Top 8 PCB manufacturing and assembly factory in European 2023 years
Europe has always been an important territory in the PCB marker. It has a huge customer group and has always been a head consumer group in the high -end PCB field. There are also many PCB manufacturers in Europe. This article will introduce the well -known PCB manufacturers in Europe. If you are looking for a PCB manufacturer, you will be helpful to you after reading the article.
1、Leadsintec PCB Factory
This is a PCB manufacturer from China,Factory covers area of 8000 square meters, owing with 10 production lines, of which there 5 high speed Juki machine SMD production line, 2 through hole and 3 assembly line.
Totally there are about 380 employees in our factory. Among them, 18 engineers who have rich experience in PCB and PCBA industry, 32QA who will inspect each production process strictly, 5 PMC to ensure right quantity and quality of incoming materials as well as that production time is kept at optimum level, 6 purchaser to buy and follow-up on purchase orders to ensure that the vendor fulfills the purchase agreement on delivery.
Leadsintec PCB Manufacturing Capability
| Surface processing | HASL / Plating gold / immersion gold / Plating gold finger /OSP / Flux |
| Layers | 1~32 layers |
| Copper Thickness | O.5OZ~5OZ |
| Board Thickness | 0.2mm~6.0mm |
| Min Hole Size | 0.2mm |
| Min Line Width | 0.1mm |
| Min Line Spacing | 0.1mm |
| Max Board Size | 508mm*609mm |
| Solder Mask Type | Green / Black / Red / Yellow / White / Blue |
| Silkscreen Color | White/ Yellow/ Black |
| Data File Format | Gerber file and corresponding drilling file, PROTEL series, BOM list |
| Base Material | FR4, CEM3, PTFE, Aluminum based, High TG FR4, High frequency board, Rogers |
2、AT&S
AT&S is one of the leading PCB manufacturers in Europe, producing high-end prototypes in various fields such as medicine, aviation, and measurement technology. As global IC substrate manufacturers for PCBs in Europe, AT&S produces semiconductor substrates for cameras, phones, computers, and portable music players. AT&S has more than 35 years of experience in the industry and is a trusted supplier for many leading companies.
PCB Manufacturing Capabilities
| Standard Capability | Advanced Capability | |
| Minimum Layer Count | 1 | 1 |
| Maximum Layer Count | 16 | 30 |
| Trace/Space | 0.006″ | 0.002″ |
| Finished Hole Size | 0.010″ | 0.004″ |
| Surface Finishes | HASL, ENIG, Hard Gold, Soft Gold (see all below) | ENEPIG, OSP, EPIG (see all below) |
| Materials | FR-4, High Temp FR-4, Isola, Rogers | PTFE/Duroid, Polyimide, Flex |
| Controlled Impedance | +/- 10% | +/- 5% |
| Annular Ring | 0.006″ | 0.003″ Mechanical, 0.001″ Laser |
| Outer Layers Finished Copper | 1.5 oz to 2 oz | 1 oz to 5 oz |
| Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 4 oz |
| Soldermask Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Silkscreen Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Filled Vias | Non-Conductive Fill | Non-Conductive Fill or Conductive Fill |
