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Advantages, Disadvantages and Applications of Aluminum PCB

05/30/2025 在： /通过：

Aluminum PCB, or aluminum substrate, is a type of printed circuit board that uses metallic aluminum as a substrate. Its structure usually includes a circuit layer (copper foil), an insulating layer and a metal base layer, with some high-end products adopting a double-sided or multilayer design. The core advantage of aluminum substrate is its excellent thermal conductivity, which can effectively reduce the operating temperature of electrical appliances and improve working efficiency and product life. In addition, it has good insulation, mechanical strength and stability, and small dimensional changes, which can replace fragile ceramic substrates and reduce the need for heat sinks, thus lowering costs.

Advantages of Aluminum-based PCBs

Aluminum-based PCBs offer a variety of features and advantages that allow them to be used in a wide range of different electronic devices:

Lightweight Design

One of the primary considerations for electronic device manufacturers when choosing a PCB is its lightweight. Aluminum-based PCBs are lighter in weight, which not only helps to reduce the overall weight of the electronic device, but also makes the device more compact, in line with the modern trend of miniaturization of equipment. Because of this, aluminum-based PCBs have become the preferred choice for lightweighting solutions for many electronic products.

Superior Heat Dissipation

Thermal performance is an important factor that every PCB must consider. Electronic components inevitably generate heat when working, and some components have higher heat and greater heat dissipation needs. The heat dissipation effect of aluminum-based PCBs is significantly better than that of metal-core PCBs made of other materials, which helps to maintain the stable operation of equipment. Therefore, choosing aluminum-based PCBs can bring better heat dissipation experience.

Durable

Stability and durability are equally important when evaluating PCB materials. If the PCB itself is not durable, the lifespan of the entire device will be affected. Aluminum has excellent durability and the ability to maintain good performance over time, making it ideal for devices that run for long periods of time. Because of this, aluminum-based PCBs are widely considered to be a reliable manufacturing choice.

Aluminum PCB

Aluminum PCB

Environmental Advantages

With the growing awareness of environmental protection, choosing environmentally friendly materials has become an important responsibility of the manufacturing industry. Aluminum, as a green material, is non-toxic and environmentally friendly, and its manufacturing and assembly processes are also more environmentally friendly. Adopting aluminum-based PCBs not only helps reduce the impact on the environment, but is also a smart move in line with the concept of sustainable development.

Cost-effective

From an economic point of view, aluminum-based PCBs are more cost-effective to manufacture. Aluminum materials are abundant and reasonably priced in the marketplace, making them relatively inexpensive to manufacture. Aluminum-based PCBs are the ideal economic solution for manufacturers with limited budgets who want to get the most out of the best cost.

Disadvantages of Aluminum-based PCBs

Despite the many advantages of aluminum-based PCBs, there are some shortcomings in their use that require attention during selection. The main limitations are shown below:

Limited double-layer design

Compared with traditional PCBs, aluminum-based PCBs are usually unable to achieve a double-layer structure. Most of the current aluminum-based PCB is mainly used for single-sided wiring, the manufacture of double-sided or multi-layer structure will face the problem of process difficulty and high cost. This is a limitation that needs to be overcome in the manufacturing process of aluminum-based PCBs.

Small-scale defects

Although aluminum-based PCBs perform well in terms of performance and functionality, some small-scale electrical strength or mechanical stress issues may still occur in practice. These potential defects mean that Aluminum-based PCBs still need to be further optimized and improved under specific application conditions.

Structural Composition of Aluminum-Based PCBs

Aluminum-based PCBs are typically composed of three distinct layers, and the functions and properties of each layer are described below:

Aluminum PCB structure

Aluminum PCB structure

Conductive Copper Layer
This layer is first etched to form the circuit pattern. The thickness of the copper layer is usually similar to that of a conventional FR-4 sheet and is made from electrolytic copper foil. This layer of copper provides excellent conductivity to the circuit and can effectively carry higher currents to ensure overall stable performance.

Insulating Layer
Immediately below the copper layer is the dielectric layer, which is the key to heat dissipation and electrical isolation. The thermal performance of aluminum-based PCBs is largely dependent on the thermal conductivity of the layer. The more evenly distributed the insulating layer is, the more ideal the heat dissipation effect will be, which can help keep electronic components running at low temperatures. Its precision is critical to the overall durability of the PCB.

Metal Substrate Layer
The bottom layer is the metal substrate, with aluminum being the most common material choice. The material of the substrate depends on the application requirements. Aluminum is a commonly used metal due to its good price/performance ratio and excellent heat dissipation performance. Aluminum substrates are available in a variety of models, such as 5052, 6061, 1060, etc., to meet diverse application requirements.

Applications of Aluminum Printed Circuit Boards

Most of the PCB assembly manufacturers prefer to opt for aluminum PCB assembly as it is suitable for various applications. Some of the applications of aluminum PCB are as follows.

1. LED Lighting Industry
Application Scenario: LED lamps (e.g. street lights, indoor lighting, automobile headlights) generate a lot of heat due to high power density and need to dissipate heat quickly to ensure luminous efficacy and longevity.
Advantage:
Thermal conductivity: aluminum substrate thermal conductivity up to 1.0~2.0 W/(m-K), far more than the traditional FR-4 material (0.3 W/(m-K)), effectively reduce the LED junction temperature.

2. Power electronic equipment
Application Scenario: Switching power supply, inverter, DC/DC converter and other equipment that need to withstand high current and high temperature.
Advantage:
Heat dissipation and volume optimization: Aluminum substrates can replace heat sinks and reduce product volume by more than 30%.

3. Automotive Electronics
Application Scenario: Engine Control Unit (ECU), Motor Drive Module, Battery Management System (BMS), etc.
Advantage:
High temperature and vibration resistance: Aluminum substrate can work stably in -40℃ to 150℃ environment, bending strength >200MPa.

4. Industrial control and automation
Application scenarios: programmable logic controllers (PLC), industrial robots, sensors, etc.
Advantage:
High reliability: Aluminum substrate is corrosion resistant (passed salt spray test >3000 hours), adapting to harsh industrial environments.

5. Communication equipment
Application scenarios: 5G base stations, routers, optical modules, etc. requiring high stability circuit boards.
Advantage:
Low thermal resistance and low loss: aluminum substrate thermal resistance <0.2℃/W, dielectric loss <0.02, to protect signal integrity.

6. Medical equipment
Application Scenario: Surgical shadowless lamps, imaging equipment (such as CT, MRI), high-precision instruments and so on.
Advantage:
Environmental protection and safety: RoHS compliant, lead-free design to guarantee medical safety.

leadsintec: Trusted Aluminum PCB Manufacturer

While choosing the right PCB material is crucial, what is also not to be overlooked is finding a trustworthy PCB manufacturer. In China, we are considered a leading PCB assembly manufacturer in the electronic printed circuit board industry, able to provide aluminum-based PCBs with excellent performance.

What’s more, you have every option to work with us to ensure that your PCB application solutions are always up to scratch. We always focus on the needs of our customers and tailor-make the most suitable aluminum-based PCB solutions after in-depth communication and detailed analysis.

