Top 8 PCB manufacturing and assembly factory in European 2023 years

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Europe has always been an important territory in the PCB marker. It has a huge customer group and has always been a head consumer group in the high -end PCB field. There are also many PCB manufacturers in Europe. This article will introduce the well -known PCB manufacturers in Europe. If you are looking for a PCB manufacturer, you will be helpful to you after reading the article.

1、Leadsintec PCB Factory
This is a PCB manufacturer from China,Factory covers area of 8000 square meters, owing with 10 production lines, of which there 5 high speed Juki machine SMD production line, 2 through hole and 3 assembly line.

Totally there are about 380 employees in our factory. Among them, 18 engineers who have rich experience in PCB and PCBA industry, 32QA who will inspect each production process strictly, 5 PMC to ensure right quantity and quality of incoming materials as well as that production time is kept at optimum level, 6 purchaser to buy and follow-up on purchase orders to ensure that the vendor fulfills the purchase agreement on delivery.

Leadsintec PCB Manufacturing Capability

Surface processing HASL / Plating gold / immersion gold / Plating gold finger /OSP / Flux
Layers 1~32 layers
Copper Thickness O.5OZ~5OZ
Board Thickness 0.2mm~6.0mm
Min Hole Size 0.2mm
Min Line Width 0.1mm
Min Line Spacing 0.1mm
Max Board Size 508mm*609mm
Solder Mask Type Green / Black / Red / Yellow / White / Blue
Silkscreen Color White/ Yellow/ Black
Data File Format Gerber file and corresponding drilling file, PROTEL series, BOM list
Base Material FR4, CEM3, PTFE, Aluminum based, High TG FR4, High frequency board, Rogers

2、AT&S
AT&S is one of the leading PCB manufacturers in Europe, producing high-end prototypes in various fields such as medicine, aviation, and measurement technology. As global IC substrate manufacturers for PCBs in Europe, AT&S produces semiconductor substrates for cameras, phones, computers, and portable music players. AT&S has more than 35 years of experience in the industry and is a trusted supplier for many leading companies.