| Smallest Mechanical Drill Diameter | 0.010″ | 0.004″ |
| Smallest Laser Drill Diameter | N/A | 0.003″ |
| Blind Vias | No | Yes |
| Buried Vias | No | Yes |
| Aspect Ratio | 10:01 | 15:01 |
| Plated Hole to Copper | 0.008″ | 0.005″ |
| Clearance – Copper to Edge of Board | Outer Layer – 0.010″ | Outer Layer – 0.005″ |
| Inner Layer – 0.015″ | Inner Layer – 0.005″ | |
| Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
| Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
| Plated Slots | Routed | Routed or Nibbled |
| Non-Plated Slots | Routed | Routed or Nibbled |
| Plating in Holes | 0.0008″ | 0.0015″ |
| Web (or Mask Width) | 0.006″ | 0.003″ |
| Soldermask Swell | 0.003″ | 0.001″ |
| Silkscreen Width | 0.003″ | 0.003″ |
| Inspection & Testing Criteria | ||
| IPC Class 2 | Yes | Yes |
| IPC Class 3 | No | Yes |
| Netlist Generation and Netlist Compare | Yes | Yes |
| Trace / Space | ||
| Outer Layers (finished copper) | 1 oz. Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .002″ Trace/Space |
| 2 oz. Cu – Min .008″ Trace/Space | 2 oz. Cu – Min .006″ Trace/Space | |
| 3 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .008″ Trace/Space | |
| 4 oz. Cu – Min .014″ Trace/Space | 4 oz. Cu – Min .012″ Trace/Space | |
| Inner Layers | ||
| 0.3 oz Cu – Min .002″ Trace/Space | 0.5 oz Cu – Min .003″ Trace/Space | |
| 0.5 oz Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .005″ Trace/Space | |
| 1 oz. Cu – Min .006″ Trace/Space | 2 oz. Cu – Min .008″ Trace/Space | |
| 2 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .0012″ Trace/Space | |
| Drilling | ||
| Min drilled diameter, final board thickness 0.031″ or less | 0.008″ | 0.004″ |
| Min drilled diameter, final board thickness between 0.031″ and 0.062″ | 0.010″ | 0.006″ |
| Min drilled diameter, final board thickness between 0.062″ and 0.093″ | 0.012″ | 0.010″ |
| Min drilled diameter, final board thickness between 0.093″ and 0.125″ | 0.015″ | 0.012″ |
| Min laser diameter, dielectric thickness less than or equal to 0.004″ | N/A | 0.003″ |
| Min laser diameter, dielectric thickness between 0.004″ and 0.005″ | N/A | 0.004″ |
| Min laser diameter, dielectric thickness between 0.005″ and 0.007″ | N/A | 0.005″ |
| Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
| Pre-drilled core blind vias | No | Yes |
| Sub-lamination blind vias | No | Yes |
| Build-up technology | No | Up to 4-N-4, Any layer |
| Buried vias | No | Yes |
| Filled vias | Non-Conductive fill | Non-Conductive or Conductive fill |
| Nibbling | No | Yes |
| Largest hole | 0.247″ plated, 0.250″ non-plated | No maximum |
| Slots | Plated or non-plated, routed | Plated or non-plated, routed or nibbled |
| Plating in holes | 0.0008″ | 0.0015″ |
| Plated hole to copper | 0.008″ | 0.005″ |
| Surface Finish | ||
| Hot Air Solder Level (HASL – Lead) | Yes | Yes |
| Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
| Electroless Nickel Immersion Gold (ENIG) | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Hard Gold Fingers with ENIG | Yes | Yes |
