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Как выбрать покрытие и толщину платы печатной платы?

11/09/2023 в /от

Once the board has passed through the standard ПХБ производство процесс, the bare copper in the PCB is ready for surface treatment.PCB plating is used to protect any copper in the PCB that would be exposed through the soldermask, whether it be pads, переходные отверстия, or other conductive components. Designers usually default to tin-lead plating, but other plating options may be better suited for your board application.

В этой статье, I will cover the different PCB plating material options and their advantages in PCBs. There are a variety of options available and depending on your reliability or application needs, you may want to check if the manufacturer can apply the plating you need in your design. We will look at these options and briefly discuss how plating affects loss.

Types of PCB Plating

There are a variety of PCB plating materials. I have summarized the popular materials that designers should know and understand in the following sections. I have never met a manufacturer that does not offer all of these options. If your target manufacturer does not explicitly state that they offer one of the options in the list below, you can always email them for a list of their capabilities, including their PCB plating material options.

Tin Lead and Immersion Tin Plating
This PCB finish may be the least expensive option, but it is not RoHS compliant due to the use of lead in the plated finish.Dip tin is a lead-free alternative for entry-level boards.

Преимущество:
▶ Ultra-flat surface
▶ Inexpensive
▶ Compatible with standard solder

Недостатки:
▶ Not conducive to multiple assembly processes or rework
▶ Forms tin whiskers over time
▶ Tin diffusion into copper may reduce shelf life depending on intermetallic compound content
▶ May damage soldermask during plating process

Выравнивание припоя горячего воздуха (Провести кровотечение) and Lead Free HASL
HASL was once a very popular finishing option, but it is not as reliable as other plating materials. It is inexpensive and has a lead-free option, so it can be used as an entry-level plating option.
Преимущество:
▶ Inexpensive
▶ Can be repaired
▶ Due to poor wettability

Недостатки:
▶Uneven surface makes it less useful for small SMD devices
▶ May be damaged by thermal shock
▶May be difficult to solder

Electroless Nickel Immersion Gold Plating (Соглашаться)
Considering the drawbacks of SnPb and immersion tin plating, ENIG is now arguably the most popular surface treatment in the industry. In this plating material, nickel acts as a barrier between the copper and the thin gold surface layer of the component to be soldered.

Преимущество:
▶ Ultra-flat surface
▶ PTH holes can be easily plated
▶ Widely available
▶Easy soldering
▶Suitable for fine-pitch components
▶Highly reliable against mechanical damage
▶Wire bondable (алюминий)

Недостатки
▶ Not favorable for multiple assembly processes or rework
▶ May experience phosphorus penetration between gold and nickel layers, known as black pad syndrome
▶ Rough interfaces can cause signal loss at high frequencies

Органическая припаяя консервант (Оп)
This organic, water-based finish selectively binds to copper to provide a highly flat surface finish. As an organic material, it is sensitive to handling and contaminants, although the application process is simpler than other PCB plating materials. It also has very low losses at high frequencies.

Преимущество:
▶ Ultra-flat surface
▶ Repairable after application
▶Simple application process
▶Very low interconnection loss at high frequencies
▶Wire bondable (алюминий)

Недостатки:
▶Easy to damage
▶Short shelf life

Immersion Silver Plating
This is my preferred PCB plating material for high frequency applications. It forms a smooth interface with the bare copper and therefore does not increase conductor losses as other PCB finishes do. The main disadvantage is that it loses its luster on the bare board, so it should be soldered and encapsulated as soon as possible after fabrication.

Преимущество:
▶ Easy aluminum soldering and wire bonding
▶ Ultra-flat surface
▶ Suitable for fine pitch
▶ Better suited for high-frequency interconnections in high-reliability systems
▶Wire bondable (алюминий)

Недостатки:
▶ Silver whiskering over time
▶Exposed (unsoldered) conductors lose luster over time, although added OSP helps prevent this ▶May be difficult to plate into small-diameter vias

Hard Gold
This plating material is essentially ENIG, but has a very thick outer layer of gold, making it one of the most expensive PCB plating materials. The gold layer creates a hard surface that can be damaged, but its thickness makes it difficult to fully expose the nickel layer.

Преимущество:
▶ Wire bondable (aluminum and gold)
▶ Very durable surface

Недостатки.
▶ Very expensive
▶ Not applicable to solderable areas
▶ Requires additional process steps for selective applications
▶ May experience brittle cracking

How to specify PCB plating material and thickness

Typical PCB plating thickness values are about 100 micro inches. For immersion silver and OSP, typical thicknesses can be as low as about 10 micro inches. If you are producing a prototype and the manufacturer has a standard quotation, you will have the opportunity to specify the type of plating on their forms. On these forms, they may not ask you to provide the thickness, so be sure to specify it if you need a specific thickness. After specifying the desired plating value, your manufacturer will need to ensure that the plating can be reliably deposited to the desired thickness.

Why is the thickness of the plated material important? There are two reasons. Первый, the IPC-2221A standard specifies minimum plating thicknesses for each IPC product category (see Table 4.3). If you want your product to comply with any of the standard IPC product categories, then you need to make sure that the plating thickness meets its specifications. Normally, if you specify the product category, as you normally do in your manufacturing notes, the minimum plating thickness will be implied. Just make sure you don’t contradict yourself, otherwise the manufacturer will email you asking for plating comments.

Another reason to worry about PCB plating thickness is its effect on losses. At low frequencies, you probably won’t notice any effect on frequency, so low-speed digital signals and sub-GHz radios don’t need to worry much about PCB plating thickness. I’ve completed custom printed transmitters running at 5.8GHz WiFi with ENIG (not the best choice for high frequencies) that swamped the receiver in our test setup, so if your circuit design is correct, you can even bypass most plating at these frequencies.

The loss problem arises at millimeter-wave frequencies, such as short-range radar (24 ГГц) and higher. At these frequencies, the roughness of the copper becomes a very noticeable factor in loss, especially on low loss RF substrates like Rogers. The thickness of the plating will determine the roughness experienced by the signal as it propagates, and this will be reflected in the skin effect resistance.