PCB Manufacturing Capabilities

Standard Capability Advanced Capability
Minimum Layer Count 1 1
Maximum Layer Count 16 30
Trace/Space 0.006″ 0.002″
Finished Hole Size 0.010″ 0.004″
Surface Finishes HASL, ENIG, Hard Gold, Soft Gold (see all below) ENEPIG, OSP, EPIG (see all below)
Materials FR-4, High Temp FR-4, Isola, Rogers PTFE/Duroid, Polyimide, Flex
Controlled Impedance +/- 10% +/- 5%
Annular Ring 0.006″ 0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper 1.5 oz to 2 oz 1 oz to 5 oz
Inner Layers Finished Copper 0.5 oz to 2 oz 0.3 oz to 4 oz
Soldermask Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Silkscreen Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Filled Vias Non-Conductive Fill Non-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter 0.010″ 0.004″
Smallest Laser Drill Diameter N/A 0.003″
Blind Vias No Yes
Buried Vias No Yes
Aspect Ratio 10:01 15:01
Plated Hole to Copper 0.008″ 0.005″
Clearance – Copper to Edge of Board Outer Layer – 0.010″ Outer Layer – 0.005″
Inner Layer – 0.015″ Inner Layer – 0.005″
Minimum Panel Size 9″ x 12″ 8″ x 8″
Maximum Panel Size 18″ x 24″ 24″ x 36″
Plated Slots Routed Routed or Nibbled
Non-Plated Slots Routed Routed or Nibbled
Plating in Holes 0.0008″ 0.0015″
Web (or Mask Width) 0.006″ 0.003″
Soldermask Swell 0.003″ 0.001″
Silkscreen Width 0.003″ 0.003″
Inspection & Testing Criteria
IPC Class 2 Yes Yes
IPC Class 3 No Yes
Netlist Generation and Netlist Compare Yes Yes
Trace / Space
Outer Layers (finished copper) 1 oz. Cu – Min .005″ Trace/Space 1 oz. Cu – Min .002″ Trace/Space
2 oz. Cu – Min .008″ Trace/Space 2 oz. Cu – Min .006″ Trace/Space
3 oz. Cu – Min .012″ Trace/Space 3 oz. Cu – Min .008″ Trace/Space
4 oz. Cu – Min .014″ Trace/Space 4 oz. Cu – Min .012″ Trace/Space
Inner Layers
0.3 oz Cu – Min .002″ Trace/Space 0.5 oz Cu – Min .003″ Trace/Space
0.5 oz Cu – Min .005″ Trace/Space 1 oz. Cu – Min .005″ Trace/Space
1 oz. Cu – Min .006″ Trace/Space 2 oz. Cu – Min .008″ Trace/Space
2 oz. Cu – Min .012″ Trace/Space 3 oz. Cu – Min .0012″ Trace/Space
Drilling
Min drilled diameter, final board thickness 0.031″ or less 0.008″ 0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″ 0.010″ 0.006″
Min drilled diameter, final board thickness between 0.062″ and 0.093″ 0.012″ 0.010″
Min drilled diameter, final board thickness between 0.093″ and 0.125″ 0.015″ 0.012″
Min laser diameter, dielectric thickness less than or equal to 0.004″ N/A 0.003″
Min laser diameter, dielectric thickness between 0.004″ and 0.005″ N/A 0.004″
Min laser diameter, dielectric thickness between 0.005″ and 0.007″ N/A 0.005″
Controlled depth blind vias No Yes, max 0.75:1 aspect ratio
Pre-drilled core blind vias No Yes
Sub-lamination blind vias No Yes
Build-up technology No Up to 4-N-4, Any layer
Buried vias No Yes
Filled vias Non-Conductive fill Non-Conductive or Conductive fill
Nibbling No Yes
Largest hole 0.247″ plated, 0.250″ non-plated No maximum
Slots Plated or non-plated, routed Plated or non-plated, routed or nibbled
Plating in holes 0.0008″ 0.0015″
Plated hole to copper 0.008″ 0.005″
Surface Finish
Hot Air Solder Level (HASL – Lead) Yes Yes
Hot Air Solder Level (HASL – Lead-Free) Yes Yes
Electroless Nickel Immersion Gold (ENIG) Yes Yes
Immersion Silver Yes Yes
Hard Gold Fingers with ENIG Yes Yes
Hard Gold Fingers with HASL Yes Yes
Electrolytic Soft Gold Yes Yes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) No Yes
Organic Surface Protectant (OSP) Yes Yes
Bare Copper Yes Yes
Electroless Palladium Immersion Gold (EPIG) No Yes
Tin Nickel No Yes
White Tin Yes Yes
Carbon Ink No Yes
Soldermask
Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Finish/Texture Semi-gloss, Matte Semi-gloss, Matte
Tented Vias Yes Yes
Soldermask Plugged Vias Yes Yes
Soldermask Thickness over Copper 5 micron to 25 micron 5 micron to 25 micron
Soldermask Web 5 mil 3 mil
Soldermask Gap to Pad 4 mil 2 mil
Copper Ring Under Mask-Defined Pad 3 mil 1 mil
Peelable Soldermask No Yes
LPI Soldermask Yes Yes
Dry Film Soldermask No Yes
Silkscreen
Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Minimum Legend Width 3 mil 3 mil
Space between Silkscreen and Pad 5 mil 4 mil
Controlled Impedance
Layers 0-10 Layers 0-30 Layers
Impedance Tolerance Single-ended +/- 10% Single-ended +/- 5%
Impedance Tolerance Differential Pairs +/- 10% Differential Pairs +/- 5%
Impedance Tolerance Coplanar Waveguide +/- 10% Coplanar Waveguide +/- 5%
TDR Testing Yes, Included Yes, Included
Board Thickness
1-Layer or 2-Layer Min .015″ | Max .200″ Min .008″ | Max .250″
4-Layer Min .020″ | Max .200″ Min .015″ | Max .250″
6-Layer Min .031″ | Max .200″ Min .025″ | Max .250″
8-Layer Min .047″ | Max .200″ Min .031″ | Max .250″
10-Layer Min .062″ | Max .200″ Min .040″ | Max .250″
12-Layer Min .062″ | Max .200″ Min .047″ | Max .250″
14-Layer Min .062″ | Max .200″ Min .054″ | Max .250″
16-Layer Min .062″ | Max .200″ Min .062″ | Max .250″
CNC / Routing / Score / Mechanical Rules
Router Bit Size 0.078″ Min 0.021″, Max. 0.078″
Spacing for Tab Rout Array 0.100″
Standard V- Score Angle 30° 20°, 30°, 45°, 60°
V-Score Depth One third of board thickness (min 0.010″)
Jump Score No Yes, overshoot up to 0.35″
Scoring Direction Vertical and Horizontal Routed Scoring
Bevel Angle 20, 30, 45, or 60 Degree Gold Finger Bevel Milling/Offset or Recessed Beveling
Countersinks 60, 82, 90, 100 Degree Countersink ** 60, 82, 90, 100 Degree Countersink **
Counterbores Yes Yes
Edge Castellations No Castellated Edges Min .040″
Plated Edges No Yes
Cross Section Level 1 Level 1, Level 2, Level 3