We focus on high quality standards, the reliability of the soldering inside the PCB and cost-effectiveness. This enables us to provide our customers with long-lasting PCB products that maintain excellent heat dissipation even in high-temperature environments and continue to safeguard the operation of their equipment.

What are the processes of electric vehicle PCB assembly?

05/27/2025 在： /通过：

In the automotive intelligence, electrification process accelerated today, automotive electronic circuit boards PCBA as the core carrier of the automotive electronic system, the processing process is precise and complex, any one of the links are related to the performance, reliability and safety of automotive electronic equipment. This article we will give you a detailed introduction to the electric car pcba assembly process, all-round control of the quality of electric car pcba.

The role of pcb in electric vehicles

PCB is the backbone of electronic equipment, providing a physical platform for installing and interconnecting various electronic components. In electric vehicles, pcb has a wide range of uses, including.

Battery Management System (BMS):The BMS monitors and manages the state of the battery to ensure optimal performance and safety. The system contains complex circuitry that requires high quality PCBs to efficiently handle power and data signals.
Power electronics: These include inverters, converters and chargers that manage the current between the battery and the motor. High-performance PCBs are essential to handle high currents and voltages.
Infotainment Systems:Modern electric vehicles are equipped with advanced infotainment systems that provide navigation, entertainment and connectivity. These systems rely on PCBs to seamlessly integrate various functions.
Advanced Driver Assistance Systems (ADAS): Technologies such as adaptive cruise control, lane keeping assist and collision avoidance require reliable PCBs to process data from sensors and cameras in real time.

Electric Vehicle PCBA Assembly Process

Raw material preparation

Circuit board substrate procurement: first of all, according to the specific needs of automotive electronics, select the appropriate circuit board substrate materials. In view of the harsh environment inside the car, large temperature changes, strong vibration and electromagnetic interference, usually with high heat resistance, high mechanical strength, good electromagnetic compatibility of the substrate, such as special modified FR-4 board or high-performance flexible board. These substrates should meet strict industry standards to ensure stable operation under complex working conditions.

Selection and procurement of electronic components: According to the design of the automotive electronic circuit, we accurately screen all kinds of electronic components, including resistors, capacitors, inductors, chips, etc. The quality of the components directly determines the quality of the PC. The quality of the components directly determines the quality of the PCBA, so we must use products that meet the automotive-grade standards, with high reliability, wide temperature range adaptability and other characteristics. Purchased components need to undergo strict factory inspection to check the integrity of the appearance, the accuracy of the electrical parameters, to prevent defective products from entering the production line.

SMT Processing

Solder Paste Printing: Solder paste is printed onto the circuit board pads through high-precision stencils to ensure sufficient quantity and accuracy to avoid soldering defects. The stencil is laser cut or etched, and different pads correspond to different mesh holes in order to meet the packaging requirements of the components.

SMD: The components are quickly and accurately mounted onto the pads using high-precision mounting machines to ensure that tiny components such as 0201, BGA chips, etc. are accurately aligned and pasted with solder paste.

Reflow Soldering: After the placement is completed, the temperature profile is precisely controlled through a multi-temperature zone reflow oven to ensure that the solder paste melts and solidifies uniformly, forming a high-quality solder joint, avoiding damage to components, and ensuring the reliability of the soldering.

THT Insert Processing (if required)

Some of the automotive electronics PCBA also involves through-hole technology (THT) processing link. For some larger power, high mechanical strength requirements or not applicable to SMT components, such as large electrolytic capacitors, relays, etc., need to use THT technology.

Insertion: Workers will insert the pins of the components into the pre-drilled holes in the circuit board, requiring the insertion of the right depth, straight pins, to ensure a good connection with the circuit board and the inner layer of the line. This process requires manual operation combined with auxiliary tooling to ensure the accuracy and consistency of the plug-in.

Wave soldering: After the plug-in is completed, the wave soldering equipment is utilized for soldering. Liquid solder to form a wave-like shape, the circuit board from the wave through the peak, so that the component pins and circuit board pads are fully infiltrated welding. The key to wave soldering is to control the solder temperature, wave height and soldering speed to ensure that the solder joints are full, no false soldering, while avoiding short circuits and other problems caused by too much solder.

Inspection and debugging

Appearance Inspection: Comprehensively inspect the PCBA appearance, check the missing components, offset, damage and defective solder joints and other issues, with the help of magnifying glass and other tools to ensure the quality of the appearance, to avoid potential safety hazards.

Electrical performance test: use professional equipment to test the PCBA electrical parameters, to confirm that the circuit connectivity, power module output and signal integrity in line with the design requirements.

Functional test: simulate the actual automotive environment, verify the actual working performance of PCBA through the test tooling to ensure its stable and reliable performance under various working conditions.

Three-proof processing

Considering the complexity of the automobile driving environment, automobile electronic PCBAs usually need three-proof (moisture-proof, mildew-proof, salt spray-proof) treatment. Special three-proof paint is used to form a protective film on the surface of PCBA by spraying, dipping or brushing to isolate the external moisture, mold, salt spray and other unfavorable factors and prolong the service life of PCBA.

EV PCB assembly

PCB Manufacturing and Assembly Considerations for Electric Vehicles

Thermal Management: The power electronics in electric vehicles generate a lot of heat. To prevent overheating, manufacturers need to use high thermal conductivity materials (e.g. copper, aluminum substrates) and advanced cooling technologies (heat sinks, hot channels, liquid cooling, etc.), and manage the coefficients of thermal expansion between different materials to avoid damages triggered by temperature changes.

High reliability: EVs are often exposed to harsh environments such as vibration, temperature differences, moisture and dust, and PCBs must be highly reliable and durable. Manufacturers need to follow IPC standards (e.g. IPC-A-600, IPC-A-610) and take protective measures such as conformal coating and encapsulation, and perform rigorous testing (temperature cycling, vibration, humidity, etc.) to ensure quality.

Miniaturization: PCBs are becoming increasingly miniaturized to fit compact vehicle designs, using HDI technology for microfabrication and multilayer stacking. Precision assembly and 3D PCB design software ensure compact layouts and stable signal and power distribution.

High power density: The high power requirements of electric vehicles require PCBs that support high currents, using thick copper layers and wide alignments to ensure stability and minimize losses in the power layer. Effective grounding, shielding, insulation and safe distance design are also critical to ensure safety and EMI suppression.

Cost and Scalability: While pursuing high performance, manufacturers need to control costs and increase production flexibility. Automated production (e.g., AOI, SMT) can reduce labor costs and improve consistency. However, there is still a need to balance innovation, cost and scale in the context of rapidly evolving technology.

Compliance with industry standards: Manufacturers must follow industry standards such as ISO 16750, IPC, and others to ensure that PCBs meet requirements for safety and performance. Compliance requires complete documentation, validation and process adjustments to adapt to changing regulations.

The Future of PCB Assembly for Electric Vehicles

The future of EV PCB assembly is bright, and the following trends are driving change in the industry:

Convergence of AI and IoT: As Artificial Intelligence (AI) and the Internet of Things (IoT) are increasingly used in EVs, the demand for high-performance PCBs increases. These advanced technologies require powerful processing and connectivity capabilities, driving the continued evolution of PCB design and assembly towards greater integration and intelligence.