Как вырезать печатную плату (Последнее руководство)

11/07/2023 в /от

Печатная плата, необходимая для разных электронных продуктов, также отличается. Как соответствовать совместимой форме, требуется разрезание печатной платы. Как сократить печатную плату в требуемый размер, а затем подробно представьте руководство по резки платы.

Почему нам нужно сократить печатную плату ?

Есть несколько причин, по которым вы, возможно, захотите сократить свою печатную плату до нужного размера для вашего текущего проекта. Многие проекты требуют размеров и размеров печатных плат, которые недоступны. В этих типах случаев, Нарезание размера, который вам нужен от большей печатной платы, может быть единственным вариантом.

Более того, Многие профессионалы и энтузиасты предпочитают заказывать большие ПХБ и резать пользовательские размеры. Это обычная практика, так как более крупные ПХБ часто стоят меньше за единицу размера. Поэтому, Эта практика может помочь сделать проекты более экономичными и экономически эффективными.

Нарезание собственных печатных плат на заказ также может помочь вам сэкономить время. Если вы находитесь в середине критического проекта и лежат большие печатные платы, Урезание нуждающегося в вам размер немедленно дает вам доступ к правильной доске. Сюда, Вам не нужно тратить время на ожидание таможенных досок от вашего поставщика.

Как вырезать печатную плату

Есть много способов сократить плату. Ниже приведены основные методы:

1. Резка: Резка является первым шагом механической работы печатной платы. Резкой, он может придать грубую форму и наброски. Основной метод резки подходит для различных субстратов, Обычно толщина не превышает 2 мм. Когда режущая доска составляет более 2 мм, края разреза будут казаться грубыми и неровными, Таким образом, этот метод обычно не принимается.

2.V Режущая машина: Большинство заводов используют специальные машины для резки V -типа для резки печатной платы.

3. Шаблон и удар: Используйте шаблон, чтобы сформировать канавку вокруг материала печатной платы, а затем используйте удар, чтобы сломать печатную плату. Однако, Этот метод может привести к трещинам в конечном продукте и снижении эффективности.

4. ПХБ маршрутизатор, V-Cut Machine, Пекарня измельчающий резак, Машина распиляния печатной платы, Выделенный инструмент резки печатной платы: Эти инструменты могут быть более применимыми при работе с печатной платой разных материалов и размеров.

Процесс резки печатной платы

1. Определите положение резания: Перед резкой, вам нужно определить положение и форму разреза. Это может помочь определить с помощью шаблонов или ручного рисунка.

2. Выберите правильный режущий инструмент: Выберите соответствующий режущий инструмент в соответствии с материалом печатной платы и размером среза. Общие режущие инструменты включают машины V-Cut, ПХБ маршрутизатор, Пеплавовая вырезка, Машины пилирования Пчеты, и т. д..

3. Отрегулируйте глубину резки: Для некоторых печатных плат, которые нужно разрезать на определенную глубину, Вам нужно отрегулировать глубину резки. Это может быть достигнуто путем установки глубины резки резки или использования шаблона на режущей машине.

4. Контролировать скорость резки: При резке, Вам нужно контролировать скорость резки, чтобы избежать чрезмерной или недостаточной резки. Вообще говоря, Более медленная скорость резки может обеспечить лучшее качество резки и меньше калорий.

5. Используйте охлаждающую жидкость: При резке, Вы можете использовать охлаждающую жидкость, чтобы помочь снизить температуру и снизить производство теплового напряжения. Это может предотвратить деформирование или разрывание платы печатной платы.

6. Проверьте качество резки: После завершения резки, Проверьте качество резки, чтобы убедиться, что резка соответствует требованиям. Если резка плохая, Вы можете настроить режущий инструмент или повторно настроить параметры резки.

Резка является важным процессом Сборка печатной платы. Правильная резка может лучше завершить сборку продукта. Для энтузиастов, Знание того, как сократить печатную плату полезно, Потому что это может помочь сэкономить и время крупных проектов. С этим руководством, Вы должны быть в состоянии научиться сокращать печатную плату, Какие инструменты вам нужны, и как использовать их для достижения наилучших результатов.

Как выбрать компанию по сборке печатной платы

11/06/2023 в /от

Choosing a correct Сборка печатной платы company can quickly complete your PCB project, and at the same time to ensure the quality of the product. The PCB project reaches the assembly stage, indicating that you have invested a lot of time and resources, so it is important to choose the correct assembly company. Good partners can help you reduce costs in all aspects. How to choose the correct assembly company takes time to inspect. Today we will discuss the steps of choosing PCB assembly companies.

What are the content of PCB assembly?

PCB assembly includes the following content:

1. Circuit board composition: The circuit board is mainly composed of pads, perforated, installation holes, wires, компоненты, plug -in plug -ins, filling, electrical boundaries, и т. д..

2. Welding of components: Welding the component through the pad on the circuit board.

3. Layout of components: According to the function and design requirements of the circuit board, the component is reasonably layout on the circuit board.

4. Connection of the wire: According to the circuit diagram and design requirements, connect the wire correctly between the pads and components of the circuit board.

5. Fix the installation hole: On the back of the circuit board, make some installation holes as needed to fix the circuit board to the chassis or bracket.

6. Fill and coverage: Fill in some parts of the circuit board to fill the insulating material to protect the circuit board from environmental effects, и в то же время, it can also improve the mechanical strength of the circuit board.

7. Test and debugging: After completing the assembly, test and debug the circuit board to ensure that its functions are normal.

Select the steps of PCB assembly company

Determine the needs

Each PCB project is different, so the solution will be different. Поэтому, when negotiating with PCB companies, you must first clear the needs and spend more time to improve the project.

Determine the experience level of PCB assembly company

Experience is another important factor to determine the choice of PCB assembly companies. An experienced company will stimulate confidence and trust. This is because they have professional teams to ensure high -quality PCBA and fast turnover time. If you want to know the experience of a company, you can go to their website to see, or talk to them directly with them.

Confirm the qualifications and certification

Ensure that the selected PCB assembly company has relevant qualifications and certifications, такие как ISO 9001 quality management certification and UL certification, which can ensure the quality of the product and meet the relevant standards.

Confirm the production capacity

It is necessary to understand the production capacity of the PCB assembly company, including the number of production lines, the modernization of equipment, and the level of employee’s technical level to ensure that the production tasks are completed in a limited time and delivered in time in time.