| Hard Gold Fingers with HASL | Yes | Yes |
| Electrolytic Soft Gold | Yes | Yes |
| Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
| Organic Surface Protectant (OSP) | Yes | Yes |
| Bare Copper | Yes | Yes |
| Electroless Palladium Immersion Gold (EPIG) | No | Yes |
| Tin Nickel | No | Yes |
| White Tin | Yes | Yes |
| Carbon Ink | No | Yes |
| Soldermask | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Finish/Texture | Semi-gloss, Matte | Semi-gloss, Matte |
| Tented Vias | Yes | Yes |
| Soldermask Plugged Vias | Yes | Yes |
| Soldermask Thickness over Copper | 5 micron to 25 micron | 5 micron to 25 micron |
| Soldermask Web | 5 mil | 3 mil |
| Soldermask Gap to Pad | 4 mil | 2 mil |
| Copper Ring Under Mask-Defined Pad | 3 mil | 1 mil |
| Peelable Soldermask | No | Yes |
| LPI Soldermask | Yes | Yes |
| Dry Film Soldermask | No | Yes |
| Silkscreen | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Minimum Legend Width | 3 mil | 3 mil |
| Space between Silkscreen and Pad | 5 mil | 4 mil |
| Controlled Impedance | ||
| Layers | 0-10 Layers | 0-30 Layers |
| Impedance Tolerance | Single-ended +/- 10% | Single-ended +/- 5% |
| Impedance Tolerance | Differential Pairs +/- 10% | Differential Pairs +/- 5% |
| Impedance Tolerance | Coplanar Waveguide +/- 10% | Coplanar Waveguide +/- 5% |
| TDR Testing | Yes, Included | Yes, Included |
| Board Thickness | ||
| 1-Layer or 2-Layer | Min .015″ | Max .200″ | Min .008″ | Max .250″ |
| 4-Layer | Min .020″ | Max .200″ | Min .015″ | Max .250″ |
| 6-Layer | Min .031″ | Max .200″ | Min .025″ | Max .250″ |
| 8-Layer | Min .047″ | Max .200″ | Min .031″ | Max .250″ |
| 10-Layer | Min .062″ | Max .200″ | Min .040″ | Max .250″ |
| 12-Layer | Min .062″ | Max .200″ | Min .047″ | Max .250″ |
| 14-Layer | Min .062″ | Max .200″ | Min .054″ | Max .250″ |
| 16-Layer | Min .062″ | Max .200″ | Min .062″ | Max .250″ |
| CNC / Routing / Score / Mechanical Rules | ||
| Router Bit Size | 0.078″ | Min 0.021″, Max. 0.078″ |
| Spacing for Tab Rout Array | 0.100″ | |
| Standard V- Score Angle | 30° | 20°, 30°, 45°, 60° |
| V-Score Depth | One third of board thickness (min 0.010″) | |
| Jump Score | No | Yes, overshoot up to 0.35″ |
| Scoring Direction | Vertical and Horizontal | Routed Scoring |
| Bevel Angle | 20, 30, 45, or 60 Degree Gold Finger Bevel | Milling/Offset or Recessed Beveling |
| Countersinks | 60, 82, 90, 100 Degree Countersink ** | 60, 82, 90, 100 Degree Countersink ** |
| Counterbores | Yes | Yes |
| Edge Castellations | No | Castellated Edges Min .040″ |
| Plated Edges | No | Yes |
| Cross Section | Level 1 | Level 1, Level 2, Level 3 |
3、Elvia PCB
Elvia PCB Group (Printed Circuit Boards) whose headquarters are located in Coutances (Normandy, France) is one of the European leaders in the Aerospace, Defence and Railway sectors. The group has five production facilities, each with a specific area of expertise and market position. It has a turnover of close to 50 million euros and 430 employees.