Sustainable Manufacturing: Sustainability is increasingly in the spotlight, and environmentally friendly PCB manufacturing processes are gaining more attention. Lead-free soldering, recyclable substrates, and energy-efficient production processes are all important initiatives to promote green manufacturing.

Growing demand for customization: The increasing diversity of electric vehicle models and features is increasing the demand for customized PCBs. Manufacturers need to provide flexible and customized solutions to meet the specialized requirements of different platforms and application scenarios.

Collaboration and standardization: Collaboration between OEMs, electronics manufacturers and industry standards organizations is driving standardization in PCB design and production. Standardization helps streamline production processes and ensures interconnectivity and compatibility between systems.

leadsintec’s excellent pcba partner for automotive electronics

LST specializes in automotive electronic circuit board PCBA processing field, with advanced production equipment, from high-precision solder paste printing machine, top-class mounter to precision reflow oven, professional testing instruments, to ensure that each processing step can meet the automotive quality standards. The company’s technical team is experienced and familiar with the automotive electronics industry specifications, providing one-stop PCBA processing services. At the same time, strict quality control system throughout the production process, through multiple rounds of testing and debugging, to ensure the delivery of each piece of automotive electronics PCBA has a high degree of reliability, for the booming development of the automotive industry escort.

What is EMS Partner

05/22/2025 在： /通过：

Industry 4.0 is profoundly reshaping the way products are designed, manufactured and delivered. Electronic Manufacturing Services (EMS) is playing an increasingly strategic role in this wave, providing integrated manufacturing and assembly services for a wide range of electronic components and devices, enabling Original Equipment Manufacturers (OEMs) to focus on their core business of design, innovation and marketing without having to invest huge amounts of money in building their own production lines.

EMS partners, represented by LST, are able to provide OEM customers with efficient manufacturing solutions that enable them to meet the challenges of complex electronics manufacturing while reducing initial capital expenditures and achieving flexible and efficient market response.

What is EMS?

EMS (Electronics Manufacturing Services) is a business model in which a third party provides electronics-related manufacturing services to brand manufacturers or original equipment manufacturers (OEMs), not only providing printed circuit board assembly (PCBA), but also covering the entire manufacturing process, from component sourcing, testing, machine assembly, logistics and distribution to after-sales support. EMS vendors not only provide printed circuit board assembly (PCBA), but may also cover the entire manufacturing process from component procurement, testing, complete machine assembly, logistics and distribution to after-sales support.

What is an EMS Partner?

An EMS Partner is a professional outsourcing service provider that has established an in-depth relationship with brands in the field of Electronic Manufacturing Service (EMS). These partners help brands focus on core R&D and sales, while reducing costs and improving efficiency by providing a full chain of services from product design, manufacturing, supply chain management to logistics and distribution.

EMS Partner Core Services

1.Manufacturing and Supply Chain Management
PCB design and production: Provide one-stop service from PCB design to SMT placement and assembly.
Component Sourcing: Reduce costs through large-scale sourcing and manage supplier network.
Quality control: Implement ISO 9001, IATF 16949 (automotive electronics) and other certification standards to ensure product yield.

2.Logistics and Distribution
International Express Mail Service (EMS): For example, China Post EMS covers 200+ countries and regions, provides services such as insured price, customs clearance on behalf of customers, and exempts fuel surcharge for some routes.
Intelligent warehousing: using RFID technology to achieve full tracking of parcels and optimize sorting efficiency (e.g. Beijing Post EMS shortens distribution time by 30% through automated equipment).

3.Value-added services
After-sales service: support payment collection, 24-hour online customer service and after-sales feedback mechanism.
Customized solutions: adjust the production line according to customers’ needs and support small-lot, multi-variety flexible manufacturing.

EMS Partner Manufacturing

EMS Partner Manufacturing

The working mode of EMS

In the EMS (Electronic Manufacturing Services) model, a strategic partnership is established between the original equipment manufacturer (OEM) and the EMS service provider. the OEM is usually responsible for the design of the product and the development of key performance indicators (KPIs) for the design cycle, while the EMS partner is responsible for the execution of the entire production process. This process, from component sourcing and PCB manufacturing to finished product assembly and functional testing, is completed by the EMS. The service content can be flexibly adjusted according to different projects, covering from small-volume prototyping to large-scale mass production.

The main aspects of EMS services include:

PCB Manufacturing: Producing printed circuit boards (PCBs), which are the core building blocks of electronic devices, to provide the electrical connection basis for the products.

Component Sourcing: Sourcing high quality electronic components from reputable suppliers to ensure product performance and consistency.

PCBA Assembly: Precision soldering of electronic components to circuit boards using methods such as SMT (Surface Mount Technology) and THT (Through Hole Technology).

Prototyping and Testing: Constructing product prototypes and conducting comprehensive testing to verify functional integrity and long-term reliability.

Complete Assembly: Performs “box build”, i.e., integrating the PCBA with the housing, buttons, cables, and other components to form the final product.

Supply Chain Management: Manage the entire logistics chain from raw material procurement to finished product delivery to ensure the optimal balance of lead time and cost.

Design for Manufacturing (DFM) Optimization: Collaborate with OEMs during the product design phase to optimize the structure to improve production efficiency and reduce manufacturing costs.

Industries that can choose EMS Partner Manufacturing

EMS Partner Manufacturing is universally applicable and beneficial to businesses of all sizes and in a variety of industries. From startups to multinational giants, any business can use EMS to optimize their manufacturing processes.

OEM: Original Equipment Manufacturers (OEMs) that design and sell their own branded products EMS providers such as PCI enable OEMs to focus on core competencies such as product development and marketing, while ensuring high quality manufacturing.
ODM: Original Design Manufacturers design and manufacture products that are then labeled and sold by other companies.EMS providers offer ODMs the flexibility to scale up production in response to market demand.
Startups and Small Businesses:These entities often lack the resources to build in-house manufacturing capabilities.EMS partners provide a cost-effective way to bring innovative products to market.
Research Institutions: Research-focused organizations can benefit from EMS expertise to manufacture specialized equipment for technological advancement.

Summary

EMS Partners help brands achieve “asset-light” operations through specialized division of labor, while becoming an indispensable link in the electronics industry chain by leveraging technology, cost and global network advantages. For companies that need to expand rapidly or focus on innovation, choosing EMS Partner is a key strategy to enhance competitiveness.

Choose Leadsintec as your flexible PCB manufacturing partner

05/20/2025 在： /通过：

The manufacturing of flexible printed circuit boards (FPCs) is a multidisciplinary field that integrates material science, precision machining and electronic engineering. Its technological evolution has directly promoted innovation in industries such as consumer electronics, medical equipment, and automotive electronics. Leadsintec is a professional flexible PCB manufacturing and assembly company. We have a professional design and processing team to meet all customer needs. Let’s take a look at our manufacturing capabilities.

Exceptional Flexible PCB Manufacturing Capability

Layer Configurations

LSTPCB offers a wide range of flexible circuit board configurations to meet the diverse demands of various industries for circuit complexity and mechanical flexibility:

  • Single-Layer Flexible PCBs: Our single-sided flexible circuits feature a conductive copper layer on a high-performance flexible dielectric substrate. They are optimized for simple designs, offering excellent bendability and cost efficiency. These lightweight structures ensure electrical reliability while enabling dynamic flexing.

