What is the manufacturing process of ceramic pcb?
/在: PCB technical knowledge /通过: administratorWith the continuous advancement of electronic technology, the market demand for circuit boards with greater robustness, higher reliability, and enhanced performance is on the rise—driving the widespread adoption of ceramic PCB manufacturing technology.
Compared with traditional PCBs that use fiberglass or plastic substrates—which perform adequately in standard applications—these conventional materials often fall short in harsh or high-performance environments. Ceramic PCBs, by contrast, have emerged as the ideal solution for industries with stringent system stability requirements, thanks to their superior thermal conductivity, outstanding structural strength, and exceptional environmental adaptability.
The production of ceramic PCBs involves a series of precise and specialized processes aimed at transforming high-performance ceramic materials into highly reliable electronic substrates. These PCBs are widely used in aerospace, automotive electronics, medical instruments, and telecommunications equipment, playing a vital role in ensuring the durability and overall performance of electronic components.
This article will provide a systematic overview of the ceramic PCB manufacturing process, the key material compositions, and a detailed comparison of their advantages over traditional PCB solutions.
What is a Ceramic PCB?
A ceramic PCB (Ceramic Printed Circuit Board) is a high-performance circuit board that uses ceramic materials as its substrate. It is fabricated by directly bonding copper foil to ceramic bases such as aluminum oxide (Al₂O₃) or aluminum nitride (AlN), offering excellent thermal conductivity, high-frequency electrical performance, and mechanical strength. As a result, ceramic PCBs are widely employed in high-power, high-frequency, and extreme-environment electronic devices.
As a next-generation high-performance electronic carrier, ceramic PCBs excel in thermal conductivity, electrical insulation, high-temperature resistance, and dimensional stability. These properties make them indispensable in demanding fields such as aerospace, military equipment, new energy vehicles, lasers, high-power modules, RF communications, and medical electronics—all of which require exceptional reliability and performance. Compared to traditional FR4 organic materials, ceramic PCBs offer significant advantages in terms of heat dissipation, frequency response, dielectric loss, and mechanical strength.
Types of Ceramic Printed Circuit Boards
Ceramic PCB manufacturing processes allow for the production of several types of ceramic PCBs, each tailored to specific applications. These include:
High-Temperature Co-Fired Ceramic (HTCC)
HTCC ceramic printed circuit boards are produced by integrating conductive layers with ceramic substrates through a high-temperature co-firing process that operates at temperatures above 1600°C. The resulting products offer enhanced integration, mechanical stability, and compatibility with high temperatures and environmental stress. HTCC dielectric substrates are commonly used in aerospace, military, and high-power applications where optimal performance stability under extreme conditions is essential.
Low-Temperature Co-Fired Ceramic (LTCC)
LTCC PCBs are manufactured using a similar co-firing technique but at a lower temperature, typically around 850°C. These boards are ideal for high-frequency signals, such as those used in RF modules and telecommunications equipment. LTCC PCBs meet high electrical standards and are the preferred choice for compact, miniaturized, and high-frequency circuits.
Multilayer Ceramic Printed Circuit Boards
Multilayer ceramic PCBs involve the use of multiple layers of ceramic materials, each containing uniquely printed circuits. These layers are stacked and fused together during the ceramic PCB manufacturing process, resulting in a compact and highly dense final product. Multilayer ceramic PCBs are widely used in microelectronics, medical devices, and satellite communication systems, where both size and performance are critical.

Ceramic PCB Manufacturing Process
Ceramic printed circuit boards are high-performance electronic components characterized by high temperature resistance, high frequency, high voltage, and high reliability. They are widely used in aerospace, military, telecommunications, and other fields. The following outlines the typical manufacturing process of ceramic PCBs.
1. Raw Material Preparation
The performance of ceramic PCBs heavily depends on the purity, particle size distribution, and chemical stability of the ceramic powder substrate. Therefore, the first step is the careful selection and treatment of base materials.
Raw Materials Composition:
Ceramic powders: such as aluminum oxide (Al₂O₃), aluminum nitride (AlN), zirconium oxide (ZrO₂), magnesium oxide (MgO), with purity exceeding 99%;
Organic binders: such as PVA (polyvinyl alcohol), polyethylene glycol, used for temporary binding;
Solvents and additives: used to adjust flowability and film formation, including ethanol, acetone, butanone, dispersants, etc.
Process Flow:
Ceramic raw material selection → ball milling and mixing → vacuum de-airing → drying and granulation → storage for use
Control Focus:
Particle size controlled between 0.5 to 3 μm;
Uniform distribution to prevent sintering defects like porosity or cracking;
Strict control of moisture and impurities to avoid gas bubbles during sintering.