Elvia ’s PCB Manufacturing Capabilities
| Technical index | Mass Batch | Small batch | Sample | |||
| Base Material | FR4 | Normal Tg | Shengyi S1141, KB6160,Huazhen H140（not suitable for lead free process ） | |||
| Middle Tg | For HDI, multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662； | |||||
| High Tg | For thick copper、high layer：SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752； | |||||
| Halogen Free | Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg: SY S1165 | |||||
| High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A； | |||||
| High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | |||||
| High Speed | SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380 | |||||
| Flex Material | Base | Glue-free：Dupont AK XingyangW-type, Panosonic RF-775； | ||||
| Coverlay | SY SF305C、Xingyang Q-type | |||||
| Special PP | No flow PP： VT-447LF，Taiguang 370BL Arlon 49N | |||||
| Ceramic filled adhesive sheet: Rogers4450F | ||||||
| PTFE adhesive sheet： Arlon6700、Taconic FR-27/FR-28 | ||||||
| Double-sided coatingPI： xingyang N-1010TF-mb | ||||||
| Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | |||||
| Special | High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250） | |||||
| High thermal conductivity material：92ML | ||||||
| Pure ceramic material：alumina ceramic、Aluminum nitride ceramics | ||||||
| BT material： Taiwan Nanya NGP-200WT | ||||||
| Layers | FR4 | 24 | 36 | 64 | ||
| Rigid&Flex /（Flex） | 16（12） | 20（12） | 24（16） | |||
| High Frequency Mixed Lamination | 12 | 18 | 24 | |||
| 100% PTFE | 4 | 12 | 18 | |||
| HDI | 2 steps | 3 steps | 4 steps | |||
| Delivery Size | Max(mm) | 460*560 | 460*560 | 550*900 | ||
| (mm) | Min(mm) | 20*20 | 10*10 | 5*10 | ||
| Width / Gap | Inner（mil） | 0.5OZ base copper： 3/3 1.0OZ base copper： 4/4 2.0OZ base copper： 5/6 | ||||
| 3.0OZ base copper： 7/9 4.0OZ base copper： 8/12 5.0OZ base copper： 10/15 | ||||||
| 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 | ||||||
| Outer（mil） | 1/3OZ base copper： 3/3 0.5OZ base copper： 4/4 1.0OZ base copper： 5/5 | |||||
| 2.0OZ base copper： 6/8 3.0OZ base copper： 7/10 4.0OZ base copper： 8/13 | ||||||
| 5.0OZ base copper： 10/16 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 | ||||||
| 12 OZ base copper： 20/28 15 OZ base copper： 24/32 | ||||||
| Line Width Tolerance | ＞5.0 mil | ±20% | ±20% | ±1.0mil | ||
| ≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |||
| Copper Thickness | Inner layer（OZ） | 4 | 6 | 12 | ||
| Out layer（OZ） | 4 | 6 | 15 | |||
| Board thickness（mm） | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | |||
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% | ||
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
| Board thickness/drill bit | 10:01 | 12:01 | 13:01 | |||
| Contour | Bevel edge | 20～60 degree；±5degree | ||||
| Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% | |||
4、NCAB Group
NCAB Group is one of the fastest growing PCB producers, whose focus has from the start, been on customer & market presence. The timeline traces our journey from PCB trader to Integrated PCB Producer.
NCAB Group ’s PCB Manufacturing Capabilities
| No. | Item | Manufacturing Capabilities |
| 1 | Material | FR-4 (Fiberglass) |
| 2 | Number of Layers | 1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers, |
| 10 Layers | ||
| 3 | TG Grade | TG130~140, TG150~160, TG170~180 |
| 4 | Max PCB Size | 1 layer & 2 layers: 1200*300mm or 600*500mm |
| Multi-layers: 600*500mm | ||
| 5 | Min PCB Size | 5mm*5mm |
| 6 | Board Size Tolerance(Outline) | ±0.2mm(CNC routing) |