  • Double-Layer Flexible PCBs: This configuration includes two conductive copper layers separated by a polyimide insulating layer, typically interconnected through plated through holes. It allows for increased circuit density without compromising flexibility.

  • Multi-Layer Flexible PCBs: We produce 4-layer flexible PCBs tailored for highly integrated systems such as wearable devices, flexible displays, medical sensing modules, and advanced automotive electronics.

  • Advanced Multi-Layer Designs: LSTPCB can manufacture 6-layer flexible circuits that balance precision signal routing with effective power distribution, ideal for high-performance systems with limited space. Our 8-layer flexible PCBs represent the leading edge of flex circuit technology, offering superior multifunctional integration and compact packaging.

  • Rigid-Flex PCBs: As a UL-certified rigid-flex PCB manufacturer, LSTPCB offers hybrid structures with up to 32 rigid layers and 12 flexible layers. These boards combine the stability of rigid substrates with the bendability of flex layers, making them ideal for complex 3D interconnect designs in aerospace, defense, and premium consumer electronics.

Technical Advantages

Our expertise in flexible PCB manufacturing encompasses the following core capabilities:

  • Fine-Line Processing: We achieve line/space widths as narrow as 25μm on multi-layer flexible materials, with layer-to-layer alignment accuracy within ±50μm.

  • Premium Material Selection: We use high-grade materials such as polyimide and specialty thermoplastics to ensure stability and durability in a wide range of applications.

  • Bend Reliability Design: We account for critical minimum bend radius requirements to enhance product lifespan under dynamic bending conditions.

  • Custom Stack-Up Solutions: From basic single-layer to complex 8-layer configurations, we provide optimized stack-ups tailored to specific application needs.

  • Diverse Surface Finishes: We offer a variety of surface treatments including ENIG (Electroless Nickel Immersion Gold), immersion tin, and others to protect exposed copper and enhance solderability.

Our Manufacturing Capabilities

Item Description
Layer Flexible board: 1-12Layers
Flex-Rigid Board: 2-32Layers
Material

PI, PET, PEN, FR-4,dupont
Stiffeners

FR4, Aluminum, Polyimide, Stainless Steel
Final Thickness Flexible board: 0.002″ – 0.1″ (0.05-2.5mm)
Flexible-rigid board: 0.0024″ – 0.16″ (0.06-4.0mm)
Surface Treatment Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
Max / Min Board Size Min: 0.2″x0.3″ Max: 20.5″x13″
Min Trace
Width / Min Clearance		 Inner: 0.5oz: 4/4mil Outer: 1/3oz-0.5oz: 4/4mil
1oz: 5/5mil 1oz: 5/5mil
2oz: 5/7mil 2oz: 5/7mil
Min Hole Ring Inner: 0.5oz: 4mil Outer: 1/3oz-0.5oz: 4mil
1oz: 5mil 1oz: 5mil
2oz: 7mil 2oz: 7mil
Copper Thickness 1/3oz – 2oz
Max / Min Insulation Thickness 2mil/0.5mil (50um/12.7um)
Min Hole Size and Tolerance Min hole: 8mil
Tolerance: PTH±3mil, NPTH±2mil
Min Slot 24mil x 35mil (0.6×0.9mm)
Solder Mask Alignment Tolerance ±3mil
Silkscreen Alignment Tolerance ±6mil
Silkscreen Line Width 5mil
Gold Plating Nickel: 100u” – 200u” Gold: 1u”-4u”
Immersion Nickel / Gold Nickel: 100u” – 200u” Gold: 1u”-5u”
Immersion Silver Silver: 6u” – 12u”
OSP Film: 8u” – 20u”
Test Voltage Testing Fixture: 50-300V
Profile Tolerance of Punch Accurate mould: ±2mil
Ordinary mould: ±4mil
Knife mould: ±8mil
Hand-Cut: ±15mil

Flexible PCB Manufacturing

Flexible PCB Manufacturing Process

At Leadsintec, the flexible PCB manufacturing process consists of a series of sophisticated and tightly controlled steps, forming a precise production chain from raw materials to finished products:

1. Substrate Preparation

  • Material Selection: Polyimide (PI) is the primary substrate material due to its excellent heat resistance (up to 400°C), chemical stability, and mechanical flexibility—suitable for most application scenarios. Liquid Crystal Polymer (LCP), with its low dielectric loss (Dk = 2.85 at 1GHz), is preferred for high-frequency 5G applications.

  • Surface Treatment: Plasma cleaning or chemical etching is used to increase the surface energy of the substrate, improving copper foil adhesion.

2. Copper Lamination & Pattern Transfer

  • Copper Deposition: A sputtering followed by electroplating process is used to create an ultra-thin seed copper layer (thickness <1μm), eliminating the thickness limitations of traditional lamination methods.

  • Photolithography: Dry film photoresist is applied, and high-precision pattern transfer is achieved using Laser Direct Imaging (LDI), enabling 50μm line width/spacing. After development, the resist protects desired copper areas.

3. Etching & Lamination

  • Chemical Etching: Acidic cupric chloride solution removes unprotected copper. Etch rate control is critical, as polyimide and FR-4 materials have up to 15% difference in etching behavior, requiring compensation to avoid undercutting.

  • Multilayer Lamination: Automated hot presses are used to bond layers under controlled temperature (180–220°C) and pressure (30–50 kg/cm²) gradients, effectively managing CTE (Coefficient of Thermal Expansion) mismatches.

4. Drilling & Metallization

  • Laser Drilling: Ultraviolet (UV) lasers (355nm wavelength) are used to create 50μm microvias without inducing mechanical stress, as seen with mechanical drilling.

  • Via Metallization: Electroless copper plating forms a 0.5–1μm conductive layer, ensuring reliable interlayer electrical connections.

5. Surface Finishing & Protection

  • ENIG (Electroless Nickel/Immersion Gold): Provides excellent solderability and corrosion resistance. Thickness is precisely controlled: Ni 3–6μm / Au 0.05–0.1μm.

  • Coverlay Application: Heat-laminated polyimide coverlays (25μm with adhesive) are applied, with laser window opening precision reaching ±25μm.

6. Profiling & Testing

  • Laser Cutting: UV laser systems ensure clean, burr-free cutting of complex board outlines.

  • Reliability Testing: Includes dynamic bend testing (100,000 cycles from 0° to 180°), thermal shock cycles (-40°C to 125°C, 1000 cycles), and signal integrity testing (TDR impedance control within ±10%).

Flexible PCB Manufacturing Process

Cross-Industry Applications

Leadsintec’s flexible printed circuit boards (Flex PCBs) are driving innovation across a wide range of industries:

  • Medical Devices: Implantable electronics, wearable health monitors, diagnostic systems

  • Automotive Electronics: Engine control units, dashboard displays, sensor networks

  • Consumer Electronics: Smartphones, digital cameras, wearable tech

  • Aerospace & Aviation: Satellite systems, aircraft control panels, navigation instruments

  • Industrial Automation: Control systems, sensor modules, interface boards

  • Telecommunications: Networking equipment, mobile devices, transmission systems

Advantages of Leadsintec Flex PCBs

Choosing Leadsintec for your flexible circuit needs brings a host of clear benefits:

  • Space and Weight Savings
    By eliminating the need for traditional connectors and ribbon cables, our flexible and rigid-flex PCBs dramatically reduce overall system size and weight. This allows for more compact, efficient internal layouts—ideal for devices where slim and lightweight design is critical.