View experience and reputation

Choosing a PCB assembly company with rich experience and good reputation can ensure the quality and reliability of product quality and delivery. You can learn its experience and reputation by viewing the manufacturer’s historical orders and customer evaluation.

Confirm the price and service

Choosing a PCB assembly company with reasonable prices and good services can reduce procurement costs and improve the procurement experience. It is necessary to consider factors such as manufacturers’ prices, after -sales service and distribution methods.

View technical ability

Choosing PCB assembly companies with high technical capabilities can ensure product quality and meet technical requirements. Considering factors such as manufacturers’ technical research and development strength, innovation ability, and patent quantity.

Examine the factory environment and equipment

Choose a PCB assembly company with modern equipment, clean process workshops and good production environment.
Examination of quality management system: Choosing a PCB assembly company with a complete quality management system and a ISO9001 certification company can ensure product quality and stability.

Dating and after -sales service

Choosing PCB assembly companies with small stress and good after -sales service can ensure the timelyness of the order and the quality of after -sales service.

By following these steps, you are much more likely to discover PCB assembly companies who will take care of your project. There is no company more qualified to do so than EEI Manufacturing. With expertise in PCB assembly services and a passion for customer satisfaction, we assure you that you will be pleased with the result of your project.

How to layout high frequency pcb

11/03/2023 в /от

High-frequency PCB refers to the electromagnetic frequency of the higher special circuit boards for high-frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 метры) in the field of PCB, is in the microwave substrate copper-clad laminate boards on the use of ordinary rigid circuit boards manufactured using some of the process or the use of special treatment methods and the production of circuit boards. High-frequency circuit board circuit design is a very complex process, the layout of each line must be in place, the next will focus on high-frequency circuit board layout methods.

How to layout high frequency pcb？

1. Multilayer board wiring

High-frequency circuits are often highly integrated, wiring density, the use of multi-layer board is both necessary for wiring, but also an effective means of reducing interference. In the PCB Layout stage, a reasonable choice of a certain number of layers of printed circuit board size, can make full use of the intermediate layer to set up shielding, a better realization of the proximity of grounding, and effectively reduce the parasitic inductance and shorten the length of the signal transmission, but also significantly reduce the signal cross-interference, и т. д., all of which are beneficial to the reliability of high-frequency circuitry.

2. High-speed electronic devices between the pins of the lead bends the less the better

High-frequency circuit wiring of the lead is best to use a straight line, the need to turn, available 45-degree fold or arc turn, this requirement in the low-frequency circuits are only used to improve the strength of the copper foil adhesion, while in the high-frequency circuits to meet this requirement can reduce the high-frequency signals to the outside of the launch and coupling between each other.

3. High-frequency circuit device pins between the lead the shorter the better

Signal radiation intensity is proportional to the length of the signal line, high-frequency signal leads the longer, the easier it is coupled to the components close to it, so for such signals as the clock, crystal, DDR data, LVDS lines, USB lines, HDMI lines, and other high-frequency signal lines are required as much as possible, the shorter the line, тем лучше.

4. The fourth trick: high-frequency circuit device pins between the lead layer alternation the less the better!

The so-called “less alternation between the layers of the lead, тем лучше” means that the components used in the connection process of the hole (Via) the less the better. According to the side, a hole can bring about 0.5pF of distributed capacitance, reduce the number of holes can significantly improve speed and reduce the possibility of data errors.

5. Pay attention to the signal line close to the parallel alignment of the introduction of “crosstalk”

High-frequency circuit wiring should pay attention to the signal lines in close proximity to the parallel alignment of the introduction of “crosstalk”, crosstalk refers to the coupling phenomenon between the signal lines are not directly connected. As high-frequency signals along the transmission line is transmitted in the form of electromagnetic waves, the signal line will play the role of the antenna, the energy of the electromagnetic field will be emitted around the transmission line, the signal due to the mutual coupling of the electromagnetic field and the resulting undesired noise signal is called crosstalk. parameters of the PCB board layer, the spacing of the signal line, the driving end and the receiving end of the electrical characteristics, as well as the signal line termination method of the crosstalk have a certain impact. Так, in order to reduce the crosstalk of high-frequency signals Therefore, in order to reduce the crosstalk of high-frequency signals, it is required to do the following as much as possible when wiring:

Under the condition that the wiring space allows, insert a ground line or ground plane between two lines with serious crosstalk, which can play the role of isolation and reduce crosstalk. When the space around the signal line itself there is a time-varying electromagnetic field, if you can not avoid parallel distribution, parallel signal lines can be arranged on the opposite side of a large area of “ground” to significantly reduce the interference.

Under the premise of wiring space permits, increase the spacing between adjacent signal lines, reduce the parallel length of the signal lines, clock lines as perpendicular as possible with the key signal lines rather than parallel. If the parallel alignment within the same layer is almost unavoidable, in two adjacent layers, the direction of the alignment must be perpendicular to each other.

In digital circuits, the clock signal is usually a fast-edge signal, external crosstalk. Поэтому, in the design, the clock line should be surrounded by ground wires and more ground holes to reduce the distribution capacitance, thereby reducing crosstalk. Clock on high-frequency signals try to use low-voltage differential clock signals and packet ground way, need to pay attention to the integrity of the packet ground hole punching.

Idle not used inputs do not hang, but will be grounded or connected to the power supply (power in the high-frequency signal loop is also the ground), because the suspended line may be equivalent to the transmitting antenna, grounding will be able to inhibit the emission. Practice has shown that this approach to eliminate crosstalk can sometimes be immediately effective.

6. IC block power supply pins to increase the high-frequency decoupling capacitance

Each integrated circuit block power supply pin near the increase of a high-frequency decoupling capacitance. Increase the power supply pin high-frequency decoupling capacitance, can effectively inhibit the power supply pin on the high-frequency harmonics form interference.