| ±0.5mm(V-scoring) | ||
| 7 | Surface Finish | HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None |
| 8 | Board Thickness | 1 Layer/2 Layers: 0.2~2.4mm |
| 4 Layers: 0.4~2.4mm | ||
| 6 Layers: 0.8~2.4mm | ||
| 8 Layers: 1.0~2.4mm | ||
| 10 Layers: 1.2~2.4mm | ||
| Note: Customized PCB thickness and Layer stackup are acceptable. | ||
| 9 | Board Thickness Tolerance | Thickness≥1.0mm: ±10% |
| Thickness<1.0mm: ±0.1mm | ||
| Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. | ||
| 10 | Outer Layer Copper Thickness | 1oz/2oz/3oz |
| (35μm/70μm/105μm) | ||
| Note: | ||
| 2oz | ||
| PCB thickness≥1.2mm, | ||
| Via size≥0.25mm, | ||
| Min Track/Spacing≥0.15mm | ||
| 3oz | ||
| PCB thickness≥2.0mm, | ||
| Via size≥0.3mm, | ||
| Min Track/Spacing≥0.2mm | ||
| 11 | Inner Layer Copper Thickness | 1oz/1.5oz |
| (35μm/50μm) | ||
| 12 | Outer layer Min track/spacing | ≥3mil |
| 13 | Inner layer Min track/spacing | ≥4mil |
| 14 | Annual ring size | ≥0.13mm |
| 15 | Grid Line track/spacing | ≥0.2mm |
| 16 | Coil board Line track/spacing | ≥0.2mm |
| 17 | BGA pad size | ≥0.2mm |
| 18 | BGA Distance | ≥0.12mm |
| 19 | Board Outlines | Track to Outline: ≥0.3mm |
| Trace to V-cut line: ≥0.4mm | ||
| 20 | Finished Hole Size Tolerance | ±0.08mm |
| 21 | Finished Hole Diameter(CNC) | 0.2mm~6.3mm |
| 1. PCB Thickness=2.0mm, Min | ||
| hole size is 0.3mm | ||
| 2. PCB Thickness=2.4mm, Min | ||
| hole size is 0.4mm | ||
| 3. Copper Thickness=2OZ, Min | ||
| hole size is 0.25mm | ||
| 4. Copper Thickness=3OZ, Min | ||
| hole size is 0.3mm | ||
| 22 | TH Via Distance | Equipotential: 0.15mm |
| Isoelectric: 0.25mm | ||
| 23 | Plated Slot Size | ≥0.5mm |
| Note: | ||
| L:W=2.5: 1 (Should be 2.5:1 or | ||
| higher. If it is less than this, the holes may be misaligned.) If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of Drilling Layer. | ||
| 24 | Castellated Holes | ≥0.6mm |
| 25 | Non-Plated Holes | ≥0.8mm |
| 26 | NPTH to Copper Line | ≥0.2mm |
| 27 | Soldermask | Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None |
| 28 | Soldermask Thickness | 20~30um |
| 29 | Soldermask Bridge | Green: ≥0.1mm |
| Others: ≥0.15mm | ||
| 30 | Soldermask to soldering pad distance | ≥0.05mm |
| 31 | Silkscreen | White, Black, Yellow, None |
| 32 | Minimum Character Width(Legend) | ≥0.15mm |
| Note: Characters of less than 0.15mm wide will be too narrow to be identifiable. | ||
| 33 | Minimum Character Height (Legend) | ≥0.75mm |
| Note: Characters of less than 0.8mm high will be too small to be recognizable. | ||
| 34 | Character Width to Height Ratio (Legend) | 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio) |
| 35 | Silkscreen to Soldermask Distance | ≥0.1mm |
| 36 | V-cut Line | ≥75mm |
| Note: | ||
| PCB thickness≥0.6mm | ||
| Details refer to right side | ||
| picture | ||
| 37 | V-cut Line Distance | ≥3.5mm |
| 38 | Distance betwen Board to Board | ≥0.8mm |
| 39 | Stamp-hole Width | ≥2.0mm |
| Note: PCB size and thickness are subject to review by PCBGOGO. |
5、KSG PCB
KSG GmbH is one of the Printed Circuit Board market leaders in Europe with a strong focus on technology and innovation. The company has two plants, one located in Gornsdorf, Germany and another in Austria. All products are manufactured exclusively within Europe to ensure the highest quality for their international customer base. At KSG, forward-looking technologies are developed from samples to large-scale production . They strive to continually be at the forefront RF solutions as well as high-current and thermal management issues that may arise.