  • Enhanced Reliability
    Flexible circuits minimize physical interconnects between components, lowering the risk of failure points. This enhances the durability and reliability of the system, while also allowing for easier modifications to adapt to evolving design requirements.

  • Superior Design Freedom
    With advanced 3D routing capabilities, circuits can be precisely shaped to fit non-standard geometries. Shorter signal paths and better impedance control are achieved, making our solutions ideal for spatially constrained and complex structures.

  • Outstanding Thermal Management
    Compared to traditional rigid boards, our flexible PCBs offer improved heat dissipation, helping maintain thermal stability under continuous operation.

  • Exceptional Vibration Resistance
    The inherent flexibility of our materials reduces mechanical stress on solder joints, ensuring excellent durability and performance even in high-vibration or harsh operating environments.

  • Cost-Effective Performance
    While initial costs may vary for highly customized or low-volume designs, our mature production processes and scalable manufacturing capabilities ensure highly competitive overall value for our clients.

Quality Assurance and Certifications

At Leadsintec, we adhere to rigorous quality control protocols throughout the entire manufacturing process:

  • UL-Certified Production for Both Rigid and Flexible PCBs

  • ISO-Compliant Quality Management System

  • Comprehensive Environmental and Reliability Testing

  • Strict Electrical Performance Validation

  • Customer-Centric Engineering Approach

At Leadsintec, we understand that flexibility and strong client relationships are just as critical as advanced engineering. We offer premium, customized engineering and manufacturing services tailored to specific requirements—from rapid prototyping of single units to high-volume production runs.

Conclusion

With nearly two decades of expertise in flexible PCB manufacturing, Leadsintec delivers world-class flexible circuit solutions that combine innovative design, precision engineering, and exceptional reliability. Our comprehensive capabilities—from basic single-layer circuits to advanced multilayer and rigid-flex configurations—empower clients across industries to push the boundaries of electronic product development.

Partner with Leadsintec for your flexible PCB needs and experience the perfect balance of cutting-edge technology and customer satisfaction.

2oz copper PCB introduction and application guide

05/08/2025 在： /通过：

Printed circuit boards (PCBs) are a key component of electronic devices, both providing physical support for electronic components and enabling electrical connections. Among the many technical parameters of a PCB, the thickness or weight of the copper foil is particularly critical and is often expressed in ounces per square foot (oz/ft²). While 1oz copper foil is a common standard in traditional applications, 2oz copper PCBs are becoming increasingly popular as the performance needs of electronic devices increase.

In this article, we’ll take an in-depth look at what the actual thickness of 2oz copper foil means in a PCB, explain why it’s growing in popularity in today’s electronic designs, plus we’ll sort through the key benefits that 2oz copper brings to the table, the applications for 2oz copper pcb’s, and introduce some design guidelines to help maximize its performance.

What is 2oz copper thick pcb

A 2oz copper thick PCB is a printed circuit board (PCB) with a copper foil thickness of 2 ounces (OZ). Below is a detailed description of 2 ounce copper thick PCBs:
In the PCB industry, copper foil thickness is measured using ounces (OZ) as a unit, with 1 oz copper thickness indicating the thickness achieved by evenly distributing 1 oz (approximately 28.35 grams) weight of copper foil over a 1 square foot area.
A 1oz copper thickness equals approximately 35 microns (1.4 mils), so a 2oz copper thickness is approximately 70 microns (2.8 mils).

Basic Properties of 2oz Copper PCBs

High Conductivity: The increased thickness of the copper foil increases the ability of the line to carry a significant amount of current (formula: I ∝ h, h is the copper thickness) and reduces resistance losses.
Excellent heat dissipation: thick copper layer can quickly export heat, preventing components from overheating, extending the life of the equipment.
High mechanical strength: strong resistance to bending, pulling and impact, adapting to complex industrial environments.
Classification difference: the production process is different between regular thick copper boards (≤3OZ) and ultra-thick copper boards (3-12OZ), with the latter requiring high-precision copper foil selection, special press-fit technology and enhanced etching process.

Why choose 2oz copper PCB?

High Current Carrying Capacity
Equation derivation: Line loadable current I is directly proportional to copper thickness h (I ∝ h), and heat generation Q is inversely proportional to copper thickness h (Q ∝ 1/h).
Practical application: In high power scenarios such as power modules and motor drives, 2oz copper PCBs can reduce resistance loss and improve system efficiency.

Thermal Management Optimization
The thick copper layer acts as a “cooling channel” to quickly transfer heat to the heat sink or enclosure to avoid localized overheating.
Case in point: automotive engine control systems are exposed to high temperatures for long periods of time, and 2oz copper PCBs ensure circuit stability.

Mechanical Reliability
Shock resistance is improved by more than 30%, suitable for industrial equipment or automotive electronics with frequent vibration.

2oz copper PCB

2oz copper PCB

Core Application Areas

Automotive Electronics
Control modules, engine control systems, airbags and other critical components need to withstand high temperatures, corrosion and mechanical stress.

Power & Energy
Power modules, DC-DC converters, solar inverters, etc., need to handle high power conversion and distribution.

Industrial Automation
High-power motor drives and automation equipment control require circuit boards with high conductivity and durability.

Emerging Fields
High-end products such as 5G base stations, AI servers, etc., have stringent requirements for PCB layers, precision and heat dissipation performance.

Design Recommendations for 2oz Copper PCBs

In order to fully utilize the advantages of 2oz copper foil thickness in circuit board design, design engineers should consider the following layout and wiring guidelines:

Reasonable use of space: 2oz copper supports finer line widths and spacing, allowing for a more compact device layout. Components can be appropriately dispersed during design to fully utilize the extra space.

Shorten wiring paths: Because 2oz copper has lower resistivity, there is less reliance on wider alignments, and shorter, more direct connections can be prioritized.

Optimize layer structure: Lower current densities allow for fewer board layers when the layout permits. However, sufficient power and ground layers need to be maintained to ensure stability.

Reduced via size: Thanks to the high resolution capability of 2oz copper, smaller via designs can be used while maintaining good wiring density.

Increased component integration: Thinner copper wires make it easier to connect small package components, thereby increasing overall component density.

Controlling High Frequency Impedance: For high frequency applications, ensure that thin copper traces are routed as short as possible to avoid signal integrity issues caused by long or narrow traces.

Reduce thermal structure: If conditions permit, remove some heat sinks to reduce overall thermal resistance.

Increase copper-filled areas: Enhance heat dissipation efficiency and electromagnetic interference (EMI) shielding effect through reasonable copper surfacing, while maintaining a safe distance from signal lines.

Avoid excessive fragmentation of planar layers: Minimize fragmentation of the power and ground layers and improve continuity through multi-point over-hole connections.

Focus on edge spacing: Under high-precision etching processes, special attention needs to be paid to the alignment gap at the edge of the board to avoid processing defects.