3、Elvia PCB
Elvia PCB Group (Printed Circuit Boards) whose headquarters are located in Coutances (Normandy, France) is one of the European leaders in the Aerospace, Defence and Railway sectors. The group has five production facilities, each with a specific area of expertise and market position. It has a turnover of close to 50 million euros and 430 employees.

Elvia ’s PCB Manufacturing Capabilities

Technical index Mass Batch Small batch Sample
Base Material FR4 Normal Tg Shengyi S1141, KB6160,Huazhen H140（not suitable for lead free process ）
Middle Tg For HDI, multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662；
High Tg For thick copper、high layer：SY S1000-2;  ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752；
Halogen Free Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg:  SY S1165
High CTI CTI≥600 SY S1600、Huazheng H1600HF、H1600A；
High Frequency Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000
High Speed SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380
Flex Material Base Glue-free：Dupont AK  XingyangW-type, Panosonic RF-775；
Coverlay SY SF305C、Xingyang Q-type
Special PP No flow PP：       VT-447LF，Taiguang 370BL   Arlon 49N
Ceramic filled adhesive sheet:   Rogers4450F
PTFE adhesive sheet：    Arlon6700、Taconic FR-27/FR-28
Double-sided coatingPI：  xingyang N-1010TF-mb
Metal Base Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase
Special High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250）
High thermal conductivity material：92ML
Pure ceramic material：alumina ceramic、Aluminum nitride ceramics
BT material：   Taiwan Nanya NGP-200WT
Layers FR4 24 36 64
Rigid&Flex /（Flex） 16（12） 20（12） 24（16）
High Frequency Mixed Lamination 12 18 24
100% PTFE 4 12 18
HDI 2 steps 3 steps 4 steps
Delivery Size Max(mm) 460*560 460*560 550*900
(mm) Min(mm) 20*20 10*10 5*10
Width / Gap Inner（mil） 0.5OZ base copper：  3/3      1.0OZ base copper：  4/4     2.0OZ base copper：  5/6
3.0OZ base copper：  7/9      4.0OZ base copper： 8/12     5.0OZ base copper： 10/15
6.0OZ base copper： 12/18     10 OZ base copper： 18/24    12 OZ base copper： 20/28
Outer（mil） 1/3OZ base copper：  3/3     0.5OZ base copper：  4/4     1.0OZ base copper：  5/5
2.0OZ base copper：  6/8     3.0OZ base copper： 7/10     4.0OZ base copper： 8/13
5.0OZ base copper： 10/16    6.0OZ base copper： 12/18    10 OZ base copper： 18/24
12 OZ base copper： 20/28    15 OZ base copper： 24/32
Line Width Tolerance ＞5.0 mil ±20% ±20% ±1.0mil
≤5.0 mil ±1.0mil ±1.0mil ±1.0mil
Copper Thickness Inner layer（OZ） 4 6 12
Out layer（OZ） 4 6 15
Board thickness（mm） 0.5-5.0 0.4-6.5 0.4-11.5
Final Board Thickness ＞1.0 mm ±10% ±8% ±8%
≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
Board thickness/drill bit 10:01 12:01 13:01
Contour Bevel edge 20～60 degree；±5degree
Bow and twist ≤0.75% ≤0.75% ≤0.5%

