Mechanical Impact of PCB Pad Dimension Design on Tombstoning During SMT Reflow Soldering and Optimization Solutions
Tombstoning (Manhattan Effect) is one of the most common failure issues in SMT reflow soldering of miniature surface-mount components such as 0201 and 0402 packages. The core cause is the imbalance of solder joint forces at both ends of the component. This article starts from the principles of mechanics and provides an in-depth analysis of […]