Optimize design rules: Tighten the design grid and DRC (Design Rule Check) parameters to accommodate the manufacturing capacity of 2oz copper boards.

Pay attention to pad-via-hole matching: In high-density wiring, ensure that the design of pads and vias meets reliability requirements to avoid soldering problems.

Through rational layout and standardized wiring strategies, 2oz copper PCBs can not only effectively reduce board size, but also significantly improve electrical performance and help control manufacturing and assembly costs!

Summary

With its high conductivity, thermal performance and mechanical strength, 2oz copper PCBs have become the first choice for high-power, high-reliability electronic devices. With the rapid development of automotive electronics, new energy and AI fields, its market demand will continue to grow. The design and manufacturing process needs to focus on line compensation, process optimization and thermal design to ensure product performance and yield. In the future, intelligent production and the application of environmentally friendly materials will further promote the technological innovation and industrial upgrading of thick copper PCB.

What is the PCB assembly process?

05/05/2025 在： /通过：

As we all know, printed circuit board (PCB) is an indispensable core component in modern electronic devices, while printed circuit board assembly (PCBA) is the process of mounting electronic components onto PCBs and making them circuit-connected through soldering and other processes. In this article, we will introduce the concepts related to PCBA and the processing flow of PCBA.

What is PCB assembly?

PCBA, or printed circuit board assembly, is an important part of electronic circuit design.
It is not just a simple printed circuit board (PCB), but electronic components (such as SMD components SMT and plug-in components DIP) are mounted on the PCB board and formed into a complete circuit system through welding and other processes.
PCBA is widely used in all kinds of electronic products, such as TVs, computers, cell phones, automotive electronics and medical equipment, etc. It is an indispensable core component for electrical connection and signal transmission in these devices.

Basic Components of Printed Circuit Board Assemblies

1. Base structure components

Substrate: Made of insulating material (e.g. FR-4 epoxy resin) that provides mechanical support and electrical isolation.
Lead layer and copper foil: copper foil etched to form a network of leads for the transmission of current and signals.
Solder pads and vias: Solder pads are used to solder component pins and vias connect different layers of the circuit.
Soldermask and silkscreen: The soldermask (green coating) protects the outer layer of the circuitry, and the silkscreen labels the component locations and identifies them.
Mounting holes and connectors: to fix the board or connect other devices.

2. Active Components

Integrated circuits (IC): core components, integrated complex logic functions, such as microprocessors, memory.
Transistor (Triode/Field Effect Tube): used for signal amplification, switching control.
Diode: unidirectional conductivity, used for rectification, voltage stabilization.
Sensors: detect environmental parameters (e.g. temperature, light) and convert them into electrical signals.
Actuator (relay, motor): according to the control signal to perform the action.

3. Passive components

Resistor: limit current, voltage and current divider.
Capacitor: store electrical energy, filtering, coupling.
Inductor: storage of magnetic energy, filtering, oscillation.
Transformer: voltage conversion, impedance matching.
Crystal oscillator: provide clock signals to ensure stable operation of the equipment.

4. Connection and protection components

Connector: connection between boards or equipment (such as rows of pins, sockets).
Fuses: overcurrent protection.
Varistor / transient suppression diode: anti-surge voltage.
Filter: Suppresses noise and improves signal quality.

The basic process of PCB assembly

PCBA production, i.e., PCB bare board through the component placement, plug-in, and complete the welding process. This process covers a number of procedures, including SMT placement processing, DIP insertion processing, PCBA testing, three-proof coating, and the final visual inspection and packaging shipment. Each step is critical and works together to ensure the quality and performance of the PCBA.

SMT SMD Processing

1. Board Drop
This link in the beginning of the SMT production line plays a crucial role, it ensures that the PCB boards can be transferred to the production line in an orderly and efficient manner, thus guaranteeing the continuity and efficiency of production.

2. Solder Paste Printing
Solder paste printing is a key part of SMT placement processing, which involves the precise printing of solder paste onto the circuit board by manual means through the stencil of the printing machine. This step not only requires professional printing machine (such as hand printing table) and squeegee, but also requires strict control of the composition of the solder paste, printing resolution, accuracy, and thickness and uniformity of the solder paste.

3. On-machine placement
On-machine placement is the SMD components in accordance with the process diagram or BOM requirements, through the SMD machine programming or manual alignment, accurate mounting to the circuit board has been printed with good solder paste.

4.Reflow soldering
In the solder paste printing and on the machine after the patch, in order to ensure that the components can be firmly soldered on the PCB board, reflow soldering must be carried out. This link through the high-temperature heating to melt the solder paste, so that the components and PCB pads closely together, so as to complete the welding.

5.AOI Inspection
Post-oven AOI is a key link in the production line. It is through the graphic recognition method will be stored in the AOI system standard digitized image and the actual detection of the image for comparison, so as to obtain the test results. The technical points of this link include inspection standard, detection force, false detection rate, sampling position, coverage rate and blind spot. Its inspection items cover a wide range of possible problems such as missing parts, reverse, upright, broken solder, wrong parts, less tin, warped legs, continuous tin and more tin.

DIP Insert Processing

DIP insertion, also known as DIP packaging or dual-row in-line packaging technology, is a process that packages integrated circuit chips in the form of dual-row in-line insertion.

1.Manual insertion
In this link, the PCB is passed through the rotation of the chain, and the workers need to insert the molded parts and components accurately and correctly to the corresponding position of the PCB according to the work instruction (applicable to through-hole components).

2. Wave soldering
Wave soldering is a kind of molten solder with the help of the pump, in the solder tank to form a specific shape of the solder wave process. During the soldering process, the PCB with components inserted passes through the conveyor chain and passes through the solder wave at a specific angle and immersion depth, thus realizing a solid connection of the solder joints.

3. Manual foot trimming
After the wave soldering is completed, the PCB board needs to be manually clipped. This step involves manual PCB board plug-in components on the surface of the pad exposed pins, in accordance with the provisions of the operating instructions for cutting. The purpose of cutting the foot operation is to ensure that the height of the component pins in the right place, while avoiding damage to the component body and its pad.

4. Manual soldering
In the manual welding process, the need for the PCB board soldering abnormalities, such as false soldering, leakage of solder, less tin, tin, etc., to repair in a timely manner. At the same time, for the components of the insertion of abnormalities, such as skewed, floating high, fewer pieces, wrong insertion, etc., also need to be dealt with accordingly to ensure the quality of welding.

DIP Insert Processing

DIP Insert Processing

Test link

1.ICT test

ICT test is designed to examine the basic characteristics of components to ensure good performance. During the testing process, NG (non-conforming) and OK (qualified) products are placed separately to facilitate subsequent processing. For the test results for the OK circuit board, the corresponding ICT test labels need to be affixed, and separated from the foam, in order to facilitate the subsequent tube.

2.FCT Test

FCT test is designed to comprehensively check the functional integrity of the circuit board. In the testing process, NG (defective) and OK (qualified) strictly differentiated, and are properly placed. For circuit boards with OK test results, they need to be labeled with the appropriate FCT test labels and isolated from the foam to facilitate subsequent tracking and management. At the same time, if you need to generate a test report, you should ensure that the serial number on the report corresponds to the serial number on the PCB board. For NG products, they need to be sent to the maintenance department for repair, and do a good job of recording the defective product maintenance report.

