Introduction to PCB board based on aluminum
The aluminum substrate is a copper metal plate with a good heat dissipation function. Generally, the single-sided panel consists of a three-layer structure, which is composed of circuit layers (copper foil), insulation layers and metal substrates. It is also designed for high-end and is designed as double panels, structures, insulation layers, aluminum-based, insulating layers, and circuit layers. Very few applications are multilayer, which can be composed of ordinary multilayer boards with insulating layers and aluminum.
Aluminum-based PCB structure
PCB aluminum-based copper plate is a metal circuit board material, consisting of copper foil, thermal conductivity insulation layer and metal substrate. Its structure is divided into three layers:
Circuit layer: equivalent to the copper cover plate of ordinary PCB, the wiring thickness of the wiring is 1oz to 10oz.
Insulation layer: The insulation layer is a layer of low heat resistance thermal conductive material. Thickness: 0.003 “to 0.006” inch. It is the core technology of aluminum -based copper plates, and has obtained UL certification.
Base layer: It is a metal substrate, usually aluminum or copper. Aluminum-based copper plates and traditional epoxy glass laminate plates, etc.
The PCB aluminum substrate consists of the circuit layer, thermal conductivity insulating layer, and metal base; the circuit layer (i.e., copper foil) is usually carved to form a printing circuit, so that the components of the component are connected to each other. In general, the circuit layer requires a large load flow. Ability, thicker copper foil should be used, with a thickness of 35 μm ~ 280 μm;
Thermal conductivity is the core technology of PCB aluminum substrate. It is usually composed of a special polymer filled with special ceramics. It has small thermal resistance, excellent viscosity, and has the ability to resist aging and can withstand mechanical and thermal stress. The insulation layer of high-performance PCB aluminum substrates such as IMS-H01, IMS-H02 and LED-0601 uses this technology to make it have extremely excellent thermal conductivity and high-strength electrical insulation performance;
Metal substrates are the supporting components of aluminum substrates. They require high thermal conductivity. They are usually aluminum plates. Copper plates can also be used ( copper plates can provide better thermal conductivity), which is suitable for routine mechanical processing such as drilling, cutting and cutting. PCB materials have unparalleled advantages over other materials. Suitable for power component surface stickers SMT public art. No radiator is required, the volume is greatly reduced, the heat dissipation effect is excellent, good insulation and mechanical properties.
Characteristics of PCB based on aluminum
● The surface of the aluminum -based PCB is adopted by Patch (SMT); the aluminum -based PCB has good heat dissipation operation in the circuit design plan;
● Aluminum-based PCB can reduce temperature, improve product power density and reliability, and extend the service life of the product;
● Aluminum-based PCB can reduce volume, reduce hardware and assembly costs;
● Aluminum-based PCB can replace ceramic substrates and get better mechanical endurance.
Application field of PCB based on aluminum
1. Audio equipment: input-output amplifier, balance amplifier, audio amplifier, front amplifier, power amplifier, etc.
2. Power device: switch regulator, DC/AC converter, switch adjustment, etc.
3. Communication electronic equipment: high frequency compressor, filter, signal transmission circuit.
4.OA equipment: motor drive, etc.
5. Car: electronic speed regulator, ignition device, power controller, etc.
6. Computer: CPU board, soft drive, power equipment, etc.
7. Power module: inverter, solid state relay, rectification bridge, etc.
8. Lighting: PCB proofing, LED lamps also began to apply large-scale applications.
Manufacturing process of PCB based on aluminum
1. Open ingredients
Cut the large material into the size required for production. When opening the material, check the first piece of size, and pay attention to the surface scraping.
The purpose of drilling: Positioning the drilling of the plate to assist in the subsequent production process and customer assembly to provide auxiliary. Pay attention to the number and size of the holes, check the punching of the aluminum surface, and the bias of the hole.
3. dry/wet film imaging
Dry/wet film imaging process: grinding plate -film -exposure -showing
4. acid/alkaline etching
Acid/alkali etching process: etching -retirement -drying -test board. After the dry/wet film imaging is reserved, the required line parts are retained. In addition to the excess parts of the line, you should pay attention to the corrosion of the etching potion on the aluminum substrate during acid etching. Pay attention to erosion, excessive etching, line width and line layout.
5. Welded welding, characters
The purpose of welding and characters in silk printing: protection does not require welding lines to prevent tin from entering the short circuit. Process: Silk Seal -Pre-grill -exposure -showing -character.
6. V-CUT, gong board
V-CUT-Gong Board-Tear Protective Film-Except Piece
① V-CUT: Cut the single PCS line with the entire PNL plate cutting a small part of the convenient packaging and removal and use
② Gong board: remove the excess part of the circuit board
1. Test, OSP process
Line test – resistance test -OSP
2. Test, the purpose of OSP
① line test: test whether the completed line works normally
② Voltage test: Detect whether the complete line can withstand the specified voltage environment
③ OSP: Make the line better tin welding
The above is an introduction to the aluminum PCB. If you have an order for aluminum PCBs, you can email us. Leadsintec is a professional PCB manufacturer that provides PCB solutions for global electronics companies.