

* PCB fabrication from 1-32 layer. (single side, double side, multi-layer, HDI board, bury & blind holes board etc)
* Material procurement and management
* Quick-turn PCBA Prototype and NPI (new product introduction)
* PCBA and through hole assembly
* IC pre-programming & Function verification & burn in testing
* Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
* Small volume is accepted and High-mix models solutions
* AOI, In circuit test, BGA placement
* Engineering support including end of life and obsolete component replacement and design support for circuit, metal,plastic casing and packaging
.
| Surface processing | HASL / Plating gold / immersion gold / Plating gold finger /OSP / Flux |
| Layers | 1~32 layers |
| Copper Thickness | O.5OZ~5OZ |
| Board Thickness | 0.2mm~6.0mm |
| Min Hole Size | 0.2mm |
| Min Line Width | 0.1mm |
| Min Line Spacing | 0.1mm |
| Max Board Size | 508mm*609mm |
| Solder Mask Type | Green / Black / Red / Yellow / White / Blue |
| Silkscreen Color | White/ Yellow/ Black |
| Data File Format | Gerber file and corresponding drilling file, PROTEL series, BOM list |
| Base Material | FR4, CEM3, PTFE, Aluminum based, High TG FR4, High frequency board, Rogers |
Delivery for samples will be 10-15 days after OEM Contact is signed and the Engineering Documents are confirmed.
For Mass production, based on the customer requirements, delivery can be done in several batches (partial delivery).

Smart Bluetooth Light PCB Board Development