7. Isolation of high-frequency digital and analog signal ground lines

Analog ground, digital ground line to the public ground with high-frequency choke bead connection or direct isolation and choose a suitable place for single-point interconnection. High-frequency digital signal ground potential is generally inconsistent, there is often a certain voltage difference between the two directly; и, high-frequency digital signal ground is often with a very rich high-frequency signal harmonic components, when directly connected to the digital signal ground and analog signal ground, high-frequency signal harmonics will be coupled through the ground to the analog signal to interfere with the way.
В общем, the high-frequency digital signal ground and analog signal ground is to do the isolation, can be used in the appropriate location of a single point of interconnection, or the use of high-frequency choke bead interconnection.

8. Avoid the formation of the loop alignment

Various types of high-frequency signal alignment try not to form a loop, if you can not avoid the loop area should be as small as possible.

9. Must ensure good signal impedance matching

Signal in the transmission process, when the impedance mismatch, the signal will occur in the transmission channel signal reflection, reflection will make the synthesized signal overshoot, resulting in the signal fluctuations in the vicinity of the logic threshold.
Eliminate the reflection of the fundamental approach is to make the transmission signal impedance is well-matched, due to the load impedance and the transmission line of the characteristic impedance of the larger the difference between the reflection of the larger, so should be as much as possible to make the signal transmission line of the characteristic impedance of the load impedance and load impedance is equal; в то же время, but also to pay attention to the PCB on the transmission line can not be a sudden change or corners, as far as possible to maintain the transmission line at all points of the impedance continuity, or in the transmission line between the various segments will be a reflection.

10. Maintain the integrity of the signal transmission

Maintain the integrity of the signal transmission, to prevent the “ground bounce phenomenon” caused by the division of the ground.

LST Technology participated in the Philippine Semiconductor and Electronics Show

10/30/2023 в /от

On October 27, 2023, the 18th Philippine Electronics Exhibition (PSECE) ended successfully. As the largest and most authoritative electronic exhibition in the Philippines, merchants from countries from the United States, France, France, Германия, Япония, Китай, Южная Корея, и т. д.. come to the exhibition. Enterprises including semiconductor manufacturing, потребительская электроника, smart homes, ПХБ производство, production equipment and other fields provide a variety of choices for the Philippines market.

As a PCB one -stop solution supplier, Shenzhen LST Technology has brought a variety of PACB samples and electronic manufacturing solutions to the audience. During the exhibition, we showed a series of high -performance, high -quality PCB circuit board products, including high -precision, высокая надежность, high integration PCB board, and customized solutions. We also introduced our product characteristics and technical advantages to visitors through brochure, display video and other methods.

Through the exhibition exchanges, let more customers know and understand LST, and we also know more clearly about market demand. We will adhere to the production concept of “эффективный, transparent, высокое качество”, and provide high -quality design for global customers worldwide Production service.

Shenzhen LST Technology is a professional PCB manufacturing supplier. В то же время, we also provide a one -stop service of electronic manufacturing. Our service areas include smart homes, потребительская электроника, Новые энергетические продукты, Медицинское оборудование, automotive accessories, и т. д.. We welcome global customers to visit our company.

Введение в технологию травления PCB

10/23/2023 в /от

ПХБ производство требует разнообразных процессов, среди которых ПХБ трасса это самая важная ссылка. Eclipse относится к процессу удаления избыточной меди с платы световой платы PCB, и оставшаяся диаграмма линейки печатной платы.

Это звучит просто, но он содержит много сложного мастерства. Чтобы помочь всем лучше понять технологию травления PCB, Мы намеренно готовим операционное руководство для всех, чтобы учиться и обсудить. Конкретный контент заключается в следующем.

Что такое травление печатной платы?

Требирование печатной платы - это процесс удаления нежелательной меди из печатной платы. Как только весь избыток меди был удален с печатной платы, Остается только необходимая схема.

Перед началом процесса травления, Создается макет для платы. Этот желаемый макет для платы передается на печатную плату с помощью процесса, называемого фотолитографией. Это образует план, который решает, какие кусочки меди должны быть удалены с платы.

На внешнем слое печатной платы, Олово вытягивает, как охватывает травление. Однако, во внутреннем слое, Фоторезист - это резист. Вообще говоря, Есть два подхода ко внутреннему слою и внешнему слое. Это сухое травление и влажное травление. Здесь, в ABL Circuits, Мы используем мокрый процесс травления с использованием технической победы щелочной травления.

Метод травления влажного ПК B

Влажное травление есть а Процесс травления, в котором нежелательные материалы растворяются при погружении в химические растворы.

В соответствии с использованием эрозионного агента, Производитель печатной платы Tongyu принимает два метода влажного травления:

1. Кислотное травление (хлорид железа и хлорид меди).

2. Щелочное травление (аммиак)

Кислотный процесс травления

Кислотный метод используется для травления внутреннего Жесткая печатная плата слой, который включает химические растворители, такие как хлорид железа fecl3 или хлорид меди (CUCI2). По сравнению с щелочными методами, Кистные методы более точны, дешевле, но более трудоемкий. Этот метод подходит для внутреннего слоя, потому что кислота не будет реагировать с фоторезистом, и не повредит необходимую часть. Кроме того, В этом методе, Нижний разрез - самый маленький.

Нижняя часть - горизонтальная коррупция травления материала ниже наиболее свинцового слоя. Когда решение встречается с медью, он атакует медь и оставляет защищенную орбиту. Используйте антикоррозионную гальванирую или экранирование света, чтобы защитить дорожку. На краю пути, Определенное количество меди всегда будет удалено ниже сопротивления, который называется нижним разрезом.

1. Медное травление

Хлорид меди является наиболее широко используемым агентом травления, потому что он может точно тратить меньше характеристик. Процесс аммиака также обеспечивает постоянную скорость травления и постоянную регенерацию при более низких затратах.

Максимальная скорость травления хлоридной системы меди представляет собой комбинацию гидрид-гидрав. Комбинация обеспечивает максимальную скорость гравюры 55 секунды в 130 ° F.. Поэтому, Этот тип травления используется для внутреннего слоя травления тонкой линии

Примечание: Использование хлорного газа требует адекватной вентиляции, резервуары для хранения и цилиндры для хранения и оборудования для обнаружения утечки. Кроме того, это должно быть одобрено соглашением о чрезвычайных ситуациях, оборудование для личной защиты, обученные операторы, и пожарная служба.