Coating of three-proof paint

Three-proof paint, as a kind of coating with special functions, is widely used in PCBA protection. Its role is to provide comprehensive protection for electronic components, effectively resist the erosion of moisture, salt spray and corrosive substances. By spraying three-proof paint, it not only ensures that the products work stably under the harsh environment of high humidity and high salt spray, but also significantly extends their service life.

Visual inspection for packing and shipping

Before packing and shipping, manual inspection must be carried out to ensure product quality, IPC610 standard is an important basis for inspection, focusing on checking whether the direction of the components on the PCBA is correct, such as IC, diodes, transistors, tantalum capacitors, aluminum capacitors and switches and so on. At the same time, it is also necessary to carefully check the defects after welding, such as short circuit, open circuit, fake parts, false welding, etc., to ensure that the products can work stably and meet customer requirements.

Looking for pcb assembly service provider?

LST is a factory with more than 20 years experience in pcb assembly, we provide customers with stable and convenient electronic manufacturing services, one-stop turnkey manufacturing. If you have a manufacturing project, please contact customer service, we will reply you at the first time.

What are the advantages of using flexible PCB?

04/28/2025 在： /通过：

In the realm of printed circuit boards (PCBs), flexible PCBs stand out as a unique category, complementing their traditional rigid counterparts. In a wide range of applications, flexible PCBs demonstrate capabilities that rival — and sometimes surpass — those of rigid PCBs. To explore the charm and versatility of flexible PCBs, this article offers an in-depth analysis of their various types and real-world applications.

What Is a Flexible Circuit Board?

An FPC (Flexible Printed Circuit), often referred to as a “soft board,” is a member of the PCB family. Made with flexible substrates such as polyimide or polyester films, FPCs boast high wiring density, lightweight construction, thin profiles, and exceptional bendability and flexibility. These boards can endure millions of dynamic flexing cycles without damaging the circuitry, making them ideal for complex spatial layouts and three-dimensional assembly. By integrating component mounting and wiring into a single structure, FPCs achieve a level of performance that rigid PCBs often cannot match.

Basic Structure of an FPC

Copper Film (Copper Foil Substrate)

  • Copper Foil: A crucial material in FPCs, copper foil is available in two types — electrolytic copper and rolled annealed (RA) copper — with common thicknesses of 1oz, 1/2oz, and 1/3oz.

  • Substrate Film: Supports the copper foil and typically comes in thicknesses of 1 mil or 1/2 mil.

  • Adhesive: Used during manufacturing to bond layers, its thickness varies depending on customer requirements.

Coverlay (Protective Cover Film)

  • Cover Film: Primarily used for surface insulation, usually with thicknesses of 1 mil or 1/2 mil, applied together with adhesive layers.

  • Release Paper: Employed during manufacturing to prevent foreign matter from adhering to the adhesive before lamination, simplifying the production process.

Stiffener (PI Stiffener Film)

  • Stiffener: Enhances the mechanical strength of the FPC, facilitating surface-mount assembly. Typically, stiffeners range from 3 mil to 9 mil in thickness and are bonded with adhesives.

  • EMI Shielding Film: Protects the internal circuits from external electromagnetic interference, ensuring the stability and reliability of electronic devices.

Types of Flexible PCBs

Types of Flexible PCBs

Types of Flexible PCBs

As a major innovation within the PCB industry, flexible PCBs not only offer exceptional performance but also come in a wide variety of types. Their versatility greatly enriches the design possibilities for electronic products and meets the demands of increasingly complex applications. Below is an overview of the most common types of flexible PCBs and their typical uses:

  1. Single-Sided Flexible PCB
    Featuring a simple structure with a single conductive layer, these PCBs are cost-effective and ideal for basic applications.

  2. Double-Sided Flexible PCB
    With copper layers on both sides connected through metallized vias, double-sided flexible PCBs offer greater functionality for more complex scenarios.

  3. Multilayer Flexible PCB
    Built with multiple layers of copper and dielectric material stacked alternately, these PCBs achieve high elasticity while delivering superior performance.

  4. Rigid-Flex PCB
    Combining both rigid and flexible circuits into a single board, rigid-flex PCBs support high-density wiring and sophisticated layout designs.

  5. HDI Flexible PCB
    Featuring high-density interconnect (HDI) designs, these boards are lightweight, compact, highly integrated, and offer excellent electrical performance.

  6. Sculptured Flexible Circuit
    Designed with variable trace thicknesses to meet specific localized requirements, these circuits are ideal for intricate electronic applications.

  7. Polymer Thick Film Flexible PCB
    Manufactured using screen-printing techniques, these low-cost flexible circuits are best suited for low-voltage applications.

  8. Dual Access/Backside Flexible PCB
    A single-sided design that allows circuit access from both sides, simplifying the layout of complex circuitry.

  9. Single-Layer Flexible FPCB
    Comprising a base layer, adhesive, and a copper layer, this straightforward structure emphasizes protection of the conductive areas.

  10. Dual Access/Backside FPCB
    Similar in structure to a single-layer FPCB but with laser-drilled openings to access the copper layer, significantly enhancing design flexibility.

Features of Flexible PCBs

  1. Flexibility:
    Flexible PCBs can bend and fold without compromising circuit functionality, allowing for freedom of movement in three-dimensional spaces.

  2. Lightweight and Thin:
    Compared to rigid PCBs, flexible PCBs are significantly thinner and lighter.

  3. Miniaturized Design:
    Thanks to their ability to bend in 3D space, flexible PCBs enable the creation of more compact electronic products.

  4. High Reliability:
    Flexible PCBs offer greater resistance to vibration and shock compared to rigid boards, enhancing overall reliability.

  5. High-Temperature Resistance:
    These PCBs can operate reliably in high-temperature environments, demonstrating outstanding thermal stability.

In-Depth Analysis of Core Advantages of Flexible PCBs

In-Depth Analysis of Core Advantages of Flexible PCBs

In-Depth Analysis of Core Advantages of Flexible PCBs

Flexible PCBs (FPCs) have become increasingly indispensable in modern electronics due to their unique physical properties and design advantages. Below is a detailed exploration of their core strengths:

1. Exceptional Flexibility and Spatial Adaptability

  • Bendable and Foldable Design:
    Utilizing flexible substrates such as polyimide (PI) or polyester (PET), FPCs can bend, fold, or even roll within three-dimensional space, breaking the two-dimensional limitations of traditional rigid PCBs. For example, in foldable smartphones, FPCs are used in hinge areas, enduring hundreds of thousands of folds without failure.

  • Space Optimization:
    With thicknesses as low as 0.1 mm and weighing only 50%-70% of a rigid PCB, FPCs significantly enhance space utilization inside devices. In smartphones, FPCs seamlessly connect the mainboard to the display and camera modules, enabling “zero-gap” designs.

2. Lightweight Design and High Reliability

  • Weight Reduction and Cost Savings:
    The lightweight nature of FPCs makes them ideal for aerospace and wearable devices. For instance, satellite electronics systems utilizing FPCs see weight reductions of over 30%, while also minimizing the need for bulky connectors and reducing overall assembly costs.