 

4、NCAB Group

NCAB Group is one of the fastest growing PCB producers, whose focus has from the start, been on customer & market presence. The timeline traces our journey from PCB trader to Integrated PCB Producer.

NCAB Group ’s PCB Manufacturing Capabilities

No. Item Manufacturing Capabilities 
1 Material FR-4 (Fiberglass)
2 Number of Layers 1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers,
10 Layers
3 TG Grade TG130~140, TG150~160, TG170~180
4 Max PCB Size 1 layer & 2 layers: 1200*300mm or 600*500mm
Multi-layers: 600*500mm
5 Min PCB Size 5mm*5mm
6 Board Size Tolerance(Outline) ±0.2mm(CNC routing)
±0.5mm(V-scoring)
7 Surface Finish HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None
8 Board Thickness 1 Layer/2 Layers: 0.2~2.4mm
4 Layers: 0.4~2.4mm
6 Layers: 0.8~2.4mm
8 Layers: 1.0~2.4mm
10 Layers: 1.2~2.4mm
Note: Customized PCB thickness and Layer stackup are acceptable.
9 Board Thickness Tolerance Thickness≥1.0mm: ±10%
Thickness<1.0mm: ±0.1mm
Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
10 Outer Layer Copper Thickness 1oz/2oz/3oz
(35μm/70μm/105μm)
Note:
2oz
PCB thickness≥1.2mm,
Via size≥0.25mm,
Min Track/Spacing≥0.15mm
3oz
PCB thickness≥2.0mm,
Via size≥0.3mm,
Min Track/Spacing≥0.2mm
11 Inner Layer Copper Thickness 1oz/1.5oz
(35μm/50μm)
12 Outer layer Min track/spacing ≥3mil
13 Inner layer Min track/spacing ≥4mil
14 Annual ring size ≥0.13mm
15 Grid Line track/spacing ≥0.2mm
16 Coil board Line track/spacing ≥0.2mm
17 BGA pad size ≥0.2mm
18 BGA Distance ≥0.12mm
19 Board Outlines Track to Outline: ≥0.3mm
Trace to V-cut line: ≥0.4mm
20 Finished Hole Size Tolerance ±0.08mm
21 Finished Hole Diameter(CNC) 0.2mm~6.3mm
1. PCB Thickness=2.0mm, Min
hole size is 0.3mm
2. PCB Thickness=2.4mm, Min
hole size is 0.4mm
3. Copper Thickness=2OZ, Min
hole size is 0.25mm
4. Copper Thickness=3OZ, Min
hole size is 0.3mm
22 TH Via Distance Equipotential: 0.15mm
Isoelectric: 0.25mm
23 Plated Slot Size ≥0.5mm
Note:
L:W=2.5: 1 (Should be 2.5:1 or
higher. If it is less than this, the holes may be misaligned.)  If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of  Drilling Layer.
24 Castellated Holes ≥0.6mm
25 Non-Plated Holes ≥0.8mm
26 NPTH to Copper Line ≥0.2mm
27 Soldermask Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None
28 Soldermask Thickness 20~30um
29 Soldermask Bridge Green: ≥0.1mm
Others: ≥0.15mm
30 Soldermask to soldering pad distance ≥0.05mm
31 Silkscreen White, Black, Yellow, None
32 Minimum Character Width(Legend) ≥0.15mm
Note: Characters of less than 0.15mm wide will be too narrow to be identifiable.
33 Minimum Character Height (Legend) ≥0.75mm
Note: Characters of less than 0.8mm high will be too small to be recognizable.
34 Character Width to Height Ratio (Legend) 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio)
35 Silkscreen to Soldermask Distance ≥0.1mm
36 V-cut Line ≥75mm
Note:
PCB thickness≥0.6mm
Details refer to right side
picture
37 V-cut Line Distance ≥3.5mm
38 Distance betwen Board to Board ≥0.8mm
39 Stamp-hole Width ≥2.0mm
Note: PCB size and thickness are subject to review by PCBGOGO.