2. Триссель оксид оксид

Из -за высокой стоимости меди, Использование агентов травления хлорида железа в промышленности ограничено. Однако, Хлорид железа - это привлекательное травление спрея, потому что оно легко использовать, способность поддерживать медь, и возможность использовать его в редких приложениях. Хлорид железа можно использовать с шелковыми чернилами, литографический клей и золото, но нельзя использовать с оловом или оловом/свинцом.

В целом, раствор хлорида железа растворяется в воде, с диапазоном концентрации 28-42% (по весу). HCI (5%) также смешивается с раствором, чтобы предотвратить образование нерастворимого гидроксида и оксида железа.

Соотношение хлорида железа обычно 36 БЫТЬ, или около 4,0 фунта/галлона FECI3. А содержание (Hcl) для коммерческого использования находится внутри 1.5 к 2%.

Щелочный процесс травления

Щелочный метод используется для травления внешнего слоя PCB. Здесь, используемые химические вещества являются хлоридом меди (Cull2) Десять гидрохлорида (HCI)+водород перекись (H2O2)+вода (H20) композиция. Щелочный метод является быстрым процессом, и это также немного дорого. Параметры этого процесса должны быть тщательно следовать, Потому что, если ты трогаешь а Растворители в течение длительного времени он разрушит, Процесс должен хорошо контролироваться.

Весь процесс проводится в воздушном спрее высокого давления, и печатная плата подвергается воздействию свежего травления спрея. Некоторые важные параметры требуются в а щелочная печатная плата. Это количество движения панели, химический спрей, и медь, чтобы быть запечатленным. Это гарантирует, что процесс травления будет выполнен равномерно через прямой конец.

В а разрушение травления, Точки, которые не требуются для медного травления, являются точками останова. Обычно это делается из средней точки камеры атомикации. Например, Предполагая, что длина атомизационной камеры 2 метры, Точка останова будет достигнута, когда пластина достигнет промежуточной точки.

ПХБ процесс травления

Процесс травления печатной платы должен выполнять следующие шаги:

Шаг 1: Самым первым шагом процесса травления является проектирование схемы, Использование программного обеспечения по вашему выбору. Как только дизайн будет готов, Переверните, а затем напечатайте его.

Шаг 2:На трансферной бумаге, Распечатайте дизайн схемы. Убедитесь, что дизайн напечатан на блестящей стороне бумаги.

Шаг 3: Сейчас, занять медную тарелку, и натирать на него бумагу. Это сделает поверхность медной грубой, и, таким образом, помогает ему эффективно удерживать конструкцию. Есть определенные моменты, чтобы запомнить шаг 3 до последнего шага:

Используйте безопасные перчатки, Во время обработки медной пластины и раствора травления. Это предотвратит перенос рук масла в медную пластину, и также защитит ваши руки от раствора или химикатов.
Когда вы шлифуете медную тарелку, Убедитесь, что вы делаете это правильно, особенно по краям тарелки.
Шаг 4: Сейчас, Вымойте тарелку каким -то спиртом и водой, так что любые небольшие частицы меди, которые удаляются с поверхности во время шлифования, промывают. Позвольте тарелке высохнуть после мытья.

Шаг 5: Правильно вырежьте печатный дизайн, и поместите их на медную пластину, обращенную вниз.

Шаг 6: Медная пластина теперь проходит через ламинатор несколько раз, пока пластина не нагревается.

Шаг 7: Вытащите тарелку с ламинатора, после того, как это жарко, и держите его в холодной ванне. Взволновать тарелку так, чтобы вся бумага сходила и плавала на воде. Вы увидите прослеженную цепь в черном на медной пластине.

Шаг 8: Теперь выньте доску из ванны, и поместите его в раствор травления. Агитировать медную пластину для 30 минуты. Убедитесь, что вся медь вокруг дизайна распущена.

Шаг 9: Выньте медную тарелку и снова вымойте ее в водяной бане. Держите это, чтобы высохнуть. Как только он полностью высохнет, Вы можете использовать втирание спирта для удаления чернил, перенесенных в печатную плату.

Шаг 10: Это завершает процесс травления печатной платы. Теперь вы можете просверлить отверстия, используя правильные инструменты с необходимым размер буровой бита.

О нас

LST Technology - это профессиональная печатная плата и PCBA производители. Мы предоставляем универсальные производственные услуги для глобальных клиентов. В 18 годы, Опыт сборки на производство печатных плат. Если у вас есть потребности в бизнесе печатной платы, Пожалуйста, оставьте нам сообщение. Я отвечу тебе на некоторое время.

2-Пчела слоя против 4-слойной печатной платы: Преимущества и недостатки введение

10/17/2023 в /от

When manufacturing electronic products, the selection of the type of circuit board is a relatively important step. Например, whether to use single-layer PCB, 2-layer PCB, или Многослойная печатная плата. Конечно, these issues are in the product design stage . Each type of PCB has unique advantages. We must choose according to the performance of the product.

Now we will discuss the advantages and disadvantages of 2-layer PCBs and 4-layer PCBs. Конкретный контент заключается в следующем:

Introduction to the concept

What is a 2-layer PCB?

A 2-layer circuit board is a circuit board with only two conductive layers and no gaps between the layers. Each layer can be wired for circuits, and the two layers do not lead to each other. This type of circuit board is generally used for simpler circuit designs, such as some small electronic devices, игрушки, и т. д.. Its advantages are easy to manufacture, бюджетный, suitable for small-scale production, и т. д..

What is a 4-layer circuit board?

A 4-layer circuit board is a circuit board that has four conductive layers with vias connecting the layers. This type of board is often used for more complex circuit designs, such as communication equipment, computer networks, и т. д.. It has the advantage of providing more circuitry. Its advantages include more wiring space, higher signal quality and more stable performance.

4-layer circuit boards are more difficult to design and fabricate, and require a higher level of technology and equipment, so their cost is also relatively high. Однако, it can provide better signal quality and more stable performance, and is suitable for application scenarios that require higher circuit performance.

2-Layer PCB Advantages and Disadvantages

Преимущества

▶ Lower Cost – double sided PCBs are less expensive than 4-layer designs. This difference can be considerable depending on the number of units you intend to order.