KSG PCB ’s PCB Manufacturing Capabilities
| ITEM | TECHNICAL PARAMETER |
| LAYERS | 1-60 |
| Max.Board Size | 680mm×1000mm |
| Board Thickness | 0.25-6.0mm 10mil-152.4mil |
| Min. Line Width | 0.075mm 3mil |
| Min Space | 0.075mm 3mil |
| Min Hole Size（Mechanical） | 0.2mm 8mil |
| Min Hole Size （Laser） | 0.10mm 4mil |
| PTH Wall Thickness | ＞0.025mm 1mil |
| PTH Hole Dia Tolerance | ±0.076mm 3mil |
| Non PTH Hole Dia Tolerance | ±0.05mm 2mil |
| Hole Position Deviation | ±0.05mm 2mil |
| Outline Tolerance | ±0.13mm 3mil |
| V-cut | 30°/45°/60° |
| Impedance Control | +/- 7% |
| Fire Resistance | 94V0 |
| Max copper weight(inner) | 6 oz |
| Peel-off Strength | 1.4N/mm |
| Soldermask Abrasion | >7H |
| Solderability Test | 260℃20 second |
| Flammability | 94v0 |
| E-test Voltage | 50-300v |
| Bow/Twist | ≤0.75% |
6、JLCPCB Factory
Founded in 2006, JLCPCB has been at the forefront of the PCB industry. With over 15-year continuous innovation and improvement based on customers’ need, we have been growing fast, and becoming a leading global PCB manufacturer, who provides the rapid production of high-reliability and cost-effective PCBs and creates the best customer experience in the industry.
JLCPCB ’s PCB Manufacturing Capabilities
| Features | Capability | Notes |
| Layer count | 1,2,4,6 layers | The number of copper layers in the board. |
| Controlled Impedance | 4/6 layer, default layer stack-up | Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator |
| Material | FR-4 | FR-4 Standard Tg 130-140/ Tg 155 |
| Dielectric constant | 4.5(double-side PCB) | 7628 structure 4.6 |
| 2313 structure 4.05 | ||
| 2116 structure 4.25 | ||
| Max. Dimension | 400x500mm | The maximum dimension JLCPCB can accept |
| Dimension Tolerance | ±0.2mm | ±0.2mm for CNC routing, and ±0.4mm for V-scoring |
| Board Thickness | 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm | The thickness of finished board. |
| Thickness Tolerance | ± 10% | e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%) |
| ( Thickness≥1.0mm) | ||
| Thickness Tolerance | ± 0.1mm | e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1). |
| ( Thickness<1.0mm) | ||
| Finished Outer Layer Copper | 1 oz/2 oz (35um/75um) | Finished copper weight of outer layer is 1oz or 2oz. |
| Finished Inner Layer Copper | 0.5 oz (17um) | Finished copper weight of inner layer is 0.5oz only. |
7、PCBWay Factory
With more than a decade in the field of PCB prototype and fabrication, we are committed to meeting the needs of our customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requests. As one of the most experienced PCB manufacturers in China, Can provide customers with various types of PCB manufacturing services.
PCBWay ’s PCB Manufacturing Capabilities
| Items | Spec. | |
| Number of Layers | General PCB board | 2-40 |
| Buried IC | yes | |
| HDI（buried and blind vias) | HDI(5+N+5) | |
| staggered and stacked vias | ||
| Materials | FR4(shengyi) | yes |
| High Tg | Tg-220 | |
| EHalongen Free | yes | |
| High Frequency | yes | |
| Maximum board size | 20*35inch(508*889mm) | |
| Board thickness | 0.21-6.0mm | |
| Minimum track line | 2mil-inner 2mil-outer | |
| Minimum Spacing line | 2mil-inner 2mil-outer | |
| Outer layer copper thickness | 7oz | |
| Inner layer copper thickness | 7oz | |