 

5、KSG PCB
KSG GmbH is one of the Printed Circuit Board market leaders in Europe with a strong focus on technology and innovation. The company has two plants, one located in Gornsdorf, Germany and another in Austria. All products are manufactured exclusively within Europe to ensure the highest quality for their international customer base. At KSG, forward-looking technologies are developed from samples to large-scale production . They strive to continually be at the forefront RF solutions as well as high-current and thermal management issues that may arise.

KSG PCB ’s PCB Manufacturing Capabilities

ITEM TECHNICAL PARAMETER
LAYERS 1-60
Max.Board Size 680mm×1000mm
Board Thickness 0.25-6.0mm 10mil-152.4mil
Min. Line Width 0.075mm 3mil
Min Space 0.075mm 3mil
Min Hole Size（Mechanical） 0.2mm 8mil
Min Hole Size （Laser） 0.10mm 4mil
PTH Wall Thickness ＞0.025mm 1mil
PTH Hole Dia Tolerance ±0.076mm 3mil
Non PTH Hole Dia Tolerance ±0.05mm 2mil
Hole Position Deviation ±0.05mm 2mil
Outline Tolerance ±0.13mm 3mil
V-cut 30°/45°/60°
Impedance Control +/- 7%
Fire Resistance 94V0
Max copper weight(inner) 6 oz
Peel-off Strength 1.4N/mm
Soldermask Abrasion >7H
Solderability Test 260℃20 second
Flammability 94v0
E-test Voltage 50-300v
Bow/Twist           ≤0.75%

6、JLCPCB Factory 
Founded in 2006, JLCPCB has been at the forefront of the PCB industry. With over 15-year continuous innovation and improvement based on customers’ need, we have been growing fast, and becoming a leading global PCB manufacturer, who provides the rapid production of high-reliability and cost-effective PCBs and creates the best customer experience in the industry.

JLCPCB ’s PCB Manufacturing Capabilities

Features Capability Notes
Layer count 1,2,4,6 layers The number of copper layers in the board.
Controlled Impedance 4/6 layer, default layer stack-up Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator
Material FR-4 FR-4 Standard Tg 130-140/ Tg 155
Dielectric constant 4.5(double-side PCB) 7628 structure 4.6
2313 structure 4.05
2116 structure 4.25
Max. Dimension 400x500mm The maximum dimension JLCPCB can accept
Dimension Tolerance ±0.2mm ±0.2mm for CNC routing, and ±0.4mm for V-scoring
Board Thickness 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm The thickness of finished board.
Thickness Tolerance ± 10% e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
( Thickness≥1.0mm)
Thickness Tolerance ± 0.1mm e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
( Thickness<1.0mm)
Finished Outer Layer Copper 1 oz/2 oz (35um/75um) Finished copper weight of outer layer is 1oz or 2oz.
Finished Inner Layer Copper 0.5 oz (17um) Finished copper weight of inner layer is 0.5oz only.

7、PCBWay  Factory 

With more than a decade in the field of PCB prototype and fabrication, we are committed to meeting the needs of our customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requests. As one of the most experienced PCB manufacturers in China, Can provide customers with various types of PCB manufacturing services.