▶ Simpler Design and Production – simpler design and production not only means you get your printed circuit boards faster. The simpler your design is, the less vulnerable it is to costly errors during the design or manufacturing process. В определенных приложениях, the ability to repair your PCB at a later date is also important; when compared to more complex 4-layer PCBs, it is inherently easier to repair double sided printed circuit boards.

▶ High Volume – Whenever projects require mass production, eliminating unnecessary layers is vital. If your project is going to be a high-volume order, 2-layer boards are typically preferred to optimize manufacturing speed, cost, and efficiency.

▶ Short Lead Time – For large and small projects, a shorter lead time is often required to quickly make a prototype. 2-layer PCBs have an advantage over other multilayer printed circuit boards, because they are extremely fast to produce.

Недостатки

▶ Simplistic Design – Oftentimes opting for a double sided circuit board means sacrificing some bells and whistles. A 4-layer PCB has more room for more components and routing options, while a 2-layer PCB typically has a simple design.

▶ Slower Speed and Lower Operating Capacity – If speed is an issue, the more layers, тем лучше. Depending on the application, you may find that 2 layers isn’t enough to give you the necessary speed and capacity for your project. The jump from 2 layers to 4 layers includes considerably more speed and operating capacity.

▶ Larger Size and Higher Weight – Despite 4-layer printed circuit boards having more layers, double sided PCBs are typically quite large and bulky in comparison to make room for components and leads. If you need to fit your printed circuit board into a compact space, adding more layers is often the best design choice.

4-Layer PCB Advantages and Disadvantages

Преимущества

▶ Useful for More Complicated Projects – The more complex your project is, the more useful you will find the additional layers of a 4-layer PCB. Being able to increase your creative design choices including layouts, routing, and additional components, gives you the opportunity to make the best end product possible.

▶ High Quality – For even simple products that demand the highest quality, going from a 2-layer to a 4-layer Дизайн печатной платы is an obvious choice. If cost is not an issue, 4-layer boards offer a higher quality result.

▶ Added Power – The ability to handle more power is a considerable advantage for 4-layer PCBs. When you are deciding whether you need a double sided or 4-layer printed circuit board, keep in mind how much power your design will require.

▶ Increased Durability – The more layers your design has, the more durable your PCB will be. А 4 layer design will be much more substantial than a 2-layer printed circuit board, despite typically being smaller in size.

▶ Smaller Size and Lighter Weight – While many people conflate a larger number layers with a larger sized board, 4-layer boards are actually often much smaller and lighter than 2-layer PCBs. This is because they require less room for components and wiring.

Недостатки

▶ Higher Costs – Since 4-layer PCBs use more materials and are more difficult to manufacture, they can be quite a lot more than 2-layer printed circuit boards. When costs are an issue, minimizing the number of layers is usually the best option.

▶ More Complicated Design and Production – When you need to quickly design and produce printed circuit boards for a project, the more layers you have, the longer each step of the process is going to take.

▶ Less Availability – You will find that the more complex your design is, the harder it is to find a manufacturer who can accommodate your needs. That being said, 4-layer designs are very common these days, so this becomes more of an issue as your PCB designs begin to get even more complicated.

▶ Longer Lead Times – For projects that are in a time crunch, adding layers to your design isn’t ideal. The smaller your timeframe is, the more important it will be to use as few layers as possible for your project.

▶ More Complex Repairs – Double-sided printed circuit boards have an advantage over 4-layer designs when it comes to ease of repairs. While everything is essentially exposed on 2-layer designs, any necessary repairs for 4-layer PCBs are going to be more difficult. For some applications, this is extremely important and should be taken into consideration.

2 Layer PCB vs 4 Layer PCB

Designs of 2 Layer PCB vs 4 Layer PCB

Vias in 2 layer PCB are used to create electrical connections that enable the routing of the traces so that they reach the opposite side of the board. Even more surface area is available for traces in a 4 layer PCB design than that in a 2 layer PCB. А 4 layer PCB design involves a prepreg layer that bonds two layers and a double-sided boards together by applying heat and pressure. Prepreg provides dielectric between the layers.

Functionality of 2 Layer PCB vs 4 Layer PCB

If the microstrip traces comprising a ground plane are utilized, а 2 layer PCB delivers more functionality as there are no propagation delays or other problems. Однако, a 4-layer PCB design consisting of ground and VCC plane layers and 2 signal layers is more preferred. This design struggle with impedance and propagation delays.

Cost of 2 Layer PCB vs 4 Layer PCB

Due to complexity of design, higher sensitivity, the higher levels of signal integrity and reduced interference levels, а 4 layer PCB is more expensive than a 2 layer PCB. The price of 2 layer PCB can be as low as $2/piece, and the cost of 4 layer pcb can be as low as $6.5/piece in ALLPCB.com.

Lead Time of 2 Layer PCB vs 4 Layer PCB

The After your payment, your 2 layer pcb order with standard manufacturing specifications can be shipped within 24 hours and the lead time of your 4 layer pcb order can be within 48 hours on ALLPCB.com. Order now, we offer worldwide free shipping service!

Introduction to the process and processing steps of ceramic PCB

10/16/2023 в /от

Ceramic PCB has the advantages of high heat dissipation, high insulation, low expansion coefficient, коррозионная стойкость, и т. д., and is widely used in aerospace, Автомобильная электроника, smart lighting, биомедицинский, and 5G interconnection. В последние годы, more and more products use ceramic PCB, according to the relevant data survey: the global керамический субстрат market size reached 1.13 billion U.S. dollars in 2022, and is expected to reach 4.15 billion U.S. dollars in 2029, with a compound annual growth rate of 18.23%.

Ceramic PCB production process many people still do not know, then we will give you a detailed introduction to the production process of ceramic PCB and manufacturing process, to help you better understand the ceramic PCB.

What is ceramic PCB?

Ceramic PCB is a ceramic-based printed circuit board, using thermally conductive ceramic powder and organic binder preparation, thermal conductivity of 9-20W/m. Ceramic PCB has excellent electrical insulation properties, высокая теплопроводность, excellent soft brazing and high adhesion strength, and can be etched like PCB boards can be a variety of graphics, has a large current-carrying capacity. In high-power power electronic circuit structure technology and interconnection technology, ceramic PCB has become the basic material.

