution, dissolving unexposed photoresist to reveal the copper layer.

development

7.Electroplating Copper:
A thicker copper layer is electroplated onto the board after exposure and development, improving its conductivity and connectivity.

PCB Plating

8.Tin Plating:
The board is dipped into a tin-containing solution, coating the copper surface with tin to protect it and provide an excellent soldering base.

Electrotin

9.Photoresist Removal:
The protective film is chemically removed to expose the areas designated for soldering and assembly.

Photoresist Removal

10.Etching:
The board is submerged in an etching solution to remove unprotected copper, leaving behind the desired circuit pattern.

11.Tin Stripping:
Unnecessary tin layers are removed using appropriate methods.

Tin Stripping

12.Optical Inspection:
Optical equipment, such as microscopes or automated optical inspection systems (AOI), examines patterns and connections to ensure quality and accuracy.

AOI Automatic Optical Inspection

13.Solder Mask Application:
A solder mask layer is applied to protect circuits and mark soldering positions. This prevents short circuits and contamination during soldering and improves reliability and insulation.

Solder Mask Application

14.Solder Mask Exposure and Developing:
The board with the solder mask is exposed using photolithography to transfer the mask pattern. A developer solution removes unexposed solder mask to form the required pattern.

Solder Mask Exposure and Developing

15.Marking:
Identifiers, serial numbers, and other necessary markings are printed or engraved on the board for identification and reference.

pcb Marking

16.Surface Treatment:
Special treatments such as anti-oxidation or anti-corrosion coatings are applied to enhance performance and durability.

pcb Surface Treatment

17.Shaping:
The board is cut, bent, or otherwise shaped to achieve the final desired form and size.

PCB Forming Process

18.Electrical Testing:
The board undergoes electrical testing to verify its functionality and connectivity, measuring parameters like resistance, capacitance, and continuity.

PCB electrical testing

19.Final Inspection:
A comprehensive inspection ensures the board meets quality standards, checking its appearance, dimensions, and markings.

PCB final inspection

20.Sampling:
Random boards are selected from the batch for quality assurance testing to maintain consistency and stability across the production run.

Sampling

21.Packaging:
Boards that pass final inspection are appropriately packaged to protect them from moisture, static electricity, and mechanical damage.

PCB Packaging

 

The PCB manufacturing process may vary depending on the manufacturer and application. The steps outlined above provide a general guide and may be subject to adjustments. For inquiries or specific needs, feel free to consult our engineers.