PCBWay ’s PCB Manufacturing Capabilities

Items Spec.
Number of Layers General PCB board 2-40
Buried IC yes
HDI（buried and blind vias) HDI(5+N+5)
staggered and stacked vias
Materials FR4(shengyi) yes
High Tg Tg-220
EHalongen Free yes
High Frequency yes
Maximum board size 20*35inch(508*889mm)
Board thickness 0.21-6.0mm
Minimum track line 2mil-inner 2mil-outer
Minimum Spacing line 2mil-inner 2mil-outer
Outer layer copper thickness 7oz
Inner layer copper thickness 7oz
Min. finished hole size(Mechanical) 0.15mm yes
Min. finished hole size(laser hole) 0.076mm yes
Aspect ratio 12:01
Solder Mask Types and brand NAYA(LP_4G) yes
Tamura(TT19G) yes
TAIYO(PSR2200) yes
Solder Mask Color green;blue;red;white;black yes
Impedance Control Tolerance ±10%,50Ω and below:±5Ω yes
Plug via hole Min.size can be plugged: 0.1mm
Max.size can be plugged: 0.7mm
Min. annular ring can be kept 3mil
Min. distance between the IC pads 8mil
can keep SM bridge
Min. SM bridge for green soldermask 3mil
Min. SM bridge for black soldermask 4mil
Surface Treatment HASL yes
ENIG yes
OSP yes
LEAD FREE HASL yes
GOLD PLATING yes
IMMERSION Ag yes
IMMERSION Sn yes
V-Cut CNC V-cut, degree 20304560
V-cut by hand, degree 20304560
Outline Profile CNC
Chamfer The angle typeof the chamfer: 203045
Min. distance of jumping chamfer: 5mm
Tolerance of the dimension size ±0.1mm
Tolerance of the board thickness 0.21-1.0 ±0.1
1.0-2.5 ±7%
2.5-6.3 ±6%
Tolerance of the finished hole size 0-0.3mm ±0.08mm
0.31-0.8mm ±0.08mm
0.81-1.60mm ±0.05mm
1.61-2.49mm ±0.75mm
2.5-6.0mm +0.15/-1mm
>6.0mm +0.3/-1mm
Certificates(copies are needed) UL yes
ISO9001 yes
ISO14000 yes
ROHS yes
TS16949 yes

 

 

8、ICAPE Group
Since 1999, ICAPE Group has had longtime experience in the production and manufacturing of Printed Circuit Boards and Customized Technical Parts. 3000 customers in more than 70 countries trust the quality and service offered by the Group and remain recurring clients even now.

ICAPE Group ’s PCB Manufacturing Capabilities

PCB Assembly Capabilities
Lead Time 2 – 5 Days, 1 – 2 Weeks and Scheduled Deliveries
Parts Procurement Full Turnkey, Partial Turnkey and Kitted/Consigned
Assembly Types Surface Mount (SMT), Thru-hole, Mixed Technology (SMT/Thru-hole), Single and Double Sided SMT/PTH, Large Parts on Both Sides, BGA on Both Sides
Board Type Rigid Boards,  Flex Boards and Rigid-Flex Boards
Stencils Laser Cut Stainless Steel and Nano-coating
Components Passive Components Smallest Size 01005, Fine Pitch Components Smallest Size 8 Mils Pitch, Leadless Chip Carriers/BGA, VFBGA, FPGA & DFN, Connectors and Terminals
Largest PCB Size 18” x 20”
Smallest PCB Size 1.2” wide
Largest QFP Size 75 mm x 75 mm
BGA Pitch Range From 0.20 mm to 3 mm
Smallest QFP Pitch Range From 0.20 mm to 3 mm
Component packaging Reels, Cut tape, Tube and Loose Parts
Inspection X-ray Analysis, AOI and Microscope to 20X
Solder Type Leaded and Lead-free/RoHS Compliant
Assembly surface mount connectors Yes
Wave Soldering Yes
PCB Finish SMOBC/HASL, Electrolytic Gold, Electroless Gold, Electroless Silver, Immersion Gold, Immersion Tin and OSP
Panelized PCB Tab Routed, Breakaway Tabs, V-Scored and Routed + V-scored
Design File Format Gerber RS-274X, Eagle and AutoCAD’s DXF, DWG BOM (Bill of Materials) and Pick and Place file (XYRS)