What are the processes of ceramic PCB?

1.direct copper plating ceramic substrate process

DPC substrate has the advantages of high graphic accuracy, vertical interconnection, и т. д., mainly used in high-power packaging.

2.direct bonding process of copper ceramic substrate

The DBC line layer is thicker, better heat resistant, mainly used in high power, high temperature variations of the IGBT package.

3.thick film printing ceramic substrate process

TPC thick ceramic substrate heat resistance, бюджетный, but poor line layer accuracy, mainly used in automotive sensors and other fields.

4.thin film ceramic substrate process

In the plane ceramic substrate, thin film ceramic substrate TFC substrate graphic accuracy, but the metal layer is thin, mainly used in small current optoelectronic device packaging.

5. AMB active brazing process

The AMB substrate line layer is thicker, better heat resistance, mainly used in high power, large temperature variations of the IGBT package.

6.multilayer htcc high temperature co-firing process

High temperature co-fired ceramic materials are mainly alumina, mullite and aluminum nitride as the main components of ceramics. HTCC ceramic powder does not join the glass material. Conductor slurry uses materials for tungsten, molybdenum, molybdenum, manganese and other high melting point metal heat resistant slurry. Sintering temperature of 1600 ° ~ 1800 °.

7. multilayer ltcc low temperature co-firing process

Low temperature co-fired ceramics to ensure that the low temperature co-firing conditions have a high sintering density, usually added to the amorphous glass component, crystallized glass, low melting point oxides to promote sintering. Glass and ceramic composites are typical low-temperature co-fired ceramic materials. Sintering temperature 900 ° ~ 1000 °, LTCC using high conductivity and low melting point of Au, Ag, Cu and other metals as a conductor material, is mainly used in high-frequency wireless communications, аэрокосмическая, память, водители, фильтры, датчики, and automotive electronics and other fields.

Production Process of Ceramic PCB

Ceramic PCB board is a high-performance circuit board with excellent thermal conductivity, high temperature resistance and corrosion resistance. It is widely used in high-end electronic products. The following is a detailed introduction to the production process of ceramic PCB.

1. Raw material preparation

Прежде всего, you need to prepare the raw materials needed to make ceramic PCB boards, including ceramic powder, organic binder, additives and metal wires.

2. Board processing

After mixing ceramic powder with organic binder, ceramic plates are made by pressing and molding. Metal wires or other conductive materials are then attached to the plate and fine-tuned and cut to conform to design requirements.

3. Punching

Holes are punched into ceramic plates, usually by laser drilling or mechanical drilling. This step requires great care to ensure that the holes are in the correct position.

4. Graphicization of the inner circuit

Inner circuit patterning refers to the conversion of the designed circuit pattern into an actual circuit layout. This step is usually performed using photolithography, wherein the circuit pattern is printed on the inner layer of the ceramic board by photolithography.

5. Goldizing

After completing the patterning of the inner layer circuit, metallization is required. This step includes copper etching and gold plating operations to ensure that the circuit board has good conductive properties.

6. Outer layer circuit patterning

Outer layer circuit patterning refers to the design of the external circuit layout . The actual circuit layout of this step is usually similar to the inner layer circuit patterning photolithography.

7. Soldering and Assembly

After completion of the outer layer of circuit patterning, the need for soldering and assembly operations. This step includes patching, плагин, connector and other operations to ensure that the entire electronic product has good functional performance.

8. Testing and inspection

After the completion of the ceramic PCB board, you need to carry out testing and inspection operations. This step usually includes appearance inspection, Функциональное тестирование, voltage testing, high temperature testing and other aspects to ensure that the product meets the design requirements and has stable and reliable performance.

LST Technology specializes in ceramic Сборка печатной платы и обработка, if you want to get more information about ceramic PCB, please leave us a message, we will contact you in 24 часы.

What is box build assembly service?

10/12/2023 в /от

Electronic production involves many parts and components, and we need to coordinate with suppliers to coordinate the materials needed one by one. When we carry out mass production, some manufacturers can help you complete the assembly task more efficiently. А box build assembly service is a good way.

The box build assembly service is not suitable for all electronic products. К счастью, you have a choice. Electronic box manufacturing is a fairly new development in the electronic manufacturing промышленность. For complete system integration, box construction may be the right choice for your next project.

What Is Box Build Assembly?

Box build assembly refers to the process of assembling, integrating, and testing various electronic components and modules into a fully functional product inside an enclosure or “box”. It involves taking printed circuit boards loaded with components (known as PCB assemblies), interconnecting them with wiring harnesses, and adding in power supplies, разъемы, electromechanical parts like switches and sensors, and other hardware. All these pieces get assembled and mounted into frames or enclosures made of metal or heavy-duty plastics that can withstand demanding physical environments.

The end result of the box build process is a completely assembled electronic product unit that is ready for integration into the final application, such as medical devices, industrial control systems, telecom equipment, and many other electronic products we use daily. Box build assembly requires collaboration between design engineers, sourcing specialists, and manufacturing technicians to take a product from initial concept through prototyping, тестирование, pilot runs, and final mass production.

What Are Some Common PCB And Box Build Assembly Applications?

Image Of Box Build Assembly In ProductionEverything from your cell phone to your computer monitor requires printed circuit board assembly. Common examples of box build assembly applications include the following.

Box Builds As Panels
Control panels are integral to the manufacturing industry and drive the operation of heavy machinery. In addition to circuit boards, a control panel may contain switches, Трансформеры, Моторные диски, contractors, breakers, and other electrical components that keep the machinery running safely and reliably. NAI can manufacture whatever control panel your business requires.

Use Box Builds For Integrated Circuits
ICs are used in virtually everything, from computers to cell phones to home appliances. An integrated circuit (or IC) is the fundamental building block of all modern electronic devices.

An IC is an integrated system of numerous miniaturized and interconnected components embedded into a thin substrate of semiconductor material. ICs allow for faster speeds and greater capacity all while evolving into smaller and smaller sizes. View our full electro-mechanical design capabilities to see how NAI can assist in your next project.

Choose Your Box Build Assembly Cable Assemblies
You can find cables in industries ranging from utilities, Производство, технология, и еще. By working with LST, a custom cable assembly manufacturer, they can help you choose the best cable type, connector options, terminal blocks, insulation materials, и еще. We offer product options for copper, fiber optic, and hybrid cable assemblies.