2. Ceramic Slurry Printing or Lamination Molding
The mixed ceramic powder, organic binder, and solvent slurry is printed onto ceramic substrates to form the required circuit patterns and component mounting locations. The forming method varies with different ceramic PCB types:
A. Thick Film/Thin Film Printing (for single-layer ceramic boards):
Ceramic or conductor slurry is printed on the substrate via screen printing or inkjet printing;
Functional patterns like circuits, pads, capacitive layers, and inductive patterns are formed.B. Green Tape Lamination (for LTCC/HTCC):
Ceramic powders are mixed into “green tapes” and laminated via hot pressing to form multilayer structures;
Conductive circuits are printed on each layer, with vias created to establish electrical connections.
Core Equipment:
Automatic screen printers
Precision laminating alignment machines
Vacuum presses / isostatic presses (the latter for complex shapes)
3. Drying and Pre-curing
Printed or laminated substrates are placed in a temperature-controlled oven for low-temperature drying at 80~120°C for 1-2 hours.
This step evaporates solvents in the slurry, enhancing initial pattern stability and preventing defects such as bubbles or delamination during subsequent sintering.
Key Points:
Uniform drying with controlled temperature rise to avoid internal stress buildup;
Conducted in cleanroom or controlled environment to prevent dust contamination.
4. High-Temperature Sintering (Densification)
This is the critical step for ceramic PCB formation.
Sintering Process:
Dried ceramic boards are placed in a high-temperature furnace following a programmed sintering curve;
Temperatures typically range from 1300 to 1650°C;
Sintering duration is 2-4 hours (including heating, soaking, and cooling phases);
Furnace atmosphere can be air, nitrogen, hydrogen, or vacuum depending on ceramic type and metallization method.
Sintering Outcomes:
Ceramic powder grains reorganize, forming a continuous, dense polycrystalline structure;
Final boards achieve target mechanical strength, dimensional stability, thermal conductivity, and electrical insulation.
5. Surface Metallization (Conductive Circuit Formation)
After sintering, ceramic substrates are insulating and require metallization to deposit conductive layers forming the circuit patterns.
Common Metallization Techniques:
Process Name | Principle & Features | Typical Applications |
---|---|---|
DPC (Direct Plated Copper) | Sputtering TiW/Cu seed layer + copper electroplating; high precision (down to 50 μm) | High-frequency, high-density packaging |
DBC (Direct Bonded Copper) | Copper foil bonded to ceramic via high-temperature eutectic reaction; copper thickness up to 800 μm | High-current modules, power devices |
Electroless Ni/Cu/Au Plating | Surface activation followed by chemical deposition of multilayer Ni/Cu/Au | Chip carriers, solder pins |
Screen-Printed Conductive Paste | Sintered silver paste, gold paste, suitable for high-frequency and thick-film circuits | Microwave, radar applications |
6. Soldering and Component Mounting
Following metallization and patterning, electronic components are soldered onto the circuits.
Common Techniques:
Reflow soldering (SMD assembly)
Laser welding, ultrasonic welding (for leads or power pins)
Silver paste sintering (especially suitable for IGBT chip mounting)
Process Features:
Ceramic PCBs withstand high temperatures (>800°C), compatible with various high-temperature soldering methods;
Strong copper-ceramic bonding endows excellent thermal shock resistance and high current capacity.
7. Testing
Completed PCBs undergo rigorous inspections, including:
Electrical Testing: Verify correct circuit connections, no shorts or open circuits, ensuring reliable operation with connected devices.
Thermal Testing: Assess heat conduction and convection performance, crucial for PCBs exposed to high temperatures.
Mechanical Testing: Apply bending, vibration, or other stresses to test mechanical resilience.
Whether used in satellites, electric vehicles, or medical devices, each test is critical to ensure reliable operation of ceramic PCBs in their intended applications.
8. Shaping, Cutting, and Packaging
Shaping:
Mechanical drilling is unsuitable for ceramics; laser processing (UV, CO₂) is employed for drilling, V-cuts, grooves, and vias with precision control.Cleaning and Packaging:
Ultrasonic cleaning with deionized water;
Drying followed by vacuum sealing;
For sensitive products, desiccants and anti-static bags are added.
Conclusion
The manufacturing of ceramic PCBs is a highly complex and precise technological process, capable of producing circuit boards that combine exceptional thermal conductivity, mechanical strength, and electrical performance. From the selection of raw materials to the formation of circuit patterns and final testing, every step is meticulously controlled to ensure outstanding performance and reliability of the finished product.
In fields with stringent demands for durability, heat dissipation efficiency, and electrical stability, ceramic PCBs have become an indispensable solution. From aerospace to medical instruments, from automotive electronics to telecommunications, ceramic-based circuit boards provide a solid foundation for the next generation of high-tech applications. As the demand for high-performance electronic systems continues to rise, ceramic PCBs will play an increasingly critical role in enhancing device reliability and operational efficiency.