| Min. finished hole size(Mechanical) | 0.15mm | yes |
| Min. finished hole size(laser hole) | 0.076mm | yes |
| Aspect ratio | 12:01 | |
| Solder Mask Types and brand | NAYA(LP_4G) | yes |
| Tamura(TT19G) | yes | |
| TAIYO(PSR2200) | yes | |
| Solder Mask Color | green;blue;red;white;black | yes |
| Impedance Control Tolerance | ±10%,50Ω and below:±5Ω | yes |
| Plug via hole | Min.size can be plugged: | 0.1mm |
| Max.size can be plugged: | 0.7mm | |
| Min. annular ring can be kept | 3mil | |
| Min. distance between the IC pads | 8mil | |
| can keep SM bridge | ||
| Min. SM bridge for green soldermask | 3mil | |
| Min. SM bridge for black soldermask | 4mil | |
| Surface Treatment | HASL | yes |
| ENIG | yes | |
| OSP | yes | |
| LEAD FREE HASL | yes | |
| GOLD PLATING | yes | |
| IMMERSION Ag | yes | |
| IMMERSION Sn | yes | |
| V-Cut | CNC V-cut, degree | 20304560 |
| V-cut by hand, degree | 20304560 | |
| Outline Profile | CNC | |
| Chamfer | The angle typeof the chamfer: | 203045 |
| Min. distance of jumping chamfer: | 5mm | |
| Tolerance of the dimension size | ±0.1mm | |
| Tolerance of the board thickness | 0.21-1.0 | ±0.1 |
| 1.0-2.5 | ±7% | |
| 2.5-6.3 | ±6% | |
| Tolerance of the finished hole size | 0-0.3mm | ±0.08mm |
| 0.31-0.8mm | ±0.08mm | |
| 0.81-1.60mm | ±0.05mm | |
| 1.61-2.49mm | ±0.75mm | |
| 2.5-6.0mm | +0.15/-1mm | |
| >6.0mm | +0.3/-1mm | |
| Certificates(copies are needed) | UL | yes |
| ISO9001 | yes | |
| ISO14000 | yes | |
| ROHS | yes | |
| TS16949 | yes | |
8、ICAPE Group
Since 1999, ICAPE Group has had longtime experience in the production and manufacturing of Printed Circuit Boards and Customized Technical Parts. 3000 customers in more than 70 countries trust the quality and service offered by the Group and remain recurring clients even now.
ICAPE Group ’s PCB Manufacturing Capabilities
| PCB Assembly Capabilities | |
| Lead Time | 2 – 5 Days, 1 – 2 Weeks and Scheduled Deliveries |
| Parts Procurement | Full Turnkey, Partial Turnkey and Kitted/Consigned |
| Assembly Types | Surface Mount (SMT), Thru-hole, Mixed Technology (SMT/Thru-hole), Single and Double Sided SMT/PTH, Large Parts on Both Sides, BGA on Both Sides |
| Board Type | Rigid Boards, Flex Boards and Rigid-Flex Boards |
| Stencils | Laser Cut Stainless Steel and Nano-coating |
| Components | Passive Components Smallest Size 01005, Fine Pitch Components Smallest Size 8 Mils Pitch, Leadless Chip Carriers/BGA, VFBGA, FPGA & DFN, Connectors and Terminals |
| Largest PCB Size | 18” x 20” |
| Smallest PCB Size | 1.2” wide |
| Largest QFP Size | 75 mm x 75 mm |
| BGA Pitch Range | From 0.20 mm to 3 mm |
| Smallest QFP Pitch Range | From 0.20 mm to 3 mm |
| Component packaging | Reels, Cut tape, Tube and Loose Parts |
| Inspection | X-ray Analysis, AOI and Microscope to 20X |
| Solder Type | Leaded and Lead-free/RoHS Compliant |
| Assembly surface mount connectors | Yes |
| Wave Soldering | Yes |
| PCB Finish | SMOBC/HASL, Electrolytic Gold, Electroless Gold, Electroless Silver, Immersion Gold, Immersion Tin and OSP |
| Panelized PCB | Tab Routed, Breakaway Tabs, V-Scored and Routed + V-scored |
| Design File Format | Gerber RS-274X, Eagle and AutoCAD’s DXF, DWG BOM (Bill of Materials) and Pick and Place file (XYRS) |