The Box Build Process

The box build process can vary as much as the design calls for. It is specific to each project. Однако, it typically includes the installation of sub-assemblies and other components, routing of cabling or wire harnesses, and fabrication of enclosures. It is all the assembly work involved in an electromechanical system complete with moving parts and sub-assemblies.

The most common box build assembly process also includes configuration and testing, as well as warehousing and shipping. You provide the drawings or the device for your CM to reverse engineer, and they do the rest. This is why it is imperative to choose the right electronic manufacturer.

Benefits of Using box build assembly service

Using a box build assembly approach offers several benefits, especially when compared to assembling products using separate components or in-house manufacturing. The key benefits include:

Simplified Supply Chain Management

One big advantage of box build assembly is streamlining your supply chain. Instead of managing a bunch of different vendors sending you individual components and subassemblies, you’re sourcing a complete, ready-to-go product from just one supplier.

Save Time and Money

Outsourcing box build assembly streamlines production and reduces costs. Instead of handling multiple vendors, сборка, тестирование, and quality control processes separately, you streamline these activities by relying on a single provider.

Expertise and Specialization

Rather than trying to master the many intricate assembly and test processes yourself, you can lean on the assembler’s seasoned knowledge. Take advantage of the skills they’ve perfected over years of box build production. Their engineering teams have tons of experience to ensure a high-quality end product.

Ensure Quality

Reputable box build assembly providers maintain strict quality control. This can result in a higher-quality final product since the provider focuses on consistent assembly and thorough testing.

Scalability

A great advantage of using a box build assembler is their flexibility to scale production up and down. For both small prototype batches or massive production runs, reputable assemblers have the capabilities to manufacture any number you need. With extensive facilities, advanced equipment, and skilled staff, they can handle any quantity of box build assembly. They can easily adapt to produce exactly the volume you need when you need.

If you are looking for a box assembly manufacturer, LST is a very good choice. У нас больше, чем 10 years of experience in electronic manufacturing. We have a very professional technical team that can quickly and efficiently start your box building manufacturing business. Contact us and get the offer for free.

Design analysis of PCB power supply system

10/09/2023 в /от

Сегодня, it is difficult to successfully design high-speed electronic systems without a thorough understanding of the power supply system characteristics of the chip, package structure and PCB. Фактически, in order to meet the requirements of lower supply voltages, faster signal flip-flops, higher integration, and many more challenging requirements, many companies at the forefront of electronic design have invested a lot of money, manpower, and resources in the analysis of power supply systems to ensure the integrity of power supplies and signals during the product design process.

Power supply system (PDS) analysis and design is becoming increasingly important in the field of high-speed circuit design, especially in the computer, полупроводник, коммуникации, networking and consumer electronics industries. With the inevitable further isotropic shrinkage of ultra-large-scale integrated circuit technology, the supply voltage of integrated circuits will continue to decrease. As more and more manufacturers move from 130nm technology to 90nm technology, it is expected that the supply voltage will drop to 1.2V or even lower, while at the same time the current will increase significantly. From DC IR voltage drop to AC dynamic voltage fluctuation control, this development trend poses a great challenge to the design of power supply systems as the allowable noise range becomes smaller and smaller.

The design of PCB power supply system mainly involves the following aspects:

➤ Circuit design: according to the needs of the equipment, design a reasonable power supply circuit. This requires consideration of factors such as circuit stability, efficiency, safety and cost.

➤ Component selection: According to the circuit design, select appropriate components such as resistors, конденсаторы, индукторы, и т. д.. to meet the performance and cost requirements.

➤ Wiring Arrangement: Determine the layout and alignment of components on the circuit board to reduce the internal resistance of the power supply, avoid electromagnetic interference, and improve the reliability of the system.

➤ Heat dissipation design: Considering that the power supply generates heat during operation, it is necessary to design a reasonable heat dissipation scheme to ensure the stability and reliability of the power supply system.

Technical Challenges

In the design of PCB power supply system, the following technical challenges may be encountered:

▲ Circuit stability: The stability of the power supply circuit directly affects the performance of the entire device. Unstable or fluctuating power supply circuits may cause the device to malfunction or not work properly.

▲Component durability: Components in the power supply system may wear out or fail during operation. How to improve the durability and reliability of components is an important issue to be addressed in the design of the power supply system.

▲System anti-interference ability: power supply system in the working process, may be subject to electromagnetic interference from the outside world, how to improve the anti-interference ability of the system in the power supply design, is also an important technical challenge.

Solutions

In response to the above technical challenges, the following are some possible solutions:

〓 Circuit Design Optimisation: Adopt reasonable circuit topology and component layout to improve the stability and efficiency of the power system. Например, power supply circuits that require high stability, mature and stable power supply topologies such as LDOs (Low Noise Linear Regulators) or switching power supplies can be used.

〓 Component Quality Assurance: Select components with reliable and durable quality, and consider factors such as component tolerance and thermal characteristics in the design process. Например, grade X and Y resistors and capacitors are selected to meet the needs of high temperature, high humidity and harsh environments.

〓 wiring arrangement is reasonable: in the circuit board layout and alignment design, the power supply internal resistance and electromagnetic interference should be fully considered. Например, the main power line and ground line should be thickened to reduce internal resistance; в то же время, a reasonable signal line layout and filtering design should be adopted to reduce electromagnetic interference.

〓 heat dissipation design: according to the actual working condition, choose the appropriate heat dissipation scheme. Например, for power modules with large power, active heat dissipation methods such as heat sinks or fans can be used; for power chips with small power, natural heat dissipation can be used.

Заключение

PCB power supply system design is an important part of electronic equipment. In the actual design, we must give full consideration to technical challenges such as circuit stability, component durability and system anti-interference ability, and improve the performance and reliability of the power supply system by optimizing circuit design, ensuring component quality, and rationally arranging wiring and heat dissipation design. In the future electronic equipment, with the continuous progress of technology and the continuous expansion of application scenarios, the design of PCB power supply systems will face more new challenges. Поэтому, we need to constantly update our design concepts and methods to adapt to changing market demand and technology trends.