  • Environmental Resistance:
    PI substrates withstand temperatures up to 250°C and exhibit excellent chemical and vibration resistance, making them suitable for harsh environments such as automotive engine compartments and industrial control systems.

3. Design Freedom and Integration Capabilities

  • 3D Routing:
    FPCs can route along curved surfaces, supporting innovative structural designs. In smartwatches, FPCs are integrated into the straps to flexibly connect sensors to the mainboard.

  • High-Density Integration:
    With technologies like laser drilling and fine-line patterning, FPCs can achieve line widths and spacings as small as 20μm/20μm, meeting the miniaturization demands of devices such as implantable medical equipment (e.g., neural stimulators) for multi-channel signal transmission.

4. Dynamic Adaptability and Durability

  • Extended Flexing Lifespan:
    Designs using serpentine routing patterns and rolled annealed (RA) copper allow FPCs to endure over 100,000 bending cycles, ideal for dynamic applications like flip phones.

  • Shock Absorption:
    Flexible substrates absorb mechanical stresses, reducing the risk of solder joint failures caused by vibrations. In automotive electronics, FPCs are used in airbag control modules to ensure signal stability even under extreme collision conditions.

5. Cost Efficiency and Manufacturing Productivity

  • Long-Term Cost Benefits:
    Although the unit cost of FPCs may be higher, their ability to reduce the need for connectors and simplify assembly processes lowers overall system costs in mass production. For example, integrated FPC modules in smartphones are 15%-20% more cost-effective than traditional cable harness solutions.

  • Rapid Production Support:
    FPCs can be produced with robotic automation, supporting small-batch, multi-variety manufacturing, ideal for the fast-paced iteration cycles of consumer electronics.

Typical Application Scenarios

  • Consumer Electronics:
    Display connections and camera modules in smartphones and tablets.

  • Medical Devices:
    Implantable pacemakers and miniature diagnostic device sensor circuits.

  • Automotive Electronics:
    Lightweight wiring for engine management systems and advanced driver-assistance systems (ADAS).

  • Aerospace:
    Radiation-resistant flexible circuits for satellite antennas and UAV control systems.

Conclusion

With the rapid rise of wearable devices, flexible displays, and smart technologies, the demand for flexible PCBs is experiencing explosive growth. In an era where electronic products increasingly prioritize lightweight, thin, compact, and highly efficient designs, ultra-thin and stretchable flexible circuits are poised to unlock immense market potential and drive the next wave of advancements in electronic devices and related technologies.

How to Remove Protective Coatings from PCBs

04/24/2025 在： /通过：

Before production and processing, a protective conformal coating is typically applied to the surface of a PCB to safeguard it from environmental damage. This coating helps prevent water, dust, salt, and dirt from coming into contact with sensitive components, thus preserving the performance of the mainboard.

Removing conformal coatings can be challenging due to their durability and resistance to wear. If rework is needed, alcohol is not the ideal choice for removing these coatings. While alcohol is inexpensive and readily available, it lacks the solvent strength to effectively dissolve the coating and often requires extended soaking to have any effect. In this article, we will explore effective methods for removing protective coatings from PCBs.

Types of Conformal Coatings

There are five common types of conformal coatings available on the market:

  1. Acrylic Resin
    Acrylic resins dissolve easily in many organic solvents, making them convenient for board rework. They offer selective chemical resistance, dry quickly, resist mold, do not shrink during curing, and provide good moisture resistance. However, they have low abrasion resistance and are prone to scratching, cracking, and peeling.

  2. Epoxy Resin
    Typically composed of two parts that begin to cure upon mixing, epoxy resins offer excellent abrasion resistance, chemical resistance, and decent moisture protection. However, they are difficult to remove and rework. Because film shrinkage occurs during polymerization, a buffer solution is recommended around precision components. Curing at lower temperatures can help minimize shrinkage.

  3. Polyurethane
    Polyurethane coatings provide strong moisture and chemical resistance. Due to their robust chemical properties, removing them usually requires strippers, which may leave ionic residues behind. These residues must be thoroughly cleaned to avoid baseboard corrosion. Although rework through soldering is possible, it often results in brown discoloration that can affect the product’s appearance.

  4. Silicone
    Silicone is typically a single-component compound that begins to cure when exposed to moisture in the air and a certain temperature. Once cured, it forms a uniform, well-adhering layer across all surfaces of electronic components or modules. It is suitable for high-temperature environments (>120°C), as well as settings that require moisture sensitivity, chemical resistance, corrosion protection, and antifungal properties.

  5. Urethane (Polyurethane Carbamate)
    Urethane offers strong protection, hardness, and high solvent resistance. It provides excellent abrasion resistance and low moisture permeability. While it performs well in cold environments, it is not suitable for high-temperature applications. Most urethane coatings are difficult or impossible to rework or repair.

pcba

Common Types of Protective Coatings and Removal Methods

  1. Chemical Solvent Method

Applicable Types:

  • Polyurethane: Methanol/ethylene glycol ether with an alkaline activator, or toluene/xylene.

  • Acrylic: Methylene chloride, chloroform, ketones (e.g., acetone), γ-butyrolactone, or butyl acetate.

  • Silicone: Methylene chloride or specific hydrocarbon solvents.

  • Epoxy: Difficult to remove once cured; for small areas, methylene chloride with an acidic activator and a cotton swab may be used.

Procedure:
Apply the solvent to the coating surface. Once the coating swells, gently wipe with a cotton swab or soft cloth. Avoid letting the solvent spread to unintended areas.

  1. Physical Removal Methods

Heat Method:

  • Tools: Soldering iron or hot air gun.

  • Note: Carefully control the temperature (do not exceed component tolerance). Suitable for high-temperature resistant components. Work quickly to avoid damaging the laminate.

Micro-abrasion Method:

  • Tools: Specialized abrasive equipment (e.g., walnut shell or glass bead media).

  • Note: Mask surrounding areas to prevent electrostatic buildup. Should be performed by trained personnel.

Mechanical Scraping:

  • Tools: Razor blade or small knife.

  • Steps: Cut a V-groove at the solder point, apply solvent, then lift the coating. Best for localized rework.

  1. Specialized Cleaning Agents

Recommendation: Use eco-friendly cleaning agents (e.g., Kyzen ES125A).
Method: Ultrasonic cleaning or soaking. Suitable for large areas or complex PCBs.

  1. Localized Replacement Method

Use Case: When only specific components need replacement.
Steps: Use a soldering iron to heat and remove the coating on the component, replace the part, clean the area, and reapply conformal coating.

Summary

PCB protective coatings are surface-applied materials designed to protect circuit boards from moisture, dust, chemicals, and high temperatures, thus improving product reliability. Common types include:

  • Acrylic (easy to apply, requires specific solvents for removal),

  • Polyurethane (strong protection, difficult to remove, may emit toxic fumes when heated),

  • Silicone (heat-resistant and reworkable), and

  • Epoxy (very tough once cured, hard to remove).

Removal methods should be selected based on coating type and may include chemical solvents (e.g., methylene chloride, methanol), physical methods (heat, abrasion), special cleaning agents, or localized replacement. Always prioritize safety and environmental responsibility, and take care to avoid damaging the PCB or its components.